MODEL NAME :DDM60
PCB NO : LA-F391P
BOM P/N : 431A8K31LXX
BR MLK12 KBL-U UMA
Kabylake U42
22
@ : Nopop Component
EMC@ : EMI, ESD and RF Component
@EMC@ : EMI, ESD and RF Nopop Component
CXDP@ : XDP Component
CONN@ : Connector Component
33
U42@ : KBL-R U42 Component
2017-09-25
REV :1.0 (A00)
U22@ : KBL-R U22 Component
DS3@ : Support DS3 Component
MB PCB
Part Number
DAA000EB00 0
44
COPYRIGHT 2015
ALL RIGHT RESERVED
REV:X00
PWB: 9RJMF
Descriptio n
PCB 258 LA-F391P REV0 MB 1
Layout Dell logo
A
NDS3@ : No Support DS3 Component
650@ : Pop NPCT650VB2YX Component
750@ : Pop NPCT750JAAYX Component
PROPRIETARY NOTE: THIS SHEET OF E NGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER P ROPRIETARY INFORMATION OF DELL INC. ( "DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
B
PARTY WITHOUT DE LL'S EXPRESS WRITTEN CONSENT.
C
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Dat e:Shee to f
Dat e:Shee to f
D
Dat e:Shee to f
Compal Electronics, Inc.
Cover Sheet
Cover Sheet
Cover Sheet
LA-F391P
LA-F391P
LA-F391P
170Monday, September 25, 2017
170Monday, September 25, 2017
170Monday, September 25, 2017
E
0.2
0.2
0.2
Vinafix.com
A
B
C
D
E
BreckenridgeMLK 12 UMA Block Diagram
Memory BUS (DDR4)
DDR4 2133MHz for KBL-U
DDR4 2400MHz for KBL-H
Up to 2x8GB Modul es
USB
USH TPM1.2
BCM58102
USB2.0[9]
SLGC55544BVTR
USB POWER SHARE
HD Audio I/F
SATA REPEATER
PI3EQX6741STZDEX
SATA/PCIE REPEATER
PS8558 x2
USB2.0[10 ]
USH board
P39
11
VGA
CONN
P24
22
PCIE[1 ]
Card reader
RTS524 2
SD4.0
33
P31
P31
Intel Jacksonville
WGI219LM
PCIE[4 ]
Transformer
RJ45
P30
P30
P30
EDP CONN
HDMI 1.4
CONN
DP TO VGA
RTD216 6
SATA[1]/ PCIE[8 ]
M.2,3042 Key B
WWAN/LTE/HC A
USB3.0[2]
P29
P23
SW2_DP1
To Type C
P24
P33
USB2.0[4]
2-Lane eDP1.3
HDMI
SW2_DP3
To VGA
M.2,3030 Key A
WLAN+ BT
DP DeMUX
PS8338B
PCIE[3 ]
P33
USB2.0[7]
DDI[1 ]
INTEL
Kaby Lake Refresh U MCP
DDI[2 ]
P22
PAGE 6~19
SATA[0]
ESPI
SMSC KBC
MEC510 5
SPI
P35-3 6
SATA[2]/PC IE[12] [11]
W25Q128JVS IQ
128M 4K sector
P8
W25Q128JVS IQ
128M 4K sector
TPM1.2/2.0 Nuvoton
NPCT750 JAAYX
KB/TP CONN
FAN CONN
P8
reserve
P45
P36
P38
Non-AR Type C
DP1.2 4 lanes
TX/RX
USB 3.0 + AM
Type C CONN.
44
USB2.0
CC
Vbus
HS Redriver Switch
TUSB546 @
PS8743 @
P25
GPIO
PD Solut i on
TPS6598 2DC
P26-2 7P28
SW2_DP1
USB3.0[1]
SMBUS
USB2.0[1]
Smart Card
TDA8034HN
RFID/NF C
Fingerprin t
CONN
SPI
SPI
Reverse Type
DDR4-SO-DIMM X2
BANK 0, 1, 2, 3
P20~21
USB2.0[8]
USB2.0[5]
USB2.0[9]_P S
P43
USB3.0[6]
USB2.0[2]
USB3.0[3]
HDA Codec
ALC32 54
P39
P34
P41
LCD Touch
Camera
USB3.0 Conn
PS(Ext Port 1)
USB3.0 Conn
(Ext Port 2)
INT.Speake r
Universal Jack
Dig. MIC
P29
P29
P43
P44
P34
P34
P29
Trough eDP Cable
SATA HDD
Conn
P41
M.2 2280
SSD Conn
P40
Trough eDP Cable
LID SWITCH
USH CONN
CPU&PCH XDP Port
AUTOMATIC POWER
SWITCH(APS)
Free Fall sensor
DC/DC Interface
POWER ON/OFF
SW & LED
LED board
P46
P38
P14
P11
P41
P47
P46
5V VR
Charger
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY N OTE: THIS SHEET OF EN GINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANS FERRED OR COPIED WITHOUT THE EXPRESS W RITTEN AUTHORIZATION O F DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
A
B
C
PARTY WITHOUT DELL 'S EXP RESS WRITTEN CONSENT.
D
Title
Size Document NumberRe v
Size Document NumberRe v
Size Document NumberRe v
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
Block diagram
Block diagram
Block diagram
LA-F391P
LA-F391P
LA-F391P
E
270Monday, September 25, 2017
270Monday, September 25, 2017
270Monday, September 25, 2017
0.2
0.2
0.2
Vinafix.com
5
POWER STATES
Signal
State
S0 (Full ON) / M0
DD
S3 (Suspend to RAM) / M3LOW
S4 (Suspend to DISK) / M3
S5 (SOFT OFF) / M 3
S3 (Suspend to RAM) / M-OFF
S4 (Suspend to DISK) / M -OFF
S5 (SOFT OFF) / M-OFF
SLP
S3#
HIGH
LOW
LOW
LOW LO WLOW
LOW LO W LOW LOW
SLP
SLP
S5#
S4#
HIGH HIGH
HIGH HIGHONONON
HIGH HIGH
LOW
LOW
LOW
HIGH HIGH
HIGH
ALWAY S
SLP
PLANE
A#
ON
HIGH
HIGH
ONON
ONON
HIGH
ONON
LOW
ON
ON
PM TABLE
+5V_A LW
+3.3V_A LW
+3.3V_ALW_D SW
power
CC
State
S0
S3
S5 S4/AC
S5 S4/AC doesn't exist
plane
+3.3V_ALW_PCH+1.2V_MEM
+RTC_CEL L
+1.8V_PRIM
+1.0V_PRIM
+1.0V_P RIM_ CORE
+5V_ALW2
+3.3V_A LW2
+3.3V_RTC_ LDO
+1.0V_MPHYGT
ON
ON
ON
+3.3V_CV2
+2.5V_MEM
+1.0 V_VCCST
+5V_ RUN
+3.3 V_RUN
+0.6V_DD R_VTT
+1.8 V_RUN
+VCC_ CORE
+VCC_G T
+VCC_SA
+1.0VS_VCCIO
ONON
ON
OFF
OFFOFF
4
M
PLA NE
ON
OFFOFFOFF
OFFOFFOFFOFF
OFFOFFOFFOFF
OFF
OFF
OFF
RUN
SUS
PLA NE
PLANE
ONONON
OFF
OFF
OFF
OFF
OFFLOW
CLOCK S
OFF
OFF
OFF
USB3.0
USB3.0- 1
USB3.0- 2
USB3.0- 3
USB3.0- 4
USB3.0- 5
USB3.0- 6
SSIC
SSIC
3
2
1
For Breckenridge12/14/15 UMA
PCIE
PCIE-1
PCIE-2
PCIE-3
PCIE-4
PCIE-5
PCIE-6
PCIE-7
PCIE-8
PCIE-9
PCIE-10
PCIE-11
PCIE-12
SATA
SATA-0
SATA-1
M.2 3042(SATA Cache or HCA)
SATA-1 *
SATA-2
M.2 2280 SSD
(PCIex2 or SATA)
12" not support JUSB3
Type-C PortType-C Port
M.2 3042(LTE)
JUSB2-->Lef t
JUSB3-->Rear Lef t
Card Reader
JUSB1-->Right
M.2 3030(WLAN)
LOM
NA
NA
SATA HDD
NA
NA
USB PORT#DESTINATION
DESTINATION
1
2
3
4
5
6
7
8
9
10
JUSB2-->Lef t
JUSB3-->Rear Lef t
M2 3042(WWAN)
Camera
NA
M.2 3030(BT)
Touch Screen
JUSB1-->Right
USH
BB
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SP ECIFICATIONS CONTAINS C ONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DEL L") THIS DOCUME NT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRe v
Size Document NumberRe v
Size Document NumberRe v
Date :Sheetof
Date :Sheetof
Date :Sheetof
Compal Electronics, Inc.
Port assignment
Port assignment
Port assignment
LA-F391P
LA-F391P
LA-F391P
1
370Monday, September 25, 2017
370Monday, September 25, 2017
370Monday, September 25, 2017
0.2
0.2
0.2
Vinafix.com
5
Barrel
ADAP TER
DD
CHAR GER
ISL953 8
(PU901)
Type-C
ADAP TER
+PWR_SRC
BATTERY
CC
SY8210A
(PU200)
SYX198D
(PU301)
SY8288C
(PU102)
SY8288B
(PU100)
4
SIO_SLP_S4 #
0.6V_DDR_ VTT_ON
PCH_ PRIM_EN
(SIO_SLP_SUS #)
ALWO N
ALWO N
+1.2V_MEM
+0.6V_DDR_VTT
+1.0V_PRIM
+5V_ALW
+5V_ALW2
+3.3V_RTC_LDO
+3.3V_ALW2
TPS22961
(UZ26)
3
PCH_ PRIM_EN
(SIO_SLP_SUS #)
SIO_SLP_S4 #
+VCC_SFR_O C
TPS62134C
(PU401)
TPS62134D
(PU402)
EM5209
(UZ4)
SLGC55544 C
(UI3)
SY6288
(UI1)
RUN_ ON
PCH_ PRIM_EN
(SIO_SLP_SUS #)
RUN_ ON
USB_POWE RSHARE _VBUS_E N
USB_PWR _EN1#
+1.0VS_VCCIO
+1.0V_PRIM_CORE
+USB_EX2_PWR
TPS22961
(UZ19)
TPS22961
(UZ21)
+5V_RUN
+5V_USB_CHG_PWR
2
1
CPU PWR
PCH PWR
GT3 PWR
RUN_ ON
SIO_SLP_S0 #
SIO_SLP_S4 #
LP2301
(QV8)
EM5209
(@UZ5)
+1.0V_VCCSTG
+1.0V_VCCS T
3.3V_TS_E N
@PCH_3.3V_T S_EN
AUD_P WR_E N
Peripheral Device PWR
TYPE-C Power
GPU PWR
+3.3V_TSP
+5V_RUN_A UDIO
+3.3V_ALW
RT8097A
CSD97396Q
ISL95857
(PU602)
IMVP_VR _ON
BB
+VCC_ SA
CSD97396Q
(PU612)
IMVP_VR _ON
+VCC_GT
(PU610)
CSD 97396Q
(PU613)
U42@
IMVP_VR _ON
+VCC_COR E
AO6405
(QV1)
EN_IN VPWR
+BL_P WR _SRC
(PU501)
EM5209
(UZ2)
EM5209
(UZ3)
EM5209
(UZ4)
G524B1T11U
(UV24)
PCH_ PRIM_EN
(SIO_SLP_SUS #)
SIO_SLP_ LAN#
3.3V_ WWAN_E N
@PCH_ALW _ON
PCH_ PRIM_EN
(SIO_SLP_SUS #)
RUN_ ON
@SIO_SLP_ WLAN#
AUX_EN_W OW L
LCD_VCC_TE ST_E N
ENVDD _PC H
+1.8V_PRIM
+3.3V_LAN
+3.3V_WWAN
+3.3V_ALW_PC H
+3.3V_RU N
+3.3V_WLAN
+LCDVD D
AOZ1336
(UZ8)
LP2301A
(QZ1)
EM5209
(@UZ5)
RUN_ ON
3.3V_C AM_EN#
AUD_P WR_E N
+1.8V_RU N
+3.3V_CAM
+3.3V_RUN_ AUDIO
TYPE-C
+TBTA_VBUS(5V~20V)
TPS22967
(UZ18)
AP7361C
AA
AP2204
(UT8)
5
+5V_ALW
+5V_TBT_VBUS
AP2112K
(UT7)
+3.3V_TBT_SX
4
(PU503)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SP ECIFICATIONS CONTAINS C ONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DEL L") THIS DOCUME NT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
3
CV2_O N
SIO_SLP_S4 #
+3.3V_CV2
+2.5V_MEM
for DDR4
USH/ B
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
Size Document NumberRe v
Size Document NumberRe v
Size Document NumberRe v
Date :Sheetof
Date :Sheetof
2
Date :Sheetof
Compal Electronics, Inc.
Power rails
Power rails
Power rails
LA-F391P
LA-F391P
LA-F391P
1
470Tuesday, September 19, 2017
470Tuesday, September 19, 2017
470Tuesday, September 19, 2017
0.2
0.2
0.2
Vinafix.com
5
4
3
2
1
PD &
FW ref lash
2.2K
2.2K
+3.3V_RU N
202
200
202
200
DIMM1
DIMM2
53
51
1
4
XDP
LNG2DMTR
1K
+3.3V_ALW _PC H
2.2K
2.2K
2.2K
2.2K
2.2K
2.2K
2.2K
2.2K
+3.3V_ALW _PC H
+3.3V_TP
+3.3V_AL W
+3.3V_AL W
+3.3V_AL W
0ohm short pad
0ohm short pad
DMN66D0LDW -7
DMN66D0LDW -7
28
31
LOM
UPD1_SMBCL K_Q
UPD1_SMBD AT_Q
DDR_XDP_ WAN_SMBC LK
DDR_XDP _WAN_SMB DAT
2.2K
2.2K
@2.2K
@2.2K
9
TP
8
+3.3V_CV 2
M9
US H
L9
USH/B
+3.3V_TBT A_FLASH
B5
A5
R7
R8
DD
SKL-U
R9
W3
SML1_SMBDATA
SML1_S MBCLK
03
W2
02
02
01
01
V3
E11D8
03
CC
MEM_SMBCLK
MEM_SMBD ATA
SML0_S MBCLK
SML0_SMBDATA
1K
1K
DAT_TP_SIO_I 2C_CLK
C12
CLK_TP_SIO_I 2C_DAT
E10
B3
USH_EXPANDER_S MBCLK
E5
USH_EXPANDER_S MBDAT
+3.3V_ALW _PC H
1K
499
499
KBC
00D7
00
MEC 5105
04
04
05
05
BB
06
06
E7
C3
B4
F7
B6
A12
N10
UPD2_SMBCLK
UPD2_S MBDAT
UPD1_SMBCLK
UPD1_S MBDAT
07
M4
M7
07
C508
C8
08
F6
09
E9
09
10
AA
10
PBAT_CHARGER_S MBCLK
N2
M3
PBAT_CHARGER_S MBDAT
2.2K
2.2K
+3.3V_AL W
100 ohm
100 ohm
4
5
Charger
BATTER Y
CONN
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SP ECIFICATIONS CONTAINS C ONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DEL L") THIS DOCUME NT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
5
4
3
2
Title
Size Document NumberRe v
Size Document NumberRe v
Size Document NumberRe v
Date :Sheetof
Date :Sheetof
Date :Sheetof
Compal Electronics, Inc.
Port assignment
Port assignment
Port assignment
LA-F391P
LA-F391P
LA-F391P
1
570Monday, September 25, 2017
570Monday, September 25, 2017
570Monday, September 25, 2017
0.2
0.2
0.2
Vinafix.com
5
4
3
2
1
For 2LANE EDP,BR/SB12
+3.3V_RUN
CPU_DP1_CTRL_CLK
RC1752.2K_0402_5%
RC1782.2K_0402_5%
DD
RC1762.2K_0402_5%
RC1772.2K_0402_5%
12
CPU_DP1_CTRL_DATA
12
CPU_DP2_CTRL_CLK
12
CPU_DP2_CTRL_DATA
12
HDMI
PS8338(NON AR)
+1.0VS_VCCIO
CC
BB
CPU_DP1_N0<23>
CPU_DP1_P0<23>
CPU_DP1_N1<23>
CPU_DP1_P1<23>
CPU_DP1_N2<23>
CPU_DP1_P2<23>
CPU_DP1_N3<23>
CPU_DP1_P3<23>
CPU_DP2_N0<22>
CPU_DP2_P0<22>
CPU_DP2_N1<22>
CPU_DP2_P1<22>
CPU_DP2_N2<22>
CPU_DP2_P2<22>
CPU_DP2_N3<22>
CPU_DP2_P3<22>
CPU_DP1_CTRL_CLK
12
CPU_DP1_CTRL_DATA
CPU_DP2_CTRL_CLK
CPU_DP2_CTRL_DATA
GPP_E23
EDP_COMP
CPU_DP1_CTRL_CLK<23>
CPU_DP1_CTRL_DATA<23>
CPU_DP2_CTRL_CLK<22>
CPU_DP2_CTRL_DATA<22>
@
T120
PAD~D
RC224.9_0402_1%
COMPENSATION PU FOR eDP
CAD Note:Trace width=20 mils ,Spacing=25mil,
Max l ength=100 mils .
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
CAD Note:
Trace width=12~15 m il, Spacing=20 mils
Max trace length= 500 m il
AA
12
RC5121_0402_1%
12
RC680.6_0402_1%
12
RC7100_0402_1%
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
9/24: Reserve for embed ded lo cati on ,r ef er I nt el P DG 0. 9
RTD3_CIO_PWR_EN
HDD_EN
CLKDET#
TPM_TYPE
LID_CL#_PCH
ISH_I2C2_SDA <33>
ISH_I2C2_SCL <33>
ISH_UART0_RXD <33>
ISH_UART0_TXD <33>
ISH_UART0_RTS# <33>
ISH_UART0_CTS# <33>
SIO_EXT_WAKE# <35>
@
T18
PAD~D
LCD_CBL_DET# <29>
HDD_EN <41>
@
T258
PAD~D
@
PAD~D
T268
GPP_A GROUP is +1.8V
WWAN
WLAN
ISH_I2C2_SDA
ISH_I2C2_SCL
LCD_CBL_DET#
12
RC3631K_0402_5%
12
RC3621K_0402_5%
12
RC287100K_0402_5%
+1.8V_RUN
+3.3V_RUN
TPM_TYPE
+3.3V_RUN
RC1864.7K_0402_5%@
NRB_BIT
12
+3.3V_RUN
10K_0402_5%
RC267@
TPM_TYPE no function,Reserve GPIO f or future use,
NO REBOOT STRAP
HIGH
LOW(DEFAULT)
Internal 20k PD
BB
+3.3V_ALW_PCH
RC1848.2K_0402_5%@
BOOT BIOS Dest i nat i on(Bi t 6)
HIGH
LOW(DEFAULT)
Internal 20k PD
AA
No REBOOT
REBOOT ENABLE
BBS_BIT6
12
LPC
SPI
5
12
ONE_DIMM#
10K_0402_5%
12
RC268
DIMM Detect
HIGH
LOW
TYPEC_CON_SE L1 LOW
TYPEC_CON_SE L2
1 DIM M
2 DIM M
RC555
@
10K_0402_5%
12
12
RC556
@
10K_0402_5%
VendorTBDTBDF OXCONJAE
+3.3V_ALW_PCH
+3.3V_ALW_PCH+3.3V_ALW_PCH
RC553
@
10K_0402_5%
TYPEC_CON_SEL2TYPEC_CON_SEL1
12
12
RC554
@
10K_0402_5%
MEM_INTERLEAVED
RC371
@
10K_0402_5%
12
12
10K_0402_5%
RC372
DIMM TYPE
HI GH
AR_DET#
Inter leave
Non-In terleaveLOW
+3.3V_ALW_PCH
RC400
10K_0402_5%
12
12
10K_0402_5%
RC401
@
AR_DET#
HI GHNON AR
LOWAR
DELL CONFIDENTIAL/PROPRIETARY
HI GHHI GH
HI GH
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (5/14)
CPU (5/14)
CPU (5/14)
LA-F391P
LA-F391P
LA-F391P
1070Tuesday, September 19, 2017
1070Tuesday, September 19, 2017
1070Tuesday, September 19, 2017
1
0.2
0.2
0.2
Vinafix.com
5
4
3
2
1
For BR UMA
For KBL-R U22
1M_0402_ 1%
U22@
RC46
21
12
12
@
RC2950_0402_5%
For Skylake,YC1 24 MHz (50 Ohm ESR)
For Canno nlake,YC1 38.4 MHz (30 O hm ESR)
546765_546765 _2014WW48_Skylake_MOW_Rev_1 _0
1M_0402_ 1%
U42@
RC421
12
12
RC42233_0402_5%U42@
For Skylake,YC3 24 MHz (50 Ohm ESR)
RC54
10M_0402_5%
12
12
@
RC2960_0402_5%
SIO_SLP_SUS#
@DS3@
RC4410_0402_5%
VCCDSW_EN_Q
NDS3@
8/21 can change to 10K for merge to RP
PCH_BATLOW#
AC_PRESENT
INTRUDER#
MPHYP_PWR_EN
VRALERT#
SIO_SLP_LAN#
SUSCLK
+3.3V_ALW_PCH
+3.3V_ALW
+3.3V_ALW
POWER_SW#_MB<36,46>
DD
CLK_PCIE_N0<33>
WWAN--->
WLAN--->
M.2 SDD--->
LAN--->
Card Reader --->
+3.3V_LAN
CC
RL7010K_0402_5%@
+3.3V_ALW_DSW
RC32310K_0402_5%
RC671K_0402_5%
+1.0V_VCCST
RC711K_0402_5%
+3.3V_ALW_PCH
RC7410K_0402_5%@
10/6 depop , prevent singal step .
RC41110K_0402_5%@
BB
+3.3V_1.8V_PGPPA
H_CPUPWRGDVCCST_PWRGD
100P_040 2_50V8J
12
CC300ESD@
AA
ESD Request:place near CPU side
CLK_PCIE_P0<33>
CLKREQ_PCIE#0<33>
CLK_PCIE_N1<33>
CLK_PCIE_P1<33>
CLKREQ_PCIE#1<33>
CLK_PCIE_N3<40>
CLK_PCIE_P3<40>
CLKREQ_PCIE#3<40>
CLK_PCIE_N4<30>
CLK_PCIE_P4<30>
CLKREQ_PCIE#4<30>
CLK_PCIE_N5<31>
CLK_PCIE_P5<31>
CLKREQ_PCIE#5<31>
LAN_WAKE#
12
12
PCH_PCIE_WAKE#
12
VCCST_PWRGD
12
ME_SUS_PWR_ACK
12
PCH_PWROK
12
@
RC5511K_0402_5%
100P_040 2_50V8J
12
CC301ESD@
+3.3V_RUN
+3.3V_RUN
+3.3V_RUN
+3.3V_RUN
+3.3V_RUN
+3.3V_RUN
12
RC18910K_0402_5%
RC4710K_0402_5%
RC5010K_0402_5%
RC5910K_0402_5%
RC5110K_0402_5%
RC19010K_0402_5%
PCH_PLTRST#
SUSACK#_R
RC215
POP
DE-POP
PCH_DPWROKPCH_RSMRST#_AND
0.01UF_04 02_25V7K
1
@
CC266
2
12
12
12
12
12
12
12
12
12
12
12
@
@
TC7SH08FU_SSOP5~D
@
T9
PAD~D
VCCST_PWRGD<14,35,36>
ME_SUS_PWR_ACK<35>
NO Support Deep sleep
Support Deep sleep
12
RC2150_0402_5%
NDS3@
100K_040 2_1%
12
RC220
@RF@
RC3730_0402_5%
@RF@
RC3740_0402_5%
@RF@
RC3760_0402_5%
@RF@
RC3770_0402_5%
@RF@
RC3780_0402_5%
12
RC620_0402_5%
12
RC2440_0402_5%
+3.3V_ALW_PCH
1
2
UC7
SUSACK#<35>
CLKREQ_PCIE#0_R
CLKREQ_PCIE#1_R
CLKREQ_PCIE#2_R
CLKREQ_PCIE#3_R
CLKREQ_PCIE#4_R
CLKREQ_PCIE#5_R
5
P
PCH_PLTRST#_AND
B
4
O
12
A
G
3
100K_0402_5%
PCH_RSMRST#_AND<14,45>
12
RC771K_0402_5%@
12
RC7860.4_0402_1%
12
@
RC4440_0402_5%
12
RC4430_0402_5%@
12
RC75
10K_0402_5%
PLTRST_LAN# <30>
PCH_PLTRST#_EC <36>
RC65
@
PCH_DPWROK<35>
PCH_PCIE_WAKE#<35,36>
PM_LANPHY_ENABLE<30>
XDP_DBRESET#<14>
+3.3V_RUN
PCH_PLTRST#_AND <31,33,38,40>
PCH_RSMRST#_AND
H_CPUPWRGDH_CPUPWRGD_R
VCCST_PWRGD_CPU
SYS_PWROK<14,35>
PCH_PWROK<56>
ME_SUS_PWR_ACK_R
SUSACK#_R
LAN_WAKE#<30,35>
3.3V_CAM_EN#<29>
RC31110K_0402_5%
RC225@8.2K_0402_5%
RC227@8.2K_0402_5%
CPU@
UC1J
D42
CLKOUT_PCIE_N0
C42
CLKOUT_PCIE_P0
AR10
GPP_B5/SRCCLKREQ0#
B42
CLKOUT_PCIE_N1
A42
CLKOUT_PCIE_P1
AT7
GPP_B6/SRCCLKREQ1#
D41
CLKOUT_PCIE_N2
C41
CLKOUT_PCIE_P2
AT8
GPP_B7/SRCCLKREQ2#
D40
CLKOUT_PCIE_N3
C40
CLKOUT_PCIE_P3
AT10
GPP_B8/SRCCLKREQ3#
B40
CLKOUT_PCIE_N4
A40
CLKOUT_PCIE_P4
AU8
GPP_B9/SRCCLKREQ4#
E40
CLKOUT_PCIE_N5
E38
CLKOUT_PCIE_P5
AU7
GPP_B10/SRCCLKREQ5#
KBL-RU42_BGA1356
PCH_PLTRST#
PCH_PLTRST#_AND
PCH_PLTRST#
SYS_RESET#
XDP_DBRESET#
AN10
B5
AY17
A68
B65
B6
BA20
BB20
AR13
AP11
BB15
AM15
AW17
AT15
12
12
12
if pop UC12, RC291 also need pop(74AHC1G09GW is OD output)
KBL-R U4+2
CLOCK SIGNALS
12
RC600_0402_5%@
12
@
RC3250_0402_5%
CPU@
UC1K
SYSTEM POWER MANAGEMENT
GPP_B13/PLTRST#
SYS_RESET#
RSMRST#
PROCPWRGD
VCCST_PWRGD
SYS_PWROK
PCH_PWROK
DSW_PWROK
GPP_A13/SUSWARN#/SUSPWRDNACK
GPP_A15/SUSACK#
WAKE#
GPD2/LAN_WAKE#
GPD11/LANPHYPC
GPD7/RSVD
KBL-RU42_BGA1356
12
@
RC2900_0402_5%
+3.3V_RUN
5
1
P
B
2
A
G
3
4
O
74AHC1G09GW_TSSOP5
ME_RESET#
KBL-U / KBL-R U4+2
RSVD_E3/XTAL24_IN
RSVD_C7/XTAL24_OUT
XTAL24_OUT/NC_1
CLKOUT_ITPXDP_N
CLKOUT_ITPXDP_P
KBL-R U4+2
SYS_RESET#_R
UC12@
Rev_0.1
XTAL24_IN/NC_2
GPD8/SUSCLK
XCLK_BIASREF
RTCX1
RTCX2
SRTCRST#
RTCRST#
10 OF 20
PLTRST_TPM# <37>
GPP_B11/EXT_PWR_GATE#
RC2241K_0402_5%
XTAL24_IN_U42_CPUXTAL24_IN_U42
E3
XTAL24_OUT_U42_CPU
C7
XTAL24_IN_U22_CPU
E37
XTAL24_OUT_U22_CPU
E35
CLK_ITPXDP_N
F43
CLK_ITPXDP_P
E43
BA17
SUSCLK
XCLK_BIASREF
E42
PCH_RTCX1
AM18
PCH_RTCX2
AM20
AN18
SRTCRST#
AM16
PCH_RTCRST# <35>
PCH_RTCRST#
CMOS1 must take care sho rt & to uch risk on layout placement
PROPRIETARY N OTE: THIS SHEET OF EN GINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANS FERRED OR COPIED WITHOUT THE EXPRESS W RITTEN AUTHORIZATION O F DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL 'S EXP RESS WRITTEN CONSENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
Service Mode Switch:
Add a switch to M E_FWP signal to unlo ck the ME region and
allow the ent ir e r egi on of the SPI f l ash to be updat ed us i ng FPT.
+3.3V_ALW_PCH
ME_FWP PCH has internal 20K PD.
(suspend power rail )
FLASH DESCRIPTOR SECURITY OVERRIDE
HOST_SD_WP# <31>
@ESD@
CC304
ME_FWP
@
RC2210_0402_5%
PT,ST pop RC222 and SW1; MP pop RC221
RC222
@
1K_0402_5%
12
ME_FWP<35>
LOW = ENABLE (DEFAULT) -->Pin1 & Pin3 short
HIGH = DISABLE (ME can update) -->Pin2 & Pin3 short
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
ESD request,Place near JXDP1 side.ESD request,Place near UC8 side.
12
0.1U_0402_25V6
@ESD@
CC307
CPU_XDP_TMS
RC13151_0402_5%
CPU_XDP_TDI
RC13451_0402_5%
CPU_XDP_TDO
RC135100_0402_5%
CPU_XDP_TRST#
RC136@51_0402_5%
CPU_XDP_TCLK
RC13951_0402_5%
XDP_TMS
TDI_XDP
TDO_XDP
12
@
RC2280_0402_5%
12
@
RC2290_0402_5%
12
@
RC2300_0402_5%
12
12
12
12
12
0.1U_0402_25V6
@ESD@
12
CC308
+1.0V_VCCSTG
PCH_JTAG_TMS <12>
PCH_JTAG_TDI <12>
PCH_JTAG_TDO <12>
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (9/14)
CPU (9/14)
CPU (9/14)
LA-F391P
LA-F391P
LA-F391P
1470Tuesday, September 19, 2017
1470Tuesday, September 19, 2017
1470Tuesday, September 19, 2017
1
0.2
0.2
0.2
Vinafix.com
5
4
3
2
1
+VCC_CORE: 0.3~1.35V
DD
@
T122
PAD~D
@
T123
PAD~D
CC
VCCOPC,VCCOPC_1P8,VCCEOPIO for SKYLAKE-U 2+3e
(w/ on package cach e)
PSC(Primary side cap) : Place as close to the pa ckage as possible
BSC(Backside cap) : Place on secondary si de, underneath the pack age
Component placement order:
Package edge > 0402 caps > 0805 caps > Bulk ca ps >Power sour ce
BB
SVID ALERT
VIDALERT_N<56>
SVID DATA
AA
VIDSOUT<56>
+1.0V_VCCST
12
+1.0V_VCCST
12
56_0402_1%
RC152
100_0402_1%
RC157
CAD Note: Place the PU resistors clo se to CPU
RC204 close to CPU 300 - 1500mil s
H_CPU_SVIDALRT#
12
RC153220_0402_5%
CAD Note: Place the PU resistors clo se to CPU
RC208close to CPU 300 - 1500mils
VIDSOUT
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
5
4
3
2
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (10/14)
CPU (10/14)
CPU (10/14)
LA-F391P
LA-F391P
LA-F391P
1570Tuesday, September 19, 2017
1570Tuesday, September 19, 2017
1570Tuesday, September 19, 2017
1
0.2
0.2
0.2
Vinafix.com
5
4
3
2
1
+VCCGT: 0.3~1.35V
KBL-R 4+2 and KBL-U 2+2&2+3e opt i on ( pl ace on p ower page)
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
3
UZ35
RZ3200_0402_5%@
+5V_ALW
+3.3V_ALW
5
1
P
B
2
A
G
3
12
4
O
+1.0V_VCCST+1.0V_VCCSTG
12
RZ1510_0603_5%@
pop option with UZ19
1 2
CZ106 0.1U_0201_10V6K
6
5
12
PJP2
PAD-OPEN1x1m
+1.0V_VCCSTG_C
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
Title
SizeDocument NumberRe v
SizeDocument NumberRe v
SizeDocument NumberRe v
Date:Sheetof
Date:Sheetof
Date:Sheetof
Compal Electronics, Inc.
CPU (12/14)
CPU (12/14)
CPU (12/14)
LA-F391P
LA-F391P
LA-F391P
1
0.2
0.2
1770Tuesday, September 19, 2017
1770Tuesday, September 19, 2017
1770Tuesday, September 19, 2017
0.2
Vinafix.com
5
+1.0V_PRIM
DD
+1.8V_PRIM
CC
+3.3V_ALW_PCH
+1.8V_PRIM
@ESPI@
BB
12
@
RC2990_0603_5%
12
@
RC3000_0402_5%
12
@
RC3010_0402_5%
12
@
RC3020_0402_5%
12
@
RC3030_0402_5%
12
@
RC3040_0402_5%
12
RC2340_0402_5%@
12
@
RC2350_0402_5%
12
RC2110_0402_5%LPC@
12
RC2120_0402_5%
12
@
RC3050_0402_5%
12
@
RC3060_0402_5%
12
@
RC3070_0402_5%
12
@
RC3080_0402_5%
+3.3V_ALW_PCH
12
LC1BLM15GA750SN1D_2P
1
CC215
2
@
1U_0402_6.3V6K
+1.0V_MPHYAON
+1.0V_CLK6
+1.0V_DTS
+1.0V_CLK1
+1.0V_CLK3
+1.8V_PGPPF
+3.3V_1.8V_PGPPG
close UC1.AF20 and <400mil
+3.3V_1.8V_PGPPA
+3.3V_1.8V_ESPI
PJP4
12
+3.3V_PGPPB+3.3V_ALW_PCH
PAD-OPEN1x1m
Must be +1.8V for eSPI I/F
+3.3V_PGPPC
+3.3V_PGPPD
+3.3V_PGPPE
8/28 schematic r eview
LC1,LC2 need link SM01000S100(S SUPPRE_ FBMA-1H-100505-601T 0402)
+3.3V_VCCHDA
1
CC313
2
0.1U_0201_10V6K
close UC1.AJ19 a nd <400mil
AA
12
@
RC1730_0402_5%
close UC1.N20 and <100mil
5
+1.0V_CLK4+1.0V_PRIM
1
CC226
2
@
47U_0805_6.3V6M
+1.0V_MPHYAON
1
2
CC203
1U_0402_6.3V6K
+1.0V_MPHYGT
close UC1.N15 and CC210 <400mil, C C211 <120mil
1
2
+1.0V_SRAM
1
2
close UC1.K15, UC1.L15 and <100mil
@
12
RC1690_0603_5%
1
2
CC281
@
0.1U_0201_10V6K
+1.0V_PRIM
12
LC2BLM15GA750SN1D_2P
1
CC225
2
@
47U_0805_6.3V6M
close UC1.V15 and <100mil
12
@
RC1700_0402_5%
close UC1.K19 an d <100mil
4
close UC1.AL1 and <120mil
1
2
CC204
1U_0402_6.3V6K
1
CC210
2
CC211
@
1U_0402_6.3V6K
47U_0805_6.3V6M
CC217
+1.0V_APLLEBB
@
1U_0402_6.3V6K
1
2
+1.0V_AMPHYPLL+1.0V_MPHYGT
1
CC219
2
@
+1.0V_CLK2+1.0V_PRIM
1
CC220
2
@
4
+1.0V_PRIM_CORE+1.0VO_DSW
1
2
close UC1.AB19 an d <400milclose UC1.K17 an d <120mil
CC205
@
1U_0402_6.3V6K
close UC1.AF18 and <400mil
+1.0V_AMPHYPLL
+1.0V_APLL
+1.0V_PRIM
+3.3V_ALW_DSW
+3.3V_VCCHDA
+3.3V_SPI
+3.3V_ALW_PCH
+1.0V_PRIM
close UC1.N18 and <120mil
CC218
1U_0402_6.3V6K
close UC1.K15 an d <120mil
1
2
CC264
@
1U_0402_6.3V6K
47U_0805_6.3V6M
+1.0V_APLL
1
CC314
2
0.1U_0201_10V6K
47U_0805_6.3V6M
+1.0V_PRIM
1
CC206
2
@
1U_0402_6.3V6K
Support DS3
No Support DS3
3
PCH PWR
UC1O
CPU@
AB19
VCCPRIM_1P0
AB20
VCCPRIM_1P0
P18
VCCPRIM_1P0
AF18
VCCPRIM_CORE
AF19
VCCPRIM_CORE
V20
VCCPRIM_CORE
V21
VCCPRIM_CORE
AL1
DCPDSW_1P0
K17
VCCMPHYAON_1P0
L1
VCCMPHYAON_1P0
N15
VCCMPHYGT_1P0_N15
N16
VCCMPHYGT_1P0_N16
N17
VCCMPHYGT_1P0_N17
P15
VCCMPHYGT_1P0_P15
P16
VCCMPHYGT_1P0_P16
K15
VCCAMPHYPLL_1P0
L15
VCCAMPHYPLL_1P0
V15
VCCAPLL_1P0
AB17
VCCPRIM_1P0_AB17
Y18
VCCPRIM_1P0_Y18
AD17
VCCDSW_3P3_AD17
AD18
VCCDSW_3P3_AD18
AJ17
VCCDSW_3P3_AJ17
AJ19
VCCHDA
AJ16
VCCSPI
AF20
VCCSRAM_1P0
AF21
VCCSRAM_1P0
T19
VCCSRAM_1P0
T20
VCCSRAM_1P0
AJ21
VCCPRIM_3P3_AJ21
AK20
VCCPRIM_1P0_AK20
N18
VCCAPLLEBB_1P0
KBL-RU42_BGA1356
+3.3V_ALW_DSW+3.3V_ALW_PCH
'V' mean POP, 'X' mean DE-POP
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
Note1: VCCPRIM_CORE Implementat i on wit h PC H C ORE_VI D Rec o mmenda t i on
AA
DELL CONFIDENTIAL/PROPRIETARY
Compal Electronics, Inc.
Compal Electronics, Inc.
Title
Title
PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTH ER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOC UMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NO R THE INFORMATION IT CONTAINS WAY B E USED BY OR DISCLOSED TO ANY THIRD
PARTY WITHOUT DELL'S EXPRESS WRITTEN CON SENT.
PROPRIETARY NOTE: THIS SHEET OF ENG INEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
PROPRIETARY NOTE: THIS SHEET OF ENG INEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL
TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT
BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION,
NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS WAY BE USED BY OR DISCLOSED TO ANY THIRD
5
4
3
PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
2
Title
Size Docum ent Numb erRe v
Size Docum ent Numb erRe v
Size Docum ent Numb erRe v
Dat e:Shee tof
Dat e:Shee tof
Dat e:Shee tof
DDR4
DDR4
DDR4
LA-F391P
LA-F391P
LA-F391P
1
2170Tuesday, September 19, 2017
2170Tuesday, September 19, 2017
2170Tuesday, September 19, 2017
0.2
0.2
0.2
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