The company reserves the right to revise this publication or to change its contents without notice. Information contained
herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are
they in anyway responsible for any loss or damage resulting from the use (or misuse) of this publication.
This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmitted or
reduced to any machine readable form without prior consent from the vendor, manufacturer or creators of this publication, except for copies kept by the user for backup purposes.
Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks of
their respective companies. They are mentioned for identification purposes only and are not intended as an endorsement
of that product or its manufacturer.
Version 1.0
June 2008
Trademarks
AMD Athlon™, AMD Sempron™ and AMD Turion™ are trademarks of Advanced Micro Devices, Inc.
Windows® is a registered trademark of Microsoft Corporation.
Other brand and product names are trademarks and./or registered trademarks of their respective companies.
II
Page 5
About this Manual
This manual is intended for service personnel who have completed sufficient training to undertake the maintenance and
inspection of personal computers.
It is organized to allow you to look up basic information for servicing and/or upgrading components of the M740J/M740JU/M760J/M760JU series notebook PC.
The following information is included:
Chapter 1, Introduction, provides general information about the location of system elements and their specifications.
Chapter 2, Disassembly, provides step-by-step instructions for disassembling parts and subsystems and how to upgrade
elements of the system.
Preface
Appendix A, Part Lists
Appendix B, Schematic Diagrams
Preface
III
Page 6
Preface
IMPORTANT SAFETY INSTRUCTIONS
Follow basic safety precautions, including those listed below, to reduce the risk of fire, electric shock and injury to persons when using any electrical equipment:
1. Do not use this product near water, for example near a bath tub, wash bowl, kitchen sink or laundry tub, in a wet
basement or near a swimming pool.
2. Avoid using a telephone (other than a cordless type) durin g an ele ctrical sto rm. There may be a remote risk of electrical shock from lightning.
3. Do not use the telephone to report a gas leak in the vicinity of the leak.
4. Use only the power cord and batteries indicated in this manual. Do not dispose of batteries in a fire. They may
explode. Check with local codes for possible special disposal instructions.
5. This product is intended to be supplied by a Listed Power Unit with an AC Input of 100 - 240V, 50 - 60Hz, DC Output
of 19V, 3.42A (65 Watts) minimum AC/DC Adapter for M740J/M760J computers, OR 19V, 4.74A (90 Watts) minimum AC/DC Adapter for M740JU/M760JU computers.
CAUTION
Preface
IV
Always disconnect all telephone lines from the wall outlet before servicing or disassembling this equipment.
TO REDUCE THE RISK OF FIRE, USE ONLY NO. 26 AWG OR LARGER,
TELECOMMUNICATION LINE CORD
This Computer’s Optical Device is a Laser Class 1 Product
Page 7
Instructions for Care and Operation
The notebook computer is quite rugged, but it can be damaged. To prevent this, follow these suggestions:
1.Don’t drop it, or expose it to shock. If the computer falls, the case and the components could be damaged.
Preface
Do not expose the computer
to any shock or vibration.
Do not place it on an unstable
surface.
Do not place anything heavy
on the computer.
2.Keep it dry, and don’t overheat it. Keep the computer and power supply away from any kind of heating element. This
is an electrical appliance. If water or any other liquid gets into it, the co mputer could be badly damaged.
Do not expose it to excessive
heat or direct sunlight.
Do not leave it in a place
where foreign matter or moisture may affect the system.
Don’t use or store the computer in a humid environment.
Do not place the computer on
any surface which will block
the vents.
3.Follow the proper working procedures for the computer. Shut the computer down properly and don’t forget to save
your work. Remember to periodically save your data as data may be lost if the battery is depleted.
Do not turn off the power
until you properly shut down
all programs.
Do not turn off any peripheral
devices when the computer is
on.
Do not disassemble the computer by yourself.
Perform routine maintenance
on your computer.
Preface
V
Page 8
Preface
4.Avoid interference. Keep the computer away from high capacity transformers, electric motors, and oth er strong mag-
netic fields. These can hinder proper performance and damage your data.
5.Take care when using peripheral devices.
Preface
Power Safety
Warning
Before you undertake
any upgrade procedures, make sure that
you have turned off the
power, and disconnected all peripherals
and cables (including
telephone lines). It is
advisable to also remove your battery in
order to prevent accidentally turning the
machine on.
Use only approved brands of
peripherals.
Unplug the power cord befor e
attaching peripheral devices.
Power Safety
The computer has specific power requirements:
•Only use a power adapter approved for use with this computer.
•Your AC adapter may be designed for international travel but it still requ ires a steady, uninterru pted power supp ly. If you are
unsure of your local power specifications, consult your service representative or local power company.
•The power adapter may have either a 2-prong or a 3-prong grounded plug. The third prong is an important safety feature; do
not defeat its purpose. If you do not have access to a compatible outlet, have a qualified electrician install one.
•When you want to unplug the power cord, be sure to disconn ect it by the plug head, not by its wire.
•Make sure the socket and any extension cord(s) you use can support the total current load of all the connected devices.
•Before cleaning the computer, make sure it is disconnected from any external power supplies.
Do not plug in the power
cord if you are wet.
Do not use the power cord if
it is broken.
Do not place heavy objects
on the power cord.
VI
Page 9
Battery Precautions
•Only use batteries designed for this computer. The wrong battery type may explode, leak or damage the computer.
•Do not remove any batteries from the computer while it is powered on.
•Do not continue to use a battery that has been dropped, or that appears damaged (e.g. bent or twisted) in any way. Even if the
computer continues to work with a damaged battery in place, it may cause circuit damage, which may possibly result in fire.
•Recharge the batteries using the notebook’s system. Incorrect recharging may make the battery explode.
•Do not try to repair a battery pack. Refer any battery pack repair or replacement to your service representative or qualified service
personnel.
•Keep children away from, and promptly dispose of a damaged battery. Always dispose of batteries carefully. Batteries may explode
or leak if exposed to fire, or improperly handled or discarded.
•Keep the battery away from metal appliances.
•Affix tape to the battery contacts before disposing of the battery.
•Do not touch the battery contacts with your hands or metal objects.
Battery Disposal
The product that you have purchased contains a rechargeable b attery. The battery is recycl able. At the end of
its useful life, under various state and local laws, it may be illegal to dispose of this battery into the municipal
waste stream. Check with your local solid waste officials for details i n your area for recycling options or p roper
disposal.
Preface
Preface
Caution
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer. Discard used battery according to the manufacturer’s instructions.
VII
Page 10
Preface
Preface
Related Documents
You may also need to consult the following manual for additional information:
User’s Manual on CD
This describes the notebook PC’s features and the procedures for operating the computer and its ROM-based setup program. It also describes the installation and operation of the utility programs provided with the notebook PC.
POWER SWITCH BOARD FOR M74 ....................................... B-45
FINGER BOARD FOR M74 ........................................................B-46
EXTERNAL ODD BOARD FOR M76 .......................................B-47
POWER SWITCH BOARD FOR M76 ........................................B-48
X
Page 13
Chapter 1: Introduction
Overview
This manual covers the information you need to service or upgrade the M740J/M740JU/M760J/M760JU series notebook computer. Information about operating the computer (e.g. getting started, and the Setup utility) is in the User’sManual. Information about drivers (e.g. VGA & audio) is also found in User’s Manual. That manual is shipped with the
computer.
Operating systems (e.g. Windows XP, Windows Vista, etc.) have their own manuals as do application software (e.g. word
processing and database programs). If you have questions about those programs, you should consult those manuals.
The M740J/M740JU/M760J/M760JU series notebook is designed to be upgradeable. See “Disassembly” on page 2 - 1
for a detailed description of the upgrade procedures for each specific component. Please note the warning and safety information indicated by the “” symbol.
The balance of this chapter reviews the computer’s technical specifications and features.
This chapter provides step-by-step instructions for disassembling the M740J/M740JU/M760J/M760JU series notebook’s parts and subsystems. When it comes to reassembly, reverse the procedures (unless otherwise indicated).
We suggest you completely review any procedure before you take the computer apart.
Disassembly
Procedures such as upgrading/replacing the RAM, optical device and hard disk are included in the User’s Manual but are
repeated here for your convenience.
To make the disassembly process easier each section may have a box in the page margin. Information contained under
the figure # will give a synopsis of the sequence of procedures involved in the disassembly procedure. A box with a
lists the relevant parts you will have after the disassembly process is complete. Note: The parts listed will be for the disassembly procedure listed ONLY, and not any previous disassembly step(s) required. Refer to the part list for the previous disassembly procedure. The amount of screws you should be left with will be listed here also.
A box with a will also provide any possible helpful information. A box with a contains warnings.
An example of these types of boxes are shown in the sidebar.
2.Disassembly
Information
Warning
Overview 2 - 1
Page 28
Disassembly
2.Disassembly
NOTE: All disassembly procedures assume that the system is turned OFF, and disconnected from any power supply (the
battery is removed too).
Maintenance Tools
The following tools are recommended when working on the notebook PC:
•M3 Philips-head screwdriver
•M2.5 Philips-head screwdriver (magnetized)
•M2 Philips-head screwdriver
•Small flat-head screwdriver
•Pair of needle-nose pliers
•Anti-static wrist-strap
Connections
Connections within the computer are one of four types:
Locking collar sockets for ribbon connectorsTo release these connectors, use a small flat-head screwdriver to
gently pry the locking collar away from its base. When replacing the connection, make sure the connector is oriented in the
same way. The pin1 side is usually not indicated.
2 - 2 Overview
Pressure sockets for multi-wire connectorsTo release this connector type, grasp it at its head and gently
rock it from side to side as you pull it out. Do not pull on the
wires themselves. When replacing the connection, do not try to
force it. The socket only fits one way.
Pressure sockets for ribbon connectorsTo release these connectors, use a small pair of needle-nose pli-
ers to gently lift the connector away from its socket. When replacing the connection, make sure the connector is oriented in
the same way. The pin1 side is usually not indicated.
Board-to-board or multi-pin socketsTo separate the boards, gently rock them from side to side as
you pull them apart. If the connection is very tight, use a small
flat-head screwdriver - use just enough force to start.
Page 29
Maintenance Precautions
The following precautions are a reminder. To avoid personal injury or damage to the computer while performing a removal and/or replacement job, take the following precautions:
1.Don't drop it. Perform your repairs and/or upgrades on a stable surface. If the computer falls, the case and other
components could be damaged.
2.Don't overheat it. Note the proximity of any heating elements. Keep the computer out of direct sunlight.
3.Avoid interference. Note the proximity of any high capacity transformers, electric motors, and other strong mag-
netic fields. These can hinder proper performance and damage components and/or data. You should also monitor
the position of magnetized tools (i.e. screwdrivers).
4.Keep it dry. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly
damaged.
5.Be careful with power. Avoid accidental shocks, discharges or explosions.
•Before removing or servicing any part from the computer, turn the computer off and detach any power supplies.
•When you want to unplug the power cord or any cable/wire, be sure to disconnect it by the plug head. Do not pu ll on the wir e.
6.Peripherals – Turn off and detach any peripherals.
7.Beware of static discharge. ICs, such as the CPU and main support chips, are vulnerable to static electricity.
Before handling any part in the computer, discharge any static electricity inside the computer. When handling a
printed circuit board, do not use gloves or other materials which allow static electricity buildup. We suggest that
you use an anti-static wrist strap instead.
8.Beware of corrosion. As you perform your job, avoid touching any connector leads. Even the cleanest hands produce oils which can attract corrosive elements.
9.Keep your work environment clean. Tobacco smoke, dust or other air-born particulate matter is often attracted
to charged surfaces, reducing performance.
10. Keep track of the component s. When re moving or replacing any p art, be careful not to le ave small part s, such as
screws, loose inside the computer.
Disassembly
Power Safety
Warning
Before you undertake
any upgrade procedures, make sure that
you have turned off the
power, and disconnected all peripherals
and cables (including
telephone lines). It is
advisable to also remove your battery in
order to prevent accidentally turning the
machine on.
2.Disassembly
Cleaning
Do not apply cleaner directly to the computer, use a soft clean cloth.
Do not use volatile (petroleum distillates) or abrasive cleaners on any part of the computer.
Overview 2 - 3
Page 30
Disassembly
Disassembly Steps
The following table lists the disassembly steps, and on which page to find the related information. PLEASE PERFORM
THE DISASSEMBLY STEPS IN THE ORDER INDICATED.
2.Disassembly
To remove the Battery:
1.Remove the batterypage 2 - 5
To remove the HDD:
1.Remove the batterypage 2 - 5
2.Remove the HDDpage 2 - 6
To remove the Optical Device:
1.Remove the batterypage 2 - 5
2.Remove the Optical devicepage 2 - 9
To remove the System Memory:
1.Remove the batterypage 2 - 5
2.Remove the system memorypage 2 - 11
To remove the Inverter Board:
1.Remove the batterypage 2 - 5
2.Remove the inverter boardpage 2 - 13
To remove and install a Processor:
1.Remove the batterypage 2 - 5
2.Remove the processorpage 2 - 14
3.Install the processorpage 2 - 16
To remove the Wireless LAN Module:
1.Remove the batterypage 2 - 5
2.Remove the wireless LANpage 2 - 17
To remove the Bluetooth Module:
:
1.Remove the batterypage 2 - 5
2.Remove the Bluetoothpage 2 - 18
To remove the Keyboard:
1.Remove the batterypage 2 - 5
2.Remove the keyboardpage 2 - 19
To remove the Modem:
1.Remove the batterypage 2 - 5
2.Remove the HDDpage 2 - 6
3.Remove the Optical devicepage 2 - 9
4.Remove the processorpage 2 - 14
5.Remove the Wireless LAN Modulepage 2 - 17
6.Remove the Bluetooth Modulepage 2 - 18
7.Remove the keyboardpage 2 - 19
8.Remove the modempage 2 - 20
2 - 4 Disassembly Steps
Page 31
Removing the Battery
Disassembly
1.Turn the computer off, and turn it over.
2.Slide the latch in the direction of the arrow.
3.Slide the latch in the direction of the arrow, and hold it in place.
4.Slide the battery in the direction of the arrow .
1
2
3
6
a.
2
b.
4
3
Figure 1
Battery Removal
a. Slide the latch and hold
in place.
b. Slide the battery in the di-
rection of the arrow.
1
2.Disassembly
4
3. Battery
Removing the Battery 2 - 5
Page 32
Disassembly
Removing the Hard Disk Drive
Figure 2
HDD Assembly
Removal
a. Locate the HDD bay
cover and remove the
screw(s).
2.Disassembly
The hard disk drive can be taken out to accommodate other 2.5" serial (SATA) hard disk drives with a height of 9.5mm
(h). Follow your operating system’s installation instructions, and install all necessary drivers and utilities (as outlined in
Chapter 4 of the User’s Manual) when setting up a new hard disk.
Hard Disk Upgrade Process
1.Turn off the computer, and remove the battery (page 2 - 5).
2.Locate the hard disk bay cover and remove screw & .
a.
21
M740J/M740JUM760J/M760JU
12
21
HDD System Warning
•2 Screws
New HDD’s are blank. Before you begin make sure:
You have backed up any data you want to keep from your old HDD.
You have all the CD-ROMs and FDDs required to install your operating system and programs.
If you have access to the internet, download the latest application and hardware driver updates for the operating system you plan
to install. Copy these to a removable medium.
2 - 6 Removing the Hard Disk Drive
Page 33
Disassembly
For M740J/M740JU computers:
3
3.Remove the hard disk bay cover .
4.Grip the tab and slide the hard disk in the direction of arrow .
5.Lift the hard disk out of the bay .
6.Remove the screw and the adhesive cover from the hard disk.
66
7.Reverse the process to install a new hard disk (do not forget to replace all the screws and covers).
b.
3
c.
4
6
4
5
7
8
6
e.
7
Figure 3
HDD Assembly
Removal (cont’d.)
b. Remove the HDD bay
cover.
c. Grip the tab and slide the
HDD in the direction of
the arrow.
d. Lift the HDD assembly
out of the bay.
e. Remove the screw and
adhesive cover.
2.Disassembly
6
8
d.
5
Removing the Hard Disk Drive 2 - 7
3. HDD Bay Cover
7. Adhesive Cover
8. HDD
•1 Screw
Page 34
Disassembly
Figure 4
HDD Assembly
Removal (cont’d.)
f. Remove the HDD Bay
Cover.
g. Grip the tab and slide the
HDD in the direction of
the arrow.
h. Lift the HDD assembly
out of the bay.
i. Remove the screw and
adhesive cover.
2.Disassembly
For M760J/M760JU computers:
3
8.Remove the hard disk bay Cover .
9.Grip the tab and slide the hard disk in the direction of arrow .
10. Lift the hard disk out of the bay .
11. Remove the screws & and the adhesive cover from the hard disk .
676
12. Reverse the process to install a new hard disk (do not forget to replace all the screws and covers).
f.
3
g.
4
6
4
5
8
9
6
i.
8
7
6
9
h.
3. HDD Bay Cover
8. Adhesive Cover
9. HDD
•2 Screws
2 - 8 Removing the Hard Disk Drive
5
Page 35
Disassembly
Removing the Optical (CD/DVD) Device
1.Turn off the computer, and remove the battery (page 2 - 5).
2.M740J/M740JU: (see over for M760J/M760JU)
Locate the component bay cover and remove screws - .
1
3.Carefully (a fan and cable are attached to the under side of the cover) lift up the bay cover.
4.Carefully disconnect the fan cable , and remove the cover
5.Remove the screw at point , and use a screwdriver to carefully push out the optical device at point .
687
5
1
.
6.Insert the new device and carefully slide it into the computer (the device only fits one way. DO NOT FORCE IT; The
screw holes should line up).
7.Restart the computer to allow it to automatically detect the new device.
a.
3
2
4
c.
1
6
M740J/M740JU
24
Figure 5
Optical Device
Removal
a. Remove the screws.
b. Disconnect the fan cable
and remove the cover.
c. Remove the screw.
d. Push the optical device
out off the computer at
point 7.
2.Disassembly
b.
c.
d.
1
8
7
5
Removing the Optical (CD/DVD) Device 2 - 9
1. Component Bay Cover
8. Optical Device
•4 Screws
Page 36
Disassembly
Figure 6
Optical Device
Removal (cont’d.)
e. Remove the screws.
f. Remove the cover.
g. Remove the screw.
h. Push the optical device
out off the computer at
point 7.
2.Disassembly
8.M760J/M760JU: Locate the hard disk bay cover and loosen screws & .
9.Remove the hard disk bay cover .
10. Remove the screw at point , and use a screwdriver to carefully push out the optical device
1
6
1
2
3
8
at point .
7
1 1. Insert the new device and carefully slide it into the computer (the device only fits one way. DO NOT FORCE IT ; Th e
screw holes should line up).
12. Restart the computer to allow it to automatically detect the new device.
e.
g.
6
1
32
7
M760J/M760JU
f.
h.
1. HDD Bay Cover
8. Optical Device
1
•3 Screws
2 - 10 Removing the Optical (CD/DVD) Device
8
7
Page 37
Disassembly
Removing the System Memory (RAM)
The computer has two memory sockets for 200 pin Small Outline Dual In-line Memory Modules (SO-DIMM) supporting
DDR2 667/800MHz. The main memory can be expanded up to 4GB. The SO-DIMM modules supported are 1024MB,
and 2048MB and DDRII Modules. The total memory size is automatically detected by the POST routine once you turn
on your computer.
Memory Upgrade Process
1.Turn off the computer, remove the battery (page 2 - 5).
2.Locate the component bay cover , and remove screws - .
3.Carefully (a fan and cable are attached to the under side of the cover) lift up the bay cover (page 2 - 9).
4.The RAM module(s) will be visible at point on the mainboard.
a.
3
2
1
1
5
24
b.
4
2
3
1
5
4
Figure 7
RAM Module
Removal
a. Remove the screws.
b. Remove the cover.
Contact Warning
Be careful not to touch
the metal pins on the
module’s connecting
edge. Even the cleanest hands have oils
which can attract particles, and degrade the
module’s performance.
2.Disassembly
M740J/M740JU
M760J/M760JU
1. Component Bay
Cover
•3 Screws
Removing the System Memory (RAM) 2 - 11
Page 38
Disassembly
Figure 8
RAM Module
Removal (cont’d.)
c. Pull the release
latch(es).
d. Remove the module(s).
e. Properly re-insert the
bay cover pins.
2.Disassembly
5.Gently pull the two release latches ( & ) on the sides of the memory socket in the direction indicated by the
67
arrows (Figure 8c).
c.
d.
67
8
6.The RAM module(s) will pop-up (Figure 8d), and you can then remove it.
8
7.Pull the latches to release the second module if necessary.
8.Insert a new module holding it at about a 30° angle and fit the connectors firmly into the memory slot.
9.The module’s pin alignment will allow it to only fit one way. Make sure the module is seated as far into the slot as it
will go. DO NOT FORCE the module; it should fit without much pressure.
10. Press the module in and down towards the mainboard until the slot levers click into place to secure the module.
11. Replace the bay cover and screws (make sure you reconnect the fan cable before screwing down the bay
cover).
Note for M760J/M760JU computers that there are four - cover pins which need to be aligned with slots in
the case, to insure a proper cover fit, before screwing down the bay cover .
912
1
8. RAM Module(s)
12. Restart the computer to allow the BIOS to register the new memory configuration as it starts up.
2 - 12 Removing the System Memory (RAM)
e.
9
1
10
11
12
Page 39
Disassembly
Removing the Inverter Board
1.Turn off the computer, and remove the battery (page 2 - 5).
2.Remove any rubber covers, screws - (Figure 9a), then run your finger around the middle of the frame to
carefully unsnap the LCD front panel module from the back.
3.Discharge the remaining system power (see “Inverter Power Warning” below).
4.Remove screw (Figure 9b) from the inverter, and carefully lift the inverter board up slightly.
5.Disconnect cables & (Figure 9c) from the inverter, then remove the inverter (Figure 9d) from the top
8
91011
case assembly.
a.b.
25
3
1
7
1
6
7
4
8
c.
6
9
10
Figure 9
Inverter Board
Removal
a. Remove the 6 screws
and unsnap the LCD
front panel module from
the back.
b. Remove the screw and
discharge the remaining
power from the inverter
board and lift the board
up slightly.
c. Disconnect the cables
from the inverter.
d. Remove the inverter.
2.Disassembly
Inverter Power Warning
In order to prevent a short circuit when removing the inverter it is necessary to discharge any remaining system power. To do
so, press the computer’s power button for a
few seconds before disconnecting the inverter cable.
d.
11
7. LCD Front Panel
11.Inverter Board
•6 Screws
Removing the Inverter Board 2 - 13
Page 40
Disassembly
Removing and Installing the Processor
Figure 10
Processor Removal
a. Remove the cover and
Iocate the heat sink.
b. Remove the screws in
the order indicated.
c. Remove the heat sink.
2.Disassembly
B. Heat Sink
Processor Removal Procedure
1.Turn off the computer, remove the battery (page 2 - 5) and the component bay cover (page 2 - 9).
2.The CPU heat sink will be visible at point on the mainboard.
3.Remove screws
4.Carefully lift up the heat sink (Figure 10c) off the computer.
a.
A
b.
1
, ,(Figure 10b) the reverse order as indicated on the label.
321
B
2
3
A
c.
B
M740J/M760J
B
•3 Screws
2 - 14 Removing and Installing the Processor
M740JU/M760JU
Page 41
Disassembly
5.Turn the release latch towards the unlock symbol , to release the CPU (Figure 11a).
6.Carefully (it may be hot) lift the CPU up out of the socket (Figure 1 1b).
C
D
7.See page 2 - 16 for information on inserting a new CPU.
8.When re-inserting the CPU, pay careful attention to the pin alignment, it will fit only one way (DO NOT FORCE IT!).
d.
C
Unlock
Lock
e.
D
Caution
Figure 11
Processor Removal
(cont’d)
d. Turn the release latch to
unlock the CPU.
e. Lift the CPU out of the
socket.
2.Disassembly
The heat sink, and CPU area in
general, contains parts which are
subject to high temperatures. Allow the area time to cool before removing these parts.
Removing and Installing the Processor 2 - 15
7. CPU
Page 42
Disassembly
Figure 12
Processor
Installation
a. Insert the CPU.
b. Turn the release latch to-
wards the lock symbol.
c. Remove the sticker from
the heat sink and insert
the heat sink.
d. Tighten the screws.
2.Disassembly
Processor Installation Procedure
1.Insert the CPU , pay careful attention to the pin alignment, it will fit only one way (DO NOT FORCE IT!), and
turn the release latch towards the lock symbol (Figure 12b).
2.Remove the sticker (Figure 12c) from the heat sink.
3.Insert the heat sink
4.Tighten screws
5.Replace the component bay cover and tighten the screws (page 2 - 9).
a.
b.
A
B
C
D
as indicated in Figure 12c.
13
- in the order indicated on the label.
c.
A
C
D
M740J/M760J
C
D
A. CPU
D. Heat Sink
•3 Screws
2 - 16 Removing and Installing the Processor
B
M740JU/M760JU
d.
Page 43
Disassembly
Removing the Wireless LAN Module
1.Turn off the computer, remove the battery (page 2 - 5) and the component bay cover (page 2 - 9).
2.The Wireless LAN module will be visible at point on the mainboard.
3.Carefully disconnect cables - , then remove screw from the module socket.
4.The Wireless LAN module will pop-up.
5.Lift the Wireless LAN module (Figure 13d) up and off the computer.
a.
1
b.
2
34
5
4
3
1
c.
5
d.
Figure 13
Wireless LAN
Module Removal
a. Remove the cover.
b. Disconnect the cable
and remove the screw.
c. The WLAN module will
pop up.
d. Lift the WLAN module
out.
Note: Make sure you
reconnect the antenna
cable to “1” + “2”
socket (Figure b).
2.Disassembly
2
5. WLAN Module.
•1 Screw
Removing the Wireless LAN Module 2 - 17
Page 44
Disassembly
Figure 14
Bluetooth Module
Removal
a. Remove the screw.
b. Lfit the cover and remove
the screw.
c. Disconnect the cable and
the connector.
d. Lift the Bluetooth module
up off the socket.
2.Disassembly
Removing the Bluetooth Module
1.Turn off the computer, remove the battery (page 2 - 5).
2.Locate the Bluetooth bay cover, and remove the screw and cover .
3.Remove the screw and turn the module over.
3
4.Carefully separate the Bluetooth module from the connector
5.Lift the Bluetooth module
6
(Figure 14c) up and off the computer.
a.
1
45
and disconnect the cable .
c.
1
b.
d.
2
2
5
4
6
2. Cover
6. Bluetooth Module
•2 Screws
2 - 18 Removing the Bluetooth Module
3
Page 45
Removing the Keyboard
Disassembly
1.Turn off the computer, and remove the battery (page 2 - 5).
2.Press the four keyboard latches at the top of the keyboard to elevate the keyboard from its normal position (you
may need to use a small screwdriver to do this).
3.Carefully lift the keyboard up, being careful not to bend the keyboard ribbon cable (Figure 15b).
4.Disconnect the keyboard ribbon cable from the locking collar socket .
a.
1
5
67
c.
2
3
4
b.
6
5
5
7
Figure 15
Keyboard Removal
a. Pre ss the four latches to
release the keyboard.
b. Lift th e keyboard up and
disconnect the cable
from the locking collar.
c. Remove the keyboard.
2.Disassembly
Re-Inserting the Key-
board
When re-inserting the
keyboard firstly align
the four keyboard tabs
at the bottom of the
keyboard with the slots
in the case.
1.Turn off the computer, remove the battery (page 2 - 5), HDD (page 2 - 6), component bay cover (page 2 - 11),
optical device (page 2 - 9), CPU (page 2 - 14), bluetooth (page 2 - 18) and keyboard (page 2 - 19).
14
21
1
22242527
2829
M760J/M760JUM740J/M740JU
16
3
7
14
8
21
20
22
23
4
5
6
19
18
15
25
24
26
27
2
10
9
11
12
13
3
4
5
6
1
8
7
18
23
17
15
27
13
12
25
22
26
10
11
9
17
c.
2829
2.Remove screws - from the bottom case.
3.Turn the computer over, remove screws - and disconnect cables - (Figure 17b).
4.For M760J/M760JU only - remove screws - (Figure 17c) from the rear of the computer.
1
a.
2
16
b.
2 - 20 Removing the Modem
Page 47
Disassembly
5.Carefully lift the top case up and off the computer (Figure 17d).
6.Remove screws - from the computer.
7.Remove screws - from the modem module.
3133
3435
8.Lift the modem up and separate the modem from the connector .
9.Lift the modem off the computer.
37
30
36
d.
30
M740J/M740JU
M760J/M760JU
e.
33
32
31
32
f.
Figure 17
Modem Removal
(cont’d.)
d. Lift the cover off the
computer.
e. Remove the screws.
f. Remove the screws and
disconnect the connec-
tor.
g. Lift the modem out.
2.Disassembly
33
31
g.
36
35
34
37
36
35
34
37
30.Top Case
37.Modem
•5 Screws
Removing the Modem 2 - 21
Page 48
Page 49
Appendix A: Part Lists
This appendix breaks down the M740J/M740JU/M760J/M760JU series notebook’s construction into a series of illustrations. The component part numbers are indicated in the tables opposite the drawings.
Note: This section indicates the manufacturer’s part numbers. Your organization may use a different system, so be sure
to cross-check any relevant documentation.
Note: Some assemblies may have parts in common (especially screws). However, the part lists DO NOT indicate the
total number of duplicated parts used.
Part Lists
Note: Be sure to check any update notices. The parts shown in these illustrations are appropriate for the system at the
time of publication. Over the product life, some parts may be improved or re-configured, resulting in new part numbers.
A.Part Lists
A-1
Page 50
Part Lists
Table A- 1
Part List Illustration
Location
Part List Illustration Location
The following table indicates where to find the appropriate part list illustration.
PartsM740JM740JUM760JM760JU
Top with Fingerprintpage A - 3page A - 11
Top without Fingerprintpage A - 4page A - 12
Bottompage A - 5page A - 6page A - 13page A - 14
LCDpage A - 7page A - 15
HDDpage A - 8page A - 16
COMBOpage A - 9page A - 17
A.Part Lists
A - 2 Part List Illustration Location
DVD-Dual Drivepage A - 10page A - 18
Page 51
Top with Fingerprint (M740J/M740JU)
Part Lists
白色 (無鉛)
無鉛
Figure A - 1
Top with
A.Part Lists
Fingerprint
(M740J/M740JU)
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
Top with Fingerprint (M740J/M740JU) A - 3
Page 52
Part Lists
Figure A - 2
Top without
Fingerprint
(M740J/M740JU)
A.Part Lists
Top without Fingerprint (M740J/M740JU)
A - 4 Top without Fingerprint (M740J/M740JU)
白色 (無鉛)
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
Page 53
Bottom (M740J)
外 無鉛
外 無鉛
海華 無鉛
無電鍍 無鉛
無電鍍 無鉛
無電鍍 無鉛
藍天3 互億 無鉛
無電鍍 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
凱碩 無鉛
無鉛
無鉛
無鉛
導電布 無鉛
導電布 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
Part Lists
Figure A - 3
Bottom (M740J)
A.Part Lists
Bottom (M740J) A - 5
Page 54
Part Lists
Figure A - 4
Bottom (M740JU)
A.Part Lists
Bottom (M740JU)
外 無鉛
外 無鉛
海華 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
導電布 無鉛
導電布 無鉛
無鉛
凱碩 無鉛
無鉛
藍天3 互億 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
A - 6 Bottom (M740JU)
Page 55
LCD (M740J/M740JU)
Part Lists
無鉛
無鋁箔 無鉛
精乘 無鉛
精乘 無鉛
中性 電鑄薄膜鍍亮鉻) 無鉛
精乘 無鉛
精乘 無鉛
Figure A - 5
LCD (M740J/
A.Part Lists
M740JU)
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
LCD (M740J/M740JU) A - 7
Page 56
Part Lists
Figure A - 6
(M74J/M740JU)
A.Part Lists
HDD
HDD (M740J/M740JU)
無鉛
(無鉛)
A - 8 HDD (M740J/M740JU)
Page 57
COMBO (M740J/M740JU)
Part Lists
*(非耐落) 無鉛
Figure A - 7
COMBO
A.Part Lists
(M740J/M740JU)
無鉛
無鉛
無鉛
無鉛
無鉛
COMBO (M740J/M740JU) A - 9
Page 58
Part Lists
Figure A - 8
DVD-Dual Drive
(M740J/M740JU)
A.Part Lists
DVD-Dual Drive (M740J/M740JU)
A - 10 DVD-Dual Drive (M740J/M740JU)
*(非耐落) 無鉛
無鉛
無鉛
無鉛
無鉛
Page 59
Top with Fingerprint (M760J/M760JU)
Part Lists
白色 (無鉛)
白色 無鉛
白色 設變 無鉛
無鉛(背膠變更)
頭徑 頭厚 號穴 鍍白鎳 I頭 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
Figure A - 9
Top with
Fingerprint
(M760J/M760JU)
A.Part Lists
Top with Fingerprint (M760J/M760JU) A - 11
Page 60
Part Lists
Figure A - 10
Top without
Fingerprint
(M760J/M760JU)
A.Part Lists
Top without Fingerprint (M760J/M760JU)
A - 12 Top without Fingerprint (M760J/M760JU)
白色 (無鉛)
白色 無鉛
白色 設變 無鉛
無鉛
無鉛(背膠變更)
頭徑 頭厚 號穴 鍍白鎳 I頭 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
Page 61
Bottom (M760J)
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
(黑色)(無鉛)
(黑色) 無鉛
藍天3 互億 無鉛
(黑色) 無鉛
度,黑色 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
導電布 無鉛
導電布 無鉛
外 無鉛
外 無鉛
非耐落 無鉛
海華 無鉛
無鉛
凱碩 無鉛
無鉛
無鉛
無鉛
無鉛
黑色 後設變咬花 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
Part Lists
Figure A - 11
Bottom (M760J)
A.Part Lists
Bottom (M760J) A - 13
Page 62
Part Lists
Figure A - 12
Bottom (M760JU)
A.Part Lists
Bottom (M760JU)
無鉛
無鉛
無鉛
無鉛
(黑色)(無鉛)
(黑色) 無鉛
藍天3 互億 無鉛
(黑色) 無鉛
度,黑色 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
導電布 無鉛
導電布 無鉛
外 無鉛
外 無鉛
非耐落 無鉛
海華 無鉛
無鉛
凱碩 無鉛
無鉛
無鉛
無鉛
無鉛
黑色 後設變咬花 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
A - 14 Bottom (M760JU)
Page 63
LCD (M760J/M760JU)
Part Lists
(非耐落) 無鉛
頭徑 頭厚 號穴 鍍白鎳 頭 無鉛
無鉛
精乘 無鉛
黑色 惠貿 無鉛
黑色 惠貿 無鉛
中性 電鑄薄膜鍍亮鉻) (偉鎮)無鉛
后蓋保護 無鉛
Figure A - 13
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
LCD (M760J/
M760JU)
A.Part Lists
LCD (M760J/M760JU) A - 15
Page 64
Part Lists
Figure A - 14
(M760J /M760JU)
A.Part Lists
HDD (M760J/M760JU)
HDD
A - 16 HDD (M760J/M760JU)
無鉛
(無鉛)
Page 65
COMBO (M760J/M760JU)
Part Lists
*(非耐落) 無鉛
黑色 無鉛
Figure A - 15
COMBO
A.Part Lists
(M760J/M760JU)
無鉛
無鉛
無鉛
COMBO (M760J/M760JU) A - 17
Page 66
Part Lists
Figure A - 16
DVD-Dual Drive
(M760J/M760JU)
DVD-Dual Drive (M760J/M760JU)
A.Part Lists
A - 18 DVD-Dual Drive (M760J/M760JU)
*(非耐落) 無鉛
黑色 無鉛
無鉛
無鉛
無鉛
無鉛
Page 67
Appendix B: Schematic Diagrams
This appendix has circuit diagrams of the M740J/M740JU/M760J/M760JU notebook’s PCB’s. The following table indicates where to find the appropriate schematic diagram.
Schematic Diagrams
Diagram - PageDiagram - PageDiagram - Page
System Block Diagram - Page B - 2HDMI, CRT - Page B - 18VCORE VDD CORE - Page B - 34
Clock Generator - Page B - 3SB700-1 - Page B - 19VCORE VDD CORE - Page B - 35
CPU-1 - Page B - 4SB700-2 - Page B - 201.8V, 0.9V - Page B - 36
CPU-2 - Page B - 5SB700-3 - Page B - 211.1VS, 1.2V, 1.2VS, 2.5V - Page B - 37
CPU-3 - Page B - 6SB700-4 - Page B - 22VGA CORE 1.5VS - Page B - 38
CPU-4 - Page B - 7New Card, Mini PCIE - Page B - 23VDD3, VDD5 - Page B - 39
DDRII S0-DIMM 0 - Page B - 83G, PATA ODD, eSATA - Page B - 24CHARGER, DC IN - Page B - 40
DDRII S0-DIMM 1 - Page B - 9USB, FAN, TP, FP, MULTI CON - Page B - 25CLICK FINGER BOARD FOR M76 - Page B - 41
RS780M-1 - Page B - 10CARD READER - Page B - 26MULTI FUNCTION BOARD - Page B - 42
RS780M-2 - Page B - 11ISATA HDD, LED, HOTKEY, BT - Page B - 27AUDIO BOARD - Page B - 43
RS780M-3 - Page B - 12PCIE GIGALAN RTL8111C - Page B - 28FINGER SENSOR BOARD - Page B - 44
M82-XT-1 - Page B - 13AUDIO CODEC ALC662 - Page B - 29POWER SWITCH BOARD FOR M74 - Page B - 45
M82-XT-2 - Page B - 14AUDIO AMP2056 - Page B - 30FINGER BOARD FOR M74 - Page B - 46
M82-XT-3 - Page B - 15KBC ITE IT8512E - Page B - 31EXTERNAL ODD BOARD FOR M76 - Page B - 47
DDRII 32MX16 - Page B - 161.8VS, 3,3VS, 5VS, 1.1VS, 3.3V - Page B - 32POWER SWITCH BOARD FOR M76 - Page B - 48
Table B - 1
Schematic
Diagrams
B.Schematic Diagrams
Version Note
The schematic diagrams in this chapter
are based upon version 6-7P-M74J9-003.
If your mainboard (or
other boards) are a later version, please
check with the Service
Center for updated diagrams (if required).
LVDS, INVERTER - Page B - 17VGA POWER & POWER GD - Page B - 33
B-1
Page 68
Schematic Diagrams
System Block Diagram
Sheet 1 of 47
System Block
Diagram
B.Schematic Diagrams
CLICK FINGER BOARD FOR M76
6-71-M76S2-D03C
MULTI FUNCTION BOARD
In tSPK- R+CCD +M DC
6-71-M74S1-D03
AUDIO Board
Head phon e+S PDIF+Ex t
M icr opho ne+US B X 1
6-71-M74SA-D 03A
FIN G ER S EN SO R B O ARD FO R M 76
6-71-M66UF-D03
POW E R SW IT CH BOA RD FOR M 74
6-71-M74SS-D03
FINGER BOARD FOR M74
6-71-M74SF-D03
EXTERNAL ODD BOARD FOR M76
6-71-M76SN-D03
POW E R SW IT CH BOA RD FOR M 76
6-71-M76SS-D02
PCIE4
MINIPCIE-3G
USB6
1.8V S,3.3V S,5VS ,1.1VS, 3.3 V,5V
VGA POEW R&PWRGD
3.3V S_V G A,1.8VS _V G A,1.1VS_VG A
VCORE_VDD_CORE
CPU_VDD0,CPU_VDDD1
VCORE_VDD_NB
1.8V , 0 .9V
1.1V S ,1.2V, 1.2 VS , 2.5V
VGA_CORE , 1.5VS
VDD3 , VDD5
CHARGER,DC IN
Ca r d R e ad er
EXTERNAL CLOCK GENERATOR
IC S9L PRS 480
LVDS CO N
HDMI CON
CR T C ON
GPP PCIE IN TERFACE
PCIE3
NEW CARD
USB4
64 PIN
LVDS MUX
M 82 X T-S
LVDS MUX
PCIE0
PC IE E THE RN ETMINIP CIE -W L
RTL81 11C
USB 2.0
USB#2
Port 2
USB#1
Port 1
B luet ooth
USB7
Finger Prin ter
USB11
CLEVO M740J(JU)/M760J(JU)
AM D S 1 G2 C PU
638-Pi n u FC PGA 638
HDT
OU T
RS780M(C)
PCIE x16
VGA
Temperature sen sor
PCIE1
USB#0
Port 0
CCD
USB9
DEBUG PORT
BATTERY CHAGER
USB8
Hype rTransport LINK0 CP U I/ F
D X10 IGP( R S780)
LV DS/T M D S
1 X 16 PCIE I/F
1 X4 PCIE I/F WITH SB
6 X1 PCIE I /F
PCIE2
USB 1.1
INT
KEYBOARD
SB700
US B 2. 0 (10)
SATA II (1 PORTS)
AZALIA HD AUDIO
ATA 66/100/133
SPI I/F
LP C I/F
AC P I 1.1
IN T RTC
( KBC )
KBC IT8512E
PS2
TO UC H P AD
Hype rTransport
IN
LINK0
PCIE
X4
LPC
DDR II, 800MT/S
SB-TSI
16 x 1 6
A TA 6 6/ 100/133 I/F
SPI I/F
SPI ROM
Channel A
Channel B
HD A UDIO I/F
S ATA II I/ F
CPU FAN
6-71-M74J0-D03A
UNBUFFERED DDR2
SODIMM 0
UNBUFFERED DDR2
SODIMM 1
MDC
SPI ROM
AUDIO AMP
A P205 6A
AZALIA CODEC
A LC 662
HDD x1
SA TA #1
PA TA O DD
CPU
Temperature sen sor
In t Speak er x 2
Headphone Jack
SPDIF J ack
MIC In Jack
e-SATA x1
SA TA#2
B - 2 System Block Diagram
Page 69
Clock Generator
Schematic Diagrams
CLK_VD D3.3VS
10U _6.3V_08
Layout note:
PLACE CRYSTAL WITHIN 500
MILS OF ICS9LPRS480
C343
27P_50V_04
C363
.1U _16V_0 4
X3
14.318MH z
.1U_16V_04
C348
12
C75 6
.1U _16V _04
C L K_ VD D
C L K_ VD D
C347
27P_50V _04
.1U_16V _04
C361
L41HC B1608KF -121T25-06
L39HC B1608KF -121T25-06
C753
.1U _16V_0 4
.1U_16V_04
C34 4
C35 0
.1U_16V_04
C33 9
.1U_16V_04
CLK_VDDIO
R474
*1 M _04
Z0205
CLK_VD D
SCLK07,8,19
SDATA07,8,19
C37 2
C755
1U_16V_06
Pl a c e ne xt to VDD 4 8
Place very
close to U1
CLK_VD D
R475
*0_0402_5m il_ short
PC IE_ EXPC AR D_C LKRE Q#
WLAN_CLKREQ#
R 469 8.2K_04
C908
*1 U _16 V _ 06
2008/03/18
CLK_VD D
R467
PC IE_ EXPC AR D_C LKRE Q#19,22
WLAN_C LKREQ#22
*8 . 2 K _ 0 4
R468
*8.2K_04
PC IE_EXPC AR D_C LKRE Q#
WLAN_CLK REQ #
1.2VSCLK_VDDIO
U30
Z0201
4
VDDA_27
7
GNDA_27
Z0202
56
VDDREF
60
GNDREF
63
VDD48
26
VDDATIG
48
VDDCPU
55
VDDHTT
35
V DD SB_ SR C
16
VDDSRC
40
VDDSATA
25
VDDATIG_IO
47
VDDCPU_IO
34
V DD SB_ SR C_IO
11
VDDSRC_IO1
17
VDDSRC_IO2
1
GND48
24
GNDATIG1
46
GNDCPU
52
GNDHTT
43
GNDSATA
33
GNDSB_SRC
10
GNDSRC1
18
GNDSRC2
Z0203
61
X1
Z0204
62
X2
Z0209
23
CLKREQ0#
45
CLKREQ1#
Z0210
44
CLKREQ2#
39
Z0211
CLKREQ3#
38
CLKREQ4#
5159
Z0206
PD#REF0/SEL_HTT66
2
SMBCLK
3
SMBDAT
GND1
Therma l_G ND1
GND2
Therma l_G ND2
GND3
Therma l_G ND3
GND4
Therma l_G ND4
ICS9L PR S48 0
CP UK G 0T_ LP RS
CPUKG0C_LPRS
SRC7T_LPR S/27MH z_SS
SR C7 C _LPRS /27 M Hz _ NS
S B_SRC0T_LP RS
SB_SRC0C_LPRS
S B_SRC1T_LP RS
SB_SRC1C_LPRS
PCI E_ EX PC A RD_CLK P 22
PCI E_ EX PC A RD_CLK N 22
PCIE_LAN_CLKP 27
PCIE_LAN_CLKN 27
PCI E_ C R_CLKP 2 5
PCI E_ C R_CLKN 25
PCI E_ W LA N _ CLKP 22
PCI E_ W LA N _ CLKN 22
NBHT_CLKP 10
NBHT_CLKN 10
CLK_48M _ USB1 9
NB_OS C 10
1.1 VRS780
R163
90.9_1%_06
1066 M H z 3.3V single ended H TT clock
SEL_HTT66
*0
100 MHz differential HTT clock
100 MH z non-spreading dif ferential S ATA clock
1
SEL_SATA
100 MH z spreading differ ential SRC clock
0 *
2 7 MH z si n g l ed c l o c k
1 *
SEL_27MHz
100 MH z spreading differ ential SRC clock
Clock chip has i ntern al seria l te rmi na tions
for di f fer en cia l p air s , exte rn al r e s is tor s ar e
rese rve d fo r de bu g pu rp os e .
L0_C AD OUT_H0
L0_CAD OUT_L0
L0_C AD OUT_H1
L0_CAD OUT_L1
L0_C AD OUT_H2
L0_CAD OUT_L2
L0_C AD OUT_H3
L0_CAD OUT_L3
L0_C AD OUT_H4
L0_CAD OUT_L4
L0_C AD OUT_H5
L0_CAD OUT_L5
L0_C AD OUT_H6
L0_CAD OUT_L6
L0_C AD OUT_H7
L0_CAD OUT_L7
L0_C AD OUT_H8
L0_CAD OUT_L8
L0_C AD OUT_H9
L0_CAD OUT_L9
MA_ D M0
MA_ D M1
MA_ D M2
MA_ D M3
MA_ D M4
MA_ D M5
MA_ D M6
MA_ D M7
MA_DQS_H0
MA_ D QS _ L 0
MA_DQS_H1
MA_ D QS _ L 1
MA_DQS_H2
MA_ D QS _ L 2
MA_DQS_H3
MA_ D QS _ L 3
MA_DQS_H4
MA_ D QS _ L 4
MA_DQS_H5
MA_ D QS _ L 5
MA_DQS_H6
MA_ D QS _ L 6
MA_DQS_H7
MA_ D QS _ L 7
G12
F12
H14
G14
H11
H12
C13
E13
H15
E15
E17
H17
E14
F14
C17
G17
G18
C19
D22
E20
E18
F18
B22
C23
F20
F22
H24
J19
E21
E22
H20
H22
Y24
AB 24
AB 22
AA 21
W22
W21
Y22
AA 22
Y20
AA 20
AA 18
AB 18
AB 21
AD 2 1
AD 1 9
Y18
AD 1 7
W16
W14
Y14
Y17
AB 17
AB 15
AD 1 5
AB 13
AD 1 3
Y12
W11
AB 14
AA 14
AB 12
AA 12
E12
C15
E19
F24
AC 2 4
Y19
AB 16
Y13
G13
H13
G16
G15
C22
C21
G22
G21
AD 2 3
AC 2 3
AB 19
AB 20
Y15
W15
W12
W13
MEM_MA_DATA0
MEM_MA_DATA1
MEM_MA_DATA2
MEM_MA_DATA3
MEM_MA_DATA4
MEM_MA_DATA5
MEM_MA_DATA6
MEM_MA_DATA7
MEM_MA_DATA8
MEM_MA_DATA9M_ Z P
ME M_ MA _D AT A 1 0
ME M_ MA _D AT A 1 1
ME M_ MA _D AT A 1 2
MEM_MA_DATA13
MEM_MA_DATA14
MEM_MA_DATA15
MEM_MA_DATA16
MEM_MA_DATA17
MEM_MA_DATA18
MEM_MA_DATA19
MEM_MA_DATA20
MEM_MA_DATA21
MEM_MA_DATA22
MEM_MA_DATA23
MEM_MA_DATA24
MEM_MA_DATA25
MEM_MA_DATA26
MEM_MA_DATA27
MEM_MA_DATA28
MEM_MA_DATA29
MEM_MA_DATA30
MEM_MA_DATA31
MEM_MA_DATA32
MEM_MA_DATA33
MEM_MA_DATA34
MEM_MA_DATA35
MEM_MA_DATA36
MEM_MA_DATA37
MEM_MA_DATA38
MEM_MA_DATA39
MEM_MA_DATA40
MEM_MA_DATA41
MEM_MA_DATA42
MEM_MA_DATA43
MEM_MA_DATA44
MEM_MA_DATA45
MEM_MA_DATA46
MEM_MA_DATA47
MEM_MA_DATA48
MEM_MA_DATA49
MEM_MA_DATA50
MEM_MA_DATA51
MEM_MA_DATA52
MEM_MA_DATA53
MEM_MA_DATA54
MEM_MA_DATA55
MEM_MA_DATA56
MEM_MA_DATA57
MEM_MA_DATA58
MEM_MA_DATA59
MEM_MA_DATA60
MEM_MA_DATA61
MEM_MA_DATA62
MEM_MA_DATA63
ME M_ MA _D M0
ME M_ MA _D M1
ME M_ MA _D M2
ME M_ MA _D M3
ME M_ MA _D M4
ME M_ MA _D M5
ME M_ MA _D M6
ME M_ MA _D M7
VDD1_9
V DD1_10
V DD1_11
V DD1_12
V DD1_13
V DD1_14
V DD1_15
V DD1_16
V DD1_17
V DD1_18
V DD1_19
V DD1_20
V DD1_21
V DD1_22
V DD1_23
V DD1_24
V DD1_25
V DD1_26
V SS1
V SS2
V SS3
V SS4
V SS5
V SS6
V SS7
V SS8
V SS9
V SS1 0
V SS1 1
V SS1 2
V SS1 3
V SS1 4
V SS1 5
V SS1 6
V SS1 7
V SS1 8
V SS1 9
V SS2 0
V SS2 1
V SS2 2
V SS2 3
V SS2 4
V SS2 5
V SS2 6
V SS2 7
V SS2 8
V SS2 9
V SS3 0
V SS3 1
V SS3 2
V SS3 3
V SS3 4
V SS3 5
V SS3 6
V SS3 7
V SS3 8
V SS3 9
V SS4 0
V SS4 1
V SS4 2
V SS4 3
V SS4 4
V SS4 5
V SS4 6
V SS4 7
V SS4 8
V SS4 9
V SS5 0
V SS5 1
V SS5 2
V SS5 3
V SS5 4
V SS5 5
V SS5 6
V SS5 7
V SS5 8
V SS5 9
V SS6 0
V SS6 1
V SS6 2
V SS6 3
V SS6 4
V SS6 5
VSS 99
VS S1 00
VS S1 01
VS S1 02
VS S1 03
VS S1 04
VS S1 05
VS S1 06
VS S1 07
VS S1 08
VS S1 09
VS S1 10
VS S1 11
VS S1 12
VS S1 13
VS S1 14
VS S1 15
VS S1 16
VS S1 17
VS S1 18
VS S1 19
VS S1 20
VS S1 21
VS S1 22
VS S1 23
VS S1 24
VS S1 25
VS S1 26
VS S1 27
VS S1 28
VS S1 29
MEM_M A_C K E04
MEM_M A_C K E14
MEM_ MA _CA S #4
MEM_ MA _RA S #4
MEM _MA_WE #4
SCLK02,8,19
SDATA02,8,19
R189
R18 7
MEM_MA0 _OD T04
10K_04
10 K_ 04
MEM_MA0 _OD T14
MEM _MA_DM [0..7]4
M EM_MA _DQS 0 _P4
M EM_MA _DQS 1 _P4
M EM_MA _DQS 2 _P4
M EM_MA _DQS 3 _P4
M EM_MA _DQS 4 _P4
M EM_MA _DQS 5 _P4
M EM_MA _DQS 6 _P4
M EM_MA _DQS 7 _P4
M EM_MA _DQS 0 _N4
M EM_MA _DQS 1 _N4
M EM_MA _DQS 2 _N4
M EM_MA _DQS 3 _N4
M EM_MA _DQS 4 _N4
M EM_MA _DQS 5 _N4
M EM_MA _DQS 6 _N4
M EM_MA _DQS 7 _N4
3. 3 V S
C382
2.2U_6.3V_06
CPU_MEM HOT#5, 8
MVREF_DIM
20mils
C360
2.2U_6.3V_06
SO-DIMM 0
MEM_ MA_AD D 0
MEM_ MA_AD D 1
MEM_ MA_AD D 2
MEM_ MA_AD D 3
MEM_ MA_AD D 4
MEM_ MA_AD D 5
MEM_ MA_AD D 6
MEM_ MA_AD D 7
MEM_ MA_AD D 8
MEM_ MA_AD D 9
MEM_ MA_AD D 10
MEM_ MA_AD D 11
MEM_ MA_AD D 12
MEM_ MA_AD D 13
MEM_ MA_AD D 14
MEM_ MA_AD D 15
MEM_ MA_BAN K2
MEM_ MB _ CK E04
MEM_ MB _ CK E14
MEM_M B_C AS #4
MEM_M B_R AS #4
MEM_ MB _W E #4
SCLK02,7,19
SDATA02,7,19
MEM_MB0_ODT04
MEM_MB0_ODT14
MEM_ MB _DM [0..7]4
MEM_MB_ D QS 0 _P4
MEM_MB_ D QS 1 _P4
MEM_MB_ D QS 2 _P4
MEM_MB_ D QS 3 _P4
MEM_MB_ D QS 4 _P4
MEM_MB_ D QS 5 _P4
MEM_MB_ D QS 6 _P4
MEM_MB_ D QS 7 _P4
MEM_MB_ D QS 0 _N4
MEM_MB_ D QS 1 _N4
MEM_MB_ D QS 2 _N4
MEM_MB_ D QS 3 _N4
MEM_MB_ D QS 4 _N4
MEM_MB_ D QS 5 _N4
MEM_MB_ D QS 6 _N4
MEM_MB_ D QS 7 _N4
H T _CPU _NB _C LK_ H03
H T _CPU _NB _C LK_ L03
H T _CPU _NB _C LK_ H13
H T _CPU _NB _C LK_ L13
H T_CPU _NB_C TL_H 03
H T_CPU _NB_C TL_L03
H T_CPU _NB_C TL_H 13
H T_CPU _NB_C TL_L13
P CIE_MXM_NB_RX0P12
P CIE_MXM_NB_RX0N12
P CIE_MXM_NB_RX1P12
P CIE_MXM_NB_RX1N12
P CIE_MXM_NB_RX2P12
P CIE_MXM_NB_RX2N12
P CIE_MXM_NB_RX3P12
P CIE_MXM_NB_RX3N12
P CIE_MXM_NB_RX4P12
P CIE_MXM_NB_RX4N12
P CIE_MXM_NB_RX5P12
P CIE_MXM_NB_RX5N12
P CIE_MXM_NB_RX6P12
P CIE_MXM_NB_RX6N12
P CIE_MXM_NB_RX7P12
P CIE_MXM_NB_RX7N12
P CIE_MXM_NB_RX8P12
P CIE_MXM_NB_RX8N12
P CIE_MXM_NB_RX9P12
P CIE_MXM_NB_RX9N12
P CIE_MXM_NB_RX10P12
P CIE_MXM_NB_RX10N12
P CIE_MXM_NB_RX11P12
P CIE_MXM_NB_RX11N12
P CIE_MXM_NB_RX12P12
P CIE_MXM_NB_RX12N12
P CIE_MXM_NB_RX13P12
P CIE_MXM_NB_RX13N12
P CIE_MXM_NB_RX14P12
P CIE_MXM_NB_RX14N12
P CIE_MXM_NB_RX15P12
P CIE_MXM_NB_RX15N12
HT_ R XC AD 0P
HT_ R XC AD 0N
HT_ R XC AD 1P
HT_ R XC AD 1N
HT_ R XC AD 2P
HT_ R XC AD 2N
HT_ R XC AD 3P
HT_ R XC AD 3N
HT_ R XC AD 4P
HT_ R XC AD 4N
HT_ R XC AD 5P
HT_ R XC AD 5N
HT_ R XC AD 6P
HT_ R XC AD 6N
HT_ R XC AD 7P
HT_ R XC AD 7N
HT_ R XC AD 8P
HT_ R XC AD 8N
HT_ R XC AD 9P
HT_ R XC AD 9N
HT_ R XC AD 10P
HT_ R XC AD 10N
HT_ R XC AD 11P
HT_ R XC AD 11N
HT_ R XC AD 12P
HT_ R XC AD 12N
HT_ R XC AD 13P
HT_ R XC AD 13N
HT_ R XC AD 14P
HT_ R XC AD 14N
HT_ R XC AD 15P
HT_ R XC AD 15N
HT_RXC LK0P
HT_RXC LK0N
HT_RXC LK1P
HT_RXC LK1N
HT_ R XC TL 0 P
HT_ R XC TL 0 N
HT_ R XC TL 1 P
HT_ R XC TL 1 N
HT_ R XC AL P
HT_ R XC AL N
R S780(RX780)
U22B
GF X_ R X0P
GF X_ R X0N
GF X_ R X1P
GF X_ R X1N
GF X_ R X2P
GF X_ R X2N
GF X_ R X3P
GF X_ R X3N
GF X_ R X4P
GF X_ R X4N
GF X_ R X5P
GF X_ R X5N
GF X_ R X6P
GF X_ R X6N
GF X_ R X7P
GF X_ R X7N
GF X_ R X8P
GF X_ R X8N
GF X_ R X9P
GF X_ R X9N
GF X_ R X10P
GF X_ R X10N
GF X_ R X11P
GF X_ R X11N
GF X_ R X12P
GF X_ R X12N
GF X_ R X13P
GF X_ R X13N
GF X_ R X14P
GF X_ R X14N
GF X_ R X15P
GF X_ R X15N
GP P_RX 0 P
GP P_RX 0 N
GP P_RX 1 P
GP P_RX 1 N
GP P_RX 2 P
GP P_RX 2 N
GP P_RX 3 P
GP P_RX 3 N
GP P_RX 4 P
GP P_RX 4 N
GP P_RX 5 P
GP P_RX 5 N
TMD S0_DA TA 0P
TMD S0_DA TA 0N
TMD S0_DA TA 1P
TMD S0_DA TA 1N
TMD S0_DA TA 2P
TMD S0_DA TA 2N
TMD S0_DA TA 3P
TMD S0_DA TA 3N
GFX_TX4P_CGFX_TX4P_C
GFX_TX4N _CGFX_TX4N_C
GFX_TX5P_CGFX_TX5P_C
GFX_TX5N _CGFX_TX5N_C
GFX_TX6P_CGFX_TX6P_C
GFX_TX6N _CGFX_TX6N_C
GFX_TX7P_CGFX_TX7P_C
GFX_TX7N _CGFX_TX7N_C
GFX_TX8P_CGFX_TX8P_C
GFX_TX8N _CGFX_TX8N_C
GFX_TX9P_C
GFX_TX9N _C
G FX_TX10P_C
GFX_TX10N_C
G FX_TX11P_C
GFX_TX11N_C
G FX_TX12P_C
GFX_TX12N_C
G FX_TX13P_C
GFX_TX13N_C
G FX_TX14P_C
GFX_TX14N_C
G FX_TX15P_C
GFX_TX15N_C
PCIE_NB_MINICARD_TXP 22
PCIE_NB_MINICARD_TXN 22
PCIE_NB_GIGALAN_TXP 27
PCIE_NB_GIGALAN_TXN 27
P CIE _N B_C ARD RE ADE R_TXP 25
P CIE _N B_C ARD RE ADE R_TXN 2 5
P CIE _N B_EXPC A R D_ TXP 2 2
P CIE _N B_EXPC A R D_ TXN 2 2
P CIE _N B_SB_T X0P 1 8
P CIE _N B_SB_T X0N 1 8
P CIE _N B_SB_T X1P 1 8
P CIE _N B_SB_T X1N 1 8
P CIE _N B_SB_T X2P 1 8
P CIE _N B_SB_T X2N 1 8
P CIE _N B_SB_T X3P 1 8
P CIE _N B_SB_T X3N 1 8
N B _L VD S_ TX _L 0P 1 6
N B _L VD S_ TX _L 0N 1 6
N B _L VD S_ TX _L 1P 1 6
N B _L VD S_ TX _L 1N 1 6
N B _L VD S_ TX _L 2P 1 6
N B _L VD S_ TX _L 2N 1 6
N B _L VD S_ TX _U 0P 16
N B _L VD S_ TX _U 0N 16
N B _L VD S_ TX _U 1P 16
N B _L VD S_ TX _U 1N 16
N B _L VD S_ TX _U 2P 16
N B _L VD S_ TX _U 2N 16
N B _L VD S_ TX _ C L K L P 1 6
N B _L VD S_ TX _ C L K L N 1 6
N B _L VD S_ TX _ C L K U P 16
N B _L VD S_ TX _ C L K U N 16
En ables the Test Deb ug Bus us ing GPIO .
RX 780:NB_TV _C; RS740 :RS740_DF T_GPIO5; RS780:VS YNC#
R S740/RS78 0 RX78 0
1 Disable Enab le
0 Enable Disa ble
RS 740/R S 7 80: Enab le s Sid e po rt m emor y
RS 740:RS740 _DFT_GPIO 0
RS 780:HSYNC #
Se lects if Memory SI DE PORT i s availa ble or n o t
1 = Memory Side port Not avai lable
0 = Memory Side port availabl e
Re gister Re adback of strap:
NB _CLKCFG:C LK_TOP_SP ARE_D[1]
VSSA PC IE1
VSSA PC IE2
VSSA PC IE3
VSSA PC IE4
VSSA PC IE5
VSSA PC IE6
VSSA PC IE7
VSSA PC IE8
VSSA PC IE9
VSSA PC IE1 0
VSSA PC IE1 1
VSSA PC IE1 2
VSSA PC IE1 3
VSSA PC IE1 4
VSSA PC IE1 5
VSSA PC IE1 6
VSSA PC IE1 7
VSSA PC IE1 8
VSSA PC IE1 9
VSSA PC IE2 0
VSSA PC IE2 1
VSSA PC IE2 2
VSSA PC IE2 3
VSSA PC IE2 4
VSSA PC IE2 5
VSSA PC IE2 6
VSSA PC IE2 7
VSSA PC IE2 8
VSSA PC IE2 9
VSSA PC IE3 0
VSSA PC IE3 1
VSSA PC IE3 2
VSSA PC IE3 3
VSSA PC IE3 4
VSSA PC IE3 5
VSSA PC IE3 6
VSSA PC IE3 7
VSSA PC IE3 8
VSSA PC IE3 9
VSSA PC IE4 0
P LA CE MVREF DIV IDERS
A ND C APS CL OS E TO
ASIC
MXM_LCD_BKL_EN 13,16
1.8VS_VGA
R436
100_1% _04+K
R429
100_1% _04+K
MXM_ L VD S_ TX_ C L KU P 1 6
MXM_ L VD S_ TX_ C L KU N 16
MXM_ L VD S_ TX_ U 0 P 16
MXM_ L VD S_ TX_ U 0 N 1 6
MXM_ L VD S_ TX_ U 1 P 16
MXM_ L VD S_ TX_ U 1 N 1 6
MXM_ L VD S_ TX_ U 2 P 16
MXM_ L VD S_ TX_ U 2 N 1 6
MXM_ L VD S_ TX_ C L KL P 16
MXM_ L VD S_ TX_ C L KL N 1 6
MXM_ L VD S_ TX_ L 0 P 1 6
MXM_ L VD S_ TX_ L 0 N 1 6
MXM_ L VD S_ TX_ L 1 P 1 6
MXM_ L VD S_ TX_ L 1 N 1 6
MXM_ L VD S_ TX_ L 2 P 1 6
MXM_ L VD S_ TX_ L 2 N 1 6
SC LK0,S DA TA 0= >Cl oc k Ge n,D DR 2,VG A
SC LK1,S DA TA 1= >PC I- E Mi ni Ca rd (WL AN ,L AN )
M/B USB PORT 0,1
AZ_BITC LK24,28
3.3VS
R 23520K_04
R 26020K_04
R 2422.2K_04
R 2512.2K_04
3.3V
R 5311K_04
R 2752.2K_04
R 2642.2K_04
R 27110K_04
R 5182.2K_04
R519*2.2K_04
R517*2.2K_04
R 5202.2K_04
R26610K_04
3.3V
R527
*22K_04
RSMRST#_R
C854
* 2. 2 U _ 6. 3V _0 6
PCIE_EXPCARD _CLKREQ#2,22
PC IE_EXPCA RD _ PW R EN#22
NEW CARD
SBGPIO6
SBGPIO0
SCLK0
S DATA0
PWR_BTN#
SCLK1
S DATA1
SUS_STAT#
GP16
GP17
STR AP pin to define
us e L P C or S PI RO M
AZ_RST#
CP U_ T HE RM TR IP #5,38
to CPU Thermal IC
U SB_ OC P8 _ 9#22
U SB_ OC P0 _ 1#24
R60233_04
C902
* 6 8P _5 0 V _ 0 4
LID_SW#1 6 , 2 6, 30
HD _ A UX_ R ST#23
SWI#30
SUS B#22,30,31,32,36
SUS C#30
PWR_BTN#30
PCI E_EXPCA RD _P W R EN#22
3.3V
TH ERM _ AL ER T#5, 3 0
SB_CR_CPPE#25
R579*0_04
R580*0_04
R6040_04
R31 7
*0_0402_5mil_short
R31 9
*0_0402_5mil_short
C90 6
22 P_5 0V_0 4
SB_CR_CPPE#25
R318*0_04
R5760_04
SB_PWR GD16,30,32
S US_ STAT#10
GA2 030
KBC_RST#30
SCI#30
SMI#30
SYS _RST#32
PC IE_ W AK E#22,27
SWI #30
R 5770_04
WD_PWRGD32
IC H _S PK R28
SC L K02,7,8
SD AT A02,7,8
SC L K122
SD AT A122
3.3V
A Z _ SDO UT24, 28
AZ _ SDIN 028
AZ _ SDIN 124
AZ_SY N C24,28
AZ_R ST#24,28
Z1901
R306 *0_040 2_5mil_short
R305 *0_040 2_5mil_short
PWR _BTN#
R281 *0_040 2_5mil_short
2008/03/18
R267 *0_040 2_5mil_short
R268 *0_040 2_5mil_short
R578*10K_04
RSM R ST#_R
2008/03/18
R304 10K_04
R 243 10K _04
3.3V
3.3V S
R28 8
*0_0402_5mil_short
PME#30
R601*0_04
R528*0_04
CPU_THERMTRIP#SB
R254
*0_040 2_5mil_short
R276*0_04
R272*0_04
R 522 *10K_04
R 316 10K _04
R 521 *10K_04
R 294 *10K_04
R 307 *10K_04
AZ_SDIN2
AZ_SDIN3
AZ_RST#
R270*0_04
R292
10K_04
COMMON
35mil
Z1902
Z1903
Z1904
Z1905
SB _ TE ST2
SB _ TE ST1
SB _ TE ST0
Z1971
Z1972
Z1906
Z1973
SBG PIO10
SB GPI O6
SB GPI O4
SB GPI O0
Z1910
Z1911
Z1912
SBG PIO9
SBG PIO8
SBG PIO66
SBG PIO5
Z1914
Z1915
Z1916
Z1917
Z1918
Z1974
Z1920
Z1921
Z1907
Z1923
Z1924
Z1925
Z1926
Z1927
Z1928
Z1929
Z1930
Z1975
AE 1 8
AD 1 8
AA 1 9
AA 1 8
AA 2 0
Y15
W15
K24
W14
W17
V17
W20
W21
W18
Y18
Y19
H19
H20
H21
F25
D22
E24
E25
D23
U31 D
E1
E2
H7
F5
G1
H2
H1
K3
H5
H4
H3
K4
F1
J2
H6
F2
J6
D3
K1
K2
C1
G5
B9
B8
A8
A9
E5
F8
E4
M1
M2
J7
J8
L8
M3
L6
M4
L5
SB700
PCI _P ME#/G EVEN T 4#
RI#/E XT E V NT0 #
SLP_ S2/GP M9#
SLP_ S3#
SLP_ S5#
PWR _BTN#
PWR _GO OD
SUS_STAT#
TEST2
TEST1
TEST0
GA2 0 IN /GE VEN T0#
KBR ST #/GEV ENT1#
LPC_PM E#/G EVEN T3#
LPC_SMI#/EXTEVN T1#
S3_ STATE/GE VEN T5#
SYS _R ESE T# /G PM 7 #
WAKE #/ GEVE NT8#
BLINK /GPM 6 #
SMB ALERT#/TH RMTRIP#/GEVENT2#
NB_ PW RG D
RSM R ST#
SATA_IS0#/GPIO10
CLK_R EQ3# /SA TA_IS1 #/G PIO 6
SMA RTVO L T/SAT A_IS2 #/GP IO4
CLK_R EQ0# /SA TA_IS3 #/G PIO 0
CLK_R EQ1#/SATA _I S4#/F ANOU T3/G PIO39
CLK _ R EQ2# /S A TA _I S5 #/F ANI N3 /G PIO40
SPKR /G PIO2
SCL0/G P O C0 #
SDA 0/ GPO C1 #
SCL1/G P O C2 #
SDA 1/ GPO C3 #
DD C1 _ SC L/GPI O9
DD C1 _ SD A/G P IO 8
LLB #/GPIO66
SHU TDO WN # /GP IO5
DD R3 _ R ST#/ GEV ENT 7 #
USB _O C 6#/IR _TX 1/GE VE NT6 #
USB _O C 5#/IR _TX0/GPM5#
USB _O C 4#/IR _RX0 /G PM4#
USB _O C 3#/IR _RX1 /G PM3#
USB _O C 2# /G PM 2 #
USB _O C 1# /G PM 1 #
USB _O C 0# /G PM 0 #
AZ_BITC LK
AZ_SD OU T
AZ_SD IN0/G PIO 4 2
AZ_SD IN1/G PIO 4 3
AZ_SD IN2/G PIO 4 4
AZ_SD IN3/G PIO 4 6
AZ_SY NC
AZ_RS T#
AZ_DO C K_RST# /G PM8#
IMC _ GP IO0
IMC _ GP IO1
SPI_CS2#/ IMC _GPIO 2
IDE_RST#/F_RST#/IMC_GPO3
IMC _ GP IO4
IMC _ GP IO5
IMC _ GP IO6
IMC _ GP IO7
USB13 N.C
USB 12 Fi ng er P r i nt er
USB11 N.C
USB10 N.C
USB9 CCD
USB8 New Card
USB7 Buletooth(For M740J/K)
USB6 Buletooth(For M760J/K)
US B 5 W L AN (PCIE M ini Card)
US B 4 3 G(PCIE Mini Card)
USB3 N.C
USB2 US B Por t 2 (Aud io/B)
USB1 US B Por t 1 (M/B)
USB0 US B Por t 0 (M/B)
3.3V
2.2K _04
R51 5
2. 2 K _ 0 4
SCLK2,SDATA2=>PCI Express Card(NEW CARD)
R51 6
SCLK3,SDATA3=>CPU
SCLK2 22
SDA TA 2 2 2
SCLK3 5
*SCLK3,SDATA3=>CPU
SDA TA 3 5
CPU? PULL HIGH
B - 20 SB700-2
Page 87
SB700-3
SATA_TX0 +_C26
SATA_TX0 -_C26
SATA_TX1 +_C23
SATA_TX1 -_C23
SATA_TX0 +_C
SATA_TX0 -_C
SATA_RX0-_C26
SATA_RX0+ _C26
SATA_TX1 +_C
SATA_RX1-_C23
SATA_RX1+ _C23
PL A C E SA TA_CAL
RE S VERY C LOSE TO
BALL OF SB700
NOTE:
R6 50 IS 1 K 1% FOR 25 MHz
XTAL, 4 .99K 1% FOR 100MH z
INTERNAL CL OCK
0417
1.2VS
3.3VS
S ATA PORT S DI STRIBUTION:
0 - 2.5" H DD
1 - eSA TA CONN .
2,3,4 ,5 - NOT USED
PLACE SATA AC CO UPLING
CAPS CLOSE TO SB7 00
C 783. 01U _16V _04
C 782. 01U _16V _04
SA TA _RX 0-_C
SA TA _RX 0+_C
C 779. 01U _16V _04
C 778. 01U _16V _04
SA TA _RX 1-_C
SA TA _RX 1+_C
R 2561.0K_1%_04
0104
C 471 15P_N PO_04
12
X4
C 472 15P_N PO_04
L46HC B1608KF-121T25-06
CLO SE TO T HE
BA LL OF S B700HWM_AGND TRACE AT LEAST
L48H CB 1608KF-121T25-06
CL O SE TO THE BALL
OF SB7 00
SPI ROM =>base on AMD, change net name
SPI CONN.=>base on LV220
R22 2
Z202 7
R22 3
Z202 8
C780.01U_16V_04
C781.01U_16V_04
R22 4
Z202 9
R22 5
Z203 0SATA_TX1-SATA_TX1 -_C
C777.01U_16V_04
C776.01U_16V_04
S ATA_LED#23
25MH z
*1 U _ 10 V _ 0 6
*0_0402_5m il_short
*0_0402_5m il_short
*0_0402_5m il_short
*0_0402_5m il_short
SATA_CA L
SATA_X1
SATA_X2
PLLVDD _ATA
XTLVDD_ATA
SATA_X1
R21 0
10M_04
SATA_X2
PLLVDD _ATA
C77 3
C774
1U_10V_06
XTLVDD_ATA
C496
1U _10V_06
SATA_TX0 +
SATA_TX0 -
SATA_R X0SATA_R X0+
Z2001
Z2002
Z2003
Z2004
SATA_TX1 +
SATA_R X1SATA_R X1+
Z2005
Z2006
Z2007
Z2008
Z2009
Z2010
Z2011
Z2012
Z2013
Z2014
Z2015
Z2016
2.2U_6.3V_06
C772
AC 1 0
AD 1 0
AD 1 1
AC 1 2
AD 1 2
AD 1 3
AC 1 4
AD 1 4
AD 1 5
AC 1 6
AD 1 6
AD 9
AE9
AB10
AE10
AE11
AB12
AE12
AE13
AB14
AE14
AE15
AB16
AE16
Y12
AA12
W11
AA11
W12
V12
U31B
SA TA _TX0P
SA TA _TX0N
SA TA _R X0 N
SA TA _R X0 P
SA TA _TX1P
SA TA _TX1N
SA TA _R X1 N
SA TA _R X1 P
SA TA _TX2P
SA TA _TX2N
SA TA _R X2 N
SA TA _R X2 P
SA TA _TX3P
SA TA _TX3N
SA TA _R X3 N
SA TA _R X3 P
SA TA _TX4P
SA TA _TX4N
SA TA _R X4 N
SA TA _R X4 P
SA TA _TX5P
SA TA _TX5N
SA TA _R X5 N
SA TA _R X5 P
SA TA _C AL
SA TA _X1
SA TA _X2
SA TA _A CT# /G PIO67
PLLVD D_SA TA
XTLVDD _ SATA
SB70 0
Part 2 of 5
SAT A PWRSERIA L ATA
SB 7 00
J_SPI? PIN ? ? LV220 JSPIDBG
3.3V_SPI
SPI_H OLD #_RSPI _D ATAIN
SPI_C LK
SPI_D ATAOU T
J_SPI1
1
9
*S PUF Z-1 0 S 3 -V B -0 -B _ N
2
10
AT A 66/10 0/133
SPI_H OLD #/G PIO 3 1
LA N_RST#/GPIO 13
ROM_RST#/GPIO14
SPI ROM
FAN OU T1/GPIO 48
FAN OU T2/GPIO 49
TE MPI N3/TALERT#/GPIO64
HW MONITOR
J_ SPI 1
12
34
56
78
910
IDE_ IO RD Y
IDE _IR Q
ID E_A0
ID E_A1
ID E_A2
IDE_ D AC K#
ID E _DR Q
IDE _IOR #
ID E _IOW #
IDE_CS1#
IDE_CS3#
ID E _D 0/G P IO 15
ID E _D 1/G P IO 16
ID E _D 2/G P IO 17
ID E _D 3/G P IO 18
ID E _D 4/G P IO 19
ID E _D 5/G P IO 20
ID E _D 6/G P IO 21
ID E _D 7/G P IO 22
ID E _D 8/G P IO 23
ID E _D 9/G P IO 24
TEMP_C OMM
TEMPIN 0/G PIO 61
TEMPIN 1/G PIO 62
TEMPIN 2/G PIO 63
VIN 0/G PIO 5 3
VIN 1/G PIO 5 4
VIN 2/G PIO 5 5
VIN 3/G PIO 5 6
VIN 4/G PIO 5 7
VIN 5/G PIO 5 8
VIN 6/G PIO 5 9
VIN 7/G PIO 6 0
AVD D
AVSS
SPI _C S#_SEL
SPI _F LA SH
AA24
AA25
Y22
AB23
Y23
AB24
AD 2 5
AC 2 5
AC 2 4
Y25
Y24
AD 2 4
ID E _ PD D0
AD 2 3
ID E _ PD D1
AE22
ID E _ PD D2
AC 2 2
ID E _ PD D3
AD 2 1
ID E _ PD D4
AE20
ID E _ PD D5
AB20
ID E _ PD D6
AD 1 9
ID E _ PD D7
AE19
ID E _ PD D8
AC 2 0
ID E _ PD D9
AD 2 0
ID E _ PD D10
AE21
ID E _ PD D11
AB22
ID E _ PD D12
AD 2 2
ID E _ PD D13
AE23
ID E _ PD D14
AC 2 3
ID E _ PD D15
G6
SP I_DAT AIN
D2
SP I_DAT AO UT
D1
SP I_CL K
F4
SP I_HO LD #
F3
SP I_CS#
U15
LAN_RST#
J1
S B700_ROM_RS T#
M8
Z2017
M5
Z2018
M7
Z2019
P5
Z2020
P8
Z2021
R8
Z2022
C6
Z2023
B6
Z2024
A6
Z2025
A5
Z2026
B5
TEMPIN 3
A4
B4
C4
Z2031
Z2032
D4
D5
Z2033
D6
A7
B7
F6
G7
ID E _ P DI OR DY 2 3
ID E _ IR Q 23
ID E _ P DA 0 23
ID E _ P DA 1 23
ID E _ P DA 2 23
ID E _ P DD AC K# 2 3
ID E_PDD R EQ 23
ID E _ P DI OR # 2 3
ID E _ P DI OW# 2 3
ID E _ P DC S1 # 23
ID E _ P DC S3 # 23
NOTE:
IF THERE IS NO IDE, TEST
POINT S FOR DEBUG BUS
IS M ANDATORY
ID E _ PDD [15:0 ]
R494
C53 3
.1U_16V_04
C53 2
2.2U_6.3V_06
R506
1K _0 4
SPI_CS #_S EL
R495
*0 _ 0 4
R50 5
10K_04
*0_0402_5mil_shor t
R297* 0_0402_5m il_short
BD _ ID0
BD _ ID1
R535* 0_0402_5m il_short
R542* 0_0402_5m il_short
R624* 0_04
VIN _5
VIN _6
VIN _7
3.3V
NC2 NC_04
SPI_CS#_SEL
S PI_DA TA INSPI_ H OLD #_R
SPI_FLASH
IDE _P DD [15: 0] 23
NOTE:
ALL HWM CIR CU I TS ARE ONL Y FOR SB6 00
ALL HWM VALUES AR E TBD
NOTE: ROUTE TE MP_COMM
AS A 10MIL TRACE
SB_BLO N 16
SB_M UTE# 2 9
SB_D PS_ LAN 27
3. 3V
10 MIL WIDE
3.3V_SPI
8Mbit
U32
1
2
3
4
CE#
SO
HO L D#
WP #
GND
*SST25VF080B
SST SPI ROM
8
VD D
7
SPI_C LK
6
SC K
SPI_D ATAOU T
5
SI
3.3V
R 315
20K_04
C832
*. 1U _16V _04
A_R ST#10,1 6,18,2 3
R511
10K_04
R514 *0_04
TEMP IN3
BD_ID 1
BD_ID 0
LAN_R ST#
3.3V3.3V
R54 1
*10K_04
R54 0
10K _04
SPI_H OLD #
D20 RB751V
R 184
*1K_04
R 538
*10K_04
R 539
10K_04
AC
D21 RB 751 V
Schematic Diagrams
B.Schematic Diagrams
Sheet 20 of 47
3.3VS
R176
20K_04
PCIE _R ST# 12 ,18
AC
BD_ID1HBD _ID 0
L
M7 40J
M7 40K
L
H
SB700-3
SB700-3 B - 21
Page 88
Schematic Diagrams
SB700-4
Sheet 21 of 47
SB700-4
B.Schematic Diagrams
.1U_16V_04
3.3V
H CB 1608KF-121T25_06
3.3VS
C49 9
C495
.1U_16V_04
1. 2V S
L83
H CB 1608KF -121T25_06
L9 2
1U_10V_06
22U_6.3V _08
C50 4
.1U_16V_04
2A
2 2 U _ 6. 3V _ 08
1.2VS
HCB1608K F-121T25_06
C878
*1U_10V_06
C501
C80 6
1U_10V_06
L82
C877
C857
.1U_16V_04
C503
1U_10V_06
3.3VS
C803
1U _10V_06
2A
22U_6.3V_08
2A
.1U _16V _04
C500
C49 3
*1U_10V_06
1.8V=>FLAS H MEMORY M ODE(DEFAULT)
3.3 V=>ID E M OD E
PC IE_ VD D R
C805
1U _10V_06
C759
1U _10V_06
C83 7
C83 8
.1U_16V_04
*1U _10V_06
C 470
C502
22U_6.3V _08
.1U _1 6 V_ 0 4
C51 2
1U_10V_06
AVD D_ SA TA
C76 0
1U _10V_06
C876
*. 1U _16V_04
3.3VS
L87
H CB1005K F-121T20_04
1.2VS
L51
H CB1608KF-121T25_06
L50
H CB 1005KF -121T20_04
C492
1U _10V _06
C48 8
.1U_ 1 6 V _ 0 4
C804
C762
C85 6
200mA
2.2U_6.3V_06
C82 5
1U_10V_06
C51 7
.1U_16V_04
C514
.1U_ 1 6 V _ 0 4
C764
.1U_ 1 6 V _ 0 4
C862
.1U _1 6V _ 04
AVDDCK_3.3V
C82 8
2A
C523
.1U_ 1 6 V _ 0 4
*1U_10V_06
200mA
1U_10V_06
C814
C479
C51 1
.1U_16V_04
C76 7
.1U_16V_04
10U_10V_08
C866
10U _10V_08
C808
1U _10V _06
2.2U_6.3V _06
1.2V_CK VDD
C811
10U_10V _08
AV DD CK _1.2V
C823
PLACE ALL THE DECOUPL ING CAPS ON
THI S SHEET C L OSE TO S B AS
POS SI BLE.
S MC LK 0/G PB3
S MD AT0/GPB4
SMCLK1/GPC1
SMDAT1/GPC2
S MC LK2/GPF 6( PU )
S MD AT2/GPF7 ( PU )
PWM
P W M0/G PA0 ( PU )
P W M1/G PA1 ( PU )
P W M2/G PA2 ( PU )
P W M3/G PA3 ( PU )
P W M4/G PA4 ( PU )
P W M5/G PA5 ( PU )
P W M6/G PA6 ( PU )
P W M7/G PA7 ( PU )
PS/2
P S2C LK0/GP F0( PU )
P S2D AT0 /GP F 1( PU )
P S2C LK1/GP F2( PU )
P S2D AT1 /GP F 3( PU )
P S2C LK2/GP F4( PU )
P S2D AT2 /GP F 5( PU )
WAKE UP
PWRSW /GPE4( PU )
R I1#/WUI0/GPD 0( P U )
R I2#/WUI1/GPD 1( P U )
GP INTERRUPT
G INT/G PD 5( PU )
( PD )RI NG #/P W RFA IL#/L PC RS T# /G PB7
UART
R XD/G PB0 ( PU )
TXD/GPB1( PU )
IT8512E/IT8502-J
0507
C928
.1U _16V_04
1122749122
127
121374
VST BY
VSTBY
VS T BY
VSTBY
VST BY
VSTBY
K/B MATRIX
LP C
IT8512E
FLASH
( PD )F LR ST# /WUI 7/TM /GP G0
GPIO
EXT GPIO
WAKE UP
( PD )LPC PD #/W UI6 /G PE6
PWM/COUNTER
( PD )T M RI0 /WU I2 /GP C4
( PD )T M RI1 /WU I3 /GP C6
PWR_OK signal shoukd not be
accidentally de-asserted due to noise
or induced glitches. To avoid any
parasitic de-assertion, the use of an
RC filter is mandatory
PC261 *.1U_X7R_10V_06
PR2080_ 0 6
PR48
22 _ 0 6
VD DA
PC59
1U _ 1 0V _ 0 6
TSE T
VR EF
PR 46
PC56.22U _16V_06
2.49K_1%_06
PR44
PC55.1U_ 2 5V _06
51K_1%_06
PR41
*0_0402_5mil_shor t
PR 39
PC48
1000P_50V_06
Single point ground connection
Signal Ground
EN _ VCO RE
PQ 28
2N7002W
PC 6 1
.01U_50V_06
ILIM
PR 45
43 . 2 K _ 1 % _0 6
PR 4 320.5K_1%_06
PR155
*0_0603_32mil_shor t
EN_VC OR E 34
Z3302
PU 6
25
CO MPV 1
26
VDD A
27
VRE F
28
TS E T
29
ILIM
30
SVD
31
SVC
32
CO MPV 2
GNDA
Z3304
PC5310 0 0 P _ 50 V _ 0 6
PC49
. 01U _50V_06
Power Ground
RSP1
RSN 1
24
RS N1
RS N 2
133234
RSP2
RSN 2
PR 49
200_06
OZ838
RSP2
100P_50V_04
3. 3V S
CSP1
CSN1
20
CSP1SCRSP1
VFIX
CSP2
CSP2
CSN2
Z3313
19
CSN1
CSN2
Z330 5
R SP1
RSN1
CSP1
PC60
PR47
*100K_04
PC57
Z3303
1718212223
EN
PWR_OK
PG
VIN
756
8
Z3306
220P_50V _04
1000P_50V_06
HDR1
GND P
HDR2
BST1
LD R1
VDD P
LD R2
BST2
3.3VS
LX 1
LX 2
PR 42
1.91K_06
CSP2
RSP2
PC 181
RSN 2
16
15
14
13
12
11
10
9
5.6K_1%_06
PR152 348_06
PC185
220P_50V_04
PR153 348_06
PR 1 51
5.6K_1%_06
2.2_1%_06
Z3308
Z3309
PR40
PC50
100P_50V_04
PR 144
P R 14 2 2 . 2 _1 % _ 0 6
.1U _ 5 0V_0 6
CSN 2
PR139
348_06
PR140
348_06
HDR1
LX1
BST2
PC180
. 2 2U _ 1 6V _ 0 6
PR 51
10K_1%_06
PC 18 6
0.1U_50V_06
CS N1
PC 183
.22U_16V_06
PD15
BST1
FM0540-N
PC182
1U _10V_06
PD 14
FM0540-N
HDR2
LX2
PR 138
10K_1%_06
PC 17 9
PC 51
PC58
6800PF_50V _06
5V
AC
AC
PQ 23
AO 4 456
P R137
2.2_1%_06
6800P_50V _06
CPU_VDD0_RUN_FB_H
CPU_VDD0_RUN_FB_L
PR149
2.2_1%_06
PQ 2 4
IR F 7 413ZPBF
678
DDD
SSS
GD
LD R 1
123
45
PQ 2 2
IR F 7 413ZPBF
678
DDD
SSS
GD
123
45
C PU_ VD D1_ R U N_FB _ H
C PU_ VD D1_ R U N_FB _ L
Z3307
VIN
678
PC175
DDD
<VALUE>
SSS
GD
123
45
678
DDD
PQ 26
AO4456
PQ 25
GD
AO 44 56
45
678
PC172
DDD
<VALUE>
SSS
GD
123
45
678
DDD
PQ 21
AO4456
GD
LDR2
45
Z3310
C P U_ VD D0_ RU N_F B _H 5
C P U_ VD D0_ RU N_F B _L 5
PC176
<VALUE>
PD 8
FM5822
SSS
AC
123
PC171
<VALUE>
PD 7
FM5822
SSS
AC
123
CPU_VDD1_RUN_FB_H 5
C P U_ VD D1_ RU N_F B _L 5
VIN
12
PC 4 0
+
15U_25V_D2
PR145
10_08
Z3311
PC 1 8 4
1000P _50V_06
CLOSE TO P D4
12
PC 44
+
15U_25V _D2
P L7.56U_10*10*4.1
PR 136
10_08
Z3312
PC169
1000P_50V _06
CLOSE TO P D7
PTH3
12
100K_06
PL8.56U _10* 10*4. 1
PC260
CAR 400L1 6M
PTH 2
12
100K_06
18 A
CPU_V DD0
CPU_VDD0
12
PC 177
+
330UF _2.5V_D 3
Rth1 and Rth2 must be placed as close as
possible to L1 respectively L2, preferably
on the same side of the PCB. Sensing lines
towards the controller can be routed on
internal layers to provide shielding from
the inductors' noise
18 A
CPU _ VD D 1
CP U_ V D D1
12
PC 166
+
3 3 0U F _ 2 . 5V _D 3
EMI
PC31 *.01U _50V _04
PC162* .01U _50V _04
12
PC42
+
330U F_2.5V_D3
12
PC157
+
330UF_2.5V_D3
12
PC41
+
*470U_2.5V_D
CPU_V DD1
12
PC39
+
*470U_2.5V_D
B - 34 VCORE VDD CORE
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