The 5100S/5500S uses the SiS630S core logic and InSyde BIOS code. This product also
features three bays for user-installed modules (a HDD, a CD-ROM or DVD-ROM or a FDD),
and has an optional Fax/Modem MDC module.
The main unit of the Model 5100S/5500S Notebook PC has the following components:
– Intel Mobile Pentium III with AGP technology-based mainboard, using the SiS630S
chipset solution supporting SDRAM with 0 MB on-board DRAM, expandable to
32MB, 64MB, 96MB, 128MB, 192MB, 256MB, or 512MB using one or two expansion
S.O. DIMMs
– user-installed modules: CD-ROM, DVD-ROM and an FDD
– main storage (HDD) bay: principal HDD, 2.5” up to 12GB(Ultra DMA33/66)
– User interfaces:
·one internal keyboard, 84 keys (depending on the language)
CD type12.8cm
Height12.7mm
Data transfer rate3600KB/s (max)
Random access time<100ms
ComplianceMultimedia PC-2 Spec.
Transportdrawer type load/eject
Interface PCI local bus master IDE
FDD
removable 3.5" 1.44MB
Memory
L2 Cache (on die)
Celeron(.18) series 128KB
Pentium III series 256KB
On board RAM 0MB
Upgradable to 512MB (MAX.)
BIOS
InSyde256KB
HDD
Removable moduleup to 12GB
Drive size2.5"
Height maximum12.7mm
Average access time<13ms
Interface:PCI local bus master
IDE with Ultra DMA33/66 I/F
Serial portx 1
IrDA/SIR/ASK/FIRx 1
Parallel portx 1
15 pin external video portx 1
External 101/102 keyboard port/ PS/2 mouse
x 1
PC Card Standard Type Ix 1
Modem (RJ-11) port for MDCx 1
USB connectorx 1
speaker-out jackx 1
microphone-in jackx 1
LAN (RJ-45) portx 1
2
Chipsets
SiS630S
–provides a high performance/low cost Desktop solution for the Intel mobile CPU
based system
–integrates a high performance North Bridge
–has an advanced hardware 2D/3D GUI engine, Super-South bridge or an external
AGP4X Slot
The SiS630S is a system-on-chip solution that complies with
–Easy PC Initiative which supports Instantly Available/OnNow PC technology
–USB
–Legacy Removal
–Slotless Design and FlexATX form factor
The SiS630S:
–integrates UltraAGPTM technology and advanced 128-bit graphic display interface.
–delivers AGP 4x performance and memory bandwidth up to 1 GB/s.
–supports an extra AGP Slot that supports 4X and Fast Write transactions.
–provides powerful hardware decoding DVD accelerator to improve the DVD
playback performance.
–Provides the standard interface for CRT monitors
–provides the Digital Flat Panel Port (DFP) for a standard interface between a
personal computer and a digital flat panel monitor.
–adopts Share System Memory Architecture which can flexibly utilize the frame
buffer size up to 64MB.
Key Features:
“Super-South Bridge” in SiS630S
-integrates all peripheral controllers/accelerators /interfaces.
-provides a total communication solution including 10/100Mb Fast Ethernet for
Office requirement and 1Mb HomePNA for Home Networking.
-offers AC’97 compliant interface that comprises digital audio engine with 3D-
hardware accelerator, on-chip sample rate converter, and professional wavetable
along with separate modem DMA controller.
-provides interface to Low Pin Count (LPC) operating at 33 MHz clock which is the
same as PCI clock on the host, and dual USB host controllers with six USB ports
that deliver better connectivity and 2 x 12Mb bandwidth.
-The built-in fast PCI IDE controller supports the ATA PIO/DMA, and the Ultra
DMA33/66 function that supports the data transfer rate up to 100 MB/s. It provides
the separate data path for two IDE channels that can eminently improve the
package, or 209-ball MicroStar Ball Grid Array (GHK) package
-3.3-V core logic with universal PCI interfaces compatible with 3.3-V and 5-V PCI
signaling environments
-Mix-and-match 5-V/3.3-V 16-bit PC Cards and 3.3-V CardBus Cards
-Single PC Card or CardBus slot with hot insertion and removal
-Burst transfers to maximize data throughput on the PCI bus and the CardBus bus
-Parallel PCI interrupts, parallel ISA IRQ and parallel PCI interrupts, serial ISA
IRQ with parallel PCI interrupts, and serial ISA IRQ and PCI interrupts
-Serial EEPROM interface for loading subsystem ID and subsystem vendor ID
-Pipelined architecture allows greater than 130M bps sustained throughput from
CardBus-to-PCI and from PCI-to-CardBus
-Interface to parallel single-slot PC Card power interface switches like the TI
TPS2211
-Up to five general-purpose I/Os
-Programmable output select for CLKRUN
-Five PCI memory windows and two I/O windows available to the 16-bit PC Card
socket
-Two I/O windows and two memory windows available to the CardBus socket
-Exchangeable Card Architecture (ExCA) compatible registers are mapped in
memory and I/O space
-Intel 82365SL-DF and 82365SL register compatible
-Distributed DMA (DDMA) and PC/PCI DMA
-16-Bit DMA on the PC Card socket
-Ring indicate, SUSPEND, PCI CLKRUN, and CardBus CCLKRUN
-Socket activity LED pins
-PCI Bus Lock (LOCK)
-Advanced Submicron, Low-Power CMOS Technology
-Internal Ring Oscillator
8
CPU and Memory
CPU
The 5100S/5500S Notebook PC uses the Intel Mobile Pentium III/Celeron (.18) processor in a
µPGA2 package.
The Intel Mobile Pentium III/Celeron (.18) processor features an integrated L2 cache(256KB
for Pentium III and 128KB for Celeron (.18)) and a 64-bit high performance system bus.
The Mobile Pentium III/Celeron (.18) processor’s 64-bit wide Low Power Gunning Transceiver Logic system bus is compatible with the SIS630S AGPSet and provides a glue-less,
point-to-point interface for an I/O bridge/memory controller.
The Intel Mobile Pentium III and Celerons (.18) processors are fully compatible with all
software written for the Pentium processor with MMX technology, Pentium processor,
Intel486 microprocessor, and Intel386 microprocessor. In addition, they provide improved
multimedia & communications performance.
They feature:
Performance improved over existing mobile processors
- Supports the Intel Architecture with Dynamic Execution
- Supports the Intel Architecture MMX technology
Integrated primary (L1) instructions and data caches
- 4-way set associative, 32-byte line size, 1 line per sector
- 16-Kbyte instruction cache and 16-Kbyte writeback data cache
- Cacheable range programmable by processor programmable registers
Integrated second level (L2) cache
- 4-way set associative, 32-byte line size, 1 line per sector
- Operated at full core speed
- 128/256-Kbyte, ECC protected cache data array
Low Power GTL+ system bus interface
- 64-bit data bus, 100-MHz operation
- Uniprocessor, two loads only (processor and I/O bridge/memory controller)
- Short trace length and low capacitance allows for single ended termination
Voltage reduction technology
Pentium III processor clock control
- Deep Sleep mode for extremely low power dissipation
Thermal diode for measuring processor temperature
9
Adding or replacing the processor .
Note: If you plan on removing the heat sink, which is necessary to add or replace the
processor, you will need to have a replacement heat sink pad available. Before proceeding, please contact your dealer to get a replacement pad which you will need when you
reinstall the heat sink.
In order to add or replace the processor you must:
A: Remove the heat sink
B: Remove the processor
C: Insert a new processor
D: Reinstall the heat sink
E: Changing the SW DIP Switch settings
A: Remove the heat sink
1) Turn off the computer
2) Turn over the computer
3) Remove the Heat Sink and CPU Cover
Heat sink
heat sink screws
O
L
Figure 4-3
heat sink cable
4) Remove the 4 screws which hold the
heat sink in place.
5) Gently remove the heat sink cable.
6) Lift the heat sink out of the computer
10
B: Remove the processor
The processor is secured on the mainboard with a lock which is easily opened using a small
regular screwdriver.
With the heat sink already removed you will need to set the lock to the open position before
removing the processor:
processor mounted on the socket
O
L
OPEN
Processor socket
Lock
1) Turn the screw on the
processor lock to the
open position. (O)
O
L
11
2) Lift the processor
O
L
from the socket.
C: Insert a new processor
1) With the processor lock in the open position, align the pins of the processor with the
holes in the socket.
2)Press the processor into
O
L
the socket.
LOCK
3) Turn the screw to the locked
position (L)
O
L
12
D: Reinstall the heat sink
Note: When reinstalling the heat sink, you will also have to replace the heat sink pad. A
heat sink pad can be obtained from your dealer.
1) Peel off the old heat sink pad and stick on a new one.
2) Insert the heat sink cable in the slot. (Figure 4-3)
3) Align the 4 screw holes on the heat sink with those on the mainboard and screw them
in about half way. Once all the screws are in about half way and the heat sink is
seated probably tighten the screws.
Heat sink pad
E: Changing the SW1 DIP Switch settings
If you have installed the processor with Intel Speedstep you will have to change the
SW1 DIP Switch settings. Follow these steps to get to change the SW1 DIP Switch
setings:
1)Turn off the computer.
2)Press the two keyboard latches to elevate the keyboard from its normal position.
3) Carefully lift the keyboard assembly out to expose the
mainboard.
13
4)Remove the metal protective shield
5)Locate the SW DIP Switch on the right side.
6)Change the settings to the following:
SW settings for Intel Speedstep processor
SW1-1 SW1-2 SW1-3 SW1-4
ON ON ON OFF
7)Put the metal shield back into place
8)Put the keyboard back into place.
Metal shield
SW1 DIP Switch
OFF position
ON position
14
Memory
The computer has two memory sockets for PC-100/PC-133 compliant, 144 pin SODIMM
(Small Outline Dual In-line Memory Module) modules. The memory can be expanded to 512
MB with the following combinations:
Bank 0
(64-bit)
32 MB Emp t y 32 MB
32 MB 32 MB 64 MB
64 MB Emp t y 64 MB
64 MB 32 MB 96 MB
2) Press the two keyboard latches at the top of the
keyboard to elevate the keyboard from its normal
position.
3) Carefully lift the keyboard assembly out to expose
the mainboard.
Figure 4-1
Bank 1Bank 0
4) Locate the memory banks, Bank 0 is on the
right and Bank 1 is on the left.
Figure 4-2
Note: Only use Bank 0 if you have one memory module. If you are using two memory modules always use the larger module in Bank 0.
5) Insert the memory module at an angle (about 45°)
and fit its connectors firmly into the bank
.
6) Press down the edge of the memory module and lock
it into place
.
7) Put the keyboard back into place.
17
Note: Make sure the connectors go into the bank. You must use a RAM module that complies with Intel unbuffered SODIMM (67.6 mm x 29.0 mm). Please consult your dealer for
the details.
67.6 mm
29.0 mm
connectors
Changing the S3 DIP Switch settings
Once you have installed the new memory you will have to change the DIP Switch settings depending on the type of memory you have installed. Please refer to the chart
below for the correct settings for the S3 DIP Switches
SDRAM
TYPE
PC100 ON OFF OFF OFF
PC133 ON OFF ON OFF
S3-1 S3-2 S3-3 S3-4
S3 DIP Switch
ON position
OFF position
18
Removing a Memory Module
1)Turn off the computer.
2)Press the two keyboard latches to elevate the keyboard from its normal position
(refer to Figure 4-1)
3)Carefully lift the keyboard assembly out to expose the mainboard.
4)Locate the memory sockets. Bank 0 is on the left and Bank 1 is on the right. (refer
to Figure 4-2)
5)Gently pull the two latches outward on both ends of the module
6)The module will pop up
7)Remove the memory module
8)Install a new memory module if desired (refer to Installing a Memory Module).
9)Put the keyboard back into place.
.
.
.
19
Drive information and Pin assignments
Storage Devices
HDD (BUIL T-IN)
-2.5", 12.7mm max. height and removable HDD
-Average access time: below 13ms
-PCI local bus IDE interface
-Supports: 12GB or higher HDD (Ultra DMA 33/66/100)
9HD(High : HD)10MOTOR ON
11N.C.12DIRECTION
13Mode Select14STEP
15GND16WRITE DATA
17GND18WRITE GATE
19GND20TRACK 00
21GND22WRITE PROTECT
23GND24READ DATA
25GND26Side One Select
Removing the FDD
Removing the Floppy Disk Drive
1)Turn off the computer.
2)Turn the computer over.
3)Locate the DVD / FDD cover
4)Unscrew and remove the cover .
5)Lift the white plastic piece which holds
.
the FDD cable in place
6)Pull out the FDD cable
7)Grasp the FDD tab and gently PULL
the FDD out of the computer
.
.
.
22
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