Codan NGT Repair guide

NGT Transceiver System

Repair Guide

No part of this guide may be reproduced, transcribed, translated into any language or
transmitted in any form whatsoever without the prior written consent of Codan Limited.

© Copyright 2006 Codan Limited

NGT®, Easitalk® and CALM® are registered trademarks of Codan Limited. Other brand,
product and company names mentioned in this document are trademarks or registered
trademarks of their respective holders.

Codan part number 15-04143-EN Issue 1, May 2006

The English version takes precedence over any translated versions.

CODAN

www.codan.com.au

Head Office

Codan Limited
ABN 77 007 590 605
81 Graves Street
Newton SA 5074
AUSTRALIA
Telephone [phone]
Facsimile [phone]

[e-mail]

Codan (UK) Ltd
Gostrey House
Union Road
Farnham Surrey GU9 7PT
UNITED KINGDOM
Telephone [phone]
Facsimile [phone]

[e-mail]

Codan US, Inc.
8430 Kao Circle
Manassas VA 20110
USA
Telephone [phone]
Facsimile [phone]

[e-mail]

NGT Transceiver System Repair Guide i

Table of contents

Introduction

Overview of this guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

How to use this guide. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

Board replacement philosophy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2

Circuit board precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

Transmitter precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Probe precautions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

Compliance

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6

European Radio and Telecommunications Terminal Equipment Directive. . . . . . . . . . . . . . . . . . . . .7

Electromagnetic compatibility and safety notices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

FCC compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

C-tick approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

Contact information

Ordering information

Overview

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Pin connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

RF unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Junction box (used with 2010 RF Units only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Brief description (2010 RF Unit with 2030 Junction Box)

General information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35

Transmit path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Handset transmit path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Junction box transmit path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

CIB transmit path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

RF unit transmit path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

Receive path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

RF unit receive path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Junction box receive path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39

Synthesiser operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

Control and switching. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40

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ii NGT Transceiver System Repair Guide

Brief description (2011/2012 RF Unit)

General information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

Transmit path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Handset transmit path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

RF unit transmit path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44

Receive path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

RF unit receive path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45

Synthesiser operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Control and switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46

Interconnection diagrams and listed spares drawings

Functional description of PCBs

Handset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Handset PCB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61

Junction box (used with 2010 RF Units only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Audio PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63

Microprocessor PCB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

RF unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Audio Interface PCB (2010 RF Unit only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68

Audio & Interconnect PCB (2011 RF Unit only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70

Audio Interconnect & Data I/O PCB (2012 RF Unit only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72

Application Processor PCB (2010 RF Unit only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74

Application Processor Handset I/F 3 V PCB (2011 RF Unit only) . . . . . . . . . . . . . . . . . . . . . . . 76

Application Processor Handset & Data I/F PCB (2012 RF Unit only) . . . . . . . . . . . . . . . . . . . . 78

RF/IF PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80

PA PCB. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83

Filter and Control PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86

Repair procedures, tests, and adjustments

Test equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Test equipment required . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90

Test equipment configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Repair procedures and fault diagnosis. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93

Mechanical inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 94

Operational tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95

Receive tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97

Transmit tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102

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NGT Transceiver System Repair Guide iii

Adjustments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110

Adjusting frequency. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .110

Adjusting the PA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .111

Test sheet for the NGT series Transceiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .141

Options

Definitions

Standards and icons . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .147

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .148

Acronyms and abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .148

Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .151

Circuit reference designations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153

Units. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .154

Unit multipliers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .155

About this issue . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156

Specifications

General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157

Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .159

Transmitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .160

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iv NGT Transceiver System Repair Guide

This page has been left blank intentionally.

NGT Transceiver System Repair Guide v

List of figures

Figure 1: Relationship of the 2010 RF Unit, 2030 Junction Box, and 2020 Handset . . . . . . . .18

Figure 2: Relationship of the 2011/2012 RF Unit and 2020 Handset . . . . . . . . . . . . . . . . . . . .19

Figure 3: Rear panel of the 2010 RF Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Figure 4: Rear panel of the 2011 RF Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Figure 5: Rear panel of the 2012 RF Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Figure 6: Front view of the CIB connector on the RF unit (2010 RF Unit only). . . . . . . . . . . .21

Figure 7: Front view of the antenna control connector on the RF unit . . . . . . . . . . . . . . . . . . .22

Figure 8: Front view of the fan connector on the RF unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Figure 9: Front view of the 10-way connector on the RF unit (2011/2012 RF Unit

only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

Figure 10: Front view of the 4-way connector on the RF unit (2011/2012 RF Unit

only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Figure 11: Front view of the handset and speaker connector attached to the RF unit

(2011/2012 RF Unit only). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25

Figure 12: Front view of the 15-way GPIO connector on the RF unit (2012 RF Unit

only) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Figure 13: Connector panel of the junction box. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27

Figure 14: Front view of the handset connector on the junction box. . . . . . . . . . . . . . . . . . . . . .27

Figure 15: Front view of a CIB connector on the junction box . . . . . . . . . . . . . . . . . . . . . . . . . .28

Figure 16: Front view of the 9-way serial data connector on the junction box . . . . . . . . . . . . . .29

Figure 17: Front view of the 15-way GPIO connector on the junction box. . . . . . . . . . . . . . . . .30

Figure 18: Representation of the waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36

Figure 19: Handset PCB (08-05300-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Figure 20: Audio PCB (08-05470-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Figure 21: Audio PCB (08-05986-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Figure 22: Microprocessor PCB (08-05317-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52

Figure 23: Audio Interface PCB (08-05266-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

Figure 24: Audio & Interconnect PCB (08-05988-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

Figure 25: Audio Interconnect & Data I/O PCB (08-06261-001) . . . . . . . . . . . . . . . . . . . . . . . .54

Figure 26: Application Processor PCB (08-05265-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54

Figure 27: Application Processor Handset I/F 3 V PCB (08-05987-001) . . . . . . . . . . . . . . . . . .56

Figure 28: Application Processor Handset & Data I/F PCB (08-06260-001) . . . . . . . . . . . . . . .56

Figure 29: RF/IF PCB (08-05261-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

Figure 30: RF/IF PCB (08-05889-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .56

Figure 31: PA PCB (08-05415-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

Figure 32: PA PCB (08-05511-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

Figure 33: PA PCB (08-05869-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

Figure 34: PA PCB (08-06461-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .58

Figure 35: Filter and Control PCB (08-05416-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60

Figure 36: Filter and Control PCB (08-05910-001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .60

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vi NGT Transceiver System Repair Guide

Figure 37: Setup for 2010 RF Unit with 2030 Junction Box . . . . . . . . . . . . . . . . . . . . . . . . . . . 91

Figure 38: Setup for 2011/2012 RF Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92

Figure 39: Acceptable two-tone RF envelope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106

Figure 40: Defective two-tone RF envelope (typical overbias of PA) . . . . . . . . . . . . . . . . . . . 106

Figure 41: Defective two-tone RF envelope (typical underbias of PA) . . . . . . . . . . . . . . . . . . 107

Figure 42: Defective two-tone RF envelope (typical spurious-related problems) . . . . . . . . . . 107

Figure 43: Intermodulation measurements using a spectrum analyser . . . . . . . . . . . . . . . . . . . 108

Figure 44: Setup for adjusting the bias gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 116

Figure 45: Repair flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121

Figure 46: 2010 Power On fault diagnosis flow chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123

Figure 47: 2011 Power On fault diagnosis flow chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125

Figure 48: 2012 Power On fault diagnosis flow chart. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

Figure 49: 2010 Receive fault diagnosis flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129

Figure 50: 2011 Receive fault diagnosis flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131

Figure 51: 2012 Receive fault diagnosis flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 133

Figure 52: 2010 Transmit fault diagnosis flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135

Figure 53: 2011 Transmit fault diagnosis flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137

Figure 54: 2012 Transmit fault diagnosis flow chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139

NGT Transceiver System Repair Guide vii

List of tables

Table 1: Earth symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

Table 2: Pinouts of the CIB connector on the RF unit (2010 RF Unit only) . . . . . . . . . . . . . .21

Table 3: Pinouts of the antenna control connector on the RF unit . . . . . . . . . . . . . . . . . . . . . .22

Table 4: Pinouts of the DC supply connector on the RF unit . . . . . . . . . . . . . . . . . . . . . . . . . .22

Table 5: Pinouts of the fan connector on the RF unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Table 6: Pinouts of the 10-way connector on the RF unit (2011/2012 RF Unit only) . . . . . . .24

Table 7: Pinouts of the 4-way connector on the RF unit (2011/2012 RF Unit only) . . . . . . . .25

Table 8: Pinouts of the 15-way GPIO connector on the RF unit (2012 RF Unit only) . . . . . .26

Table 9: Pinouts of the handset connector on the junction box . . . . . . . . . . . . . . . . . . . . . . . .27

Table 10: Pinouts of the CIB connectors on the junction box . . . . . . . . . . . . . . . . . . . . . . . . . .28

Table 11: Pinouts of the speaker connector on the junction box . . . . . . . . . . . . . . . . . . . . . . . .28

Table 12: Pinouts of the 9-way serial data connector on the junction box . . . . . . . . . . . . . . . . .29

Table 13: Pinouts of the 15-way GPIO connector on the junction box . . . . . . . . . . . . . . . . . . .30

Table 14: Pinouts of the headphone jack on the desk console . . . . . . . . . . . . . . . . . . . . . . . . . .31

Table 15: List of drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47

Table 16: Test points for the Handset PCB (08-05300-001) . . . . . . . . . . . . . . . . . . . . . . . . . . .62

Table 17: Test points for the Audio PCB (08-05470-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64

Table 18: Test points for the Audio PCB (08-05986-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65

Table 19: Test points for the Microprocessor PCB (08-05317-001) . . . . . . . . . . . . . . . . . . . . .67

Table 20: Test points for the Audio Interface PCB (08-05266-001) . . . . . . . . . . . . . . . . . . . . .69

Table 21: Test points for the Audio & Interconnect PCB (08-05988-001) . . . . . . . . . . . . . . . .71

Table 22: Test points for the Audio Interconnect & Data I/O PCB (08-06261-001) . . . . . . . . .73

Table 23: Test points for the Application Processor PCB (08-05265-001) . . . . . . . . . . . . . . . .75

Table 24: Test points for the Application Processor Handset I/F 3 V PCB

(08-05987-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77

Table 25: Test points for the Application Processor Handset & Data I/F PCB

(08-06260-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .79

Table 26: Test points for the RF/IF PCB (08-05261-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81

Table 27: Test points for the RF/IF PCB (08-05889-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82

Table 28: Test points for the PA PCB (08-05415-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84

Table 29: Test points for the PA PCB (08-05511-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .84

Table 30: Test points for the PA PCB (08-05869-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85

Table 31: Test points for the PA PCB (08-06461-001) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .85

Table 32: Test points for the Filter and Control PCB (08-05416-001). . . . . . . . . . . . . . . . . . . .87

Table 33: Test points for the Filter and Control PCB (08-05910-001). . . . . . . . . . . . . . . . . . . .88

Table 34: 100 W output power scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105

Table 35: 125 W output power scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105

Table 36: Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145

Table 37: General specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .157

List of tables

viii NGT Transceiver System Repair Guide

Table 38: Receiver specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159

Table 39: Transmitter specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160

NGT Transceiver System Repair Guide Index-1

Index

Numerics

10-way connector

pinouts 24
2010 Power On fault diagnosis flow chart 123
2010 Receive fault diagnosis flow chart 129
2010 Transmit fault diagnosis flow chart 135
2011 Power On fault diagnosis flow chart 125
2011 Receive fault diagnosis flow chart 131
2011 Transmit fault diagnosis flow chart 137
2012 Power On fault diagnosis flow chart 127
2012 Receive fault diagnosis flow chart 133
2012 Transmit fault diagnosis flow chart 139
4-way connector

pinouts

25

A

A/F

distortion 160

power 160

response 160, 161
adjustments 89, 110

frequency 110

PA 111

active bias 117
balance control 117
bias gain 116
driver bias 111
high output power 114
low output power 115
PA bias 113
PA gain 119

AGC 159

test 98
ALC 161

test 103
antenna control connector

pinouts 22
Audio Output test 99

B

balance control

adjusting 117
Basic Receive test 97
Basic Transmit test 102
bias

active

adjusting

117

gain

adjusting

116

blocking 159

brief description

2010

33

control and switching 40
receive path 39
synthesiser operation 40
transmit path 36

2011/2012 41

control and switching 46
receive path 45
synthesiser operation 46
transmit path 44

C

carrier suppression 161
channels

capacity

157

checks 89
CIB

transmit path

37

CIB connector

pinouts 21, 28
clarifier 160
compliance 5

electromagnetic compatibility and safety notices 8

earth symbols 9
electrical safety 9

electromagnetic compatibility 8
FCC 10
IC 11
R&TTE Directive 7

declarations of conformity 7

product marking and labelling 7

protection of the radio spectrum 7

connectors

desk console

headphone

31

junction box

CIB 28

GPIO 30

handset 27

serial data 29

speaker 28
RF unit

10-way 24

4-way 25

antenna control 22

CIB 21

DC supply 22

fan 23

GPIO 26

handset and speaker 25

RF 22

Index

Index-2 NGT Transceiver System Repair Guide

control and switching

2010 40

2011/2012 46
cooling 158
C-tick 11

D

DC supply connector

pinouts 22
description

functional

PCB

49

desensitisation 159
desk console

headphone connector

31

distortion

A/F 160
driver bias

adjusting 111
duty cycle 160

E

electromagnetic compatibility and safety notices

compliance

earth symbols 9
electrical safety 9
electromagnetic compatibility 8

emission

harmonic 161

spurious 161

F

fan connector

pinouts 23
fault diagnosis 93
FCC compliance 10
flow chart

2010 Power On fault diagnosis

123

2010 Receive fault diagnosis 129

2010 Transmit fault diagnosis 135

2011 Power On fault diagnosis 125

2011 Receive fault diagnosis 131

2011 Transmit fault diagnosis 137

2012 Power On fault diagnosis 127

2012 Receive fault diagnosis 133

2012 Transmit fault diagnosis 139

Repair 121
frequency

generation 157

IF 159

range 157

stability 157
Frequency test 103

functional description

PCB 49

Application Processor (2010) 74
Application Processor Handset & Data I/F (2012) 78
Application Processor Handset I/F 3 V (2011) 76
Audio 63
Audio & Interconnect (2011) 70
Audio Interconnect & Data I/O (2012) 72
Audio Interface (2010) 68
Filter and Control 86
Handset 61
Microprocessor 66
PA PCB 83
RF/IF 80

G

general specifications 157
GPIO connector

pinouts 26, 30

H

handset

size 158
weight 158

handset and speaker connector

pinouts 25

handset connector

pinouts 27
Handset test 97
handset transmit path 36, 44
harmonic emissions 161
headphone connector

pinouts

31

heatsink 160
high output power

adjusting

114

I

IC certification 11
image rejection 159
impedance 157
interconnection diagrams 47
intermodulation 159, 161

inband 160
Intermodulation and Distortion test 106

using a spectrum analyser 108

using an oscilloscope 106

J

junction box

connectors

CIB

28

GPIO 30
handset 27

Index

NGT Transceiver System Repair Guide Index-3

serial data 29

speaker 28
receive path 39
size 158
transmit path 36
weight 158

L

listed spares drawings 47
low output power

adjusting 115

M

maintenance

circuit boards

excessive heat 3

unsoldering 3
CMOS devices

grounding 3

handling 3

switching off 3
general

spare boards 2
precautions

probe 4

transmitter 4

mechanical inspection 94
microphone 161

N

Noise Limiter test 100

O

operating modes 157
operational tests 95

examining the profile 96
Handset 97
Power On 96
setting up equipment for 95

options 145
output

power 160

oven warm up time 157
overview 17, 18

P

PA

adjusting 111

active bias 117

balance control 117

bias gain 116

driver bias 111

high output power 114

low output power 115
PA bias 113
PA gain 119

PCB layout

Application Processor (2010) 54
Application Processor Handset & Data I/F (2012) 56
Application Processor Handset I/F 3 V (2011) 56
Audio 52
Audio & Interconnect (2011) 54
Audio Interconnect & Data I/O (2012) 54
Audio Interface (2010) 54
Filter and Control 60
Handset 52
Microprocessor 52
PA PCB 58
RF/IF 56

PCBs

handset 61
junction box 63
RF unit 68

pin connections 20

desk console

headphone connector

31

junction box

CIB connectors 28
GPIO connector 30
handset connector 27
serial data connector 29
speaker connector 28

RF unit

10-way connector 24
4-way connector 25
antenna control connector 22
CIB connector 21
DC supply connector 22
fan connector 23
GPIO connector 26
handset and speaker connector 25

power

A/F 160
output 160

reflected 160
Power On test 96
programming 157
protection 160

input 159

overvoltage 158

thermal 160

R

R&TTE Directive

compliance 7

declarations of conformity 7
product marking and labelling 7
protection of the radio spectrum 7

Index

Index-4 NGT Transceiver System Repair Guide

receive path

brief description

2010 39
2011/2012 45

junction box 39
RF unit

2010

39

2011/2012 45

receive tests 97

AGC 98
Audio Output 99
Basic Receive 97
Noise Limiter 100
Selectivity 100
Sensitivity 98

receiver

specifications 159
relative humidity 158
repair 89
Repair flow chart 121
repair procedures 93
required test equipment 90
response

A/F 160, 161
RF connector 22
RF Output Power test 104
RF unit

connectors

10-way

24

4-way 25
antenna control 22
CIB 21
DC supply 22
fan 23
GPIO 26
handset and speaker 25
RF 22

receive path

2010 39
2011/2012 45

size 158

transmit path

2010 37
2011/2012 44

weight 158

S

safety

radiation 8
selectivity 159
Selectivity test 100
sensitivity 159
Sensitivity test 98
serial data connector

pinouts

29

sideband

unwanted

161

signal

input

160

size

handset 158
junction box 158
RF unit 158

spare boards 2
speaker connector

pinouts 28

specifications 17, 157

general 157
receiver 159
transmitter 160

spurious

emissions 161

responses 159
supply current 158, 160
supply voltages 157
suppression

carrier

161

switching 157
synthesiser operation

2010 40

2011/2012 46

T

TDM audio

channels 36
temperature 158
test equipment

required 90

setup 91
test sheet 141
tests 89

operational 95

examining the profile 96
Handset 97
Power On 96
setting up equipment for 95

receive 97

AGC 98
Audio Output 99
Basic Receive 97
Noise Limiter 100
Selectivity 100
Sensitivity 98

transmit 102

ALC 103
Basic Transmit 102
Frequency 103
Intermodulation and Distortion 106

using a spectrum analyser 108
using an oscilloscope 106

Index

NGT Transceiver System Repair Guide Index-5

RF Output Power 104
setting up equipment for 102

transmit path

brief description

2010

36

2011/2012 44
CIB 37
handset 36, 44
junction box 36
RF unit

2010 37

2011/2012 44

transmit tests 102

ALC 103
Basic Transmit 102
Frequency 103
Intermodulation and Distortion 106

using a spectrum analyser 108

using an oscilloscope 106
RF Output Power 104
setting up equipment for 102

transmitter

specifications

160

U

unwanted sideband 161

V

voltages

supply 157

W

weight

handset 158
junction box 158
RF unit 158

Index

Index-6 NGT Transceiver System Repair Guide

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NGT Transceiver System Repair Guide 1

Introduction

Overview of this guide

This Repair Guide is for Codan Accredited Service Centres, enabling them to provide
rapid and cost-effective service to customers, through diagnosis and repair of faulty
equipment.

This guide provides an overview of the equipment and its specifications, functional
descriptions, fault diagnosis to board level, board replacement, functional testing and
interconnection diagrams for the NGT series Transceivers. The fault diagnosis and
testing procedures provided assume that the transceiver is unoptioned.

This guide assumes that you have a good understanding of electronics, and a technical
background.

This guide contains the following sections:

Compliance—compliance information and safety notices

Contact information—explains how to contact Codan if technical assistance is required

Ordering information—explains the details required by Codan to ensure prompt service

and delivery

Overview—general description of the transceivers

Brief description (2010 RF Unit with 2030 Junction Box)—brief technical description of

the 2010 RF Unit with 2030 Junction Box and 2020 Handset, including a general
description of the major circuit functions for the control, reception and transmission of
signals

Brief description (2011/2012 RF Unit)—brief technical description of the

2011/2012 RF Unit with 2020 Handset, including a general description of the major
circuit functions for the control, reception and transmission of signals

Interconnection diagrams and listed spares drawings—provides drawings that are

required during repair of an NGT series Transceiver

Functional description of PCBs—functional description of each PCB including a list of

test points and PCB layouts

Repair procedures, tests, and adjustments—provides flow charts and tests for identifying

faulty subassemblies, and a test sheet for recording test data

Options—provides drawings and instructions for identifying and checking correct

operation of hardware options in the transceiver

Definitions—lists all standards, acronyms, abbreviations and units used in this guide

Specifications—specifications for the NGT series Transceivers

Introduction

2 NGT Transceiver System Repair Guide

How to use this guide

This guide contains pages that fold out beyond the folder on either side. This enables you
to view block diagrams, test point layouts and flow charts while reading relevant text on
tests and procedures.

Begin the fault diagnosis process by using Figure 45 on page 121. The same flow chart is
also used to confirm that a transceiver is operating correctly.

Follow the steps in Figure 45 on page 121 systematically to ensure the correct fault is
isolated. If you step out of the flow chart to a test procedure, return to the same point on
the flow chart upon completing the test, and continue as prompted.

At some points where a pass criteria is not met, the Repair flow chart refers to a function-
specific fault diagnosis flow chart. Some steps require a simple task to be performed.
Other steps require a test to be performed. In such a case, the PCB, test point, and test
condition are provided.

Board replacement philosophy

To facilitate rapid and cost-effective service to customers, and to effectively manage the
increasing sophistication of electronic assemblies, a strategy of board replacement
applies to all NGT series Transceivers.

As part of this strategy, all boards are designed and tested so that any individual board
can be replaced, while maintaining factory specifications of the entire unit.

If functional spare boards are held in stock, they may be substituted during the fault
diagnosis process in order to positively localise the fault to one board.

NOTE

Not all faults may be diagnosed from the fault diagnosis flow charts due
to the complex nature of the transceiver. In such an instance, or to confirm
that a PCB is faulty, see page 49, Functional description of PCBs.

Introduction

NGT Transceiver System Repair Guide 3

Circuit board precautions

Switching off

Ensure that power supplies are switched off before making connections or
disconnections between circuit boards.

Handling

Handle circuit boards as little as possible.

Grounding

Anything connected to or touching the circuit board tracks should be grounded as
follows:

• Ground test equipment connected to a board through its mains lead.

• Discharge static charges, which may build up on a person, by touching a grounded
metal surface with both hands. This should be done before working on, and at
frequent intervals while working on circuit boards.

• Wear a suitably grounded conductive wrist strap. This will minimise the build up of
static on you.

Excessive heat

Excessive heat may lift the track from the circuit boards. This will cause serious damage.
Avoid the use of high-powered soldering irons. A soldering iron rated at a maximum of
60 W, preferably temperature-controlled at approximately 370°C, is sufficient for most
tasks. A soldering iron rated at a slightly higher temperature of 425°C may be required
for heavier components such as PA transistors. Only apply the soldering iron long
enough to unsolder an existing joint, or to solder a new one.

Unsoldering

When unsoldering a component, use a solder sucker or solder wick to remove solder.

CAUTION

Do not use sharp metal tools such as screwdrivers or twist drills to remove
components as these may damage the printed circuit track and plated thru-
holes.

Introduction

4 NGT Transceiver System Repair Guide

Transmitter precautions

When making measurements of the low-level stages of the exciter, it is advisable to
remove the drive to the PA PCB. The supply voltage is applied to the PA at all times
when the transceiver is switched on.

Probe precautions

Observe the following when connecting oscilloscope probes to the transceiver:

• When connecting probes to the PA assembly, the earth clip lead should be wound
around the body of the probe so that the earth clip just reaches the probe tip. This
reduces stray RF pick-up.

• The earth clip should be connected to the ground plane, adjacent to the point of
measurement.

• It is not advisable to connect two probes at the same time, particularly when one is
earthed to the PA ground plane and the other is earthed to the exciter. This may
cause earth loop problems.

• Probes should be connected after power has been applied to the transceiver and the
test equipment. The earth connection should be made first and disconnected last.

CAUTION

Caution should be exercised when connecting probes to avoid incorrect
readings.

NGT Transceiver System Repair Guide 5

Compliance

This section contains the following topics:

Introduction (6)

European Radio and Telecommunications Terminal Equipment Directive (7)

Electromagnetic compatibility and safety notices (8)

FCC compliance (10)

IC certification (11)

C-tick approval (11)

Compliance

6 NGT Transceiver System Repair Guide

Introduction

This section describes how to ensure that an NGT series Transceiver complies with the
European Electromagnetic Compatibility Directive 89/336/EEC and the European Low
Voltage Directive 73/23/EEC as called up in the European Radio and
Telecommunications Terminal Equipment Directive 1999/5/EC.

The CE Declarations of Conformity and Expert Letters of Opinion for this product range
are listed on page 156, Associated documents. These documents can be made available
upon request to Codan or a Codan-authorised supplier.

This section also contains the requirements for FCC compliance, IC certification and
C-tick.

Compliance

NGT Transceiver System Repair Guide 7

European Radio and Telecommunications Terminal Equipment Directive

The NGT series Transceivers have been tested and comply with the following standards
and requirements (articles of the R&TTE Directive):

• Article 3.1b: ETSI EN 301 489-1

• Article 3.1b: ETSI EN 301 489-15

• Article 3.2: Australian type approval according to AZ/NZS 4770:2003 or ECR 209

• Article 3.1a: assessed against ICNIRP and FCC requirements

• Article 3.1a: EN 60950

Product marking and labelling

Any equipment supplied by Codan that satisfies these requirements is identified by the

, , or markings on the model label of the product.

Declarations of Conformity and Expert Letters of Opinion

The CE Declarations of Conformity and Expert Letters of Opinion for this product range
are listed on page 156, Associated documents. These documents can be made available
upon request to Codan or a Codan-authorised supplier.

Protection of the radio spectrum

CAUTION

Most countries restrict the use of HF radio communications equipment to
certain frequency bands and/or require such equipment to be licensed. It is
the user’s responsibility to check the specific requirements with the
appropriate communications authorities. If necessary, contact Codan for
more information.

0191 0191

Compliance

8 NGT Transceiver System Repair Guide

Electromagnetic compatibility and safety notices

Radiation safety

To ensure optimal transceiver performance and to avoid exposure to excessive
electromagnetic fields, the antenna system must be installed according to the instructions
provided.

Safe working distance is based on continuous exposure to CW-type transmissions, as set
out in the ICNIRP Exposure Guidelines (1998) for occupational exposure. Safe working
distance can be reduced with normal voice communication.

Electromagnetic compatibility

To ensure compliance with the EMC Directive is maintained, you must:

1 Use standard shielded cables supplied from Codan (where applicable).
1 Ensure the covers for the equipment are fitted correctly.

1 Cover unused connectors on the junction box (if fitted) and RF unit with the

protective caps supplied to prevent electrostatic discharge passing through your
NGT equipment.

WARNING

High voltages exist on the antenna during transmission and tuning. Do not
touch the antenna during these activities. RF burns may result.

WARNING

Install the grounding system or counterpoise as directed to prevent RF
burns from any metal part of the transceiver.

WARNING

You should not transmit from your transceiver or tune the antenna unless
people are beyond the safe working distance of:

• 1.5 m (5 ft) of any part of a mobile antenna

• 2 m (7 ft) of any part of a fixed antenna in a data installation of up to
125 W output

• 5 m (17 ft) of any part of a fixed antenna in a data installation of up to
1 kW output

CAUTION

If it is necessary to remove the covers at any stage, they must be
refitted correctly before using the equipment.

Compliance

NGT Transceiver System Repair Guide 9

Electrical safety

To ensure compliance with the European Low Voltage Directive is maintained, you must
install and use the NGT series Transceiver in accordance with the instructions in the
relevant NGT Transceiver Getting Started Guide and NGT Transceiver Reference
Manual.

When using equipment that is connected directly to the AC mains these precautions must
be followed and checked before applying AC power to the unit:

1 Use the standard AC mains cable supplied.
1 Ensure the covers for the equipment are fitted correctly.

Earth symbols

Chassis earth connection points are provided on the NGT series Transceiver and
3020 Transceiver Supply. A protective earth is provided in the AC mains wiring of the
3020 Transceiver Supply. This protective earth must be connected at the AC mains
supply outlet. The symbols shown in Table 1 are used to identify the earths on the
equipment.

CAUTION

If it is necessary for a qualified electronics technician to remove the
covers during servicing, they must be refitted correctly before using
the equipment.

WARNING

A protective earth connection must be included in the mains wiring to
the 3020 Transceiver Supply (see below, Earth symbols).

The protective cover must always be fitted when the
3020 Transceiver Supply is connected to the AC mains.

Table 1: Earth symbols

Symbol Meaning

Chassis earth

Protective earth

Compliance

10 NGT Transceiver System Repair Guide

FCC compliance

FCC Part 90 certification

The 2010 RF Unit with 2030 Junction Box and 2020 Handset complies with FCC
standards (FCC identifier code DYYNGT-3).

The 2011/2012 RF Unit with 2020 Handset complies with FCC standards (FCC
identifier code DYYNGT-11).

FCC Part 15 compliance

Any modifications made to the NGT series Transceiver (2010 RF Unit with 2030
Junction Box and 2020 Handset, or 2011/2012 RF Unit with 2020 Handset) and 3020
Transceiver Supply that are not approved by the party responsible for compliance may
void your equipment’s compliance under Part 15 of the FCC rules.

The NGT series Transceiver (2010 RF Unit with 2030 Junction Box and 2020 Handset,
or 2011/2012 RF Unit with 2020 Handset) and 3020 Transceiver Supply have been
tested and found to comply with the limits for a Class B device, pursuant to Part 15 of the
FCC rules. These limits are designed to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate
radio frequency energy and, if not installed and used in accordance with the instructions,
may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment
does cause harmful interference to radio or television reception, which can be
determined by switching the equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:

• reorient or relocate the receiving antenna

• increase the separation between the equipment and receiver

• connect the equipment into an outlet on a circuit different from that to which the
receiver is connected

• consult the dealer or an experienced radio/TV technician for help

Compliance

NGT Transceiver System Repair Guide 11

IC certification

Product markings and labelling

The 2011/2012 RF Unit with 2020 Handset is certified to IC standards (IC identifier
1029A-NGT-3).

C-tick approval

The 2012 RF Unit with 2020 Handset meets the requirements of the Australian
Communications Authority Radiocommunications (MF and HF Radiotelephone
equipment—Land Mobile Services) Standard 2003 (AS/NZS 4770).

Compliance

12 NGT Transceiver System Repair Guide

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NGT Transceiver System Repair Guide 13

Contact information

If the fault diagnosis guidelines do not locate the faulty module or cable, or if further
technical assistance is required for any other reason, please see our details on the internet
at www.codan.com.au. In the HF Radio Communications section, click on Product
Support.

Outside of normal office hours, Codan has Customer Service Engineers on call to
provide emergency technical assistance. They will either answer your call immediately
or return your call as soon as possible.

If you are connected to a voice mail system when you call, please follow the instructions
carefully, that is, leave your name and contact phone number (including the country
code), then a brief, clear description of your problem.

Contact information

14 NGT Transceiver System Repair Guide

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NGT Transceiver System Repair Guide 15

Ordering information

Orders for replacement parts/modules must include the following information. This will
ensure that the correct items are supplied, and speed up delivery times.

• equipment type (e.g. Type 2020 Handset)

• part/module location (e.g. SR Handset assembly, 08-05629-001)

• full part/module description (e.g. Handset power/Emergency key PCB)

Ordering information

16 NGT Transceiver System Repair Guide

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NGT Transceiver System Repair Guide 17

Overview

This section contains the following topics:

Overview (18)

Pin connections (20)

Overview

18 NGT Transceiver System Repair Guide

Overview

The NGT is a transceiver that can be installed in a vehicle or used as a base station. The
minimum NGT system comprises:3434

• any one of:

• a 2010 RF Unit with 2030 Junction Box, or

• a 2011 RF Unit, or

• a 2012 RF Unit

• a 2020 Handset

The handset is a hand-held device with a microphone, PTT button, display and keypad. A
desk console unit for the handset is available for use in base stations.

The junction box is a unit to which the handset, 2010 RF Unit, speaker and related units
are connected in a complex system. In transceivers that use the 2011 or 2012 RF Unit,
the handset and speaker are connected to the RF unit via the handset and speaker
connector and 10-way connector.

The RF unit modulates audio signals received from the handset onto radio frequencies
and transmits these frequencies. It also demodulates received radio frequencies into
audio signals.

The 2010 RF Unit and 2030 Junction Box are connected together using a versatile and
flexible bus system called the Codan interconnect bus (CIB). Transceivers that use the
2011 RF Unit do not have system connection capabilities. Transceivers that use the
2012 RF Unit have limited system connection capabilities.

Figure 1: Relationship of the 2010 RF Unit, 2030 Junction Box, and 2020 Handset

Overview

NGT Transceiver System Repair Guide 19

Figure 2: Relationship of the 2011/2012 RF Unit and 2020 Handset

4-WAY

CONNECTOR

10-WAY

CONNECTOR

15-WAY

CONNECTOR

(2012 ONLY)

Overview

20 NGT Transceiver System Repair Guide

Pin connections

RF unit

Figure 3: Rear panel of the 2010 RF Unit

Figure 4: Rear panel of the 2011 RF Unit

Figure 5: Rear panel of the 2012 RF Unit

fan

CIB

earth
point

DC supply

antenna

control

RF connector

fan

10-way

connector

(with 4-way

connector)

earth
point

antenna

control

DC supply

RF connector

fan

10-way

connector

(with 4-way

connector)

earth
point

antenna

control

DC supply

RF connector

15-way

connector

Overview

NGT Transceiver System Repair Guide 21

Pinouts of the CIB connector on the RF unit (2010 RF Unit only)

Figure 6: Front view of the CIB connector on the RF unit (2010 RF Unit only)

Table 2: Pinouts of the CIB connector on the RF unit (2010 RF Unit only)

Pin no. Function Signal levels

1 Ground 0 V

2 System data 1 to 5 V logic

3 System data 1 to 5 V logic

4 Power on Momentary 0 V = PWR ON

5 +6V standby +6V

6 System audio 5 to 10 V sync and TDM

7 System audio 0 to 5 V sync and TDM

8 A rail protected (2 A) +13.6 V nominal

1

2

3

4

5

6

7

8

Overview

22 NGT Transceiver System Repair Guide

Pinouts of the antenna control connector on the RF unit

Figure 7: Front view of the antenna control connector on the RF unit

Pinouts of the DC supply connector on the RF unit

RF connector

The RF connector is a flying lead located on the right side of the rear panel. It is used to
connect to an antenna.

Table 3: Pinouts of the antenna control connector on the RF unit

Pin no. Function Signal levels

1 Tune in/out 5 V logic, active low

2 Scan Active low (open collector)

3 Tuned in 5 V logic

4 A rail protected (1 to 2 A) nominal +13.6 V nominal

5 External ALC input Control at 3.6 V

6 Ground 0 V

Table 4: Pinouts of the DC supply connector on the RF unit

Pin no. Function

1 +12 V nominal (10.8 to 16 V DC)

2 Ground

1

2

3

4

5

6

Overview

NGT Transceiver System Repair Guide 23

Pinouts of the fan connector on the RF unit

Figure 8: Front view of the fan connector on the RF unit

Table 5: Pinouts of the fan connector on the RF unit

Pin no. Function

–0V

+ +13.6 V nominal (when fan is

activated)

 +

Overview

24 NGT Transceiver System Repair Guide

Pinouts of the 10-way connector on the RF unit (2011/2012 RF Unit only)

Figure 9: Front view of the 10-way connector on the RF unit (2011/2012 RF Unit only)

Table 6: Pinouts of the 10-way connector on the RF unit (2011/2012 RF Unit only)

Pin no. Function Signal levels

1 Speaker audio + Approx. 12 V p–p at onset of

clipping

2 Speaker audio – 0 V

3 Microphone audio + Nominally 500 mV p–p to ground

with normal speech

4 Microphone audio – Nominally 500 mV p–p to ground

with normal speech

5 Handset data + 1 to 5 V logic

6 Handset data – 1 to 5 V logic

7 Power on Momentary 0 V = PWR ON

8 Standby power for handset +5 V standby power or

+9 V handset power

9 A rail protected (1 A nominal) +13.6 V nominal

10 Ground 0 V

123

4567

8910

Overview

NGT Transceiver System Repair Guide 25

Pinouts of the 4-way connector on the RF unit (2011/2012 RF Unit only)

Figure 10: Front view of the 4-way connector on the RF unit (2011/2012 RF Unit only)

Pinouts of the handset and speaker connector attached to the RF unit (2011/2012 RF Unit only)

Figure 11: Front view of the handset and speaker connector attached to the RF unit (2011/2012 RF Unit only)

For details on the pinouts of the handset connector see Table 9 on page 27. For details on
the pinouts of the speaker connector see Table 11 on page 28.

Table 7: Pinouts of the 4-way connector on the RF unit (2011/2012 RF Unit only)

Pin no. Function Signal levels

1 A rail protected (2 A) +13.6 V nominal

2 Ground 0 V

3 RS232 Transmit data RS232 output

4 RS233 Receive data RS232 input

1

23

4

handset

connector

speaker

connector

1

2345

6

7

Overview

26 NGT Transceiver System Repair Guide

Pinouts of the 15-way GPIO connector on the RF unit (2012 RF Unit only)

Figure 12: Front view of the 15-way GPIO connector on the RF unit (2012 RF Unit only)

Table 8: Pinouts of the 15-way GPIO connector on the RF unit (2012 RF Unit only)

Pin no. Function Signal levels

1 RTS RS232 output

2 RS232 Receive data RS232 input

3 RS232 Transmit data RS232 output

4 Ground 0 V

5 Tx audio input (10 kΩ balanced) 300 mV p–p ALC threshold

6 External alarm relay contact

(NO or NC depending on jumper
P10)

Contacts rated 50 V, 1 A

7 External alarm relay common, or

600 Ω balanced audio output

Contacts rated at 5 V, 1 A, or 600 Ω
audio output

8 A rail protected +13.6 V nominal

9 CTS RS232 input

10 PTT input 5 V TTL logic active low

11 Morse input 5 V TTL logic active low

12 Busy/output 5 V TTL logic

13 Quiet (Q) line input 5 V TTL logic active high when

Fax/Data Mode selected
5 V TTL logic active low when all
other modes selected

14 System audio output unbalanced, or

600 Ω balanced audio output

100 Ω audio output 1 V p–p, or
600 Ω balanced audio output

15 Tx audio input (10 kΩ balanced) 300 mV p–p ALC threshold

NOTE The 600 Ω output option is selected by internal links (pins 7 and 14).

1

915

8

Overview

NGT Transceiver System Repair Guide 27

Junction box (used with 2010 RF Units only)

Figure 13: Connector panel of the junction box

Pinouts of the handset connector on the junction box

Figure 14: Front view of the handset connector on the junction box

Table 9: Pinouts of the handset connector on the junction box

Pin no. Function Signal levels

1 Standby power for handset +5 V standby power or

+9 V handset power

2 Handset data 1 to 5 V logic

3 Handset data 1 to 5 V logic

4 Ground 0 V

5 Microphone audio Nominally 500 mV p–p to ground

with normal speech

6 Microphone audio Nominally 500 mV p–p to ground

with normal speech

7 Power on Momentary 0 V = PWR ON

15-way port status light earth point

handsetCIBspeaker9-way port

1

2

3

4

5

6

7

Overview

28 NGT Transceiver System Repair Guide

Pinouts of the CIB connectors on the junction box

Figure 15: Front view of a CIB connector on the junction box

Pinouts of the speaker connector on the junction box

The speaker should be 4 Ω with a power rating of 5 W.

Table 10: Pinouts of the CIB connectors on the junction box

Pin no. Function Signal levels

1 Ground 0 V

2 System data 1 to 5 V logic

3 System data 1 to 5 V logic

4 Power on Momentary 0 V = PWR ON

5 +6 V standby +6 V

6 System audio + 5 to 10 V sync and TDM

7 System audio – 0 to 5 V sync and TDM

8 A rail protected (2 A) +13.6 V nominal

Table 11: Pinouts of the speaker connector on the junction box

Connection Function

Tip Speaker audio output

Sleeve Ground

1

2

3

4

5

6

7

8

Overview

NGT Transceiver System Repair Guide 29

Pinouts of the 9-way serial data connector on the junction box

Figure 16: Front view of the 9-way serial data connector on the junction box

Table 12: Pinouts of the 9-way serial data connector on the junction box

Pin no. Function Signal levels

1N/C

2 RS232 Receive data RS232 input

3 RS232 Transmit data RS232 output

4 DTR RS232 output

5 Ground 0 V

6 DSR RS232 input

7 RTS RS232 output

8 CTS RS232 input

9N/C

1

69

5

Overview

30 NGT Transceiver System Repair Guide

Pinouts of the 15-way GPIO connector on the junction box

Figure 17: Front view of the 15-way GPIO connector on the junction box

Table 13: Pinouts of the 15-way GPIO connector on the junction box

Pin no. Function Signal levels

1 RTS 0 to 5 V

2 RS232 Receive data RS232 input

3 RS232 Transmit data RS232 output

4 Ground 0 V

5 Tx audio input (50 kΩ balanced) 300 mV p–p ALC threshold

6 External alarm relay Contacts rated 50 V, 1 A

7 External alarm relay Closed for alarm

8 A rail +13.6 V nominal

9 CTS RS232 input

10 PTT input 5 V TTL logic active low

11 Morse input 5 V TTL logic active low

12 Spare input/output 5 V TTL logic

13 Spare input/output 5 V TTL logic

14 System audio output 1 V p–p (maximum load 1 kΩ)

15 Tx audio input (50 kΩ balanced) 300 mV p–p ALC threshold

NOTE

Pins 6, 7 and 9 may be linked internally to select normally open or closed.
The pins can be configured to switch to ground or the A rail.

1

915

8

Overview

NGT Transceiver System Repair Guide 31

Pinouts of the headphone jack on the desk console

Table 14: Pinouts of the headphone jack on the desk console

Connection Function

Ring Audio

Tip Audio

Sleeve Ground

Overview

32 NGT Transceiver System Repair Guide

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NGT Transceiver System Repair Guide 33

Brief description (2010 RF Unit with 2030 Junction Box)

This section contains the following topics:

General information (35)

Transmit path (36)

Receive path (39)

Synthesiser operation (40)

Control and switching (40)

Brief description (2010 RF Unit with 2030 Junction Box)

34 NGT Transceiver System Repair Guide

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03-01032 Issue 2

03-01032 Issue 4

Brief description (2010 RF Unit with 2030 Junction Box)

NGT Transceiver System Repair Guide 35

General information

The information in this section should be read in conjunction with the appropriate issue
of the block diagram for the NGT series Transceiver. See below to determine which issue
of the block diagram you should be viewing.

For transceivers with:

The transceiver uses double conversion in both the Receive and Transmit modes. Only
the 455 kHz sideband filter and the local oscillators VCO and REF OSC are common to
both modes of operation.

The signal routing is determined by switching and control voltages according to the
selected mode.

Codan part number of PCB assembly See...

Audio PCB (2030 Junction Box) 03-01032 Issue 2

08-05470

Application Processor PCB (2010 RF Unit)

08-05265

RF/IF PCB (2010 RF Unit)

08-05261

PA PCB (2010 RF Unit)

08-05415
08-05416
08-05511

Audio PCB (2030 Junction Box) 03-01032 Issue 4

08-05986

RF/IF PCB (2010 RF Unit)

08-05889

PA PCB (2010 RF Unit)

08-05869 or 08-06461
08-05910

Brief description (2010 RF Unit with 2030 Junction Box)

36 NGT Transceiver System Repair Guide

Transmit path

Handset transmit path

The microphone audio is amplified in the handset and passed to the junction box via the
handset bus.

Junction box transmit path

The audio from the handset is amplified and gated to produce TDM channel audio on the
Audio PCB in the junction box. There are eight time slots for the TDM, comprising one
synchronisation channel and seven audio channels.

The audio is passed to the RF unit via the CIB.

Time division multiplex audio channels

The system audio uses TDM to produce seven channels of audio and one
synchronisation pulse to reference the channel timing to pass audio between the RF unit
and the junction box(es).

The audio is sampled at a rate of 12.5 kHz by the TDM gates. The position of the audio
channel varies depending on the requirements of the system.

Figure 18: Representation of the waveform

The TDM audio is passed via SYS AUDIO+/– on the CIB.

Sync pulse

Time

Audio (channel 3)

Channels

Brief description (2010 RF Unit with 2030 Junction Box)

NGT Transceiver System Repair Guide 37

CIB transmit path

The CIB is an 8-wire bus that connects all the units in the system together:

• SYS AUDIO+/–: The audio is TDM balanced, as described on page 36, Time

division multiplex audio channels.

• SYS DATA+/–: The data uses CAN protocol. This protocol has good error detection
capabilities and performs well in high-noise environments. The data rate on the CIB
is 125 kbps.

• STBY: Standby power is a 100 mA, 6 V DC continuous supply. This is used to
backlight the key at night.

• A PROTECTED: The Protected A rail is an unregulated supply that is used to
supply power to all the units in the transceiver system. The maximum current that
this can supply is 2 A. If very long runs of the CIB cabling are required, an external
supply may be connected to the junction box to supply power locally.

• PWR ON: The power on line is used to switch the transceiver on when the line is
grounded.

• GND: Ground is the supply return wire and is connected to the negative terminal of
the battery.

RF unit transmit path

Audio Interface PCB

The audio from the junction box connects to the Audio Interface PCB. This PCB
decodes the TDM audio to normal audio.

Application Processor PCB

The transmit audio is passed to the Application Processor PCB for compression, which
converts the signal to a fixed level before passing to the RF/IF PCB.

RF/IF PCB

The audio is mixed with the local oscillator to produce double sideband. It is then filtered
by a 2.5 kHz sideband filter centred on 455 kHz, so that only the wanted sideband is
passed to the first mixer. It is then mixed with the reference oscillator to produce an IF
signal centred on 45 MHz.

The transmit signal is filtered by a BPF with a bandwidth of 15 kHz, before being passed
to the input of the second mixer.

At the second mixer, the signal mixes with the local oscillator VCO to produce the
required channel frequency. The signal is passed to the PA PCB.

Brief description (2010 RF Unit with 2030 Junction Box)

38 NGT Transceiver System Repair Guide

PA PCB

On the PA PCB, the signal is amplified then passed through the transmit/receive relay to
the selected LPF.

The output from the LPF is passed via the VSWR detector to the RF output connector.
From there it is connected by coaxial cable to the antenna.

Brief description (2010 RF Unit with 2030 Junction Box)

NGT Transceiver System Repair Guide 39

Receive path

RF unit receive path

PA PCB

The receive signal from the antenna passes through a PA LPF to the transmit/receive
relay. It is then passed to the receiver input on the RF/IF PCB.

RF/IF PCB

From the receiver input, the signal passes to the input of the first balanced mixer. Here it
mixes with the local oscillator VCO to produce an IF signal centred on 45 MHz.

The 45 MHz signal is filtered using a BPF with a bandwidth of 15 kHz, before being
passed to the second balanced mixer. The signal mixes with 44.545 MHz to produce an
IF signal centred on 455 kHz.

The output from the second mixer passes through a 2.5 kHz sideband filter so that only
the wanted sideband is fed to the high-gain AGC IF amplifier.

The amplified 455 kHz signal is demodulated to produce an audio signal and also to
operate an AGC circuit. This circuit controls the gain of the IF amplifier to prevent
overloading when strong signals are received. It also maintains constant audio output
with changing input signals.

Audio Interface PCB

The audio is passed to the Audio Interface PCB where it divides into two paths. One path
is the unprocessed (raw) audio on one TDM channel. The other path is passed to the
Application Processor PCB where the audio is enhanced (noise-reduced). This audio is
then passed back to the Audio Interface PCB and becomes another TDM audio channel.

The audio is then passed to the junction box via the CIB.

Junction box receive path

The audio from the RF unit is decoded and either raw audio or noise-reduced audio (as
selected by the user) is passed to the speaker.

Brief description (2010 RF Unit with 2030 Junction Box)

40 NGT Transceiver System Repair Guide

Synthesiser operation

The transceiver uses a single loop synthesiser. The synthesiser VCO is used as the first
mixer LO, generating an oscillator frequency in 10 Hz steps. In Receive mode, the
frequency of the oscillator ranges from 45.25 MHz to 75 MHz. In Transmit mode, the
frequency of the oscillator ranges from 46.6 MHz to 75 MHz.

The reference oscillator (REF OSC) at 44.545 MHz is used as the second mixer LO. This
frequency is also fed to two DDS ICs to produce a variable reference frequency for VCO
with 10 Hz resolution.

The second DDS IC produces 456.5 kHz (USB) and 453.5 kHz (LSB) for the Tx MOD
and Rx DEMOD circuits.

The reference oscillator at 14.848333 MHz is fed through a 44.5 MHz BPF to select the
3rd harmonic to produce the 44.545 MHz second mixer LO. The 14.848333 MHz
frequency is also fed to two DDS ICs to produce a variable reference frequency for VCO
with 10 Hz resolution.

The second DDS IC produces 456.5 kHz (USB) and 453.5 kHz (LSB) for the Tx MOD
and Rx DEMOD circuits.

Control and switching

Most functions of the transceiver are controlled by microprocessors.

A microprocessor in the handset reads the key strokes entered by the user. The keyed
data is then passed to the junction box via the handset bus. The junction box sends data
to the handset to update the display.

A microprocessor in the junction box transmits commands and data onto the CIB using
the CAN protocol. The data rate on the bus is 125 kbps.

The RF unit receives the data, decodes it and then carries out the required function.

The RF unit contains five microprocessors located on four PCBs. Incoming data first
goes to the main application microprocessor. This microprocessor then commands lower
level microprocessors to carry out the required function.

ALTERNATIVE TEXT

ALTERNATIVE TEXT

NGT Transceiver System Repair Guide 41

Brief description (2011/2012 RF Unit)

This section contains the following topics:

General information (43)

Transmit path (44)

Receive path (45)

Synthesiser operation (46)

Control and switching (46)

Brief description (2011/2012 RF Unit)

42 NGT Transceiver System Repair Guide

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03-01126

03-01190

Brief description (2011/2012 RF Unit)

NGT Transceiver System Repair Guide 43

General information

The transceiver uses double conversion in both the Receive and Transmit modes. Only
the 455 kHz sideband filter and the local oscillators VCO and REF OSC are common to
both modes of operation.

The signal routing is determined by switching and control voltages according to the
selected mode.

NOTE

The information in this section should be read in conjunction with the
appropriate block diagram for the RF unit. See below to determine which
block diagram you should be viewing.

For RF unit type... See...

2011 03-01126

2012 03-01190

Brief description (2011/2012 RF Unit)

44 NGT Transceiver System Repair Guide

Transmit path

Handset transmit path

The microphone audio is amplified in the handset and passed to the RF unit via the
handset and speaker connection cable.

RF unit transmit path

2011—Audio & Interconnect PCB

The audio from the microphone is buffered on the Audio & Interconnect PCB, then
passed to the Application Processor Handset I/F 3 V PCB for compression to convert the
signal to a fixed level. This signal is then returned to the Audio & Interconnect PCB
where it is forwarded to the RF/IF PCB.

2012—Audio Interconnect & Data I/O PCB

The audio from the microphone is buffered on the Audio Interconnect & Data I/O PCB,
then passed to the Application Processor Handset & Data I/F PCB for compression to
convert the signal to a fixed level. This signal is then returned to the Audio Interconnect
& Data I/O PCB where it is forwarded to the RF/IF PCB.

RF/IF PCB

The audio is mixed with the local oscillator to produce double sideband. It is then filtered
by a 2.5 kHz sideband filter centred on 455 kHz, so that only the wanted sideband is
passed to the first mixer. It is then mixed with the reference oscillator to produce an IF
signal centred on 45 MHz.

The transmit signal is filtered by a BPF with a bandwidth of 15 kHz, before being passed
to the input of the second mixer.

At the second mixer, the signal mixes with the local oscillator VCO to produce the
required channel frequency. The signal is passed to the PA PCB.

PA PCB

On the PA PCB, the signal is amplified then passed through the transmit/receive relay to
the selected LPF.

The output from the LPF is passed via the VSWR detector to the RF output connector.
From there it is connected by coaxial cable to the antenna.

Brief description (2011/2012 RF Unit)

NGT Transceiver System Repair Guide 45

Receive path

RF unit receive path

PA PCB

The receive signal from the antenna passes through a PA LPF to the transmit/receive
relay. It is then passed to the receiver input on the RF/IF PCB.

RF/IF PCB

From the receiver input, the signal passes via a selectable pre-amplifier to the input of the
first balanced mixer. Here it mixes with the local oscillator VCO to produce an IF signal
centred on 45 MHz.

The 45 MHz signal is filtered using a BPF with a bandwidth of 15 kHz, before being
passed to the second balanced mixer. The signal mixes with 44.545 MHz to produce an
IF signal centred on 455 kHz.

The output from the second mixer passes through a 2.5 kHz sideband filter so that only
the wanted sideband is fed to the high-gain AGC IF amplifier.

The amplified 455 kHz signal is demodulated to produce an audio signal and also to
operate an AGC circuit. This circuit controls the gain of the IF amplifier to prevent
overloading when strong signals are received. It also maintains constant audio output
with changing input levels.

2011—Audio & Interconnect PCB

The audio is passed to the Audio & Interconnect PCB where it divides into two paths.
One path is the unprocessed (raw) audio. The other path is passed to the Application
Processor Handset I/F 3 V PCB where the audio is enhanced (noise-reduced) before
returning to the Audio & Interconnect PCB. The required audio path is switch-selected
and passed to the audio amplifier, then to the speaker via the handset and speaker
connection cable.

2012—Audio Interconnect & Data I/O PCB

The audio is passed to the Audio Interconnect & Data I/O PCB where it divides into two
paths. One path is the unprocessed (raw) audio. The other path is passed to the
Application Processor Handset & Data I/F PCB where the audio is enhanced (noise-
reduced) before returning to the Audio Interconnect & Data I/O PCB. The required audio
path is switch-selected and passed to the audio amplifier, then to the speaker via the
handset and speaker connection cable.

Brief description (2011/2012 RF Unit)

46 NGT Transceiver System Repair Guide

Synthesiser operation

The transceiver uses a single loop synthesiser. The synthesiser VCO is used as the first
mixer LO, generating an oscillator frequency in 10 Hz steps. In Receive mode, the
frequency of the oscillator ranges from 45.25 MHz to 75 MHz. In Transmit mode, the
frequency of the oscillator ranges from 46.6 MHz to 75 MHz.

The reference oscillator at 14.848333 MHz is fed through a 44.5 MHz BPF to select the
3rd harmonic to produce the 44.545 MHz second mixer LO. The 14.848333 MHz
frequency is also fed to two DDS ICs to produce a variable reference frequency for VCO
with 10 Hz resolution.

The second DDS IC produces 456.5 kHz (USB) and 453.5 kHz (LSB) for the Tx MOD
and Rx DEMOD circuits.

Control and switching

Most functions of the transceiver are controlled by microprocessors.

A microprocessor in the handset reads the key strokes entered by the user. The keyed
data is then passed to the RF unit via the differential handset bus. The RF unit sends data
to the handset to update the display over the same bus.

The RF unit contains five microprocessors located on four PCBs. Incoming data first
goes to the main application microprocessor. This microprocessor then commands lower
level microprocessors to carry out the required function.

NGT Transceiver System Repair Guide 47

Interconnection diagrams and listed spares drawings

The drawings listed in this section are required during repair of an NGT series
Transceiver.

Table 15: List of drawings

Title Drawing number

Interconnection Diagram

2010 04-03223

2030 04-03562

2011 04-03437

2012 04-03533

Handset—NGT Listed Spares 16-00111-001 (sheet 1)

Desktop Console—NGT Listed Spares 16-00111-002 (sheet 1)

Junction Box—NGT Listed Spares 16-00111-003 (sheet 1)

RF Unit—NGT Listed Spares 16-00111-004 (sheet 1)

16-00111-004 (sheet 2)

RF Unit—NGT Listed Spares MS1253 16-00114 (sheet 1)

16-00114 (sheet 2)

Interconnection diagrams and listed spares drawings

48 NGT Transceiver System Repair Guide

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04-03223

04-03562

CODAN

04-03437

04-03533

16-00111-001 (sheet 1)

16-00111-002 (sheet 1)

16-00111-003 (sheet 1)

16-00111-004 (sheet 1)

16-00111-004 (sheet 2)

16-00114 (sheet 1)

16-00114 (sheet 2)

NGT Transceiver System Repair Guide 49

Functional description of PCBs

This section contains the following topics:

Handset (61)

Junction box (used with 2010 RF Units only) (63)

RF unit (68)

NOTE

The functional description should be read in conjunction with the
appropriate brief description (see page 33, Brief description (2010 RF

Unit with 2030 Junction Box) or page 41, Brief description (2011/2012
RF Unit)).

Functional description of PCBs

50 NGT Transceiver System Repair Guide

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This page has been left blank intentionally.

Functional description of PCBs

NGT Transceiver System Repair Guide 51

Functional description of PCBs

Figure 19: Handset PCB (08-05300-001)

Figure 21: Audio PCB (08-05986-001)

Figure 20: Audio PCB (08-05470-001)

Figure 22: Microprocessor PCB (08-05317-001)

52 NGT Transceiver System Repair Guide

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Functional description of PCBs

NGT Transceiver System Repair Guide 53

Functional description of PCBs

Figure 23: Audio Interface PCB (08-05266-001)

Figure 25: Audio Interconnect & Data I/O PCB (08-06261-001)

Figure 24: Audio & Interconnect PCB (08-05988-001)

Figure 26: Application Processor PCB (08-05265-001)

54 NGT Transceiver System Repair Guide

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Functional description of PCBs

NGT Transceiver System Repair Guide 55

Functional description of PCBs

Figure 27: Application Processor Handset I/F 3 V PCB (08-05987-001)

Figure 29: RF/IF PCB (08-05261-001)

Figure 28: Application Processor Handset & Data I/F PCB (08-06260-001)

Figure 30: RF/IF PCB (08-05889-001)

56 NGT Transceiver System Repair Guide

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Functional description of PCBs

NGT Transceiver System Repair Guide 57

Functional description of PCBs

Figure 31: PA PCB (08-05415-001)

Figure 33: PA PCB (08-05869-001)

Figure 32: PA PCB (08-05511-001)

Figure 34: PA PCB (08-06461-001)

58 NGT Transceiver System Repair Guide

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Functional description of PCBs

NGT Transceiver System Repair Guide 59

Functional description of PCBs

Figure 35: Filter and Control PCB (08-05416-001)

Figure 36: Filter and Control PCB (08-05910-001)

60 NGT Transceiver System Repair Guide

Functional description of PCBs

NGT Transceiver System Repair Guide 61

Handset

Handset PCB

The Handset PCB performs the following functions:

• interprets data from the Microprocessor PCB (junction box)/Audio &
Interconnect PCB (2011)/Audio Interconnect & Data I/O PCB (2012) and displays it
on the handset screen

• reads keypad entries and sends data to the Microprocessor PCB (junction
box)/Audio & Interconnect PCB (2011)/Audio Interconnect & Data I/O PCB (2012)

• provides an RS232 port for programming

• provides some pre-amplification of microphone audio

• provides brightness and contrast adjustment for LCD

The Handset PCB contains:

• a microprocessor with ROM and RAM (IC1)

• an LCD and drivers (H1)

• a connection to the keypad matrix

• a programming port (J1)

• an I/O IC to drive the handset bus (IC8)

• a microphone amplifier (IC9)

For details on the Handset PCB,
Codan part number

See...

08-05300-001 Table 16 on page 62 and

Figure 19 on page 52

Functional description of PCBs

62 NGT Transceiver System Repair Guide

08-05300-001

CAUTION

If this PCB is replaced, ensure that IC3 has the same (or later) firmware
version as the original.

Table 16: Test points for the Handset PCB (08-05300-001)

Test point Correct signal Explanation

+5V 5.0 V 5 V supply rail regulated on-board. This supplies power for the

display driver microcontroller, the display, the RS232 serial
port driver and the handset data driver.

+9V 9.0 V 9 V nominal supply rail. Only present when the transceiver is

switched on. This supplies the microphone pre-amp, display
and handset backlighting, and the RS232 serial port driver.

VEE –0.8 V to –2.4 V LCD contrast control voltage. Typically, this measures –1.3 V,

depending on the contrast setting. The negative voltage is
generated by the RS232 driver IC.

Pin 1, P8 5.4 V

9.2 V

5.4 V when the transceiver is switched off. Power is supplied
from the Audio PCB (junction box)/Audio & Interconnect PCB
(2011)/Audio Interconnect & Data I/O PCB (2012).

9.2 V when the transceiver is switched on.

Pin 6 & 7, P8 500 mV p–p Push-pull balanced amplified microphone audio.

Pin 8, P8 12.9 V

0.4 V

12.9 V when the transceiver is switched off. Power is supplied
from the Audio PCB (junction box)/Audio & Interconnect PCB
(2011)/Audio Interconnect & Data I/O PCB (2012).

0.4 V when the transceiver is switched on.

Functional description of PCBs

NGT Transceiver System Repair Guide 63

Junction box (used with 2010 RF Units only)

Audio PCB

The Audio PCB performs the following functions:

• provides amplification and volume control for speaker audio

• provides level control of beeps

• provides level control of morse tone

• provides level control of external Tx audio input (GPIO source)

• controls TDM audio sampling gates

• provides external port connections for Tx audio input, Rx audio output, PTT, and
RS232 (GPIO port)

• provides external alarm relay contacts (GPIO port)

• provides connection point for desk console

The Audio PCB contains:

• an audio amplifier (IC3)

• digital volume control elements

• Rx and Tx audio active filters

• an EPLD to control the TDM switching

For details on the Audio PCB,
Codan part number

See...

08-05470-001 Table 17 on page 64 and

Figure 20 on page 52

08-05986-001 Table 18 on page 65 and

Figure 21 on page 52

Functional description of PCBs

64 NGT Transceiver System Repair Guide

08-05470-001

CAUTION

If this PCB is replaced, ensure that IC1 has the same (or later) firmware
version as the original.

Table 17: Test points for the Audio PCB (08-05470-001)

Test point Correct signal Explanation

+5V 5.0 V 5 V supply rail regulated on-board.

+10V 10.0 V 10 V supply rail regulated on-board.

Pin 9 & 10, P3 13.6 V 13.6 V supplied from the RF unit via the CIB cable.

Pin 1, P7 5.4 V

9.2 V

5.4 V when the transceiver is switched off. Power is supplied to
the handset.

9.2 V when the transceiver is switched on.

TX_AF 1 V p–p audio Filtered and level-controlled Tx audio prior to being

multiplexed onto the CIB.

RX_AF 600 mV p–p audio Filtered and level-controlled Rx audio before being applied to

the volume control circuitry.

AUDIO_O/P High level audio Rx audio output as applied to the speaker. This can be as high as

12 V p–p at the onset of clipping, depending on the volume
level.

Pin 12, P10 1 V p–p Audio output to GPIO.

TP1

TP2

TDM audio On the CRO, this waveform should appear as 5 V p–p

amplitude (10 V p–p differential) 10 µs-wide sync pulses,
followed by seven channels of sampled audio of approximately
1 V p–p (2 V p–p differential) amplitude. TDM slot 1 typically
carries Rx audio, slot 2 carries enhanced Rx audio, and slot 3
carries Tx audio.

TP3

TP4

CAN DATA High

CAN DATA Low

CAN digital serial data stream. CAN in the NGT operates at
125 kbps. CAN High and CAN Low form a differential pair.
CAN High nominally measures 3.80 V with approx. 3 V
amplitude low-going pulses, and CAN Low nominally
measures 1.4 V with approx. 3 V amplitude high-going pulses.

Functional description of PCBs

NGT Transceiver System Repair Guide 65

08-05986-001

CAUTION

If this PCB is replaced, ensure that IC1 has the same (or later) firmware
version as the original.

Table 18: Test points for the Audio PCB (08-05986-001)

Test point Correct signal Explanation

+3V3 3.3 V 3.3 V supply rail regulated on-board.

+5V 5.0 V 5 V supply rail regulated on-board.

+10V 10.0 V 10 V supply rail regulated on-board.

Pin 9 & 10, P3 13.6 V 13.6 V supplied from the RF unit via the CIB cable.

Pin 1, P7 5.4 V

9.2 V

5.4 V when the transceiver is switched off. Power is supplied to
the handset.

9.2 V when the transceiver is switched on.

TX_AF 1 V p–p audio Filtered and level-controlled Tx audio prior to being

multiplexed onto the CIB.

RX_AF 1 V p–p audio Filtered and level-controlled Rx audio before being applied to

the volume control circuitry.

AUDIO_O/P High level audio Rx audio output as applied to the speaker. This can be as high as

12 V p–p at the onset of clipping, depending on the volume
level.

Pin 12, P10 1 V p–p Audio output to GPIO.

TP1

TP2

TDM audio On the CRO, this waveform should appear as 5 V p–p

amplitude (10 V p–p differential) 10 µs-wide sync pulses,
followed by seven channels of sampled audio of approximately
1 V p–p (2 V p–p differential) amplitude. TDM slot 1 typically
carries Rx audio, slot 2 carries enhanced Rx audio, and slot 3
carries Tx audio.

TP3

TP4

CAN DATA High

CAN DATA Low

CAN digital serial data stream. CAN in the NGT operates at
125 kbps. CAN High and CAN Low form a differential pair.
CAN High nominally measures 3.80 V with approx. 3 V
amplitude low-going pulses, and CAN Low nominally
measures 1.4 V with approx. 3 V amplitude high-going pulses.

Functional description of PCBs

66 NGT Transceiver System Repair Guide

Microprocessor PCB

The Microprocessor PCB performs the following functions:

• generates local speaker beeps and morse code tones when required

• sends and receives commands from the handset

• sends and receives commands from the RF unit via the CIB

• stores user data: Address List, Phone Link List, Keypad List, junction box control
macros

• controls arbitration of the system audio bus

The Microprocessor PCB contains:

• a microprocessor (IC1)

• a static RAM (IC8)

• a program flash ROM (IC4)

• a CAN controller (IC11)

• a CAN I/O IC

• a UART and RS232 I/O driver IC

• a tone generator

• an I/O data driver for handset bus

• the TPE and Service mode links

For details on the Microprocessor PCB,
Codan part number

See...

08-05317-001 Table 19 on page 67 and

Figure 22 on page 52

Functional description of PCBs

NGT Transceiver System Repair Guide 67

08-05317-001

CAUTION

If this PCB is replaced, ensure that IC4 has the same (or later) firmware
version as the original.

Table 19: Test points for the Microprocessor PCB (08-05317-001)

Test point Correct signal Explanation

+3V3 3.3 V 3.3 V supply rail regulated on-board.

Pin 1, IC13 5.0 V 5 V supply rail regulated on-board.

Pin 17 & 18, X1 13.6 V 13.6 V supplied from the Audio PCB.

Pin 4, IC7 16 MHz square

wave

Buffered version of the clock to the microprocessor IC1.
Absence of this clock signal means IC1 is not running correctly.

Z2 3.6864 MHz Clock for IC10.

Functional description of PCBs

68 NGT Transceiver System Repair Guide

RF unit

Audio Interface PCB (2010 RF Unit only)

The Audio Interface PCB performs the following functions:

• converts balanced CIB audio into single-ended Tx and Rx audio

• indicates to the Application Processor PCB to mute the audio output when an Rx
signal is not present

• provides a mute detector circuit with logic level output for the Application
Processor PCB

• converts balanced CIB data into single-ended TTL data stream

• provides routing of Tx audio to the RF/IF PCB

• decodes and encodes TDM system audio

• generates sync timing pulses for the TDM system audio

• provides power on/off function; switches volts to the power relay on the Filter and
Control PCB

• provides battery-backed real time clock

• provides current-limited, overload-protected, battery DC supply to the CIB

The Audio Interface PCB contains:

• a PIC microprocessor (IC12)

• an EPLD (IC11)

• a CAN I/O IC

• TDM sampling gates

• a mute detector circuit

• a fuse that may be reset electronically (IC14)

For details on the Audio Interface PCB,
Codan part number

See...

08-05266-001 Table 20 on page 69 and

Figure 23 on page 54

Functional description of PCBs

NGT Transceiver System Repair Guide 69

08-05266-001

CAUTION

If this PCB is replaced, ensure that IC11 and IC12 have the same (or later)
firmware versions as the originals.

Table 20: Test points for the Audio Interface PCB (08-05266-001)

Test Point Correct Signal Explanation

+5V 5.0 V 5 V supply rail regulated on-board.

+10V 10.0 V 10 V supply rail regulated on-board.

A 13.6 V 13.6 V supplied from the Filter and Control PCB.

A PROT 13.6 V Protected power supply voltage. It is supplied to the CIB and

the antenna control cable. It is current limited and short-circuit
protected.

Pin 5, P1 13 V

0.4 V

13 V when the transceiver is switched off.

0.4 V when the transceiver is switched on. Switched in the
handset.

+6V_STBY 6.2 V Standby power for the handset supplied via the CIB and the

junction box.

RESET 5.0 V Resets microprocessors when low.

RX_AUDIO 800 mV p–p Rx audio supplied from the RF/IF PCB.

TX_AUDIO1 700 mV p–p Tx audio supplied to the Application Processor PCB for digital

enhancing.

TX_AUDIO2 1 V p–p Digitally enhanced Tx audio supplied to the RF/IF PCB.

MUTE

5V

0V

Mute detect.

5 V when a signal is present.

0 V when no signal is present.

SYNC_ERR 0 V TDM audio synchronisation error status.

MASTER_MODE 5.0 V TDM master indicator. This shows which RF unit is generating

the TDM synchronisation pulses when multiple RF units are
present on one bus. In the test configuration, this should be

5.0 V.

SYS_AUDIO1

SYS_AUDIO2

TDM audio On the CRO, this waveform should appear as 5 V p–p

amplitude (10 V p–p differential) 10 µs-wide sync pulses,
followed by seven channels of sampled audio of approximately
1 V p–p (2 V p–p differential) amplitude. TDM slot 1 typically
carries Rx audio, slot 2 carries enhanced Rx audio, and slot 3
carries Tx audio.