The company reserves the right to revise this publication or to change its contents without notice. Information contained
herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are
they in anyway responsible for any loss or damage resulting from the use (or misuse) of this publication.
This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmitted or
reduced to any machine readable form without prior consent from the vendor, manufacturer or creators of this publication, except for copies kept by the user for backup purposes.
Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks of
their respective companies. They are mentioned for identification purposes only and are not intended as an endorsement
of that product or its manufacturer.
Version 1.0
January 2010
Trademarks
Intel, and Intel Core are trademarks/registered trademarks of Intel Corporation.
Other brand and product names are trademarks and./or registered trademarks of their respective companies.
II
Page 5
About this Manual
hexainf@hotmail.com
This manual is intended for service personnel who have completed sufficient training to undertake the maintenance and
inspection of personal computers.
It is organized to allow you to look up basic information for servicing and/or upgrading components of the C4100/C4105
series notebook PC.
The following information is included:
Chapter 1, Introduction, provides general information about the location of system elements and their specifications.
Chapter 2, Disassembly, provides step-by-step instructions for disassembling parts and subsystems and how to upgrade
elements of the system.
Preface
Appendix A, Part Lists
Appendix B, Schematic Diagrams
Preface
III
Page 6
Preface
IMPORTANT SAFETY INSTRUCTIONS
Follow basic safety precautions, including those listed below, to reduce the risk of fire, electric shock and injury to persons when using any electrical equipment:
1. Do not use this product near water, for example near a bath tub, wash bowl, kitchen sink or laundry tub, in a wet
basement or near a swimming pool.
2. Avoid using a telephone (other than a cordless type) during an electrical storm. There may be a remote risk of electrical shock from lightning.
3. Do not use the telephone to report a gas leak in the vicinity of the leak.
4. Use only the power cord and batteries indicated in this manual. Do not dispose of batteries in a fire. They may
explode. Check with local codes for possible special disposal instructions.
5. This product is intended to be supplied by a Listed Power Unit (Full Range AC/DC Adapter - AC Input 100 - 240V,
50 - 60Hz/ DC Output 19V, 3.42A or 18.5V, 3.5A (65W) minimum).
Preface
IV
CAUTION
Always disconnect all telephone lines from the wall outlet before servicing or disassembling this equipment.
TO REDUCE THE RISK OF FIRE, USE ONLY NO. 26 AWG OR LARGER,
TELECOMMUNICATION LINE CORD
This Computer’s Optical Device is a Laser Class I Product
Page 7
Instructions for Care and Operation
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The notebook computer is quite rugged, but it can be damaged. To prevent this, follow these suggestions:
1.Don’t drop it, or expose it to shock. If the computer falls, the case and the components could be damaged.
Preface
Do not expose the computer
to any shock or vibration.
Do not place it on an unstable
surface.
Do not place anything heavy
on the computer.
2.Keep it dry, and don’t overheat it. Keep the computer and power supply away from any kind of heating element. This
is an electrical appliance. If water or any other liquid gets into it, the co mputer could be badly damaged.
Do not expose it to excessive
heat or direct sunlight.
Do not leave it in a place
where foreign matter or moisture may affect the system.
Don’t use or store the computer in a humid environment.
Do not place the computer on
any surface which will block
the vents.
3.Follow the proper working procedures for the computer. Shut the computer down properly and don’t forget to save
your work. Remember to periodically save your data as data may be lost if the battery is depleted.
Do not turn off the power
until you properly shut down
all programs.
Do not turn off any peripheral
devices when the computer is
on.
Do not disassemble the computer by yourself.
Perform routine maintenance
on your computer.
Preface
V
Page 8
Preface
Power Safety
Warning
Before you undertake
any upgrade procedures, make sure that
you have turned off the
power, and disconnected all peripherals
and cables (including
telephone lines). It is
advisable to also remove your battery in
order to prevent accidentally turning the
machine on.
4.Avoid interference. Keep the computer away from high capacity transformers, electric motors, and oth er strong mag-
netic fields. These can hinder proper performance and damage your data.
5.Take care when using peripheral devices.
Preface
VI
Use only approved brands of
peripherals.
Unplug the power cord befor e
attaching peripheral devices.
Power Safety
The computer has specific power requirements:
•Only use a power adapter approved for use with this computer.
•Your AC adapter may be designed for international travel but it still requires a stea dy, uninterrupted po wer supply. If you ar e
unsure of your local power specifications, consult your service representative or local power company.
•The power adapter may have either a 2-prong or a 3-prong grounded plug. The third prong is an important safety feature; do
not defeat its purpose. If you do not have access to a compatible outlet, have a qualified electrician install one.
•When you want to unplug the power cord, be sure to disconnect it by the plug head, not by its wire.
•Make sure the socket and any extension cord(s) you use can support the total current load of all the connected devices.
•Before cleaning the computer, make sure it is disconnected from any external power supplies (i.e. AC/DC adapter or car
adapter).
Do not plug in the power
cord if you are wet.
Do not use the power cord if
it is broken.
Do not place heavy objects
on the power cord.
Page 9
Battery Precautions
Battery Disposal
The product that you have purchased contains a rechargeable battery. The battery is recyclable. At the end of its useful life, under various state and local laws, it may be illegal to dispose of this battery into the municipal waste stream. Check with your local solid waste
officials for details in your area for recycling options or proper disposal.
Caution
Danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the manufacturer.
Discard used battery according to the manufacturer’s instructions.
Battery Level
Click the battery icon in the taskbar to see the current battery level and charge status. A battery that drops below a level of 10%
will not allow the computer to boot up. Make sure that any battery that drops below 10% is recharged within one week.
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•Only use batteries designed for this computer. The wrong battery type may explode, leak or damage the computer.
•Do not continue to use a battery that has been dropped, or that appears damaged (e.g. bent or twisted) in any way. Even if the
computer continues to work with a damaged battery in place, it may cause circuit damage, which may possibly result in fire.
•Recharge the batteries using the notebook’s system. Incorrect recharging may make the battery explode.
•Do not try to repair a battery pack. Refer any battery pack repair or replacement to your service representative or qualified service
personnel.
•Keep children away from, and promptly dispose of a damaged battery. Always dispose of batteries carefully. Batteries may explode
or leak if exposed to fire, or improperly handled or discarded.
•Keep the battery away from metal appliances.
•Affix tape to the battery contacts before disposing of the battery.
•Do not touch the battery contacts with your hands or metal objects.
Battery Guidelines
The following can also apply to any backup batteries you may have.
•If you do not use the battery for an extended period, then remove the battery from the computer for storage.
•Before removing the battery for storage charge it to 60% - 70%.
•Check stored batteries at least every 3 months and charge them to 60% - 70%.
POWER SWITCH & LID BOARD .............................................B-37
X
Page 13
1: Introduction
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Overview
This manual covers the information you need to service or upgrade the C4100/C4105 series notebook computer. Information about operating the computer (e.g. getting started, and the Setup utility) is in the User’s Manual. Information
about drivers (e.g. VGA & audio) is also found in User’s Manual. That manual is shipped with the computer.
Operating systems (e.g. Windows Vista/ Window 7, etc.) have their own manuals as do application software (e.g. word
processing and database programs). If you have questions about those programs, you should consult those manuals.
Introduction
The C4100/C4105 series notebook is designed to be upgradeable. See Disassembly on page 2 - 1 for a detailed description of the upgrade procedures for each specific component. Please note the warning and safety information indicated by
the “” symbol.
The balance of this chapter reviews the computer’s technical specifications and features.
1.Introduction
Overview 1 - 1
Page 14
Introduction
Latest Specification Information
The specifications listed in this here are correct
at the time of going to press. Certain items (particularly processor types/speeds) may be
changed, delayed or updated due to the manufacturer's release schedule. Check with your
service center for details.
CPU
The CPU is not a user serviceable part. Accessing the CPU in any way may violate your
warranty.
Specifications
1.Introduction
Processor Options
Intel® Core™2 Duo Processor
T6600 (2.2GHz), T6500 (2.1GHz), T6400 (2.0GHz)
Three USB 2.0 Ports
One HDMI Out Port
One Headphone-Out Jack
One Microphone-In Jack
One RJ-45 LAN Jack
One RJ-11 Modem Jack
One DC-in Jack
One External Monitor Port
One ExpressCard/34 Slot
)
1 - 2 Specifications
Page 15
Communication
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Introduction
10Mb/100Mb
(Factory Option) 802.11b/g/n Wireless LAN Half Mini-Card
Module
(Factory Option) 1.3M Pixel USB PC Camera Module
(Factory Option) Bluetooth 2.1 + EDR Module
(Factory Option) 3.75G/HSPA Mini-Card Module
Card Reader
Embedded 7-in-1 Card Reader (MS/ MS Pro/ SD/ Mini SD/
MMC/ RS MMC/ MS Duo)
Note: MS Duo/ Mini SD/ RS MMC Cards require a PC
adapter
Power
6 Cell Smart Lithium-Ion Battery Pack, 48.84WH
(Factory Option)
Full Range AC/DC Adapter
AC Input: 100 - 240V, 50 - 60Hz
DC Output: 19V, 3.42A or 18.5V, 3.5A (65 Watts)
Energy Star 5.0 Compliant
Environmental Spec
Temperature
Operating: 5
Non-Operating: -20°C - 60°C
Relative Humidity
Operating: 20% - 80%
Non-Operating: 10% - 90%
Ethernet LAN
6 Cell Battery Pack, 62.16WH
C - 35°C
°
1.Introduction
Dimensions & Weight
340mm (w) * 238mm (d) * 13.9 - 31.8mm (h)
2.2 kg With 6 Cell Battery and ODD
Specifications 1 - 3
Page 16
Introduction
Figure 1
Front View with LCD Pan-
el Open
1. Built-In PC Camera
(Optional)
2. LCD
3. Power Button
4. Hot-Key Buttons
5. LED Status
Indicators
6. Keyboard
7. Built-In Microphone
8. Touchpad &
Buttons
1
4
6
7
3
5
8
2
1.Introduction
External Locator - Front View with LCD Panel Open
1 - 4 External Locator - Front View with LCD Panel Open
Page 17
External Locator - Front and Rear View
1
Figure 2
Front View
1. LED Power
Indicators
Figure 3
Rear View
1. Battery
1
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Introduction
1.Introduction
External Locator - Front and Rear View 1 - 5
Page 18
Introduction
1
2
4
6
3
5
7
8
5
Figure 4
Left Side View
1. DC-In Jack
2. External Monitor
Port
3. RJ-45 LAN Jack
4. HDMI Port
5. 2 * USB 2.0 Ports
6. Vent
7. ExpressCard/34
Slot
8. 7-in-1 Card
Reader
Figure 5
Right Side View
1. Microphone-In
Jack
2. Headphone-Out
Jack
3. USB 2.0 Port
4. RJ-11 Modem
Jack
5. Optical Device
Drive Bay
6. Emergency Eject
Hole
7. Security Lock Slot
1
2
3
5
6
4
7
1.Introduction
External Locator - Left & Right Side View
1 - 6 External Locator - Left & Right Side View
Page 19
External Locator - Bottom View
Figure 6
Bottom View
1. Vent
2. Component Bay
Cover
3. Hard Disk Bay
Cover
4. Battery Release
Latch
5. Battery
Overheating
To prevent your computer from overheating
make sure nothing
blocks the vent/fan intakes while the computer is in use.
2
4
1
1
3
1
1
4
5
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Introduction
1.Introduction
External Locator - Bottom View 1 - 7
Page 20
Introduction
Figure 7
Mainboard Top
Key Parts
1. JMB261
2. CLOCK GEN.
3. ITE 8502E
2
1
3
1.Introduction
Mainboard Overview - Top (Key Parts)
1 - 8 Mainboard Overview - Top (Key Parts)
Page 21
Mainboard Overview - Bottom (Key Parts)
Figure 8
Mainboard Bottom
Key Parts
1. SC452
2. CPU Socket (no
CPU installed)
3. NorthBridge
INTEL GL40
4. SorthBridge
ICH9M
5. REALTEK
ALC272
6. Memory Slots
DDR3 So-DIMM
7. Mini-PCIe Socket
(Wireless Lan
Module)
1
5
2
4
3
6
7
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Introduction
1.Introduction
Mainboard Overview - Bottom (Key Parts) 1 - 9
Page 22
Introduction
Figure 9
Mainboard Top
Connectors
1. USB Ports
2. ExpressCard/34
Slot
3. Microphone Cable
Connector
4. Keyboard Cable
Connector
5. TouchPad Cable
Connector
6. Audio Cable
Connector
1
6
5
2
4
3
1
1.Introduction
Mainboard Overview - Top (Connectors)
1 - 10 Mainboard Overview - Top (Connectors)
Page 23
Mainboard Overview - Bottom (Connectors)
Figure 10
Mainboard Bottom
Connectors
1. RJ-45 Jack
2. D-Sub-Out Port
3. DC-In Jack
4. CCD Cable
Connector
5. LCD Cable
Connector
6. Battery Connector
7. ODD Connector
8. HDD Connector
9. 3G Module
Connector
10.SIMLOCK
11. CMOS Cable
Connector
12.Fan Cable
Connector
13.MDC Cable
Connector
14.7-in-1 Card Reader
1
6
7
8
5
2
4
3
9
11
10
12
14
13
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Introduction
1.Introduction
Mainboard Overview - Bottom (Connectors) 1 - 11
Page 24
Introduction
1.Introduction
1-12
Page 25
2: Disassembly
Information
Warning
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Overview
This chapter provides step-by-step instructions for disassembling the C4100/C4105 series notebook’s parts and subsystems. When it comes to reassembly, reverse the procedures (unless otherwise indicated).
We suggest you completely review any procedure before you take the computer apart.
Disassembly
Procedures such as upgrading/replacing the RAM, CD device and hard disk are included in the User’s Manual but are
repeated here for your convenience.
To make the disassembly process easier each section may have a box in the page margin. Information contained under
the figure # will give a synopsis of the sequence of procedures involved in the disassembly procedure. A box with a
lists the relevant parts you will have after the disassembly process is complete. Note: The parts listed will be for the disassembly procedure listed ONLY, and not any previous disassembly step(s) required. Refer to the part list for the previous disassembly procedure. The amount of screws you should be left with will be listed here also.
A box with a will also provide any possible helpful information. A box with a contains warnings.
An example of these types of boxes are shown in the sidebar.
2.Disassembly
Overview 2 - 1
Page 26
Disassembly
2.Disassembly
NOTE: All disassembly procedures assume that the system is turned OFF, and disconnected from any power supply (the
battery is removed too).
Maintenance Tools
The following tools are recommended when working on the notebook PC:
•M3 Philips-head screwdriver
•M2.5 Philips-head screwdriver (magnetized)
•M2 Philips-head screwdriver
•Small flat-head screwdriver
•Pair of needle-nose pliers
•Anti-static wrist-strap
Connections
Connections within the computer are one of four types:
Locking collar sockets for ribbon connectorsTo release these connectors, use a small flat-head screwdriver to
gently pry the locking collar away from its base. When replacing the connection, make sure the connector is oriented in the
same way. The pin1 side is usually not indicated.
2 - 2 Overview
Pressure sockets for multi-wire connectorsTo release this connector type, grasp it at its head and gently
rock it from side to side as you pull it out. Do not pull on the
wires themselves. When replacing the connection, do not try to
force it. The socket only fits one way.
Pressure sockets for ribbon connectorsTo release these connectors, use a small pair of needle-nose pli-
ers to gently lift the connector away from its socket. When replacing the connection, make sure the connector is oriented in
the same way. The pin1 side is usually not indicated.
Board-to-board or multi-pin socketsTo separate the boards, gently rock them from side to side as
you pull them apart. If the connection is very tight, use a small
flat-head screwdriver - use just enough force to start.
Page 27
Maintenance Precautions
Power Safety
Warning
Before you undertake
any upgrade procedures, make sure that
you have turned off the
power, and disconnected all peripherals
and cables (including
telephone lines). It is
advisable to also remove your battery in
order to prevent accidentally turning the
machine on.
hexainf@hotmail.com
The following precautions are a reminder. To avoid personal injury or damage to the computer while performing a removal and/or replacement job, take the following precautions:
1.Don't drop it. Perform your repairs and/or upgrades on a stable surface. If the computer falls, the case and other
components could be damaged.
2.Don't overheat it. Note the proximity of any heating elements. Keep the computer out of direct sunlight.
3.Avoid interference. Note the proximity of any high capacity transformers, electric motors, and other strong mag-
netic fields. These can hinder proper performance and damage component s and/or data. You should also monitor
the position of magnetized tools (i.e. screwdrivers).
4.Keep it dry. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly
damaged.
5.Be careful with power. Avoid accidental shocks, discharges or explosions.
•Before removing or servicing any part from the computer, turn the computer off and detach any power supplies.
•When you want to unplug the power cord or any cable/wire, be sure to disconnect it by the plug head. Do no t pull on th e wir e.
6.Peripherals – Turn off and detach any peripherals.
7.Beware of static discharge. ICs, such as the CPU and main support chips, are vulnerable to static electricity.
Before handling any part in the computer, discharge any static electricity inside the computer. When handling a
printed circuit board, do not use gloves or other materials which allow static electricity buildup. We suggest that
you use an anti-static wrist strap instead.
8.Beware of corrosion. As you perform your job, avoid touching any connector leads. Even the cleanest hands produce oils which can attract corrosive elements.
9.Keep your work environment clean. Tobacco smoke, dust or other air-born particulate matter is often attracted
to charged surfaces, reducing performance.
10. Keep track of the components. When removing or replacing any part, be careful not to leave small part s, such as
screws, loose inside the computer.
Cleaning
Do not apply cleaner directly to the computer, use a soft clean cloth.
Do not use volatile (petroleum distillates) or abrasive cleaners on any part of the computer.
Disassembly
2.Disassembly
Overview 2 - 3
Page 28
Disassembly
Disassembly Steps
The following table lists the disassembly steps, and on which page to find the related information. PLEASE PERFORM
THE DISASSEMBLY STEPS IN THE ORDER INDICATED.
2.Disassembly
To remove the Battery:
1.Remove the batterypage 2 - 5
To remove the HDD:
1.Remove the batterypage 2 - 5
2.Remove the HDDpage 2 - 6
To remove the Optical Device:
1.Remove the batterypage 2 - 5
2.Remove the Optical devicepage 2 - 8
To remove the System Memory:
1.Remove the batterypage 2 - 5
2.Remove the system memorypage 2 - 9
To remove and install a Processor:
1.Remove the batterypage 2 - 5
2.Remove the processorpage 2 - 10
3.Install the processorpage 2 - 12
To remove the 3G Module:
1.Remove the batterypage 2 - 5
2.Remove the 3G modulepage 2 - 13
To remove the Bluetooth Module:
1.Remove the batterypage 2 - 5
2.Remove the Bluetooth Modulepage 2 - 15
To remove the Modem:
1.Remove the batterypage 2 - 5
2.Remove the Modempage 2 - 16
To remove the LCD Back Cover:
1.Remove the batterypage 2 - 5
2.Remove the LCD Back Coverpage 2 - 17
To remove the LCD Front Cover:
1.Remove the batterypage 2 - 5
2.Remove the LCD Front Coverpage 2 - 19
To remove the Keyboard:
1.Remove the batterypage 2 - 5
2.Remove the keyboardpage 2 - 20
To remove the Wireless LAN Module:
1.Remove the batterypage 2 - 5
2.Remove the WLAN modulepage 2 - 14
2 - 4 Disassembly Steps
Page 29
Removing the Battery
2. Battery
1
2
634
Figure 1
Battery Removal
a. Slide latch at point 1 to-
wards the unlock symbol
and hold it in place.
b. Slide the battery in the di-
rection of the arrow.
1
a.
b.
3
2
4
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1.Turn the computer off, and turn it over.
2.Slide the latch in the direction of the arrow.
3.Slide the latch in the direction of the arrow, and hold it in place.
4.Slide the battery in the direction of the arrow .
Disassembly
2.Disassembly
Removing the Battery 2 - 5
Page 30
Disassembly
Figure 2
HDD Assembly
Removal
a. Locate the HDD bay
cover and remove th
screw(s).
•2 Screws
1
2
2
1
a.
HDD System Warning
New HDD’s are blank. Before you
begin make sure:
You have backed up any data
you want to keep from your old
HDD.
You have all the CD-ROMs and
FDDs required to install your operating system and programs.
If you have access to the internet,
download the latest application
and hardware driver updates for
the operating system you plan to
install. Copy these to a removable medium.
Removing the Hard Disk Drive
The hard disk drive can be taken out to accommodate other 2.5" serial (SATA) hard disk drives with a height of 9.5mm
(h). Follow your operating system’s installation instructions, and install all necessary drivers and utilities (as outlined in
Chapter 4 of the User’s Manual) when setting up a new hard disk.
Hard Disk Upgrade Process
1.Turn off the computer, and remove the battery (page 2 - 5).
2.Locate the hard disk bay cover and remove screw & .
2.Disassembly
2 - 6 Removing the Hard Disk Drive
Page 31
Disassembly
634
5
6
9
10
11
4
b.
c.
e.
5
9
d.
3
e.
10
8
7
6
11
3. HDD Bay Cover
10.Adhesive Cover
11.HDD
•4 Screws
Figure 3
HDD Assembly
Removal (cont’d.)
b. Remove the HDD bay
cover.
c. Grip the tab and slide the
HDD in the direction of
the arrow.
d. Lift the HDD assembly
out of the bay.
e. Remove the screws and
adhesive cover.
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3.Remove the hard disk bay cover
4.Grip the tab and slide the hard disk in the direction of arrow
.
.
5.Lift the hard disk out of the bay .
6.Remove the screw - and the adhesive cover from the hard disk.
7.Reverse the process to install a new hard disk (do not forget to replace all the screws and covers).
2.Disassembly
Removing the Hard Disk Drive 2 - 7
Page 32
Disassembly
Figure 4
Optical Device
Removal
a. Remove the screws.
b. Remove the cover.
c. Remove the screw.
d. Slide the optical device
out of the computer at
point 9.
Fan Cable
Make sure you reconnect the fan cable
before screwing down
the bay cover.
61256
1
789
1. Component Bay
Cover
8. Optical Device
•5 Screws
2
4
3
b.
1
5
1
5
6
a.
d.
c.
8
7
9
1
Removing the Optical (CD/DVD) Device
1.Turn off the computer, remove the battery (page 2 - 5).
2.Locate the component bay cover , and remove screws - .
3.Carefully (a fan and cable are attached to the under side of the cover) lift up the bay cover.
4.Carefully disconnect the fan cable , and remove the cover
5.Remove the screw at point , and use a screwdriver to carefully push out the optical device at point .
6.Insert the new device and carefully slide it into the computer (the device only fits one way. DO NOT FORCE IT; The
screw holes should line up).
7.Restart the computer to allow it to automatically detect the new device.
.
2.Disassembly
2 - 8 Removing the Optical (CD/DVD) Device
Page 33
Removing the System Memory (RAM)
Figure 5
RAM Module
Removal
a. Locate the memory
socket.
b. Pull the release
latch(es).
c. Remove the mod-
ule(s).
Contact Warning
Be careful not to touch
the metal pins on the
module’s connecting
edge. Even the cleanest
hands have oils which
can attract particles, and
degrade the module’s
performance.
4. RAM Module
123
a.
b.
c.
1
3
2
4
4
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The computer has two memory sockets for 200 pin Small Outline Dual In-line Memory Modules (SO-DIMM) supporting
DDRIII (DDR3) Up to 1066/1333 MHz. The main memory can be expanded up to 4GB. The SO-DIMM modules supported are 1024MB and 2048MB DDRIII Modules. The total memory size is automatically detected by the POST routine once you turn on your computer.
Memory Upgrade Process
1.Turn off the computer, turn it over and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The RAM module(s) will be visible at point on the mainboard.
3.Gently pull the two release latches ( & ) on the sides of the memory socket in the direction indicated by the
Disassembly
arrows (Figure 5b).
2.Disassembly
4.The RAM module(s) will pop-up
5.Pull the latches to release the second module if necessary.
6.Insert a new module holding it at about a 30° angle and fit the connectors firmly into the memory slot.
7.The module will only fit one way as defined by its pin alignment. Make sure the module is seated as far into the slot
8.Press the module in and down towards the mainboard until the slot levers click into place to secure the module.
9.Replace the component bay cover and the screws
10. Restart the computer to allow the BIOS to register the new memory configuration as it starts up.
as it will go. DO NOT FORCE IT; it should fit without much pressure.
(
Figure 5c), and you can then remove it
(see
page 2 - 8).
.
Removing the System Memory (RAM) 2 - 9
Page 34
Disassembly
4
321
5
Figure 6
Processor Removal
a. Locate the heat sink.
b. Remove the screws from
the CPU heatsink.
c. Remove the CPU heat
sink.
5. Heat Sink
•4 Screws
2
3
4
a.
c.
b.
5
A
1
Removing and Installing a Processor
Processor Removal Procedure
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.Locate the heat sink.
3.Loosen the CPU heat sink screws in the order ,
4.Carefully lift up the heat sink (Figure 6c) off the computer.
, & (the reverse order as indicated on the label).
2.Disassembly
2 - 10 Removing and Installing a Processor
Page 35
6
7
Figure 7
Processor Removal
(cont’d)
d. Turn the release latch to
unlock the CPU.
e. Lift the CPU out of the
socket.
d.
e.
Caution
The heat sink, and CPU area in
general, contains parts which are
subject to high temperatures. Allow
the area time to cool before removing these parts.
UnlockLock
6
7
6
7. CPU
hexainf@hotmail.com
Disassembly
5.Turn the release latch towards the unlock symbol to release the CPU.
6.Carefully (it may be hot) lift the CPU up and out of the socket (Figure 7e).
7.Reverse the process to install a new CPU.
8.When re-inserting the CPU, pay careful attention to the pin alignment, it will fit only one way (DO NOT FORCE IT!).
2.Disassembly
Removing and Installing a Processor 2 - 11
Page 36
Disassembly
ABC
D
123
4
b.
B
a.
D
1
3
2
4
Note:
Tighten the screws
in the order as indicated on the label.
C
A
c.
d.
Figure 8
Processor
Installation
a. Insert the CPU.
b. Turn the release latch to-
wards the lock symbol.
c. Remove the sticker from
the heat sink and insert
the heat sink.
d. Tighten the screws.
A. CPU
D. Heat Sink
•3 Screws
Processor Installation Procedure
1.Insert the CPU , pay careful attention to the pin alignment, it will fit only one way (DO NOT FORCE IT!), and turn
the release latch towards the lock symbol (Figure 8b).
2.Remove the sticker (Figure 8c) from the heat sink.
3.Insert the heat sink
4.Tighten the CPU heat sink screws in the order
8d).
5.Replace the component bay cover (don’t forget to replace the fan cable) and tighten the screws (page 2 - 8).
as indicated in Figure 8d.
, , & (the order as indicated on the label and Figure
2.Disassembly
2 - 12 Removing and Installing a Processor
Page 37
Removing the 3G Module
Figure 9
3G Module Removal
a. Locate the 3G module.
b. Disconnect the cable
and remove the screw.
c. Remove the 3G module.
Note: Make sure you
reconnect the antenna
cable to socket (Fig-
ure 9b).
1
2
3
4
b.
c.
a.
3
1
2
4
4. 3G Module
•1 Screw
hexainf@hotmail.com
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The 3G module will be visible at point on the mainboard.
3.Carefully disconnect the cable , and then remove the screw
4.The 3G module (Figure 10c) will pop-up, and you can remove it from the computer.
.
Disassembly
2.Disassembly
Removing the 3G Module 2 - 13
Page 38
Disassembly
Figure 10
Wireless LAN
Module Removal
a. Locate the WLAN.
b. Disconnect the cable
and remove the screw.
c. The WLAN module will
pop up.
d. Remove the Wireless
LAN module.
Note: Make sure you
reconnect the antenna
cable to the “1 + 2”
socket (Figure 10b).
1
234
5
b.
c.
a.
4
3
2
d.
5
5
1
5.Wireless LAN Module
•1 Screw
Removing the Wireless LAN Module
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The Wireless LAN module will be visible at point on the mainboard.
3.Carefully disconnect the cables & , and then remove the screw
4.The Wireless LAN module (Figure 10c) will pop-up, and you can remove it from the computer.
.
2.Disassembly
2 - 14 Removing the Wireless LAN Module
Page 39
Removing the Bluetooth Module
Figure 11
Bluetooth Module
Removal
a. Locate the Bluetooth
module.
b. Remove the screw.
c. Disconnect the cable
and the connector from
the Bluetooth module.
d. Lift the Bluetooth module
out.
1
2
3
4
5
c.
a.
4
1
5
2
3
b.
d.
5. Bluetooth Module
•1 Screw
hexainf@hotmail.com
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The Bluetooth module will be visible at point on the mainboard.
3.Remove the screw and turn the module over.
4.Carefully disconnect the cable and separate the connector (Figure 11b) from the Bluetooth Module.
5.Lift the Bluetooth Module (Figure 11c) up and off the computer.
Disassembly
2.Disassembly
Removing the Bluetooth Module 2 - 15
Page 40
Disassembly
Figure 12
Modem Removal
a. Locate the modem.
b. Remove the screws.
c. Lift the modem up and
off the sockets.
1
2
354
5. Modem
•2 Screws
c.
a.
4
1
5
2
3
b.
Removing the Modem
1.Turn off the computer, turn it over, and remove the battery (page 2 - 5) and the component bay cover (page 2 - 8).
2.The modem will be visible at point on the mainboard.
3.Remove the screws
4.Carefully lift the modem up and off the socket .
- ,
2.Disassembly
2 - 16 Removing the Modem
Page 41
Removing the LCD Back Cover for MOFA
1
2
3
4
5
6
7
a.
1
3
2
4
56
b.
7
c.
Rubber Screw Covers
After removing the rubber screw covers, place them on a
clean dry surface (or attach them to the front cover itself) in
order to prevent loss of adhesive.
Figure 13
LCD Back Cover
Removal
a. Remove the rubber cov-
ers and screws.
b. Slide the cover forward.
c. Remove the LCD back
cover.
7. LCD Back Cover
•2 Screws
hexainf@hotmail.com
1.Turn off the computer, and turn the computer over to remove the battery (page 2 - 5).
2.Open the LCD and carefully remove the rubber screw covers & (2 corne r rubber screw covers only) a nd set
them aside.
3.Remove screws & from the front cover.
4.Carefully slide the cover forward in the direction of the arrows & as illustrated below.
5.Remove the LCD back cover .
Disassembly
2.Disassembly
Removing the LCD Back Cover for MOFA 2 - 17
Page 42
Disassembly
8
8
9
9
1010
10
d.
Figure 14
LCD Back Cover
Removal (cont’d)
d. Align the replacement
cover and slide forward to
click firmly into place.
9
10
2.Disassembly
6.Align the replacement cover with the dotted line as illustrated below (and as marked on the cover).
7.Slide the back cover forward until it clicks firmly into place .
8.Run your hands around the sides and front of the cover to make sure it is firmly aligned in place (carefully press
down to make sure the fit is secure).
9.Replace the screws and rubber covers.
2 - 18 Removing the LCD Back Cover for MOFA
Page 43
Removing the LCD Front Cover
Figure 15
LCD Front Cover
Removal
a. Remove the screws and
unsnap the LCD front
cover from the LCD panel.
b. Slide the LCD panel cov-
er in the direction of the
arrow.
1
4
5
6
7
5. LCD Front Cover
•4 Screws
a.b.
1
2
3
4
7
5
6
7
5
Rubber Screw Covers
After removing the rubber screw covers, place them on a
clean dry surface (or attach them to the front cover itself) in
order to prevent loss of adhesive.
hexainf@hotmail.com
1.Turn off the computer, and remove the battery (page 2 - 5), and remove the LCD back cover (page 2 - 17).
2.Remove the rubber covers and screws - (Figure 15a), then run your finger around the middle of the frame to
carefully unsnap the LCD front cover from the LCD panel.
3.After unsnapping all four sides of the LCD front cover, carefully slide the LCD front cover downwards in the direction of the arrow (be careful of the LCD hinges at point ).
4.You can now remove the LCD front cover.
Disassembly
2.Disassembly
Removing the LCD Front Cover 2 - 19
Page 44
Disassembly
Figure 16
Keyboard Removal
a. Press the four latches to
release the keyboard.
b. Lift the keyboard up and
disconnect the cable
from the locking collar.
c. Remove the keyboard.
5
5
6
7
Re-Inserting the
Keyboard
When re-inserting the
keyboard firstly align the
four keyboard tabs at the
bottom (
Figure 16c) at
the bottom of the keyboard with the slots in the
case.
a.
b.
Keyboard Tabs
1
3
2
4
6
7
5
c.
7. Keyboard
Removing the Keyboard
1.Turn off the computer, and remove the battery (page 2 - 5).
2.Press the four keyboard latches at the top of the keyboard to elevate the keyboard from its normal position (you
may need to use a small screwdriver to do this).
3.Carefully lift the keyboard up, being careful not to bend the keyboard ribbon cable (Figure 16b).
4.Disconnect the keyboard ribbon cable from the locking collar socket .
5.Carefully lift up the keyboard (Figure 16c) off the computer.
2.Disassembly
2 - 20 Removing the Keyboard
Page 45
Appendix A:Part Lists
hexainf@hotmail.com
This appendix breaks down the C4100/C4105 series notebook’s construction into a series of illustrations. The component
part numbers are indicated in the tables opposite the drawings.
Note: This section indicates the manufacturer’s part numbers. Your organization may use a different system, so be sure
to cross-check any relevant documentation.
Note: Some assemblies may have parts in common (especially screws). However, the part lists DO NOT indicate the
total number of duplicated parts used.
Part Lists
Note: Be sure to check any update notices. The parts shown in these illustrations are appropriate for the system at the
time of publication. Over the product life, some parts may be improved or re-configured, resulting in new part numbers.
A.Part Lists
A-1
Page 46
Part Lists
Table A - 1
Part List Illustration
Location
Part List Illustration Location
The following table indicates where to find the appropriate part list illustration.
PartC4100/C4105
Top (C4100)
page A - 3
A.Part Lists
Top (C4105)
Bottom (C4100)
LCD (C4100)
LCD (C4105)
HDD
SATA-DVD-SUPER-MULTI
page A - 4
page A - 5
page A - 6
page A - 7
page A - 8
page A - 9
A - 2 Part List Illustration Location
Page 47
Top (C4100)
Figure A - 1
Top (C4100)
無鉛
無鉛
無鉛
(灰色) 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
(非耐落) 無鉛
無鉛
無鉛
香檳銀色 無鉛
無鉛
無鉛
非耐落 無鉛
無鉛
無鉛
無鉛
hexainf@hotmail.com
Part Lists
A.Part Lists
Top (C4100) A - 3
Page 48
Part Lists
Figure A - 1
Top (C4105)
無鉛
無鉛
(灰色) 無鉛
無鉛
無鉛
無鉛
無鉛
(非耐落) 無鉛
無鉛
非耐落 無鉛
無鉛
無鉛
無鉛
黑色 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
A.Part Lists
Top (C4105)
A - 4 Top (C4105)
Page 49
Bottom (C4100)
Figure A - 2
Bottom (C4100)
hexainf@hotmail.com
Part Lists
A.Part Lists
Bottom (C4100) A - 5
Page 50
Part Lists
Figure A - 3
LCD (C4100)
無鉛
無鉛
(華力)無鉛
無鉛
非耐落 無鉛
今皓 / 泰林 無鉛
無鉛
無鉛
中性 電鑄薄膜鍍亮鉻(字體連結) 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
銘板 無鉛
無鉛
華力 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
精乘 (銅箔接地)無鉛
精乘 無鉛
精乘 無鉛
無鉛
無鉛
無鉛
無鉛
A.Part Lists
LCD (C4100)
A - 6 LCD (C4100)
Page 51
LCD (C4105)
無鉛
無鉛
(華力)無鉛
無鉛
非耐落 無鉛
今皓 / 泰林 無鉛
無鉛
無鉛
無鉛
無鉛
中性 電鑄薄膜鍍亮鉻(字體連結) 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
銘板 無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
無鉛
精乘 (銅箔接地) 無鉛
精乘 無鉛
精乘 無鉛
無鉛
無鉛
Figure A - 4
LCD (C4105)
hexainf@hotmail.com
Part Lists
A.Part Lists
LCD (C4105) A - 7
Page 52
Part Lists
無鉛
(無鉛)
Figure A - 5
HDD
A.Part Lists
HDD
A - 8 HDD
Page 53
SATA-DVD-SUPER MULTI
*(非耐落) 無鉛
無鉛
無鉛
無鉛
內縮 無鉛
內縮 無鉛
已內縮 無鉛
已內縮 無鉛
Figure A - 6
SATA-DVD-SUPER
MULTI
hexainf@hotmail.com
Part Lists
A.Part Lists
SATA-DVD-SUPER MULTI A - 9
Page 54
Part Lists
A.Part Lists
A - 10
Page 55
Appendix B:Schematic Diagrams
Table B - 1
Schematic
Diagrams
Version Note
The schematic diagrams in this chapter
are based upon version 6-7P-C4104-003.
If your mainboard (or
other boards) are a later version, please
check with the Service
Center for updated diagrams (if required).
hexainf@hotmail.com
This appendix has circuit diagrams of the C4100/C4105 notebook’s PCB’s. The following table indicates where to find
the appropriate schematic diagram.
Diagram - PageDiagram - PageDiagram - Page
SYSTEM BLOCK DIAGRAM - Page B - 2DDRIII SO-DIMM B - Page B - 14HDD, ODD, MDC, TP, Conn, 3G - Page B - 26
CLOCK GENERATOR - Page B - 3PANEL, CRT - Page B - 15NEW CARD, USB, MINI PCIE - Page B - 27
Penryn (Socket-P)1/2 - Page B - 4INVERTER, BLUETOOTH, FAN - Page B - 16LED, CCD, AUDIO Conn - Page B - 28
Penryn (Socket-P)2/2 - Page B - 5ICH9M 1/4, SATA - Page B - 17SYSTEM POWER, PWR SW - Page B - 29
CANTIGA 1/7, HOST - Page B - 6ICH9M 2/4, PCI, USB - Page B - 18AC_IN, CHARGER - Page B - 30
CANTIGA 2/7, Graphics - Page B - 7ICH9M 3/4 - Page B - 19VCORE - Page B - 31
CANTIGA 3/7 - Page B - 8ICH9M 4/4 - Page B - 20VDD3, VDD5 - Page B - 32
CANTIGA 4/7 - Page B - 9HDMI - Page B - 211.8V/1.05VS - Page B - 33
Schematic Diagrams
B.Schematic Diagrams
CANTIGA 5/7 - Page B - 10KBC-ITE IT8502E - Page B - 221.5V,0.75VS - Page B - 34
CANTIGA 6/7 - Page B - 11JMC21 CARD READER/LAN - Page B - 23CLICK BOARD - Page B - 35
CANTIGA 7/7 - Page B - 12AUDIO CODEC ALC272 - Page B - 24AUDIO/ USB/ RJ11 BOARD - Page B - 36
DDRIII SO-DIMM A - Page B - 13AUDIO AMP TPA6017 - Page B - 25POWER SWITCH & LID BOARD - Page B - 37
B-1
Page 56
Schematic Diagrams
Sheet 1 of 35
SYSTEM BLOCK
DIAGRAM
<=8"
0.5"~5.5"
SO-DIMM1
USB2
CLEVO C4 100 DDR3 S ystem Block Diagram
USB2.0
(JUS B 1)
24 MHz
Memory Termination
667/800 MHz
MIC IN,HEADPHONE
Synaptic
32.768 KHz
AZALIA LINK
SYSTEM POWER
Aud io Boar d
CLICK BOARD
AC-IN,CHARGER
48pins LQFP
USB 5
ITE 85 02E
PCIE
+VCORE
PATA-133
RJ-45
AUDIO AMP
128pins LQFPINT SPK
100 MHz
INT. K/B
VDD3,VDD5,3.3V,5V
SATA I/II 3.0Gb/s
EC SMBUS
LPC
Bluetooth
Realtek
ALC272
MDC C ON
480 Mbps
LCD CO NNE CTO R,
INVERTER
24pins TSSOP
SMART
FAN
MIC
IN
1.8V,1.05VS
14*14*1.6mm
TOUCH PAD
USB & Phone
Jack B'd
32.768KHz
3G CARD
F75383M
810602-1703
667/800MHz
1.5V,0.75VS
FSB
9.8*6.4*1.2mm
AZALIA
MDC
MODULE
THERMAL
SENSOR
EC
SPI
TPA6017
9*9*1.6mm
33 MHz
SMART
BATTERY
INT MIC
SO-DIMM2
USB3
RJ-11
Azal ia Co dec
HP
OUT
CRT
DDRIII
DDRIII
CCD
Intel Penryn
Intel GL40
PROCESSOR
NORTH BRIDGE
1329 Ball FCBGA
DMI
478pins uFCBGA
SOUTH BRIDG E
676 mBGA
ICH9M
14.318 MHz
SLG8SP513V
CLOCK GEN.
SYSTEM SMBU S
0.1"~13
HDMI
Ne w Ca rd
SO CK ET
(U SB 8)(U SB4)
SOCKET
Mini PCI E
JMB261
CARD READER
LAN
SOCKET
4IN1
USB
USB11
USB
(JUSB0)
SATA HDD ,
LID
SATA ODD
SYSTEM BLOCK DIAGRAM
B.Schematic Diagrams
B - 2 SYSTEM BLOCK DIAGRAM
Page 57
CLOCK GENERATOR
1.05V S
3.3VS
1.05VS
3.3VS
3.3V S_G
1.05VS
1.05VS_G
3. 3 V S
3.3VS_G
3.3V S
3.3VS_G
1.05VS_G
PM _STPC PU# 18
C PU _BSEL 23
CPU _BSEL 03
ICH _SM BDA T012,13,18
CLK_SATA# 16
CLK_CPU_BCLK# 3
CLK_ IC H4 818
PC L K_KBC21
CLK_CPU_BCLK 3
C LK _D R EFSS# 7
C PU _BSEL 13
MCH_ BS EL 0 7
CLK_SATA 16
CLK_D REF #7
CLK_D REF7
PCLK_ICH17
ICH _SM BCLK012,13,18
CLK_DREFSS 7
PM _STPPC I# 18
CLK_MCH_BCLK 5
CLK_MCH_BCLK# 5
C LK _P CIE_N EW _C ARD # 26
C LK _P CIE_N EW _C ARD 2 6
CLK_PCIE_ICH# 17
CLK_PCIE_ICH 17
CLK_ IC H1 418
CLK_PW RG D18
MCH_CLKREQ# 7
N EW C ARD _CLKR EQ # 2 6
WLAN_CLKREQ # 26
PWR SAVE #18
LAN_CLKREQ# 22
CLK_PCIE_MINI# 26
CLK_PCIE_MINI 26
CLK_PCIE_3GPLL 7
CLK_PCIE_3GPLL# 7
C LK _P CIE_CR# 22
CLK_PCIE_CR 22
MC H_ B S E L 17MC H_ BSE L2 7
C L K_SEL
PC LK TP M
C L K_BSEL 2
CLK_CPU_BCLK
PC L K_KBC
C L K_BSEL 1
C L K_SATA#
C L K_DR EF SS #
C L K_BSEL 0
C L K_DR EF SS
FSLA
CLK_CPU_BCLK #
C L K_SATA
C LK _B SEL 0
PC LK KBC
VTT_PWR _GD
XTAL_ IN
XTAL_ OU T
VTT_PWR_GD
C L K_MC H_BC LK
C L K_MC H_BC LK#
XTA L_IN
XTA L_OUT
C L K_DR EF
C L K_DR EF #
C L K_PCI E_ NEW _ CAR D#
C L K_PCI E_ NEW _ CAR D
C L K_PCI E_ ICH
C L K_PCI E_ ICH #
FSLB
CLK_ICH14
FSLC
CLK_SE L
C L K_PCI E_ MIN I#
C L K_PCI E_ 3GPLL #
C L K_PCI E_ MIN I
C L K_PCI E_ 3GPLL
C L K_PCI E_ CR
C L K_PCI E_ CR #
PC LK ICH
CLK_BS EL2
CLK_BS EL1
RN26
1K_8P4R_04
123
45
678
R152*10mil_short
R12910K_04
R1610_04
U6
SLG8SP 513V
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
3637
38
39
7
6
5
4
3
2
1
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
65
66
67
68
69
70
PCI_0/C L KRE Q_A#
VDD _PC I
PCI_1/C L KRE Q_B#
PCI_2
PCI_3
^PCI _4/LCDCLK_SEL
PCIF _5/I TP _E N
VSS_PC I
VDD _4 8
USB _48 M Hz /FS_ A
VSS_48
VD D_I/O
SRC _0 /DO T_96
SRC _0 #/ DO T_96#
VSS_I/O
VDD _PL L3
LCDCLK /27M
LCDCLK#/27M_S S
VSS_PLL 3
V DD_PLL3_I/O
SR C_2
SR C_2 #
VSS_SR C_ 1
SRC _3 /CLKR EQ _C #
SRC_3#/CLKREQ_D#
VD D_SR C _I /O_1
SR C_4
SR C_4 #
VSS_SR C_ 2SR C_9
SR C_9 #
SR C_1 1# /CLKR EQ _G #
SCL
SDA
REF /FS_C/ TE ST_S EL
VDD _RE F
XT A L _ I N
XT A L _ O U T
VSS_R EF
FS_B/TEST_MOD E
C KPW R G D/PD #
VDD _CP U
CP U_ 0
CPU_0#
VSS_C PU
CPU_1_MCH
CPU_1_MCH#
VD D_ CP U_ I/O
NC
SRC_8/CPU_ITP
SRC_8#/CPU_ITP#
VD D_SR C _I /O_3
SR C_7 /C LK REQ _F #
SR C_ 7 # /C LK RE Q _ E #
VSS_SR C_ 3
SR C_6
SR C_6 #
VDD _SR C
PCI_STO P#
CPU_STOP#
VD D_SR C _I /O_2
SR C _10#
SR C_1 0
SRC_11/CLKREQ_H#
TH R M_PAD_1
TH R M_PAD_2
TH R M_PAD_3
TH R M_PAD_4
TH R M_PAD_5
TH R M_PAD_6
R 172475_1%_04
C22 1
0.1u_16V_Y5V_04
C50 7
0.1u_16V_Y5V_04
C225
0.1u_16V_Y5V_04
C505
0.1u_16V_Y 5V_04
C504
1u_ 6.3 V_Y5V_ 0 4
R 179 *20mil_shor t_04
R132*10K_04
C24 7
0. 1u_16V_Y5V_04
C248
1u_ 6.3V_ Y5 V_04
R1442.2K_04
C250
0.1u_16V_Y5V_04
C210
33p_50V _NPO_04
C218
0.1u_16V_Y 5V _04
R 18033_04
R159100K_04
C503
0.1u_16V _Y5V_04
C 246
0.1u_16V _Y5V_04
C21 6
0.1u_16V_Y 5V _04
R 351 *20mil_short_04
R15133_04
C222
0.1u_16V_Y 5V_04
C249
1u_6.3V_Y5V_04
C24 5
10u_6.3V_X5R_06
C502
10u_6.3V_X5R_06
C20 6
0.1u_16V_Y 5V _04
X1
FSX8L_14. 31818MH z
12
R 170475_1%_04
C20 9
33p_50V_NPO_04
R137
*56_04
R133*0_04
R150*0_04
R 1431K_04
C501
1u_6. 3V _Y5V_04
R1282.2K_04
R 126*10K_04
R138
1K_04
R 178475_1%_04
R12733_04
R13033_04
C217
0.1u_16V_Y 5V_04
C215
*.1U_10V_X7R _04
C582
22p_50V_N PO_04
R13633_04
R 13110K_04
EMI
CLOCK GENERATOR
1
FSC
0
FSA
13 3 MH z
0
667 MHz
0
20 0 MH z
10 66 MH z
800 MHz
1
FS B
0
Hos t Cloc k
0
10
533 MHz
1
0
CK505
BSEL0
26 6 MH z
16 6 MH z
0
BSEL2 BSEL1
Frequency
0.1u F near t he every p ower p in .
LAYOUT NOTE:
??Pin???,?? ??? ???? 0.1u?CAP
10mil
PLACE CRYSTAL
WITHIN 500 MILS
OF CK410M
D02
D02
D02
Sheet 2 of 36
CLOCK
GENERATOR
hexainf@hotmail.com
Schematic Diagrams
B.Schematic Diagrams
CLOCK GENERATOR B - 3
Page 58
Schematic Diagrams
Sheet 3 of 36
Penryn (Socket-
P)1/2
3.3VS
1.05VS
1.05VS
3.3V
H_TRDY# 5
H_IGNNE#16
THER M_AL ER T # 21
H_BPRI# 5
H_INTR16
H _D#[63:0]5
H_D INV#2 5
CPU_BSEL22
H _D STBP#3 5
H_D STBN#3 5
H_BNR# 5
PSI #30
H_LOCK# 5
H_DSTBP #05
H_F ER R #16
H_DINV#15
H_D#[ 63:0]5
PM_TH RM # 1 8
CPU_BSEL02
CLK_CPU_BCLK 2H_D PRSTP# 7,16,30
H_CPURST# 5
H_C PUSLP# 5
H_NMI16
H_STPCLK#16
H_RS#2 5
H_DRDY# 5
H _D PSLP# 1 6
H_DSTBP #15
H_D PWR# 5
H_DSTBN #15
H _D BSY # 5
H_HIT# 5
H_ADS# 5
H_D#[6 3 :0 ] 5
H _ ADSTB#15
H_DSTBN #05
H_INIT# 16
H _ RE Q# [4 :0 ]5
H_D#[6 3 :0 ] 5
H_HITM# 5
SM D_ C PU_ T H ERM 21
H_DINV#05H _A#[35:3]5
H_DEFER# 5
H_D STBN#2 5
PM_ TH R MTRI P# 7,16,31
H _ AD ST B#05
CLK_CPU_BCLK# 2
H_P WRGD 16
H_D INV#3 5
H_BR0# 5
CPU_BSEL12
H _D STBP#2 5
H_SMI#16
H_RS#1 5
H _A #[35:3]5
H_A20M#16
SM C_ C PU_ T H ERM 21
H_RS#0 5
H _D#38
H_D #13
H_B PM1#
H _D#52
H_THER M DC
H_A# 3 0
H_D #24
H_R EQ# 2
H_D #19
CPU _T ES T1
H_IERR#
H_TCK
H_A# 1 8
H _D#60
H_D #18
H_D #30
H_P REQ#
H_D #2
COMP0
CPURSVD04
H_A# 8
H_TMS
H_D #23
H_A# 2 1
H_A# 3 4
H _D#48
H_P ROCHOT#
CO MP2
H_A# 1 4
H_A# 1 6
H_A# 2 9
H _D#33
H _D#62
H_A# 6
H _D#49
H_TDI
H_A# 1 9
H _D#37
H _D#61
H _D#35
H_D #27
H _D#42
H_A# 2 5
H_D #29
H_D #17
H_B PM3#
H_A# 3 2
H_P RDY#
H_THER M DA
H _D#45H_R EQ# 0
H_A# 1 5
H_D #0
H_A# 1 0
H _D#63
H_D #25
H _D#34
CPU _T ES T2COMP2
H_D #16
H_D #6
H_A# 7
CPURSVD06
H_IERR#
CPU _T ES T6
H_D #9
ITP_ D BRST #
H_D #26
H_D #3
H_D #10
H_THERMDA
H_D #14
COMP1
H _D#59
CPU _T ES T4
H_A# 1 3
H_D #12
H_D #20
CPURSVD02
H_D #11
H _D#54
H _D#39H_D #7
H _D#41
H_THERMDC
H_A# 2 0
CPU _T ES T3
H_D #21
H _D#36
H _D#57
H_A# 2 7
H_P ROCHOT#
H _D#46
H_D #15
H_A# 2 3
CPURSVD09
H_TDO
H_D #5
CPU _T ES T7
H _D#51
ITP_ D BRST #
H
_D#58
H_A# 9
H_A# 1 2
H_R EQ# 4
H_D #1
COMP3
CO MP0
H_D #22
H_B PM2#
CPURSVD01
H _D#53
CPURSVD03
CP U_ GTL R EF
H_D #28
H_B PM0#
H_A# 1 1
H_D #4
H_R EQ# 1
H_D #8
H _D#50
H_A# 2 2
H _D#40
H_A# 2 8
CPURSVD05
CO MP1
H_A# 2 6
H_A# 5
CPU _T ES T5
H_P REQ#
H_A# 3 5
H_TCK
CPURSVD08
H_TRST#
H_A# 3 1
H_A# 4
H_TMS
H_A# 3 3
CPURSVD07
H_A# 3
CO MP3
H_R EQ# 3
H _D#55
H _D#32
H _D#43
H_A# 2 4
H_A# 1 7
H_TRST#
H _D#44
H _D#47
H_TDI
H_D #31
H _D#56
R2654.9_1%_04
R330
10K_04
R 324*1K_04
C43 3
1000p_50V_X7R_04
R 331 *0_04
R32856_04
C 413*.1U_10V_X7R _04
DATA GRP 0DATA GRP 1
DATA GRP 2DATA GRP 3
MIS C
JS K T 1B
Penry n
R26
U26
AA1
Y1
E22
F24
J2 4
J2 3
H22
F26
K22
H23
N22
K25
P26
R23
E26
L2 3
M2 4
L2 2
M2 3
P25
P23
P22
T2 4
R24
L2 5
G22
T2 5
N25
Y22
AB24
V24
V26
V23
T22
U25
U23
F23
Y25
W22
Y23
W24
W25
AA23
AA24
AB25
AE24
AD 2 4
G25
AA21
AB22
AB21
AC 2 6
AD 2 0
AE22
AF23
AC 2 5
AE21
AD 2 1
E25
AC 2 2
AD 2 3
AF22
AC 2 3
E23
K24
G24
AF1
H25
N24
U22
AC 2 0
E5
B5
D24
J2 6
L2 6
Y26
AE25
H26
M2 6
AA26
AF24
AD26
AE6
D6
D7
C24
B22
B23
C21
D25
AF26
A26
C23
C3
CO M P[0 ]
CO M P[1 ]
CO M P[2 ]
CO M P[3 ]
D[0]#
D[1]#
D [10]#
D [11]#
D [12]#
D [13]#
D [14]#
D [15]#
D [16]#
D [17]#
D [18]#
D [19]#
D[2]#
D [20]#
D [21]#
D [22]#
D [23]#
D [24]#
D [25]#
D [26]#
D [27]#
D [28]#
D [29]#
COMP0, COMP2: 0.5" Max, Zo=27.4 Ohms
COMP1, COMP3: 0.5" Max, Zo=55 Ohms
Best estimate is 18 mils wide trace for outer
layers and 14 mils wide trace if on internal
layers.
Layout note:
Zo=55 ohm, 0.5"max for
GTLREF
H_TDI
C i rc ul t: 5 4 .9 o hm c he c k 15 0 oh m
If PRO CHO T# is rou te d be tw een CPU , IMV P an d MC H,
p ul l- up re si st or ha s to be 6 8 oh m ? 5 %. If no t
us e, pull -u p re sis to r ha s to be 56 ohm ? 5%
Route H_THERMDA and
H_THERMDC on same layer.
10 mil trace on 10 mil
spacing.
Zo = 55 O? 5%
Layout Note:
Near to Thermal
IC
COMP[3:0]
traces should be at least 25 mils (> 50 mils
preferred) away from any other toggling
signal.
TO POWER PAGE
D12
D12
Penryn (Socket-P)1/2
B.Schematic Diagrams
B - 4 Penryn (Socket-P)1/2
Page 59
Penryn (Socket-P)2/2
Sheet 4 of 36
Penryn (Socket-
P)2/2
1. 05 V S
VCO R E
VCORE
VC OR E
VCORE
VC OR E
1.05V S
1.5VS
VCORE
VC OR E
1.05V S
VC OR E
VC CS ENS E 30
H_VID 6 30
H_VID 1 30
H_VID 5 30
H_VID 4 30
H_VID 0 30
H_VID 2 30
VSS S EN SE 3 0
H_VID 3 30
VCCSENSE
VSSS ENS E
C42 9
1u_6.3V_Y5V _04
C405
0.1u_10V_X7R _04
C27
*10u_6.3V _X 5R _06
C41 7
10u_6.3V_X5R_06
C440
1u_6.3V_Y5V_04
C29
*.1U_10V_X7R_04
C423
10u_6.3V_X5R_06
C38
*10u_6.3V_X5R_06
R316
100_1% _06
C416
2 2 u _ 6. 3 V _X 5 R _0 8
C34
22u_6.3V_X5R _08
C43 9
0.1u_10V_X7R_04
C19
0.1u_10V_X7R_04
C435
1u_6.3V _Y5V_04
C43 6
1u_6.3V_Y5V_04
C40
*.1U_10V_X7R_04
R317
100_1%_06
C406
0.01u_16V_X7R_04
C412
0.1u_10V_X7R _0 4
C44 1
1u_6.3V_Y5V_04
C17
10u_6.3V_X5R_06
C24
0. 1u_10V_X7R _04
C424
22u_6.3V_X5R _08
C43 7
0.01u_16V_X7R_04
C42 5
22u_6.3V_X5R _08
C31
*10u_6.3V_X5R _06
C25
22u_6.3V_X5R_08
C28
0.1u_10V_X7R_04
C428
1u_6.3V _Y5V_04
C43 2
0.01u_16V_X7R_04
C41 9
10 u_6.3V_X5R_06
C30
22u_6.3V_X5R_08
C22
22u_6.3V_X5R_08
C42 1
1u_6.3V_Y 5V_04
C35
* 10u_6.3V_X5 R _ 06
JSKT1C
Penryn
.
A7
A9
A10
A12
A13
A15
A17
A18
A20
B7
B9
B10
B12
B14
B15
B17
B18
B20
C9
C10
C12
C13
C15
C17
C18
D9
D10
D12
D14
D15
D17
D18
E7
E9
E10
E12
E13
E15
E17
E18
E20
F7
F9
F10
F12
F14
F15
F17
F18
F20
AA 7
AA 9
AA10
AA12
AA13
AA15
AA17
AA18
AA20
AB 9
AC 10
AB10
AB12
AB14
AB15
AB17
AB18
AB 20
AB 7
AC 7
AC 9
AC 1 2
AC 1 3
AC 1 5
AC 1 7
AC 1 8
AD 7
AD 9
AD 1 0
AD 1 2
AD 1 4
AD 1 5
AD 1 7
AD 1 8
AE 9
AE 10
AE 12
AE 13
AE 15
AE 17
AE 18
AE 20
AF 9
AF 10
AF 12
AF 14
AF 15
AF 17
AF 18
AF 20
VC C P[03 ]
VC C P[04 ]
VC C P[05 ]
VC C P[06 ]
VC C P[07 ]
VC C P[08 ]
VC C P[09 ]
VC C P[10 ]
VC C P[11 ]
VC C P[12 ]
VC C P[13 ]
VC C P[14 ]
VC C P[15 ]
VC C P[16 ]
VC CSE NS E
VID [0]
VID [1]
VID [2]
VID [3]
VID [4]
VID [5]
VID [6]
L_ VDD _EN
LVDS _I BG
LVDS_VBG
LVDS_VREF H
LVDS_VREF L
LVDSA_CLK#
LVDSA_CLK
LVDSA_DATA#_0
LVDSA_DATA#_1
LVDSA_DATA#_2
LVDSA_DATA_1
LVDSA_DATA_2
LVDSB_CLK#
LVDSB_CLK
LVDSB_DATA#_0
LVDSB_DATA#_1
LVDSB_DATA#_2
LVDSB_DATA_1
LVDSB_DATA_2
L_ BKLT_E N
TVA_DAC
TVB_DAC
TVC_DAC
TV_ R TN
CR T_BLUE
CR T_DDC_CLK
CR T_DDC_DATA
CR T_G REEN
CR T_HSYNC
CR T_T VO_IREF
CR T_RED
C
R T_I R TN
CRT_VSYNC
LVDSA_DATA_0
LVDSB_DATA_0
L_ BKLT_C T RL
TV_DCONSEL_0
TV_DCONSEL_1
LVDSA_DATA#_3
LVDSA_DATA_3
LVDSB_DATA#_3
LVDSB_DATA_3
C 1830. 1u_ 10V _X7R _04
R114
10K_04
R1 09 * 10mi l_s hort
R1 08 * 10mi l_s hort
R113
2.2K_04
R33730.1_1%_04
R112
2. 2K_04
R 991 . 02K_ 1%_04
R33530.1_1%_04
R120
49. 9_1 %_04
R334
15 0_1%_0 4
R332
1 50_1 %_04
R333
15 0_1 %_04
R115
10K_0 4
R1 23 2. 37K _1 %_04
Zo= 55O? 5 %
Min imize REFS ET
rou ting lengt h and
shi eld w ith V SS
MA X=0.5 "
Zo= 50O? 5%
FOR IN TE L HD MI CO NN
PEG _CO M PI and the PE G_CO M PO pin s sh oul d be
sho rte d at th e pa cka ge a nd t hen rou ted to one
end of a 4 9.9 O ? % pull -up res isto r t o
VCC _PE G . P lac e th e r esis tor wit hin 500 mil s
(1. 27 cm) of the (G)MCH
P CI ex pr es s gr ap hi cs la ne
reverse option for layout
convenience
MCH_CFG_10
PCIE
Loopback
enable
iTPM HOST INTERFACE
Lo w= enab le
High=disable
(default)
Add 0.1uF capacitor on this
rail close to (G)MCH.
DM I la ne re ve rs al
This "Daisy Chain" CMOS topology
should be routed from ICH9M to Intel
MVP, then to (G)MCH and CPU (in this
order exactly). CPU must be end agent
on the DPRSTP topology to avoid
signal integrity degradation.
Zo=
40O? 5%
D12
D12
D12
D12
D12
D12
D12
CANTIGA 3/7
B.Schematic Diagrams
B - 8 CANTIGA 3/7
Page 63
CANTIGA 4/7
Sheet 8 of 36
CANTIGA 4/7
M_B _DQS4 13
M_A_BS0# 12
M_A _DQS5 12
M_A_BS1# 12
M_B _BS0# 13
M_B _DM6 13
M_B _DQS6 13
M_A _RAS# 12
M_A _DQS6# 12
M_ A _D Q [ 6 3: 0]12
M_A _DQS1 12
M_A _WE# 12
M_A _DM5 12
M_B _WE# 13
M_A _DQS7 12
M_B _DM7 13
M_B _BS1# 13
M_A _DQS0 12
M_A _DM7 12
M_B _DM2 13
M_B _DQS6# 13
M_B _DM3 13
M_B _DM1 13
M_B _DQS7 13
M_A _DM4 12
M_B _DQS3# 13
M_B _DQS1 13
M_B _DQS2# 13
M_A _DQS3 12
M_A _DM0 12
M_A_BS2# 12
M_A _DQS0# 12
M_A _DM2 12
M_B _DQS0# 13
M_B_DQ[63:0]13
M_B _DQS5 13
M_B _DQS0 13
M_B _DQS2 13
M_A _DQS3# 12
M_B_CAS# 13
M_A _DM6 12
M_A _DQS5# 12
M_A _DM1 12
M_A _DQS7# 12
M_A _DQS6 12
M_A _DQS2 12
M_A _CAS# 12
M_B _DM5 13
M_B _BS2# 13
M_B _DQS4# 13
M_B _DQS7# 13
M_B _DQS1# 13
M_B _DM4 13
M_A _DQS4 12
M_A _DQS1# 12
M_A _DQS2# 12
M_A _DM3 12
M_B_RAS# 13
M_B _DM0 13
M_A _DQS4# 12
M_B _DQS3 13
M_B _DQS5# 13
M_A _A[14:0] 12M_B _A[14:0] 13
M_A _ D Q4
M_B_DQ8
M_B_DQ0
M_B_DQ63
M_A _ D Q3 9
M_B_DQ42
M_A _ D Q1
M_A _ D Q1 6M_B_DQ17
M_A_A6
M_B_DQ57
M_A _ D Q4 2
M_A _ D Q9
M_A _ D Q0
M_A_A7
M_A _ D Q3 3
M_B_DQ21
M_B_DQ31
M_A _ D Q3 8
M_B_DQ9
M_ B_ A0
M_A _ D Q1 8
M_B_DQ47
M_A _ D Q3
M_B_DQ14
M_ B_ A12
M_A _ D Q5 8
M_B_DQ25
M_A _ D Q4 9
M_B_DQ28
M_B_DQ58
M_B_DQ41
M_A_A9
M_B_DQ37
M_A _ D Q4 8
M_A _ D Q2
M_B_DQ34
M_ B_ A2
M_B_DQ62
M_B_DQ48
M_B_DQ35
M_A_A0
M_B_DQ27
M_A _ D Q6
M_B_DQ12
M_A _ D Q4 5
M_A _ D Q2 4
M_ B_ A7
M_B_DQ44
M_B_DQ6
M_B_DQ55
M_B_DQ51
M_A_A10
M_B_DQ29
M_B_DQ4
M_B_DQ56
M_ B_ A6
M_A _ D Q6 1
M_ B_ A11
M_ B_ A8
M_A _ D Q6 2
M_A_A2
M_B_DQ52M_ A_A14
M_B_DQ22
M_B_DQ45
M_A _ D Q8
M_A _ D Q2 8
M_B_DQ2
M_A _ D Q3 0
M_ B_ A4
M_A _ D Q1 7
M_A _ D Q2 9
M_A _ D Q2 5
M_B_DQ43
M_A_A13
M_B_DQ10
M_B_DQ46
M_A _ D Q4 4
M_A _ D Q4 3
M_ B_ A9
M_A _ D Q5 1
M_A _ D Q5 0
M_A _ D Q6 3
M_B_DQ20
M_ B_ A10
M_B_DQ61
M_B_DQ40
M_A _ D Q3 6
M_B_DQ50
M_A_A1
M_A _ D Q5 5
M_A_A4
M_A _ D Q2 6
M_A _ D Q4 7
M_A _ D Q4 1
M_B_DQ26
M_B_DQ18
M_B_DQ23
M_A_A12
M_B_DQ53
M_
B_DQ15
M_A _ D Q2 1
M_B_DQ3
M_B_DQ7
M_B_DQ38
M_A_A3
M_A _ D Q1 4
M_ B_ A13
M_A _ D Q3 4
M_A _ D Q1 1
M_A _ D Q5 3
M_B_DQ32
M_A _ D Q5 7
M_A _ D Q7
M_A _ D Q2 7
M_ B_ A5
M_B_DQ13
M_A _ D Q2 3M_B_DQ24
M_A _ D Q1 3
M_A _ D Q3 2
M_B_DQ5
M_B_DQ49
M_ B_ A14
M_B_DQ30
M_B_DQ54
M_A _ D Q1 2
M_ B_ A1
M_A _ D Q3 7
M_B_DQ36
M_A _ D Q1 5
M_A _ D Q3 5
M_B_DQ1
M_A_A8
M_A _ D Q5 6
M_B_DQ16
M_A _ D Q1 0
M_A _ D Q2 0
M_A _ D Q5 4
M_A _ D Q5
M_ B_ A3
M_B_DQ11
M_B_DQ19
M_A _ D Q4 0
M_A_A11
M_A _ D Q2 2
M_A _ D Q4 6
M_A _ D Q5 2
M_B_DQ39
M_A _ D Q3 1
M_A _ D Q6 0
M_A _ D Q1 9
M_B_DQ60M_A _ D Q5 9
M_B_DQ59
M_A_A5
M_B_DQ33
DDR SYSTEM MEMORY A
U15D
CA NT IG A
AJ38
AJ41
AU 40
AT38
AN 41
AN 39
AU 44
AU 42
AV 39
AY 44
BA 40
BD 43
AN 38
AV 41
AY 43
BB 41
BC 40
AY 37
BD 38
AV 37
AT36
AY 38
BB 38
( PD )ID 0 /G P H 0
( PD )ID 1 /G P H 1
( PD )ID 2 /G P H 2
( PD )ID 3 /G P H 3
( PD )ID 4 /G P H 4
( PD )ID 5 /G P H 5
( PD )ID 6 /G P H 6
( PD )ID 7 /G P G 1
SMCL K0/GP B3
SMDAT0 /GP B4
SMCL K1/GP C1
SMDAT1 /GP C2
SMC L K2/GP F6( PU )
SMD AT 2 /GP F 7 ( PU )
FLFR AME#/GPG 2
FLAD 0/SCE #
FLAD1/SI
FLAD 2/SO
FLAD3/GPG 6
FLCLK/SCK
( PD )FLRST#/WUI7/TM/GPG0
( PD )L 80H L A T /GP E 0
C 263*.1U_16V_04
C 275*.1U_16V_04
C 237*.1U_16V_04
C 235*.1U_16V_04
C 236*.1U_16V_04
C 262*.1U_16V_04
C307
*.1U_16V_04
R 19610K_04
C28 9
0. 1u_16V_Y5V_04
C 258*.1U_16V_04
C5840.1u_16V_Y5V_04
C 259*.1U_16V_04
C5830.1u_16V_Y5V_04
C58 50.1u_16V_Y5V_04
C 242*.1U_16V_04
C58 60.1u_16V_Y5V_04
C 244*.1U_16V_04
NC2
SH OR T
C 241*.1U_16V_04
C 256*.1U_16V_04
C 257*.1U_16V_04
C 243*.1U_16V_04
D29
BA V9 9 RE C T IFIER
A
C
AC
.
L23
H CB1005KF-121T20
R 2 20* 1 0 m il _ s ho r t
C 234*.1U_16V_04
C 260*.1U_16V_04
C 261*.1U_16V_04
R238*0_04
J_80DEBUG 1
85205-05001
1
2
3
4
5
.
L21
H C B 1 0 0 5K F - 1 2 1T 2 0
KBC_SPI_*_R = 0.1"~0.5"
RX
???
MO DE L_ ID
512Kbit
0_ 04 F OR IT 85 12 CX / EX
0 .1 U_ 04 FOR IT E8 5 12-J (I TE 85 02- J W/0 CIR)
E C Co st Down
RY
0_04 for M760T/TU
BKP1005HS121_04 for M740T/TU
E MI So lu ti on
24
C4100-DDR2
1
X
J_KB1
VOLTAGE
3.3V
LOW ACTIVE
D12
D02
D02
D12
RY
C4100-DDR3
RX
X0V
D02 For EMI
KBC-ITE IT8502E
B.Schematic Diagrams
B - 22 KBC-ITE IT8502E
Page 77
JMC21 CARD READER/LAN
DVD D
3.3V
3.3VS
DVD D
3.3V
3.3V
VC C_ C ARD
3.3V
DVDD
3.3V
VC C_C ARD
3.3V
3.3V
DVD D
3. 3 V
VCC _ CAR D
DVD D
3.3V
3.3V
3. 3 V
VC C_C ARD
5VS
DVD D
DVD D
DVDD
VCC_CARD
3. 3V
P CIE_W AK E# 18,26
CR _ W AKE# 18
LAN_C LKREQ # 2
C L K_ PCIE_C R 2
CLK _ PC IE_ CR # 2
P C I E _T X N 5_ C A R D 1 7
PCIE _TXP5_CAR D 17
PCIE_RXN 5_CAR D 17
BU F _PL T_R ST# 17,21
PC IE_ RXP5_ C ARD 1 7
DC _N P
MLMX0-
MDIO13
MDIO13
M LM X 0- _R
ML MX 1 +
SD_CD#
LAN_MDIN0
LAN_LED1
SD_BS
SD_D3
LAN_MDIN 1
TD _ C T
MD IO 12
RD _C T
MLMX1+
LAN_MDIP2
SD_CLK
MDIO14
LAN_S DA
MS_INS#
SD_CLK
SD_BS
SD_D3
MDIO10
ML M X1-_ R
SD_CD#
LAN_MDIN1
REGLX
LAN_MDIP1
XR ST N
REG L X
SD _W P
SD _CL K
SD_D2
LAN_SDA
MLMX0+
DD _N P
WA KEN
SD _D3
LAN_MDIN 2
SD_D0
M LM X 1- _R
ML M X1+ _ R
LAN_S CL
DV DD
LAN_MDIP0
LAN_MDIP3
SD_D 0
CR 1 _P C TL N
SD_D1
LAN_MDIP0
LANXOUT
LAN_MDIP1
MDIO9
MLMX0+_R
ML MX 1 -
ML MX 0 +
SD_WP
LANXOUT
LAN_SCL
SD_CLK
SD _ CD #
MPD
SD _CD #
CR1_PCTLN
SD_D2
MLMX1+_R
ML MX 0 -
TX_C T
LAN_MDIN 3
MDIO11
SD_WP
SD _D2
ML M X0-_ R
ML M X0+ _ R
WAKEN
SD_D1
MLMX1-
LANXIN
MS_INS#
LAN_LED0
SD_BS
LAN_MDIN 0
MS_INS#
LA N X I N
SD _BS
MDIO8
SD_D1
LAN_C L KREQ #
MDIO7
SD_D0
RX_CT
C54 2
*10p_50V_N PO_04
C36 9
0.1u_16V_Y5V_04
R3684.7K_04
C54 1
0.1u_16V_Y5V_04
C36 0
22p_50V_NPO_04
LP2
*W CM201 2F2S-161T03
1
4
2
3
R 2 80* 10 m i l _s h o r t
R2784.7K_04
C38 1
22u_6.3V_X5R _08
R23
75_1%_04
J_ CA RD -REV1
MDR 019-C 0-1042
P2
P21
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
P16
P17
P18
P19
P20
P1
P23
P22
DAT2_SD
VSS _MS
CD/DAT3_SD
CMD_SD
VSS _SD
VD D_SD
CLK _SD
VSS _SD
DAT0_SD
DAT1_SD
WP_SD
VSS _MS
VC C_M S
SC LK_MS
DAT3_MS
IN S _MS
DAT2_MS
SD IO/DAT 0_MS
DAT1_MS
BS_M S
CD_SD
GND
GND
C 5500.1u_10V_X7R_04
C414
0.01u_16V_X7R_04
R3644.7K_04
C567
10u_6.3V_X5R_06
R24
75_1% _04
C382
* 1 0u _ 6 . 3 V _ X5 R _ 06
C41 5
0.01u_16V _X7R_04
C56 0
0.1u_16V_Y5V_04
X4X8 A02 5 000 FG 1H _25M Hz12
C34 4
0.1u_16V_Y5V_04
C371
0.1u_16V_Y5V_04
R3744.7K_04
C343
0.1u_16V_Y 5V _04
R21
75_1%_04
C558
10u_6.3V_X5R_06
C370
0.1u_16V_Y5V_04
C575
22u_6.3V_X5R_08
(LQFP 64)
JMC261
U11
JMC 261-LGCZ0A 7*7
123456789101112141516
17
18
19
20
21
22
23
24
13
3738394041424344454647
48
363534
33
32
31
30
29
28
27
26
25
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
REXT
VD DX33
XIN
XO UT
GN DLXFB12
VDD REG
CLKN
CLKP
AVDDH
RX P
GND
TXN
TX P
AVD DX
RSTN
WAKEN
MPD
CREQN
SM B_SCL /LED2
CR_CD1N
CR_CD0N
RXN
MDIO8
VDD IO
MDIO7
MDIO6
GND
MDIO5
MDIO4
MDIO3
VDD IO
MDIO2
MD IO 1
MDIO0
MDIO9
MD IO 10
MDIO11
MDIO12
GN D
MDIO13
MDIO14
SM B_SDA/ CR _LED N
TESTN
VDD IO
VD D
VCC 3 O
LED0
LED1
VD D
GND
VI P_1
VI N_ 1
AV DD 12
VI P_2
VI N_ 2
GND
AV DD 33
VI P_3(N C)
VI N_ 3(NC )
AV DD 12(N C)
VI P_4(N C)
VI N_ 4(NC )
D10
*B AV99 REC TIFIER
A
C
AC
C566
0.1u_16V_Y5V_04
L29
S WF2520C F-4R7M-M
C347
0.1u_16V_Y 5V _04
C345
0.1u_16V_Y5V_04
C384
0.1u_16V_Y5V_04
R36 3* 0_04
R295
75_1%_04
D11
*BAV99 R ECT IF IER
A
C
AC
RN25
10K_8P4R_04
1
2
3456
7
8
C37 3
0. 1u _ 1 6V _Y 5 V _ 04
R22
75_1% _04
R2881M_04
R 3610_04
C36 1
22p_50V_N PO_04
C38 3
*10u_6.3V_ X5R _ 06
C54 5
10u_6.3V _X5R_06
R 29 122_04
D13
*BAV99 R EC TIF IE R
A
C
AC
C409
1000p_2KV_X7R _12_H125
D12
*B AV99 RECTIFIER
A
C
AC
C386
0.1u_16V_Y 5V _04
LP1
*W CM201 2F2S-161T03
1
4
2
3
L36
LF-H80P-1
1
2
16
15
314
412
5
6
7
13
98
11
10
RD +
RD -
RX+
RX-
RD _C T R X_C T
NCNC
NC
TD _ C T
TD +
NC
TX-TD -
TX_CT
TX+
C38 8
0.1u_16V_Y5V_04
U20
*H T24LC0218P B
6
1
2
3
7
5
8
4
SCL
A0
A1
A2
WP
SDA
VCC
GND
C387
0.1u_16V_Y 5V _04
C368
0.1u_16V_Y5V_04
D37 * RB751V
AC
C385
0.1u_16V_Y5V_04
C 346* 0. 1u_16V _Y 5V_04
R30 5
12K_1%_04
R290 *28mil_short_06
R362*100K_04
C 5490.1u_10V_X7R_04
R 279*10mil_short
PJS-08SL3B
J_RJ1
8
7
6
5
4
3
2
1GN D 1
GN D 2
DD-
DD+
DB-
DC-
DC+
DB+
DA-
DA+ shield
shield
NC
NC
Func ti on
Ca rd Re a der P ow e r
0.1u
MDIO S ingle
End = 50
Ohm
NC
(>20 m il)
For JMC251 /261
only
NC
R363
Near Ca r dr eade r CO NN
NCEnab l e D 3 E( 1)
R362
NC
100K
0
NC
R361
Disable D3E
Near JMC 261 Power Pin
0NC
(>20mil)
1. For JMC251/JMC261 onl y.
2. M PD co nnect t o M ain Power or RSTN for
D3E applicai on, to A UX pow er ot herw i se.
Ena bl e D 3 E( 2)
For JMC25 1/261
only
(>20mil)
Switchin g Regulat or
4 IN 1 SOCKET SD/MMC/MS/MS Pro
Pla ce al l c apacito rs cl os ed to c hip.
The subscr ipt in each CAP inc icate s the
pin n um b er o f JM C2 51 /J MC 26 1 th at
sh ou ld be c los ed t o.
C346
Card Reader/Lan (JMC261)
P CI e Di ff er en ti al
Pa ir s = 10 0 Oh m
(>20mil)
D02
D02
Sheet 22 of 36
JMC21 CARD
READER/LAN
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Schematic Diagrams
B.Schematic Diagrams
JMC21 CARD READER/LAN B - 23
Page 78
Schematic Diagrams
Sheet 23 of 36
AUDIO CODEC
ALC272
AUDG
AUDG
AUDG
AUD G
AUDG
5V
3.3VS
AUDG
3.3VS_AU D
AUDG
AUD G
5VS
AUDG
AUD G
5V S_ AU D
1.5VS3.3V S
MIC 1-R27
AZ_S DIN016
AZ _SDOUT16, 25
AZ_SYNC16,25
JD _ SE N SE_MI C27
MIC1-L27
HEADPHONE-L 27
AZ _RST#16, 25
JD_SENSE27
HEADPHONE-R 27
AZ _BITC LK16, 25
FRONT- L 24
FRONT- R 24
E APD_MODE24
ICH _S PKR18
KB C_B EEP21
BEE P
INT_ MIC
MIC 1-L
HEADP HONE-L
MIC 1_R
MIC1-R
MIC 2_L
ALC _V REF
MIC1_L
MIC1-VREFO-R
MIC 2_R
MIC 1-V REFO
MIC1_R
MIC 1_L
ALC _GPI O 0
AZ_SDIN0_R
MIC2_L
INT_MIC
MIC1-VREFO-L
HEADP HONE-R
MIC 2-VREF O
MIC2_R
ALC _GPI O 1
FRONT-R
JDREFMIC 2-VREF O
FRONT-L
SP DIFO
B EEP
R389 *28 mil_short _06
R2841K_04
C546
*0. 1u_10V_X7R_04
C365
0.1u_16V_Y5V_04
C354 4.7u_6.3V _X5R_ 06
C552 * 0.1u_10V_X7R_04
C574
0. 1u_16V_Y5V_04
C581 0.1u_50V_Y5V_06
C363 *0.1u_16V_Y5V_04
C349 4.7u_6.3V _X5R_ 06
C556
0.1u_16V_Y5V_04
R71
2.2K_04
C351 4.7u_6.3V _X5R_ 06
C356 *0.1u_16V_Y5V_04
C579
10u_10V_Y5V_08
R3691K _1%_04
R3855.1K_1% _04
R377 22_04
C348 *0.1u_16V_Y5V_04
R28675_1% _04
C380
1u_6. 3V_Y5V_04
C548 1u_6.3V_Y5V_04
C578
10u_10V_Y5V_08
R28520K_1%_04
D38 *SCS551V-30
AC
C553
*680p_50V_X7R _04
C375
0.1u_16V_Y5V_04
C554
*680p_50V_X 7R_04
R29620K_1%_04
C118
330p_50V_X 7R_04
J_INTMIC1
88266-02001
88266-2L
2
1
C573 2.2u_6.3V _X5R _04
C362 *0.1u_16V_Y5V_04
C379
0.1u_16V_Y5V_04
L28
*20mil_short_04
L30 * 28mil_short _0 6
R28175_1% _04
C555 0.1u_16V _Y5V_04
R36710K _04
D41
CH 355PT
AC
R376
4.7K_04
R289
*0_04
C350 4.7u_6.3V _X5R_ 06
C580 0.1u_50V_Y5V_06
D39
CH 355PT
AC
C564 4.7u_25V_X5R_08
C572 * 22p_50V_NPO_04
R375
4.7K_04
C569 2.2u_6.3V _X5R _04
C557
10u_10V_Y5V_08
DIGITAL
ANAL OG
U19
ALC272
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
26
27
28
29
30
31
32
33
34
35
36
37
39
40
41
42
43
44
45
46
47
48
38
25
DVD D
GPIO0/DM IC-DAT A1/2
GPIO1/DM IC-DAT A3/4
DVSS1
S DATA- OUT
BIT-CLK
DVSS2
S DATA- IN
DVDD- IO
SYNC
RESET #
PCBEEP-IN
Sense A( JD1)
LI NE2-L
LI NE2-R
MIC 2-L
MIC 2-R
LI NE1-VREFO
MIC2 -VREF O
LI NE2-VREFO
MIC 1-L
MIC 1-R
LINE1-L
LINE 1-R
A VSS 1
VREF
MIC1 - VREFO
CBP
CBN
CPVEE
HPOUT- R
HPOUT-L
Sense B( JD2)
LOUT1-L
LOUT1-R
MONO-OUT
LOUT2-L
JDREF
LOUT2-R
A VSS 2
NC
DMIC-CLK3/4
SPDIFO2
DMIC-CLK1/2
EAPD
SPDIFO1
AVDD2
AVDD1
C355
1u_10V_06
C352
1u_10V_06
R287
*28mil_short _06
NEAR CODEC
Codec pin 1 ~ pin 11 and pin 44 ~ pin 48
are Digital signals.
The others are Analog signals.
PIN25,PIN38 ? 1? 10uF/ .1uF
CO DE C ( AL C2 72 -G R )
V ery clos e to Audi o Co dec
Layout Note:
Layout Note:
Ve ry cl ose to Au dio Code c
Layout Note:
PIN 13 ,PIN34 JD_SENSE
P C BE EP
D12
B.Schematic Diagrams
B - 24 AUDIO CODEC ALC272
AUDIO CODEC ALC272
Page 79
AUDIO AMP TPA6017
Sheet 24 of 36
AUDIO AMP
TPA6017
AUDG
AUD G
AUD G
5VS_REAR
5VS
3. 3VS
AUDG
AUDG
AUD G
5VS
3. 3VS
AUD G
3.3VS_AUD
SPKOUTR- 27
SPKOUTR+ 27
FRONT-R23
KB C_M U TE #21
FRONT-L23
SB_MUTE#18
EAPD_MODE23
SUSB#18,2 1,2 6,2 8,32 ,33
LIN-
SPKOUTL+
SPKOUTR+
SPK_EN
GAIN1
FRONT-L
SPKOUTL-_R
SPKOUTL+_R
SPK_EN
FRONT-R
LIN+
SPKOUTR-
RIN+
RIN-
SPKOUTL-
GAIN0
AMP_BYPASS
C57 61u_6 .3V_X5R_0 4
C565
*0.1 u_10 V_X7R_ 04
R383100K_04
C57 71u_6 .3V_X5R_0 4
R293100K_04
Th erm al Pa d
U18
N701 0
19
17
5
10
11
2
14
8
6
4
20
3
18
15
21
9
1
13
12
16
7
SD#
RIN-
LIN -
BYPASS
GND
GAIN0
ROUT-
LOUT -
PVDD
LOU T+
GND
GAIN1
ROUT+
PVDD
E XP O SE D PA D
LIN +
GND
GND
NC
VDD
RIN+
C559
*10u_ 6.3 V_X5R_ 06
C35 91u_6 .3V_X5R_0 4
C353
4.7 u_6. 3V _X5R _06
D40*SCS355V
AC
C563
*10 u_10 V_Y 5V_08
C571
0.1u _16 V_ Y5V _04
C37 2 *1 000p _50V _X7R_0 4
L27F CM10 05KF -121 T0312
C551
10u_10V_Y 5 V_08
C374
180 p_50 V_NPO_04
R303*10m i l_s h ort
R379*10 0K _04
J_SPKL1
85204-0 2001
PCB Fo otp ri nt = 85204 -02 R
1
2
C367
180 p_5 0V_NPO_04
L26F CM10 05KF -121 T0312
C57 0 *0.1 u_16 V_Y 5V_04
C36 41u_6 .3V_X5R_0 4
R301*10 0K _04
R387
*100K_04
U22
MC 74VHC1 G08DF T1 G
1
2
5
4
3
R 386*0_0 4
R382
10 0K_04
L47 R0805_sh ort
D42*SCS355V
AC
AMP (TPA6017)
1
J _SPK 1
2
Gain Set ting s
GAIN 0 GA IN1 AV( inv) INPU T IM PED ANCE
0 0 6 d B 90 k
0 1 10 dB 70 k
1 0 15. 6 dB 45 k
1 1 21. 6 dB 25 k
Low mu te !
D02
D0 2
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Schematic Diagrams
B.Schematic Diagrams
AUDIO AMP TPA6017 B - 25
Page 80
Schematic Diagrams
Sheet 25 of 36
HDD, ODD, MDC,
TP, Conn, 3G
5VS
3G_3.3V
3.3V
3G_3.3V
3G_3.3V
3G _ 3 . 3 V
3G_3.3V
3.3V
5VS
5VS_T P
5VS
3.3VS
1.5V3.3V
3G_DET#21
3G _ E N 2 1
SATATXN 1 16
SATATXP1 16
SATAR XP1 1 6
SATAR XN1 1 6
3G _ P W R21
AZ_SD IN116
AZ_SY NC16,23
AZ_RS T#16,23
AZ_SDOUT16,23
A Z_BITCLK 16,23
TP_D ATA 21
TP_CLK 21
USB _P N2 1 7
USB _P P2 1 7
ODD_DETECT# 18
SATATXN0 16
SATATXP0 16
SATAR XP 0 16
SATAR XN0 1 6
U SB_ PN 2
MUIM_DATA
MUIM_VPP
MUIM_PWR
MUIM_RST
MUIM_CLK
U SB_ PP2
MUIM_DATA
MUIM_RSTMUIM_VPPMUIM_VPP
MUIM_PWR
MUIM_CLK
SATAR XP1 _R
SATATXP1 _R
SATATXN1_ R
SATAR XN1 _R
AZ_SY NC
AZ_SDOUTMAZ_SDOUT
AZ_RS T#
AZ_SD IN1
MAZ_RST#
MA Z _ S D I N1
MA Z _ S Y N C
MAZ _ B I TC L K
SATATXN0_R
SATATXP0_R
SATARXP 0_R
SATARXN 0_R
C 470
0.1u_16V_Y5V_04
C33 4
1u_6.3V_Y5V_04
C465
*10U_10V_08
C537
*22P_50V_04
C466
1u_10V_06
C538
*22P_50V_04
C54 0
*22P_50V _04
C536
*22P_50V_04
C 529
10u_10V_Y5V_08
R25 7
10K_1% _04
C278
0.1u_10V_X7R_04
R 3700_04
C535
0.1u_10V_X7R_04
R 3730_04
R277*0_08
C342
0.1u_16V_Y 5V_04
J_MDC1
88018-120G
1
3
5
7
9
1112
10
8
6
4
2
GND
Azalia_SDO
GND
Aza lia_SYN C
Azalia_SDI
Azalia_RST# Azalia_BCLK