The company reserves the right to revise this publication or to change its contents without notice. Information contained
herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are
they in anyway responsible for any loss or damage resulting from the use (or misuse) of this publication.
This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmitted or
reduced to any machine readable form without prior consent from the vendor, manufacturer or creators of this publication, except for copies kept by the user for backup purposes.
Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks of
their respective companies. They are mentioned for identification purposes only and are not intended as an endorsement
of that product or its manufacturer.
Version 1.0
January 2010
Trademarks
Intel, and Intel Core are trademarks/registered trademarks of Intel Corporation.
Other brand and product names are trademarks and./or registered trademarks of their respective companies.
II
Page 5
About this Manual
hexainf@hotmail.com
This manual is intended for service personnel who have completed sufficient training to undertake the maintenance and
inspection of personal computers.
It is organized to allow you to look up basic information for servicing and/or upgrading components of the C4800/C4801/C4805/C4801M series notebook PC.
The following information is included:
Chapter 1, Introduction, provides general information about the location of system elements and their specifications.
Chapter 2, Disassembly, provides step-by-step instructions for disassembling parts and subsystems and how to upgrade
elements of the system.
Preface
Appendix A, Part Lists
Appendix B, Schematic Diagrams
Preface
III
Page 6
Preface
IMPORTANT SAFETY INSTRUCTIONS
Follow basic safety precautions, including those listed below, to reduce the risk of fire, electric shock and injury to persons when using any electrical equipment:
1. Do not use this product near water, for example near a bath tub, wash bowl, kitchen sink or laundry tub, in a wet
basement or near a swimming pool.
2. Avoid using a telephone (other than a cordless type) during an electrical storm. There may be a remote risk of electrical shock from lightning.
3. Do not use the telephone to report a gas leak in the vicinity of the leak.
4. Use only the power cord and batteries indicated in this manual. Do not dispose of batteries in a fire. They may
explode. Check with local codes for possible special disposal instructions.
5. This product is intended to be supplied by a Listed Power Unit (Full Range AC/DC Adapter - AC Input 100 - 240V,
50 - 60Hz/ DC Output 19V, 3.42A or 18.5V, 3.5A (65W) minimum).
Preface
IV
CAUTION
Always disconnect all telephone lines from the wall outlet before servicing or disassembling this equipment.
TO REDUCE THE RISK OF FIRE, USE ONLY NO. 26 AWG OR LARGER,
TELECOMMUNICATION LINE CORD
This Computer’s Optical Device is a Laser Class I Product
Page 7
Instructions for Care and Operation
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The notebook computer is quite rugged, but it can be damaged. To prevent this, follow these suggestions:
1.Don’t drop it, or expose it to shock. If the computer falls, the case and the components could be damaged.
Preface
Do not expose the computer
to any shock or vibration.
Do not place it on an unstable
surface.
Do not place anything heavy
on the computer.
2.Keep it dry, and don’t overheat it. Keep the computer and power supply away from any kind of heating element. This
is an electrical appliance. If water or any other liquid gets into it, the co mputer could be badly damaged.
Do not expose it to excessive
heat or direct sunlight.
Do not leave it in a place
where foreign matter or moisture may affect the system.
Don’t use or store the computer in a humid environment.
Do not place the computer on
any surface which will block
the vents.
3.Follow the proper working procedures for the computer. Shut the computer down properly and don’t forget to save
your work. Remember to periodically save your data as data may be lost if the battery is depleted.
Do not turn off the power
until you properly shut down
all programs.
Do not turn off any peripheral
devices when the computer is
on.
Do not disassemble the computer by yourself.
Perform routine maintenance
on your computer.
Preface
V
Page 8
Preface
Power Safety
Warning
Before you undertake
any upgrade procedures, make sure that
you have turned off the
power, and disconnected all peripherals
and cables (including
telephone lines). It is
advisable to also remove your battery in
order to prevent accidentally turning the
machine on.
4.Avoid interference. Keep the computer away from high capacity transformers, electric motors, and oth er strong mag-
netic fields. These can hinder proper performance and damage your data.
5.Take care when using peripheral devices.
Preface
VI
Use only approved brands of
peripherals.
Unplug the power cord befor e
attaching peripheral devices.
Power Safety
The computer has specific power requirements:
•Only use a power adapter approved for use with this computer.
•Your AC adapter may be designed for international travel but it still requires a stea dy, uninterrupted po wer supply. If you ar e
unsure of your local power specifications, consult your service representative or local power company.
•The power adapter may have either a 2-prong or a 3-prong grounded plug. The third prong is an important safety feature; do
not defeat its purpose. If you do not have access to a compatible outlet, have a qualified electrician install one.
•When you want to unplug the power cord, be sure to disconnect it by the plug head, not by its wire.
•Make sure the socket and any extension cord(s) you use can support the total current load of all the connected devices.
•Before cleaning the computer, make sure it is disconnected from any external power supplies (i.e. AC/DC adapter or car
adapter).
Do not plug in the power
cord if you are wet.
Do not use the power cord if
it is broken.
Do not place heavy objects
on the power cord.
Page 9
Battery Precautions
Battery Disposal
The product that you have purchased contains a rechargeable battery. The battery is recyclable. At the end of its useful life, under various state and local laws, it may be illegal to dispose of this battery into the municipal waste stream. Check with your local solid waste
officials for details in your area for recycling options or proper disposal.
Caution
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer.
Discard used battery according to the manufacturer’s instructions.
Battery Level
Click the battery icon in the taskbar to see the current battery level and charge status. A battery that drops below a level of 10%
will not allow the computer to boot up. Make sure that any battery that drops below 10% is recharged within one week.
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•Only use batteries designed for this computer. The wrong battery type may explode, leak or damage the computer.
•Do not continue to use a battery that has been dropped, or that appears damaged (e.g. bent or twisted) in any way. Even if the
computer continues to work with a damaged battery in place, it may cause circuit damage, which may possibly result in fire.
•Recharge the batteries using the notebook’s system. Incorrect recharging may make the battery explode.
•Do not try to repair a battery pack. Refer any battery pack repair or replacement to your service representative or qualified service
personnel.
•Keep children away from, and promptly dispose of a damaged battery. Always dispose of batteries carefully. Batteries may explode
or leak if exposed to fire, or improperly handled or discarded.
•Keep the battery away from metal appliances.
•Affix tape to the battery contacts before disposing of the battery.
•Do not touch the battery contacts with your hands or metal objects.
Battery Guidelines
The following can also apply to any backup batteries you may have.
•If you do not use the battery for an extended period, then remove the battery from the computer for storage.
•Before removing the battery for storage charge it to 60% - 70%.
•Check stored batteries at least every 3 months and charge them to 60% - 70%.
POWER SWITCH & LID BOARD .............................................B-36
X
Page 13
1: Introduction
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Overview
This manual covers the information you need to service or upgrade the C4800/C4801/C4805/C4801M series notebook
computer. Information about operating the computer (e.g. getting started, and the Setup utility) is in the User’s Manual.
Information about drivers (e.g. VGA & audio) is also found in User’s Manual. That manual is shipped with the computer.
Operating systems (e.g. Windows Vista/ Window 7, etc.) have their own manuals as do application software (e.g. word
processing and database programs). If you have questions about those programs, you should consult those manuals.
Introduction
The C4800/C4801/C4805/C4801M series notebook is designed to be upgradeable. See Disassembly on page 2 - 1 for a
detailed description of the upgrade procedures for each specific component. Please note the warning and safety information indicated by the “” symbol.
The balance of this chapter reviews the computer’s technical specifications and features.
1.Introduction
Overview 1 - 1
Page 14
Introduction
Latest Specification Information
The specifications listed in this here are correct
at the time of going to press. Certain items (particularly processor types/speeds) may be
changed, delayed or updated due to the manufacturer's release schedule. Check with your
service center for details.
CPU
The CPU is not a user serviceable part. Accessing the CPU in any way may violate your
warranty.
Specifications
1.Introduction
Processor Options
Intel® Core™2 Duo Processor
P8800 (2.66GHz), P8700 (2.53GHz), P8600 (2.4GHz)
Three USB 2.0 Ports
One Headphone-Out Jack
One Microphone-In Jack
One RJ-45 LAN Jack
One RJ-11 Modem Jack
One DC-in Jack
One External Monitor Port
One ExpressCard/34 Slot
)
1 - 2 Specifications
Page 15
Communication
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Introduction
10Mb/100Mb
56K MDC Modem - V.90 & V.92 Compliant
(Factory Option) 802.11b/g/n Wireless LAN Half Mini-Card
Module
(Factory Option) 1.3M Pixel USB PC Camera Module
(Factory Option) Bluetooth 2.1 + EDR Module
(Factory Option) 3.75G/HSPA Mini-Card Module
Card Reader
Embedded 7-in-1 Card Reader (MS/ MS Pro/ SD/ Mini SD/
MMC/ RS MMC/ MS Duo)
Note: MS Duo/ Mini SD/ RS MMC Cards require a PC
adapter
Power
6 Cell Smart Lithium-Ion Battery Pack, 48.84WH
Full Range AC/DC Adapter
AC Input: 100 - 240V, 50 - 60Hz
DC Output: 19V, 3.42A or 18.5V, 3.5A (65W)
Environmental Spec
Temperature
Operating: 5
Non-Operating: -20°C - 60°C
Relative Humidity
Operating: 20% - 80%
Non-Operating: 10% - 90%
Ethernet LAN
C - 35°C
°
1.Introduction
Dimensions & Weight
340mm (w) * 238mm (d) * 13.9 - 31.8mm (h)
2.2 kg With 6 Cell Battery and ODD
Specifications 1 - 3
Page 16
Introduction
Figure 1
Front View with LCD Pan-
el Open
1. Built-In PC Camera
(Optional)
2. LCD
3. Power Button
4. Hot-Key Buttons
5. LED Status
Indicators
6. Keyboard
7. Built-In Microphone
8. Touchpad &
Buttons
1
4
6
7
3
5
8
2
1.Introduction
External Locator - Front View with LCD Panel Open
1 - 4 External Locator - Front View with LCD Panel Open
Page 17
External Locator - Front and Rear View
1
Figure 2
Front View
1. LED Power
Indicators
Figure 3
Rear View
1. Battery
1
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Introduction
1.Introduction
External Locator - Front and Rear View 1 - 5
Page 18
Introduction
1
2
4
3
5
7
6
4
Figure 4
Left Side View
1. DC-In Jack
2. External Monitor
Port
3. RJ-45 LAN Jack
4. 2 * USB 2.0 Ports
5. Vent
6. ExpressCard/34
Slot
7. 7-in-1 Card
Reader
Figure 5
Right Side View
1. Microphone-In
Jack
2. Headphone-Out
Jack
3. USB 2.0 Port
4. RJ-11 Modem
Jack
5. Optical Device
Drive Bay
6. Emergency Eject
Hole
7. Security Lock Slot
1
2
3
5
6
4
7
1.Introduction
External Locator - Left & Right Side View
1 - 6 External Locator - Left & Right Side View
Page 19
External Locator - Bottom View
Figure 6
Bottom View
1. Vent
2. Component Bay
Cover
3. Hard Disk Bay
Cover
4. Battery Release
Latch
5. Battery
Overheating
To prevent your computer from overheating
make sure nothing
blocks the vent/fan intakes while the computer is in use.
2
4
1
1
3
1
1
4
5
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Introduction
1.Introduction
External Locator - Bottom View 1 - 7
Page 20
Introduction
Figure 7
Mainboard Top
Key Parts
1. Realtek RTL820ICL
2. JMB385
3. ITE IT8502E
4. ICS9LPR600
2
1
3
4
1.Introduction
Mainboard Overview - Top (Key Parts)
1 - 8 Mainboard Overview - Top (Key Parts)
Page 21
Mainboard Overview - Bottom (Key Parts)
Figure 8
Mainboard Bottom
Key Parts
1. CPU Socket (no
CPU installed)
2. SiS 307ELV
3. SiS M672
Integrated Video
4. Mini-PCIe Socket
(Wireless Lan
Module)
5. Memory Slots
DDR2 SO-DIMM
6. Realtek ALC272
7. NorthBridge
8. ICS9P935
1
5
2
4
3
6
7
8
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Introduction
1.Introduction
Mainboard Overview - Bottom (Key Parts) 1 - 9
Page 22
Introduction
Figure 9
Mainboard Top
Connectors
1. USB Ports
2. ExpressCard/34
Slot
3. Microphone Cable
Connector
4. Keyboard Cable
Connector
5. TouchPad Cable
Connector
6. Audio Cable
Connector
7. Swith Cable
Connector
1
6
7
5
2
4
3
1
1.Introduction
Mainboard Overview - Top (Connectors)
1 - 10 Mainboard Overview - Top (Connectors)
Page 23
Mainboard Overview - Bottom (Connectors)
Figure 10
Mainboard Bottom
Connectors
1. RJ-45 Jack
2. DVI-Out Port
3. DC-In Jack
4. CCD Cable
Connector
5. LCD Cable
Connector
6. Battery Connector
7. ODD Connector
8. HDD Connector
9. 3G Module
Connector
10.SIMLOCK
11. MDC Cable
Connector
12.Fan Cable
Connector
13.7-in-1 Card Reader
1
6
7
8
52
4
3
9
11
10
12
13
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Introduction
1.Introduction
Mainboard Overview - Bottom (Connectors) 1 - 11
Page 24
Introduction
1.Introduction
1 - 12 Mainboard Overview - Bottom (Connectors)
Page 25
2: Disassembly
Information
Warning
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Overview
This chapter provides step-by-step instructions for disassembling the C4800/C4801/C4805/C4801M series notebook’s
parts and subsystems. When it comes to reassembly, reverse the procedures (unless otherwise indicated).
We suggest you completely review any procedure before you take the computer apart.
Disassembly
Procedures such as upgrading/replacing the RAM, CD device and hard disk are included in the User’s Manual but are
repeated here for your convenience.
To make the disassembly process easier each section may have a box in the page margin. Information contained under
the figure # will give a synopsis of the sequence of procedures involved in the disassembly procedure. A box with a
lists the relevant parts you will have after the disassembly process is complete. Note: The parts listed will be for the disassembly procedure listed ONLY, and not any previous disassembly step(s) required. Refer to the part list for the previous disassembly procedure. The amount of screws you should be left with will be listed here also.
A box with a will also provide any possible helpful information. A box with a contains warnings.
An example of these types of boxes are shown in the sidebar.
2.Disassembly
Overview 2 - 1
Page 26
Disassembly
2.Disassembly
NOTE: All disassembly procedures assume that the system is turned OFF, and disconnected from any power supply (the
battery is removed too).
Maintenance Tools
The following tools are recommended when working on the notebook PC:
•M3 Philips-head screwdriver
•M2.5 Philips-head screwdriver (magnetized)
•M2 Philips-head screwdriver
•Small flat-head screwdriver
•Pair of needle-nose pliers
•Anti-static wrist-strap
Connections
Connections within the computer are one of four types:
Locking collar sockets for ribbon connectorsTo release these connectors, use a small flat-head screwdriver to
gently pry the locking collar away from its base. When replacing the connection, make sure the connector is oriented in the
same way. The pin1 side is usually not indicated.
2 - 2 Overview
Pressure sockets for multi-wire connectorsTo release this connector type, grasp it at its head and gently
rock it from side to side as you pull it out. Do not pull on the
wires themselves. When replacing the connection, do not try to
force it. The socket only fits one way.
Pressure sockets for ribbon connectorsTo release these connectors, use a small pair of needle-nose pli-
ers to gently lift the connector away from its socket. When replacing the connection, make sure the connector is oriented in
the same way. The pin1 side is usually not indicated.
Board-to-board or multi-pin socketsTo separate the boards, gently rock them from side to side as
you pull them apart. If the connection is very tight, use a small
flat-head screwdriver - use just enough force to start.
Page 27
Maintenance Precautions
Power Safety
Warning
Before you undertake
any upgrade procedures, make sure that
you have turned off the
power, and disconnected all peripherals
and cables (including
telephone lines). It is
advisable to also remove your battery in
order to prevent accidentally turning the
machine on.
hexainf@hotmail.com
The following precautions are a reminder. To avoid personal injury or damage to the computer while performing a removal and/or replacement job, take the following precautions:
1.Don't drop it. Perform your repairs and/or upgrades on a stable surface. If the computer falls, the case and other
components could be damaged.
2.Don't overheat it. Note the proximity of any heating elements. Keep the computer out of direct sunlight.
3.Avoid interference. Note the proximity of any high capacity transformers, electric motors, and other strong mag-
netic fields. These can hinder proper performance and damage component s and/or data. You should also monitor
the position of magnetized tools (i.e. screwdrivers).
4.Keep it dry. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly
damaged.
5.Be careful with power. Avoid accidental shocks, discharges or explosions.
•Before removing or servicing any part from the computer, turn the computer off and detach any power supplies.
•When you want to unplug the power cord or any cable/wire, be sure to disconnect it by the plug head. Do no t pull on th e wir e.
6.Peripherals – Turn off and detach any peripherals.
7.Beware of static discharge. ICs, such as the CPU and main support chips, are vulnerable to static electricity.
Before handling any part in the computer, discharge any static electricity inside the computer. When handling a
printed circuit board, do not use gloves or other materials which allow static electricity buildup. We suggest that
you use an anti-static wrist strap instead.
8.Beware of corrosion. As you perform your job, avoid touching any connector leads. Even the cleanest hands produce oils which can attract corrosive elements.
9.Keep your work environment clean. Tobacco smoke, dust or other air-born particulate matter is often attracted
to charged surfaces, reducing performance.
10. Keep track of the components. When removing or replacing any part, be careful not to leave small part s, such as
screws, loose inside the computer.
Cleaning
Do not apply cleaner directly to the computer, use a soft clean cloth.
Do not use volatile (petroleum distillates) or abrasive cleaners on any part of the computer.
Disassembly
2.Disassembly
Overview 2 - 3
Page 28
Disassembly
Disassembly Steps
The following table lists the disassembly steps, and on which page to find the related information. PLEASE PERFORM
THE DISASSEMBLY STEPS IN THE ORDER INDICATED.
2.Disassembly
To remove the Battery:
1.Remove the batterypage 2 - 5
To remove the HDD:
1.Remove the batterypage 2 - 5
2.Remove the HDDpage 2 - 6
To remove the Optical Device:
1.Remove the batterypage 2 - 5
2.Remove the Optical devicepage 2 - 8
To remove the System Memory:
1.Remove the batterypage 2 - 5
2.Remove the system memorypage 2 - 9
To remove and install a Processor:
1.Remove the batterypage 2 - 5
2.Remove the processorpage 2 - 10
3.Install the processorpage 2 - 12
To remove the 3G Module:
1.Remove the batterypage 2 - 5
2.Remove the 3G modulepage 2 - 13
To remove the Wireless LAN Module:
To remove the Bluetooth Module:
1.Remove the batterypage 2 - 5
2.Remove the Bluetooth Modulepage 2 - 15
To remove the Modem:
1.Remove the batterypage 2 - 5
2.Remove the Modempage 2 - 16
To remove the LCD Back Cover:
1.Remove the batterypage 2 - 5
2.Remove the LCD Back Coverpage 2 - 17
To remove the LCD Front Cover:
1.Remove the batterypage 2 - 5
2.Remove the LCD Front Coverpage 2 - 19
To remove the Inverter Board:
1.Remove the batterypage 2 - 5
2.Remove the LCD Front Coverpage 2 - 19
3.Remove the inverter boardpage 2 - 20
To remove the Keyboard:
1.Remove the batterypage 2 - 5
2.Remove the keyboardpage 2 - 21
1.Remove the batterypage 2 - 5
2.Remove the WLAN modulepage 2 - 14
2 - 4 Disassembly Steps
Page 29
Removing the Battery
2. Battery
1
2
634
Figure 1
Battery Removal
a. Slide latch at point 1 to-
wards the unlock symbol
and hold it in place.
b. Slide the battery in the di-
rection of the arrow.
1
a.
b.
3
2
4
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1.Turn the computer off, and turn it over.
2.Slide the latch in the direction of the arrow.
3.Slide the latch in the direction of the arrow, and hold it in place.
4.Slide the battery in the direction of the arrow .
Disassembly
2.Disassembly
Removing the Battery 2 - 5
Page 30
Disassembly
Figure 2
HDD Assembly
Removal
a. Locate the HDD bay
cover and remove th
screw(s).
•2 Screws
1
2
2
1
a.
HDD System Warning
New HDD’s are blank. Before you
begin make sure:
You have backed up any data
you want to keep from your old
HDD.
You have all the CD-ROMs and
FDDs required to install your operating system and programs.
If you have access to the internet,
download the latest application
and hardware driver updates for
the operating system you plan to
install. Copy these to a removable medium.
Removing the Hard Disk Drive
The hard disk drive can be taken out to accommodate other 2.5" serial (SATA) hard disk drives with a height of 9.5mm
(h). Follow your operating system’s installation instructions, and install all necessary drivers and utilities (as outlined in
Chapter 4 of the User’s Manual) when setting up a new hard disk.
Hard Disk Upgrade Process
1.Turn off the computer, and remove the battery (page 2 - 5).
2.Locate the hard disk bay cover and remove screw & .
2.Disassembly
2 - 6 Removing the Hard Disk Drive
Page 31
Disassembly
634
5
6
9
10
11
4
b.
c.
e.
5
9
d.
3
e.
10
8
7
6
11
3. HDD Bay Cover
10.Adhesive Cover
11.HDD
•4 Screws
Figure 3
HDD Assembly
Removal (cont’d.)
b. Remove the HDD bay
cover.
c. Grip the tab and slide the
HDD in the direction of
the arrow.
d. Lift the HDD assembly
out of the bay.
e. Remove the screws and
adhesive cover.
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3.Remove the hard disk bay cover
4.Grip the tab and slide the hard disk in the direction of arrow
.
.
5.Lift the hard disk out of the bay .
6.Remove the screw - and the adhesive cover from the hard disk.
7.Reverse the process to install a new hard disk (do not forget to replace all the screws and covers).
2.Disassembly
Removing the Hard Disk Drive 2 - 7
Page 32
Disassembly
Figure 4
Optical Device
Removal
a. Remove the screws.
b. Remove the cover.
c. Remove the screw.
d. Slide the optical device
out of the computer at
point 9.
Fan Cable
Make sure you reconnect the fan cable
before screwing down
the bay cover.
61256
1
789
1. Component Bay
Cover
8. Optical Device
•5 Screws
2
4
3
b.
1
5
1
5
6
a.
d.
c.
8
7
9
Removing the Optical (CD/DVD) Device
1.Turn off the computer, remove the battery (page 2 - 5).
2.Locate the component bay cover , and remove screws - .
3.Carefully (a fan and cable are attached to the under side of the cover) lift up the bay cover.
4.Carefully disconnect the fan cable , and remove the cover
5.Remove the screw at point , and use a screwdriver to carefully push out the optical device at point .
6.Insert the new device and carefully slide it into the computer (the device only fits one way. DO NOT FORCE IT; The
screw holes should line up).
7.Restart the computer to allow it to automatically detect the new device.
.
2.Disassembly
2 - 8 Removing the Optical (CD/DVD) Device
Page 33
Removing the System Memory (RAM)
Figure 5
RAM Module
Removal
a. Locate the memory
socket.
b. Pull the release
latch(es).
c. Remove the mod-
ule(s).
Contact Warning
Be careful not to touch
the metal pins on the
module’s connecting
edge. Even the cleanest
hands have oils which
can attract particles, and
degrade the module’s
performance.
4. RAM Module
123
a.
b.
c.
1
3
2
4
4
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The computer has two memory sockets for 200 pin Small Outline Dual In-line Memory Modules (SO-DIMM) supporting
DDRII (DDR2) Up to 667/800 MHz. The main memory can be expanded up to 4GB. The SO-DIMM modules supported
are 1024MB and 2048MB DDRIII Modules. The total memory size is automatically detected by the POST routine once
you turn on your computer.
Memory Upgrade Process
1.Turn off the computer, turn it over and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The RAM module(s) will be visible at point on the mainboard.
3.Gently pull the two release latches ( & ) on the sides of the memory socket in the direction indicated by the
Disassembly
arrows (Figure 5b).
2.Disassembly
4.The RAM module(s) will pop-up
5.Pull the latches to release the second module if necessary.
6.Insert a new module holding it at about a 30° angle and fit the connectors firmly into the memory slot.
7.The module will only fit one way as defined by its pin alignment. Make sure the module is seated as far into the slot
8.Press the module in and down towards the mainboard until the slot levers click into place to secure the module.
9.Replace the component bay cover and the screws
10. Restart the computer to allow the BIOS to register the new memory configuration as it starts up.
(
Figure 5c), and you can then remove it
as it will go. DO NOT FORCE IT; it should fit without much pressure.
(see
page 2 - 8).
.
Removing the System Memory (RAM) 2 - 9
Page 34
Disassembly
4
321
5
Figure 6
Processor Removal
a. Locate the heat sink.
b. Remove the screws from
the CPU heatsink.
c. Remove the CPU heat
sink.
5. Heat Sink
•4 Screws
2
3
4
1
a.
c.
b.
5
A
1
Removing and Installing a Processor
Processor Removal Procedure
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.Locate the heat sink.
3.Loosen the CPU heat sink screws in the order ,
4.Carefully lift up the heat sink (Figure 6c) off the computer.
, & (the reverse order as indicated on the label).
2.Disassembly
2 - 10 Removing and Installing a Processor
Page 35
6
7
Figure 7
Processor Removal
(cont’d)
d. Turn the release latch to
unlock the CPU.
e. Lift the CPU out of the
socket.
d.
e.
Caution
The heat sink, and CPU area in
general, contains parts which are
subject to high temperatures. Allow
the area time to cool before removing these parts.
UnlockLock
9
7
7. CPU
hexainf@hotmail.com
Disassembly
5.Turn the release latch towards the unlock symbol to release the CPU.
6.Carefully (it may be hot) lift the CPU up and out of the socket (Figure 7e).
7.Reverse the process to install a new CPU.
8.When re-inserting the CPU, pay careful attention to the pin alignment, it will fit only one way (DO NOT FORCE IT!).
2.Disassembly
Removing and Installing a Processor 2 - 11
Page 36
Disassembly
ABC
D
123
4
b.
B
a.
D
1
3
2
4
Note:
Tighten the screws in
the order as indicated
on the label.
C
A
c.
d.
Figure 8
Processor
Installation
a. Insert the CPU.
b. Turn the release latch to-
wards the lock symbol.
c. Remove the sticker from
the heat sink and insert
the heat sink.
d. Tighten the screws.
A. CPU
D. Heat Sink
•3 Screws
Processor Installation Procedure
1.Insert the CPU , pay careful attention to the pin alignment, it will fit only one way (DO NOT FORCE IT!), and turn
the release latch towards the lock symbol (Figure 8b).
2.Remove the sticker (Figure 8c) from the heat sink.
3.Insert the heat sink
4.Tighten the CPU heat sink screws in the order
8d).
5.Replace the component bay cover and tighten the screws (page 2 - 8).
as indicated in Figure 8d.
, , & (the order as indicated on the label and Figure
2.Disassembly
2 - 12 Removing and Installing a Processor
Page 37
Removing the 3G Module
Figure 9
3G Module Removal
a. Locate the 3G module.
b. Disconnect the cable
and remove the screw.
c. Remove the 3G module.
Note: Make sure you
reconnect the antenna
cable to socket (Fig-
ure 9b).
1
2
3
4
b.
c.
a.
3
1
2
4
4. 3G Module
•1 Screw
hexainf@hotmail.com
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The 3G module will be visible at point on the mainboard.
3.Carefully disconnect the cable , and then remove the screw
4.The 3G module (Figure 10c) will pop-up, and you can remove it off the computer.
.
Disassembly
2.Disassembly
Removing the 3G Module 2 - 13
Page 38
Disassembly
Figure 10
Wireless LAN
Module Removal
a. Locate the WLAN.
b. Disconnect the cable
and remove the screw.
c. The WLAN module will
pop up.
d. Remove the Wireless
LAN module.
Note: Make sure you
reconnect the antenna
cable to the “1 + 2”
socket (Figure 10b).
1
234
5
b.
c.
a.
4
3
2
d.
5
5
1
5.Wireless LAN Module
•1 Screw
Removing the Wireless LAN Module
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The wireless LAN module will be visible at point on the mainboard.
3.Carefully disconnect the cables - , and then remove the screw
4.The wireless LAN module (Figure 10c) will pop-up, and you can remove it off the computer.
.
2.Disassembly
2 - 14 Removing the Wireless LAN Module
Page 39
Removing the Bluetooth Module
Figure 11
Bluetooth Module
Removal
a. Locate the Bluetooth
module.
b. Remove the screw.
c. Disconnect the cable
and the connector from
the Bluetooth module.
d. Lift the Bluetooth module
out.
1
2
3
4
5
c.
a.
4
1
5
2
3
b.
d.
5. Bluetooth Module
•1 Screw
hexainf@hotmail.com
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The Bluetooth module will be visible at point on the mainboard.
3.Remove the screw and turn the module over.
4.Carefully disconnect the cable and separate the connector (Figure 11b) from the Bluetooth Module.
5.Lift the Bluetooth Module (Figure 11c) up and off the computer.
Disassembly
2.Disassembly
Removing the Bluetooth Module 2 - 15
Page 40
Disassembly
Figure 12
Modem Removal
a. Locate the modem.
b. Remove the screws.
c. Lift the modem up and
off the sockets.
1
2
354
5. Modem
•2 Screws
c.
a.
4
1
5
2
3
b.
Removing the Modem
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The modem will be visible at point on the mainboard.
3.Remove the screws
4.Carefully lift the modem up and off the sockets .
- ,
2.Disassembly
2 - 16 Removing the Modem
Page 41
Removing the LCD Back Cover for MOFA (C4801M)
1
2
3
4
5
6
7
a.
1
3
2
4
56
b.
7
c.
Rubber Screw Covers
After removing the rubber screw covers, place them on a
clean dry surface (or attach them to the front cover itself) in
order to prevent loss of adhesive.
Figure 13
LCD Back Cover
Removal (C4801M)
a. Remove the rubber cov-
ers and screws.
b. Slide the cover forward.
c. Remove the LCD back
cover.
7. LCD Back Cover
•2 Screws
hexainf@hotmail.com
1.Turn off the computer, and turn the computer over to remove the battery (page 2 - 5).
2.Open the LCD and carefully remove the rubber screw covers & (2 corne r rubber screw covers only) a nd set
them aside.
3.Remove screw & from the front cover.
4.Carefully slide the cover forward in the direction of the arrows & as illustrated below.
5.Remove the LCD back cover .
Disassembly
2.Disassembly
Removing the LCD Back Cover for MOFA (C4801M) 2 - 17
Page 42
Disassembly
8
8
9
9
1010
10
d.
Figure 14
LCD Back Cover
Removal (cont’d)
d. Align the replacement
cover and slide forward to
click firmly into place.
9
10
2.Disassembly
6.Align the replacement cover with the dotted line as illustrated below (and as marked on the cover).
7.Slide the back cover forward until it clicks firmly into place .
8.Run your hands around the sides and front of the cover to make sure it is firmly aligned in place (carefully press
down to make sure the fit is secure).
9.Replace the screws and rubber covers.
2 - 18 Removing the LCD Back Cover fo r MOFA (C4801M)
Page 43
Removing the LCD Front Cover
Figure 15
LCD Front Cover
Removal
a. Remove the screws and
unsnap the LCD front
cover from the LCD panel.
b. Slide the LCD panel cov-
er in the direction of the
arrow.
1
4
5
6
7
5. LCD Front Cover
•4 Screws
a.b.
1
2
3
4
7
5
6
7
5
Rubber Screw Covers
After removing the rubber screw covers, place them on a
clean dry surface (or attach them to the front cover itself) in
order to prevent loss of adhesive.
hexainf@hotmail.com
1.Turn off the computer, and remove the battery (page 2 - 5), and remove the LCD back cover (page 2 - 17).
2.Remove the rubber covers and screws - (Figure 15a), then run your finger around the middle of the frame to
carefully unsnap the LCD front cover from the LCD panel.
3.After unsnapping all four sides of the LCD front cover, carefully slide the LCD front cover downwards in the direction of the arrow (be careful of the LCD hinges at point ).
4.You can now remove the LCD front cover.
Disassembly
2.Disassembly
Removing the LCD Front Cover 2 - 19
Page 44
Disassembly
Figure 16
Inverter Board
Removal
a. Remove the screw from
the inverter board and lift
the board up slightly.
b. Disconnect the cables
from the inverter.
c. Remove the inverter.
1
234
4. Inverter Board
2 Screws
a.
b.
Inverter Power Warning
In order to prevent a short circuit
when removing the inverter it is
necessary to discharge any remaining system power. To do
so, press the computer’s power
button for a few seconds before
disconnecting the inverter cable.
1
2
3
c.
4
2.Disassembly
Removing the Inverter Board
1.Turn off the computer, remove the battery (page 2 - 5), and remove the LCD back cover (page 2 - 17), and
remove LCD front cover (page 2 - 19).
2.Discharge the remaining system power (see Inverter Power Warning below).
3.Remove screw (Figure 16a) from the inverter, and carefully lift the inverter board up slightly.
4.Disconnect cables & (Figure 16b) from the inverter, then remove the inverter (Figure 16c) from the top
case assembly.
2 - 20 Removing the Inverter Board
Page 45
Removing the Keyboard
Figure 17
Keyboard Removal
a. Press the four latches to
release the keyboard.
b. Lift the keyboard up and
disconnect the cable
from the locking collar.
c. Remove the keyboard.
5
5
6
7
Re-Inserting the
Keyboard
When re-inserting the
keyboard firstly align the
four keyboard tabs at the
bottom (
Figure 17
c) at
the bottom of the keyboard with the slots in the
case.
a.
b.
Keyboard Tabs
1
3
2
4
6
7
5
c.
7. Keyboard
hexainf@hotmail.com
1.Turn off the computer, and remove the battery (page 2 - 5).
2.Press the four keyboard latches at the top of the keyboard to elevate the keyboard from its normal position (you
may need to use a small screwdriver to do this).
3.Carefully lift the keyboard up, being careful not to bend the keyboard ribbon cable (Figure 17b).
4.Disconnect the keyboard ribbon cable from the locking collar socket .
5.Carefully lift up the keyboard (Figure 17c) off the computer.
Disassembly
2.Disassembly
Removing the Keyboard 2 - 21
Page 46
Disassembly
2.Disassembly
2-22
Page 47
Appendix A:Part Lists
hexainf@hotmail.com
This appendix breaks down the C4800/C4801/C4805/C4801M series notebook’s construction into a series of illustrations. The component part numbers are indicated in the tables opposite the drawings.
Note: This section indicates the manufacturer’s part numbers. Your organization may use a different system, so be sure
to cross-check any relevant documentation.
Note: Some assemblies may have parts in common (especially screws). However, the part lists DO NOT indicate the
total number of duplicated parts used.
Part Lists
Note: Be sure to check any update notices. The parts shown in these illustrations are appropriate for the system at the
time of publication. Over the product life, some parts may be improved or re-configured, resulting in new part numbers.
A.Part Lists
A-1
Page 48
Part Lists
Table A - 1
Part List Illustration
Location
Part List Illustration Location
The following table indicates where to find the appropriate part list illustration.
page A - 4
page A - 5
page A - 6
page A - 7
page A - 8
page A - 9
page A - 10
A - 2 Part List Illustration Location
Page 49
Top (C4800/C4801)
Figure A - 1
Top (C4800/C4801)
無鉛
無鉛
無鉛
(灰色) 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
(非耐落) 無鉛
無鉛
無鉛
無鉛
香檳銀色 無鉛
無鉛
無鉛
無鉛
無鉛
黑色 無鉛
無鉛
非耐落 無鉛
無鉛
無鉛
無鉛
hexainf@hotmail.com
Part Lists
A.Part Lists
Top (C4800/C4801) A - 3
Page 50
Part Lists
Figure A - 1
Top (C4805)
無鉛
無鉛
(灰色) 無鉛
無鉛
無鉛
無鉛
無鉛
(非耐落) 無鉛
無鉛
無鉛
非耐落 無鉛
無鉛
無鉛
無鉛
黑色 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
A.Part Lists
Top (C4805)
A - 4 Top (C4805)
Page 51
Bottom (C4800/C4801/C4805/C4801M)
Figure A - 2
Bottom (C4800/
C4801/C4805/
C4801M)
hexainf@hotmail.com
Part Lists
A.Part Lists
Bottom (C4800/C4801/C4805/C4801M) A - 5
Page 52
Part Lists
Figure A - 3
LCD (C4800/
C4801)
無鉛
無鉛
(華力)無鉛
無鉛
非耐落 無鉛
今皓 / 泰林 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
中性 電鑄薄膜鍍亮鉻( 字體連結) 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
銘板 無鉛
無鉛
華力 / 訊裕 無鉛
精乘 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
精乘 (銅箔接地)無鉛
精乘 無鉛
精乘 無鉛
精乘 無鉛
精乘 無鉛
無鉛
無鉛
A.Part Lists
A - 6 LCD (C4800/C4801)
LCD (C4800/C4801)
Page 53
LCD (C4805)
無鉛
無鉛
(華力)無鉛
無鉛
精乘 無鉛
非耐落 無鉛
今皓 / 泰林 無鉛
精乘 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
中性 電鑄薄膜鍍亮鉻( 字體連結) 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
銘板 無鉛
無鉛
華力 / 訊裕 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
精乘 ( 銅箔接地) 無鉛
精乘 無鉛
精乘 無鉛
精乘 無鉛
無鉛
Figure A - 4
LCD (C4805)
hexainf@hotmail.com
Part Lists
A.Part Lists
LCD (C4805) A - 7
Page 54
Part Lists
無鉛
無鉛
(華力)無鉛
無鉛
非耐落 無鉛
今皓 / 泰林 無鉛
精乘 (銅箔接地)無鉛
無鉛
無鉛
無鉛
無鉛
中性 電鑄薄膜鍍亮鉻( 字體連結) 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
銘板 無鉛
無鉛
華力 / 訊裕 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
精乘 無鉛
精乘 無鉛
無鉛
無鉛
一般漆
ONLY FOR BACK COVER 一般漆
FOR MOFA
Figure A - 5
LCD (C4801M)
A.Part Lists
LCD (C4801M)
A - 8 LCD (C4801M)
Page 55
HDD
無鉛
(無鉛)
Figure A - 6
HDD
hexainf@hotmail.com
Part Lists
A.Part Lists
HDD A - 9
Page 56
Part Lists
*(非耐落) 無鉛
無鉛
無鉛
無鉛
內縮 無鉛
內縮 無鉛
已內縮 無鉛
已內縮 無鉛
Figure A - 7
SATA-DVD-SU-
PER MULTI
A.Part Lists
SATA-DVD-SUPER MULTI
A - 10
Page 57
Appendix B:Schematic Diagrams
Table B - 1
Schematic
Diagrams
Version Note
The schematic diagrams in this chapter
are based upon version 6-7P-C4804-004.
If your mainboard (or
other boards) are a later version, please
check with the Service
Center for updated diagrams (if required).
hexainf@hotmail.com
This appendix has circuit diagrams of the C4800/C4801/C4805/C4801M notebook’s PCB’s. The following table indicates where to find the appropriate schematic diagram.
Diagram - PageDiagram - PageDiagram - Page
SYSTEM BLOCK DIAGRAM - Page B - 2INVERTER, BLURTOOTH, FAN - Page B - 14NEW CARD, USB, MINI PCIE - Page B - 26
Penryn 1/2 - Page B - 3968_PCIE_IDE_MuTIOL_SPI 1/4 - Page B - 15LED, PC BEEP, CCD, Audio Conn - Page B - 27
Penryn 2/2 - Page B - 4968_PCIE_LAN_GPIO 2/4 - Page B - 16SYSTEM POWER - Page B - 28
SiS672_HOST_PCIE 1/5 - Page B - 5968_USB_SATA 3/4 - Page B - 17AC_IN, CHARGER - Page B - 29
SiS672_DRAM 2/5 - Page B - 6968_PWR_GND 4/4 - Page B - 18VCORE - Page B - 30
SiS672_MuTITOL_VGA 3/5 - Page B - 7CLK_GEN & CLK_BUTTER - Page B - 19VDD3, VDD5 - Page B - 31
SiSM672 PWR 4/5 - Page B - 8KBC-ITE IT8512E - Page B - 201.05VS,1.2V,1.5V - Page B - 32
SiSM672_5/5 - Page B - 9JMC261 CARD READER/LAN - Page B - 211.8V/0.9VS - Page B - 33
Schematic Diagrams
B.Schematic Diagrams
DRII SO-DIMM_1 - Page B - 10AUDIO CODEC ALC272 - Page B - 22CLICK BOARD - Page B - 34
DDRII SO-DIMM_2 - Page B - 11AUDIO AMP TPA6017 - Page B - 23AUDIO/ USB/ RJ11 BOARD - Page B - 35
SiS307ELV - Page B - 12SATA HDD, POWER GOOD & SW - Page B - 24POWER SWITCH & LID BOARD - Page B - 36
PANEL, CRT - Page B - 13ODD, MDC, TP Conn, 3G - Page B - 25
B-1
Page 58
Schematic Diagrams
Sheet 1 of 35
SYSTEM BLOCK
DIAGRAM
SiS968
MuTIOL 1G
PROCESSOR
+VCORE
479 pin s soc ket P
570balls mBGA
Intel Penryn
SOUTH BRIDGE
FSB
SiSM672
852balls TEBGA
NORTH BRIDGE
AZALIA LINK
DDRII
ICS9LPR600
Colck Generator
RJ-11
A zal ia Cod ecAU DIO AMP
MDC CON
N7010
AZALIA
MDC
MODULE
INT SPK
Memory Termination
SO-DIMM0
533/667(/800) MHz
24 MHz
PCIE
USB2.0
480 Mbps
CRT
SATA ODD
33 MHz
EC
I TE 85 02E
32.768 KHz
LPC
THERMAL
SENSOR
SMART
BATTERY
TOUCH PA D
SMART
FAN
F75383M
EC SMB US
INT. K/B
3 5* 35 * 2. 4m m
27*27*2.5mm
17 .1 *8 .1 * 1. 2m m
INT MIC
9*9 *1.6 mm9 .8 *6.4 *1. 2m m
3 5* 35 * 2. 7m m
14*14*1.6mm
SATA HDD,
LID
AC-IN,CHARGER
Synapt ic
32.768KHz
14.318 MHz
DDRII
SO-DIMM1
LV DS (TV )
SiS307ELV
13*13*1.7mm
SATA I/II 3.0Gb/s
100 MHz
48pins LQFP
128pins LQFP
56pins TSSOP
169balls BGA
810602-1703
24pins TSSOP
Realte k
ALC272
USB6
CCD
HP
OUT
MIC
IN
SPI
L CD CON NE CTO R,
INVERTER
CLICK BOARD
17.1*8. 1*1. 2m m
C loc k Buf fer
ICS9P935
28pins SSOP
Aud io Boar d
US B, SPD IF , MIC IN
HEADPHONE
0.9VS,1.8V
1.05VS,1.2V,1.5V
VDD3,VDD5,3.3V,5V
SYST EM POWE R
800/1066 MHz
CLEVO C4800 System Block Diagram
3G CARD
(JUSB2)
SHEET 24
USB2
USB & Phone
Jack B'd
Bluetooth
(USB7)
(JUSB1)
USB4
RJ-45
MINI PCIE
GOL AN
(USB0)(USB1)
SOCKET
New Card
SOCKET
JMC261
SOCKET
7IN1
CA RD REA DE RMini PCIE
LAN 10/100
SYSTEM BLOCK DIAGRAM
B.Schematic Diagrams
B - 2 SYSTEM BLOCK DIAGRAM
Page 59
Penryn 1/2
1.05VS
CPU_GTLREF
1.05VS
1.05V S
1.05V S
3.3V
3.3 V
CPU_ BSEL218
CPU_ BSEL118
CPU_ BSEL018
H_T HR M TR IP # 15
H_D INV# 14
H_DSTBP#14
H_D STBN # 04
H_D INV# 04
H_D STBN # 14
H_D#[63:0]4
H_D#[63:0]4
H_DSTBP#04
H_AD ST B#14
H_PROCHOT# 15
H_RE Q# [4 :0 ]4
H_A#[35:3]4
H_PWRGD 4
H _ CP USLP# 15
H_DPSLP# 6
H_DPWR# 4
H _ DP RSTP# 6 ,2 9
H_RS#1 4
H _ CL K_ CP U# 18
H _ CL K_ CP U 1 8
H_RS#0 4
H_TRDY# 4
H_DEFER# 4
H _IN IT # 15
H_CPURST# 4
H_RS#2 4
H_BPRI# 4
1.05V S 3,4,6,7,17,31
3.3V 12,13,15,16,17,20,23,24,25,30,31,32
PSI# 29
H_DSTBN#34
H _DSTBP#2 4
H_DSTBN#24
H_D#[63:0] 4
H _DSTBP#3 4
H_DINV#2 4
H_D#[63:0] 4
H_DINV#3 4
H_ADS# 4
H_BNR# 4
H_DRDY# 4
H _DBSY # 4
H_HITM# 4
H_LOCK# 4
H_BR0# 4
H_HIT# 4
VDD3 13,16,19,25,26,27,28,30,32
SMD _ CP U_T HE RM 19
SMC _ CP U_T HE RM 19
H_A#[35:3]4
H_ADSTB#04
H_INTR15
H_IGNNE#15
H_SMI#15
H_STP C L K#15
H_N MI15
H_A20M#15
H_FE RR #15
THER M_ALER T# 1 9
CO M P 0
CO M P 3
CO M P 2
CO M P 1
H_TMS
H _ DB R#
H_TRST#
H_TCK
H_DPWR#_R
H _PR EQ#
H_PROCHOT#
H_TDI
H _DP SL P#
H_INTR
H_NMI
H_SMI#
H_IGNNE#
H_D#3
H_D#29
H_D#54
H_D#46
CP U_ BS E L2
H_D#44
H_D#7
H_D#27
H_D#58
Z0210
H_D#57
H_D#11
H_D#40H_D#8
H_D#25
H_D#1
H_D #14
H_D#62
H_D#19
H_D#53
H_D#37
H_D#17
H_D#30
H_D#22
H_D#63
H_D#12
H_D#20
H_D#23
H_D#42
H_D#48
H_PW R G D
H_D#52
Z0211
H_D#50
H_D#4
PS I#
H_D#13
H_D#0
H_D#47
CP U_ BS E L0
H_D#60
H_D#49
COMP3
H_D#21
COMP1
H_D#61
H_D#56
H_D#16
H_D#10
H_D#9
H_D#51
H_D#38
COMP2
H_D#43
H_D#26
H_D#6
H_D#59
H_D#5
H_D#31
H_D#33
H_D#2
H_D PSL P#
H_D#18
H_D#24
H_D#45
H_D#32
H_D#15
H_D#35
H_D#39
H_D#41
H_D#28
CP U_ BS E L1
H_D PW R #_R
H_D#55
H_D#34
COMP0
H_D#36
H_BPM3 #
H_R EQ#1
H_TDI
Z0206
H_BPM2 #
H_PROCHOT#
H_THERMDC
H_
CP UR ST#
H_IN IT#
H_BR 0#
Z0207
H_BPM0 #
H_PR EQ#
H_TRST #
Z0201
H_DB R#
H_BPM1 #
H_PR DY #
H_R EQ#2
H_IER R#
Z0202
Z0203
Z0204
H_TDO
Z0205
H_TCK
H_R EQ#0
H_TMS
H_THERMDA
H_R EQ#3
Z0209
Z0208
H_THRMTRIP#
H_R EQ#4
H_A20M#
H _ CP USLP#
H_PWRGD
H_IERR#
H_PWRGD
H _ CP UR S T#
H_BR0#
C PU _ BSEL0
C PU _ BSEL1
C PU _ BSEL2
H _STPC LK #
H_INIT#
H_THR MTRIP#
H_FERR#
Z0226
H_THERMDC
H_THERMDA
Z0225
H_DPWR#_R
H_C PUS LP #
H_A#8
H_A#11
H_A#3
H_A#16
H_A#12
H_A# 2 8
H_A# 2 9
H_A#15
H_A# 2 1
H_A# 2 4
H_A# 2 0
H_A# 1 8
H_A# 1 7
H_A#5
H_A#13
H_A#14
H_A# 2 5
H_A#9
H_A#6
H_A#4
H_A# 1 9
H_A# 2 2
H_A# 2 6
H_A# 2 3
H_A# 2 7
H_A# 3 0
H_A#10
H_A# 3 1
H_A#7
H_SMI#
H_NMI
H_A20M#
H_STPCLK#
H_INTR
H_FERR#
H_IGNNE#
H_A# 3 5
H_A# 3 2
H_A# 3 3
H_A# 3 4
Z0213
Z0215
Z0212
Z0214
Z0216
R4054.9_1%_04
R3151_ 1 %_04
R2551_ 1 %_04
R2856_ 1 %_04
R2951_ 1 %_04
R91 * 1 0 m il_short- NM NP
R801K_04
C495
*.1U_16V_04
R7968_04
R47*51_04
R7356_04
R55*330_04
DATA GR P 0
DATA G RP 1
DATA GRP 2DATA GRP 3
MI SC
JS K T1B
Penry n
R26
U26
AA 1
Y1
E22
F24
J2 4
J2 3
H22
F26
K22
H23
N22
K25
P26
R23
E26
L2 3
M24
L2 2
M23
P25
P23
P22
T2 4
R24
L2 5
G22
T2 5
N25
Y22
AB 24
V24
V26
V23
T22
U25
U23
F23
Y25
W22
Y23
W24
W25
AA 23
AA 24
AB 25
AE 24
AD 2 4
G25
AA 21
AB 22
AB 21
AC 2 6
AD 2 0
AE 22
AF 23
AC 2 5
AE 21
AD 2 1
COMP0, COMP2: 0.5" Max, Zo=27.4 Ohms(20mil)
COMP1, COMP3: 0.5" Max, Zo=55 Ohms(5mil)
Best estimate is 18 mils wide trace for outer
layers and 14 mils wide trace if on internal
layers.
If PROCHOT# is ro uted between CPU, IMVP and MCH,
pull -u p res is to r h as t o be 68 o hm ? 5%. If n ot
use, pul l -up re si s tor ha s t o be 56 o hm ? 5 %
CPU to SB interface
( SiS Recommandation 200p)
Thermal IC
Route H_THERMDA and
H_THERMDC on same layer.
10 mil trace on 10 mil spacing.
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS S
VS SVSS
3. 3V S 6,9,10,11,12,13,15,16,17,18,19,20,21,22,23, 25,26,27,29
SB_PC IR ST#23
3. 3V2,12,13,15,16,17,20, 23,24,25,30,31,32
PCI _REQ #4
PCI _REQ #3
PCI _REQ #0
PCI_INT#C
PCI_INT#D
PCI _SER R#
PCI_IRDY#
PCI _F RA ME#
PCI _PL OC K#
P CI_PL O C K#
PCI_INT#B
PCI_REQ#2
PCI _AD4
ZAD1
PCI_INT#A
PC I_AD 2
PC I_AD 20
PC I_AD 21
PCI_AD30
SPI_TR AP
ZAD 15
PC I_AD 6
PCI_AD11
ZAD 0
ZA D10
PC I_AD 14
ZAD 4
PCI_FRAME#
PCI_REQ#4
ZAD 7
PCI_DEVSEL#
PCI_AD7
PCI_AD18
ZAD 14
ZAD 8
ZAD 3
ZAD9
PCI_STOP#
PC I_AD 13
ZAD12
SZCMP_P
PCI_SERR#
PC I_AD 28
ZAD5
PCI_INT#C
PCI _AD1 9
ZAD 11
ZA D2
PCI_TRDY#
PCI_IRDY#
PCI_INT#D
PCI_AD22
PC I_AD3 1
Z1905
ZAD16
SZCMP_N
ZA D6
PCI_REQ#1
PC I_AD 5
ZA D13
PCI_REQ#3
Z1901
Z1902
Z1903
Z1904
SP I_ MO SI
SP I_ MIS O
SP I_ CS 0#
SP I_ CLK
Z1907
IDE _P DIO R DY
IDE_PDDREQ
IDE _I RQ
IDE _P DD 3
IDE _P DD 4
IDE _P DD 5
IDE _P DD 6
IDE _P DD 7
IDE _P DD 8
IDE _P DD 9
IDE _P DD 10
IDE _P DD 11
IDE _P DD 12
IDE _P DD 13
IDE _P DD 14
IDE _P DD 15
P S 2 C LK 0/ G P F 0 ( P U )
PS2D AT 0/G PF1 ( PU )
P S 2 C LK 1/ G P F 2 ( P U )
( PD )TMRI 0/W UI2/G PC4
( PD )TMRI 1/W UI3/G PC6
LPCR ST#/WUI 4/GPD2( PU )
( PD )W U I 5/G P E 5
PWR SW/G PE4 ( PU )
RI 1#/W U I0/GP D0 ( PU )
RI 2#/W U I1/GP D1 ( PU )
( PD )R ING #/PW RF AIL# /LP CR ST#/G PB7
TXD/G PB1( PU )
RXD / GP B0( P U )
( P D )C T X/G P B2
PS2D AT 1/G PF3 ( PU )
P S 2 C LK 2/ G P F 4 ( P U )
PS2D AT 2/G PF5 ( PU )
( P D )TA C H0 / G PD6
( P D )TA C H1 / G PD7
PWM 0 /GPA 0( P U )
PWM 1 /GPA 1( P U )
PWM 2 /GPA 2( P U )
PWM 3 /GPA 3( P U )
PWM 4 /GPA 4( P U )
PWM 5 /GPA 5( P U )
PWM 6 /GPA 6( P U )
PWM 7 /GPA 7( P U )
AD C0/G PI0
AD C1/G PI1
AD C2/G PI2
AD C3/G PI3
AD C4/G PI4
AD C5/G PI5
AD C6/G PI6
AD C7/G PI7
SM CLK0/GP B3
SM DAT0/GP B4
SM CLK1/GP C1
SM DAT1/GP C2
SM CLK2 /GP F6 ( PU )
SM DAT2/GP F 7( PU )
FLFRA ME#/G PG2
FLAD 0/S CE#
FLAD 1/SI
FLAD2/SO
FLAD3/GPG6
FLCLK/SC K
( PD )FLRST#/W U I7/GPG 0/TM
( PD )L 80H LA T/G PE 0
X3 32.768KHz
14
32
C 311 *10P_50V_04
R217*10M_04
C280*33P_50V_04
R208*10_04
J_ K B 2
85201-24051
24
23
22
14
12
11
21
8
20
19
6
5
18
4
17
10
9
7
3
2
1
16
15
13
R 201 *10mil_short-N MNP
R187100_04
R 2954.7K_04
R 2964.7K_04
???
8Mbit
KBC_SPI_*_R = 0.1"~0.5"
J_KB1/J_KB2
124
RA
RB
LOW ACTIVE
WEB0--- >AP KEY
WE B 1--->EMAILKEY
WEB2--- >WWW KEY
F or W7 40 SFor W76S
EC? ?8502
R 0_04
8512
C 0.1U_04R574
J20090724
Reserve
MX25L8005
J20091126
Fo r 2800 mA Bat te ry
KBC-ITE IT8512E
B.Schematic Diagrams
B - 20 KBC-ITE IT8512E
Page 77
JMC261 CARD READER/LAN
3.3V
VC C_ CA RD
5VS
3.3V
3.3V
3.3V
DVD D
3.3V
VC C_CA RD
3.3VS
3.3V
DVD D
DVD D
3.3V
DVD D
DVD D
3.3V
3. 3V
3.3V
DVDD
VC C_ CA RD
VC C_ CA RD
3.3V
DVDD
DVD D
VCC _ CAR D
3. 3 V
LPC_R ST# 19,23,25
PCI E_C L K_CAR DR EAD ER# 18
LA N_CL KR EQ# 1 5 ,1 8
PC IE_W AKE # 4,1 6,25
PCIE_TXP1_CARDR EAD ER 15
PC IE_RXP1_ CAR DR EAD ER 15
PCIE_TXN1_CA RDREAD ER 15
PC IE_RXN 1_C ARD REA DER 15
PCIE_CLK_CARDREADER 18
3.3V2,12,13,15,16,17,23,24,25,30,31,32
5VS12,13,21, 22,23,24, 26,27
C R_W AKE # 15
SD _ BS
SD _ W P
REG L X
SD _ D1
LANXOUTMDIO13
DD_NP
LANXOUT
MLMX1-_R
LAN_SD A
WA KEN
TX _ C T
REGLX
LANXIN
MLMX1-_R
MDIO14
LAN_MDIN1
MLMX0+
MLMX0-_R
LAN_MDIN3
LAN_MDIP0
SD _ D3
SD _ CD #
MLMX1+_R
LAN_MDIP0
ML M X0+
SD _D 2
SD _ D2
LAN_LED1
MLMX1-
WAKEN
MLMX1+
SD_BS
RX_CT
XR S TN
MS_INS#
MLM X0+_R
LAN_SDA
LAN_MDIP1
ML M X0-
LAN_CLK REQ#
SD_CLK
LAN_LED0
MDIO12
SD_CLK
SD_WP
SD _ D1
SD _ BS
LAN_MDIN0
MLMX0-
SD_D 0
SD _D 3
SD _ CD #
CR1_PCTLN
SD _W P
SD_CLK
LAN_MDIP2
CR1_PC TLN
MDIO11
MDIO8
DVD D
SD _ D0
LAN_MDIN1
MDIO10
SD _ D0
MS_INS#
ML M X1+
MS _I N S #
MPD
LAN_MDIP1
SD _ D2
MLM X1+_R
SD _CD#
LAN_SC L
SD _B S
SD _ D3
MDIO9
SD _ D1
MDIO7
MLMX0+_R
LAN_MDIP3
LANXIN
ML M X1-
MLMX0-_RLAN_MDIN0
LAN_MDIN2
LAN_SCL
SD_CLK
MD IO 13
DC_NP
SD _CD#
C62 9
*10p_50V_NPO _04
C56 1
0.1u_16V_Y5V_04
R3844.7K_04
C55 9
0.1u_16V_Y5V_04
C62 7
22p_50V _N PO _04
R 390*10mil_shor t
LP 2
*W CM2012F2S-161T03
1
4
2
3
R3954.7K_04
C63 3
10U _10V_08
R27
75_1% _04
J_ CAR D-R EV1
MDR 019-C0-1042
P2
P21
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P1
P23
P22
DAT2 _ S D
VSS_M S
CD / DA T3_S D
CM D _ SD
VSS_SD
VDD _ SD
CLK _ S D
VSS_SD
DAT0 _ S D
DAT1 _ S D
WP_SD
VSS_M S
VCC _ MS
SCLK_ M S
DAT3 _ MS
INS _M S
DAT2 _ MS
SDI O/D A T0_MS
DAT1 _ MS
BS_MS
CD _ SD
GND
GND
C 6320.1u_10V_X7R_04
R3944.7K_04
C650
10u_6.3V_X5R_06
R56
75_1% _04
C639
*10u_6.3V_X5R _06
C48 5
0. 1 u _ 1 0V _X 7 R _ 0 4
C649
0.1u_16V_Y5V_04
X6X8A025000FG 1H _25MHz12
C653
0.1u_16V_Y5V_04
C63 6
0.1u_16V_Y5V_04
R3854.7K_04
C647
0.1u_16V_Y5V _04
R58
75_1%_04
C646
10u_6.3V_X5R_06
C63 5
0.1u_16V_Y5V_04
R39 2
*15mil_short_06
C641
10U_10V_08
(L Q FP 6 4)
JMC261
U17
JMC261-LGC Z0A 7*7
123456789101112141516
17
18
19
20
21
22
23
24
13
3738394041424344454647
48
363534
33
32
31
30
29
28
27
26
25
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
REXT
VD DX33
XIN
XO UT
GN DLXFB12
VDD REG
CLKN
CLKP
AV DD H
RX P
GND
TXN
TXP
AVD DX
RSTN
WAKEN
MP D
CR EQ N
SMB _S CL /LED2
CR_CD1N
CR_CD0N
RXN
MDIO8
VDD IO
MDIO7
MD IO6
GN D
MDIO5
MDIO4
MDIO3
VDD IO
MDIO2
MDIO1
MDIO0
MDIO9
MDIO10
MDIO11
MD IO 12
GN D
MD IO 13
MD IO 14
SM B_SDA/C R_L ED N
TESTN
VDDIO
VD D
VCC 3O
LED0
LED1
VD D
GND
VIP _1
VIN _ 1
AVD D 12
VIP _2
VIN _ 2
GND
AVD D 33
VIP _3(N C)
VIN _ 3 (NC )
AVD D 12(N C)
VIP _4(N C)
VIN _ 4 (NC )
D36
*BAV 99 R ECTIFI ER
A
C
AC
C648
0.1u_16V_Y5V _04
L67
S WF2520C F-4R7M-M
C643
0.1u_16V_Y5V _04
C642
0.1u_16V_Y5V_04
C652
0.1u_16V_Y5V _04
R387*0_04
R393
75_1% _04
D37
* BAV99 REC TIFIER
A
C
AC
RN31
10K_8P 4R_04
1
2
3456
7
8
C64 0
0.1u_16V _Y5V_04
R24
75_1%_04
R3861M_04
R 3890_04
C62 6
22p_50V_NPO _04
C645
*10u_6.3V_X5R _06
C63 0
10u_6.3V_X5R _06
R396*10mil_short
R38322_04
D35
* BA V9 9 REC TIF IER
A
C
AC
C42 3
1000p_2K V_X7R_12_H125
D34
*BA V 99 R E C T I F I E R
A
C
AC
C638
0.1u_16V_Y5V _04
LP 1
*W CM2012F2S-161T03
1
4
2
3
L1 0
LF - H 8 0 P - 1
1
2
16
15
314
412
5
6
7
13
98
11
10
RD+
RD-
RX+
RX-
RD_CT RX_CT
NCNC
NC
TD _CT
TD +
NC
TX-TD -
TX_C T
TX+
C63 4
0.1u_16V_Y5V_04
U34
*H T24LC0218PB
6
1
2
3
7
5
8
4
SCL
A0
A1
A2
WP
SDA
VCC
GND
C651
0.1u_16V_Y5V _04
C644
0.1u_16V_Y5V _04
D 39 * RB751V
AC
C637
0.1u_16V_Y5V_04
C 628*0.1u_16V_Y5V _04
R39 1
12 K _ 1 % _ 04
R388*100K_04
C 6310.1u_10V_X7R_04
PJS-08SL3B
J_RJ45
8
7
6
5
4
3
2
1GN D1
GN D 2
DD -
DD +
DB-
DC -
DC +
DB+
DA-
DA+ shiel d
shield
NC
R362
Ena bl e D 3 E( 1 )
NC
Ne a r JMC 26 1 P o w er Pin
Ne ar Car dre a de r CONN
NC
MDIO S ingle
End = 50
Ohm
R363
Card Reader/Lan (JMC261)
0.1u
Disable D3 E
Card Reader Power
Plac e al l c apac itors cl osed to c hip.
The subs cr i pt in eac h CAP i nc ica te s th e
pin n um b er o f JM C2 51 /JM C 26 1 th at
sh ou ld be c l os ed t o.
(>20mil)
For JMC25 1/261
only
NC
For J MC251/ 261
on ly
Function
NC
(>20mil)
Switchin g Regulator
Ena bl e D 3 E( 2 )
(>20mil)
R361
(>20mil)
NC0
0
10 0K
C346
DE L R5 44 for ME BU G
NC
1. For JMC251/JMC261 onl y.
2. MPD connec t to Main Power or RSTN for
D3E applicaion, to AUX powe r oth erw is e.