EV9011
Evaluation Kit
User Manual
CML Microcircuits
COMMUNICATION SEMICONDUCTORS
Features
CMX901 Evaluation
Available in three variants:
EV9011-160 - Operation 150MHz to 170MHz
EV9011-435 - Operation 400MHz to 470MHz
EV9011-915 - Operation 900MHz to 930MHz
UM9011/1 February 2017 Advance Information
1 Brief Description
The CMX901 is a wideband RF power amplifier with high efficiency and high gain and may be used as a power amplifier or
driver amplifier. The device can be used for a wide range of frequencies from 130MHz to 950MHz. The power delivered
from the device depends on the power supply.
CMX901 can provide RF power as high as 2.5W with 4.0V supply. It is strongly recommended that the supply voltage
DOES NOT exceed 6V and the output power DOES NOT exceed 36dBm (4W).
2017 CML Microsystems Plc
Evaluation Kit for CMX901 EV9011
CONTENTS
Section Page
1 Brief Description ....................................................................................................................................................... 1
1.1 History ............................................................................................................................................................................... 3
2 Block Diagram .......................................................................................................................................................... 3
3 Preliminary Information ........................................................................................................................................... 4
3.1 Laboratory Equipment....................................................................................................................................................... 4
3.1.1 Power Supply ..................................................................................................................................................................... 4
3.2 Handling Precautions ........................................................................................................................................................ 4
3.2.1 Static Protection ................................................................................................................................................................ 4
3.2.2 Contents - Unpacking ........................................................................................................................................................ 4
3.3 Approvals........................................................................................................................................................................... 4
4 Quick Start ............................................................................................................................................................... 5
4.1 Setting-Up ......................................................................................................................................................................... 5
4.2 Operation .......................................................................................................................................................................... 5
5 Signal Lists ................................................................................................................................................................ 6
6 Circuit Schematics and Board Layouts ....................................................................................................................... 7
7 Detailed Description ................................................................................................................................................. 8
7.1 Circuit Description ............................................................................................................................................................. 8
7.1.1 Input Circuit ....................................................................................................................................................................... 8
7.1.2 Inter-stage Matching ......................................................................................................................................................... 8
7.1.3 Output Circuit .................................................................................................................................................................... 8
7.1.4 Bias Circuits ....................................................................................................................................................................... 8
7.2 Vias for the Central Metal Pad .......................................................................................................................................... 8
7.3 Routings of Input and Output ............................................................................................................................................ 8
7.4 Placement of External Components .................................................................................................................................. 8
7.5 Heatsink ............................................................................................................................................................................. 8
7.6 Application Information .................................................................................................................................................... 8
8 Performance Specification ...................................................................................................................................... 11
8.1 Electrical Performance .................................................................................................................................................... 11
8.1.1 Absolute Maximum Ratings ............................................................................................................................................ 11
8.1.2 Operating Limits .............................................................................................................................................................. 11
8.1.3 Operating Characteristics ................................................................................................................................................ 11
Table Page
Table 1 Signal List ................................................................................................................................................................................ 6
Table 2 Test Points ............................................................................................................................................................................... 6
Figure Page
Figure 1 Block Diagram ........................................................................................................................................................................ 3
Figure 2 Typical Evaluation Connections for EV9011 ........................................................................................................................... 5
Figure 3 PCB Layout: Overlay ............................................................................................................................................................... 7
Figure 4 PCB Layout: Top Copper ........................................................................................................................................................ 7
Figure 5 Typical Swept Response of EV9011-160 ................................................................................................................................ 9
Figure 6 Typical Swept Response of EV9011-435MHz ......................................................................................................................... 9
Figure 7 Ramp Up and Down EV9011-435MHz, -40°C ....................................................................................................................... 10
Figure 8 Typical Swept Response of EV9011-915MHz ....................................................................................................................... 10
It is recommended that you check for the latest product datasheet version from the Datasheets page of the CML website:
[www.cmlmicro.com].
2017 CML Microsystems Plc 2 UM9011/1
Evaluation Kit for CMX901 EV9011
Version
Changes
Date
1
Original document
Feb 2017
RFIN
RFIN
RFOUT
RFOUT
RFOUT
RFOUT
VGS3
VGS2
RFOUT
RFOUTRFIN
EXT. INPUT
MATCHING
J2
EXT. OUTPUT
MATCHING
J3
VGS1
VA
GND
INTERSTAGE
MATCH 1/2
VDD1
VDD2
J1
VPARAMP
VBIAS
GNDA
CMX901
BIAS
1
BIAS 2BIAS
3
+V
GND TAB
INTERSTAGE
MATCH 2/3
VPARAMP
VBIAS
GNDA
1.1 History
This is Advance Information; changes and additions may be made to this specification. Parameters marked TBD or left
blank will be included in later issues. Items that are highlighted or greyed out should be ignored. These will be clarified in
later issues of this document.
2 Block Diagram
Figure 1 Block Diagram
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Evaluation Kit for CMX901 EV9011
This product uses CMOS circuits that can be damaged by electrostatic discharge. Partially-damaged circuits can
function erroneously, leading to misleading results. Observe ESD precautions at all times when handling this
product.
3 Preliminary Information
The EV9011 is an evaluation kit for the CMX901. It is available in three variants:
EV9011-160 - Operation 150MHz to 170MHz
EV9011-435 - Operation 400MHz to 470MHz
EV9011-915 - Operation 900MHz to 930MHz
3.1 Laboratory Equipment
3.1.1 Power Supply
3.2 Handling Precautions
3.2.1 Static Protection
The following laboratory equipment is needed to use this evaluation kit:
Dual / Triple Power Supply
Spectrum Analyser (e.g. 100MHz to 3GHz)
RF Power Attenuator
RF Signal Generator (e.g. 100MHz to 1GHz)
RF Power Meter
For more detailed design or investigation work the customer may require other RF test equipment.
All power supply and control voltage connections to the EV9011 are not regulated on the PCB so care should be taken
that applied voltages are within the specified values.
The maximum input voltage to the PCB for all circuits, except the PA, is 3.3V.
The supply (+V) to the PA is connected directly to the CMX901: a voltage of 4.0V, at the PA, is recommended.
The +3.3V supply should be rated at 100mA and the PA supply (+V) rated at 2A.
NOTE: Care should be exercised with the supplies, as they are not protected for reverse polarity. For optimum RF
performance, the PA supply is connected directly to the CMX901, good quality power cables are recommended to
avoid excessive voltage drop between the power supply and the EV9011.
Like most evaluation kits, this product is designed for use in office and laboratory environments. The following practices
will help ensure its proper operation.
3.2.2 Contents - Unpacking
Please ensure that you have received all of the items on the separate information sheet (EK9011) and notify CML within
seven working days if the delivery is incomplete.
3.3 Approvals
This product is not approved to any EMC or other regulatory standard. Users are advised to observe local statutory
requirements, which may apply to this product and the radio frequency signals that may emanate from it.
2017 CML Microsystems Plc 4 UM9011/1
Evaluation Kit for CMX901 EV9011
RF
Signal
Generator
30dB RF
Attenuator
--
CMX901
J1
J3J2
V
PARAMP
+V (4.0V)
GND
Dual
Power
Supply
Vbias (3.3V)
GND
Variable
Voltage
Source
EV9011
- xxx
RF Spectrum
Analyser or
Power Meter
Serial Number/
Mod State
RFin RFout
4 Quick Start
This section provides instructions for users who wish to experiment immediately with the evaluation kit. A more detailed
description of the kit and its use appears later in this document. Before using the EV9011 the user should read the
CMX901 Datasheet.
4.1 Setting-Up
In this first main step external connections are made to the EV9011 and then power is applied. Perform the following
steps in sequence:
1. Connect the power amplifier output (J3) to a suitable 50 load. Failure to do this may damage the PA stage and
any test equipment being used to monitor the output.
2. Connect test leads as shown below in Figure 2.
3. Connect signal generator to the input (J2) and ensure that RF is off.
4. Power should be applied to the main supply +V (J1 pin 4 , 4.0V nominal).
5. Power should be applied to V
6. V
(J1 pin 2) should remain at 0V.
PARAMP
(J1 pin 3, 3.3V nominal).
BIAS
4.2 Operation
2017 CML Microsystems Plc 5 UM9011/1
Figure 2 Typical Evaluation Connections for EV9011
PARAMP
to 3.3V
Following the configuration procedure in section 4.1 commence operation as follows:
The output power should now be close to Pmax specified for the relevant frequency band in section 8.1.3.
1. Program the signal generator to the nominal operating frequency for the EV9011 version under test
2. Program the spectrum analyser to the nominal operating frequency for the EV9011 version under test (typical
settings: 1MHz span, other settings auto, apply offset for the power attenuator, set reference level to +35dBm)
3. Turn the signal generator on, set signal level to the input level specified in the CMX901 datasheet for the
nominal operating frequency
4. Increase V
5. Observe the output spectrum on the spectrum analyser
Evaluation Kit for CMX901 EV9011
CONNECTOR PINOUT
Connector
Ref.
Connector
Pin No.
Signal
Name
Signal
Type
Description
J1 1 GNDA
PWR
Analogue ground
J1 2 V
PARAMP
I/P
Output power control
J1 3 V
BIAS
PWR
Final stage bias (3.3V) and VA
J1 4 +V
PWR
Power supply
J1 5 GNDA
PWR
Analogue ground
J2 1 RFIN
I/P
RF signal input
J3 1 RFOUT
O/P
RF signal output
TEST POINTS
Test
Point
Ref.
Default
Measurement
Description
TP1
3.3V
V
PARAMP
Output power control voltage
5 Signal Lists
Table 1 Signal List
Table 2 Test Points
Notes: I/P = Input
O/P = Output
PWR = Power Supply Connection
TP = Test Point
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Evaluation Kit for CMX901 EV9011
6 Circuit Schematics and Board Layouts
For clarity, circuit schematics are available as separate high-resolution files. These can be obtained via the CML website.
The layout of the pcb is shown in Figure 3 and Figure 4. Note that no components are placed on the underside of the pcb.
Complete design files for the PCB are available from the CML website.
Figure 3 PCB Layout: Overlay
Figure 4 PCB Layout: Top Copper
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7 Detailed Description
7.1 Circuit Description
7.1.1 Input Circuit
The RF input is applied via connector J2. C9 provides dc blocking and C21, C22 and L4 provide a flexible pi-match that can
be configured depending on the operating frequency. R3 and C23 are placed close to the device input and are important
to ensure the stability of the CMX901.
7.1.2 Inter-stage Matching
L2 provides inter-stage tuning between the first and second stage of the PA. The match can be “de-Qed” using R2 if
required.
L1 and R1 provide similar inter-stage matching between the second and third (final) stages. C20 can provide additional
low frequency coupling if required.
7.1.3 Output Circuit
The output circuit comprises L3 and the pi-match of C10, L5 and C11+C12. The circuit transforms the low device output
impedance of a few Ohms to the interface impedance of 50Ω. The PA power supply (signal +V) must be applied through
L3 which therefore needs to be capable of handling up to 2A and have low dc resistance.
7.1.4 Bias Circuits
The three amplifier stages have separate bias voltages Vgs1, Vgs2 and Vgs3. Control of Vgs1 and Vgs2 can be used to
adjust the output power of the device and provide a defined envelope on / off characteristic.
7.2 Vias for the Central Metal Pad
There are 25 thru vias (0.2mm hole size) in the central metal pad of the CMX901, this is important to provide a good
grounding and thermal dissipation.
7.3 Routings of Input and Output
In order to minimise power loss the PCB traces for the input and output ports are 50Ω microstrip.
7.4 Placement of External Components
All decoupling capacitors and choke inductors in each stage are close to the pins to minimise strays. It is particularly
important that the 51Ω resistor in series with Vgs3 (pin 24) is placed close to the pin to avoid self-excitation.
7.5 Heatsink
In all RF power devices some of the consumed power is not converted to RF power and will be converted to thermal
energy (heat). To keep the device within specified operating conditions, a good heatsink is necessary.
Note: without a good heatsink, output power may decrease rapidly after power on.
The heatsink should be well contacted to the top of the chip or the ground vias conducting the central metal pad. On the
EV9011 the large exposed copper ground plane on the rear of the PCB and on internal layers acts as a satisfactory
heatsink. Mounting holes are provided if the user wishes to fit an external heatsink.
7.6 Application Information
Results of the CMX901 performance measured on the EV9011 can be found in the CMX901 Datasheet for operation at
150 - 170MHz, 400 – 470MHz and 900 - 930MHz (section 3.2).
2017 CML Microsystems Plc 8 UM9011/1
Evaluation Kit for CMX901 EV9011
Figure 5 Typical Swept Response of EV9011-160
Figure 6 Typical Swept Response of EV9011-435MHz
2017 CML Microsystems Plc 9 UM9011/1
Evaluation Kit for CMX901 EV9011
Figure 7 Ramp Up and Down EV9011-435MHz, -40°C
Figure 8 Typical Swept Response of EV9011-915MHz
2017 CML Microsystems Plc 10 UM9011/1
Evaluation Kit for CMX901 EV9011
Min.
Max.
Units
+V Supply (VIN - V
GND
)
-0.3
6.0
V
Voltage on any connector pin to VSS
-0.3
V
DD
+ 0.3
V
Current into or out of VIN and V
SS
pins
0
+1.5
A
Notes
Min.
Max.
Units
+V Supply (VIN - V
GND
)
2.7
5.0
V
Ambient Operating Temperature
+15
+35
°C
Extreme Operating Temperature
-40
+85
°C
Notes
Min.
Typ.
Max.
Units
DC Parameters
Supply current (no RF input)
1 16
30
mA
Supply current at PmaxNNN
1
EV9011-160
1.0
1.2
A
EV9011-435
0.85
1.2
A
EV9011-915
0.9
1.2
A
AC Parameters
Tx I/P impedance (nominal)
50
Tx O/P impedance (nominal)
50
Signal Output Level (Pmax)
EV9011-160
1
33
34 dBm
EV9011-435
1
31
32.5
dBm
EV9011-915
1
30
31.5
dBm
8 Performance Specification
8.1 Electrical Performance
8.1.1 Absolute Maximum Ratings
Exceeding these maximum ratings can result in damage to the Evaluation Kit.
8.1.2 Operating Limits
8.1.3 Operating Characteristics
Details in this section represent design target values and are not currently guaranteed. For the following conditions unless
otherwise specified:
+V = 4.0V, V
BIAS
and V
PARAMP
= 3.3V, T
= +25°C.
AMB
Notes: 1. Operating conditions as specified to achieve PmaxNNN in the device datasheet.
2017 CML Microsystems Plc 11 UM9011/1
Evaluation Kit for CMX901 EV9011
CML does not assume any responsibility for the use of any circuitry described. No IPR or circuit patent licences are implied. CML
reserves the right at any time without notice to change the said circuitry and any part of this product specification. Evaluation kits and
demonstration boards are supplied for the sole purpose of demonstrating the operation of CML products and are supplied without
warranty. They are intended for use in a laboratory environment only and are not for re-sale, end-use or incorporation into other
equipments. Operation of these kits and boards outside a laboratory environment is not permitted within the European Community.
All software/firmware is supplied "as is" and is without warranty. It forms part of the product supplied and is licensed for use only with
this product, for the purpose of demonstrating the operation of CML products. Whilst all reasonable efforts are made to ensure that
software/firmware contained in this product is virus free, CML accepts no responsibility whatsoever for any contamination which
results from using this product and the onus for checking that the software/firmware is virus free is placed on the purchaser of this
evaluation kit or development board.
www.cmlmicro.com
United Kingdom tel: +44 (0) 1621 875500 email: sales@cmlmicro.com
techsupport@cmlmicro.com
Singapore tel: +65 62888129 email: sg.sales@cmlmicro.com
sg.techsupport@cmlmicro.com
United States tel: +1 336 744 5050 email: us.sales@cmlmicro.com
800 638 5577 us.techsupport@cmlmicro.com
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