Clevo 3200, 3600, 3400 Service Manual

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Notebook Computer
Service Manual

3200/3400/3600

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Preface

copyrights

NOTICE

The company reserves the right to revise this publication or to change its contents without notice. Information
contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any
subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this
publication nor are they in anyway responsible for any loss or damage resulting from the use (or misuse) of this
publication.

This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmit­ted or reduced to any machine readable form without prior consent from the vendor, manufacturer or creators of
this publication, except for copies kept by the user for backup purposes.

Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks
of their respective companies. They are mentioned for identification purposes only and are not intended as an
endorsement of that product or its manufacturer.

First Edition ©October, 1999

Trademarks

Intel

®

, Pentium® and Pentium® with MMX™ technology are registered trademarks of Intel Corporation.

IBM® and OS/2® are registered trademarks of IBM Corporation.
MS-DOS®, Windows®, Windows® 95 and Windows NT™ are registered trademarks of Microsoft Corporation.
SystemSoft® and CardWizard® are registered trademarks of SystemSoft Corporation.

Other brand and product names are trademarks and/or registered trademarks of their respective companies.

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the manual

ABOUT THIS MANUAL

This manual is intended for service personnel who have completed sufficient training to undertake the mainte­nance and inspection of personal computers.

It is organized to allow you to look up basic information for servicing and/or upgrading components of the note­book computer. The following information is included:

Chapter 1, Introduction, provides general information about the location of system elements and their specifications.
Chapter 2, Chipset, briefly describes the computer’s core logic, memory and supporting chipset.
Chapter 3, Disassembly, provides step-by-step instructions for disassembling parts and subsystems and how to

upgrade elements of the system.

Chapter 4, Troubleshooting, provides recommendations on how to solve possible system problems.

Appendix A, Part Lists

Appendix B, Circuit Diagrams

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Preface

conventions

CONVENTIONS

This manual uses the following typesetting conventions:

Example

commonly used terms (capitals): FDD, HDD, AC, DC
features on the notebook (icons):
keyboard keys (bold, as printed): Y, N, Enter
programs, operating systems (italics): Setup, Windows 95
files (all capitals): AUTOEXEC.BAT
menu items (initial capitals): External Cache Memory
variables (quotes): “Enabled”
DOS text the user must enter (bold): a:>\setup
keys to press while in DOS (brackets,bold): [Enter]
menu buttons (bold): Continue
command switches (bold): format /s
space:

~

RELATED DOCUMENTS

You may also need to consult the following manuals for additional information:

User’s Manual

This describes the notebook’s features and the procedures for operating the computer and its ROM-based setup
program. It also describes the installation and operation of the utility programs provided with the notebook.

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table of contents

TABLE OF CONTENTS

Preface

Cover ....................................................................................................................................................................................................i

Notice.................................................................................................................................................................................................. ii

About This Manual ........................................................................................................................................................................... iii

Conventions ................................................................................................................................................................................. iv

Related Documents .................................................................................................................................................................... iv

Table of Contents............................................................................................................................................................................... v

List of Figures .................................................................................................................................................................................. viii

List of Tables ....................................................................................................................................................................................... x

Chapter 1: Introduction

System Specifications ....................................................................................................................................................................1-2

CPU ............................................................................................................................................................................................. 1-2

Memory ......................................................................................................................................................................................1-2

BIOS .............................................................................................................................................................................................1-2

Video ...........................................................................................................................................................................................1-3

Drives ..........................................................................................................................................................................................1-3

Audio...........................................................................................................................................................................................1-3

I/O ............................................................................................................................................................................................... 1-4

Interface ..................................................................................................................................................................................... 1-4

Power System ............................................................................................................................................................................1-4

Other Features (optional) .........................................................................................................................................................1-5

Environment .................................................................................................................................................................................... 1-5

Physical ............................................................................................................................................................................................1-5

External Locator ..............................................................................................................................................................................1-6

Chapter 2: Chipset

CPU - Intel Mobile Dixon/Celeron...............................................................................................................................................2-4

Core Logic Chipset - Intel 440BX AGPset .................................................................................................................................. 2-5

North Bridge AGPset System Controller, 443BX..................................................................................................................2-5

South Bridge, PCI ISA IDE Xcelerator, PIIX4E ........................................................................................................................ 2-6

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Preface

Supporting Chips ........................................................................................................................................................................... 2-8

Ricoh 5C475 PCI-CardBus Bridge ..........................................................................................................................................2-8

SMSC FDC37N869 PC 99 ...................................................................................................................................................... 2-10

Compliant 5V and 3.3V Super I/O Controller with Infrared Support ............................................................................... 2-10

ATI 3D RAGE Mobility Graphics Controller ........................................................................................................................... 2-11

YAMAHA YMF744B DS-XG .................................................................................................................................................... 2-12

Chapter 3: Disassembly

Connections ...................................................................................................................................................................................3-2

Maintenance Precautions ...................................................................................................................................................... 3-3

Battery Precautions.................................................................................................................................................................. 3-3

Cleaning .................................................................................................................................................................................... 3-4

Maintenance Tools .................................................................................................................................................................. 3-4

General Disassembly: Under the Keyboard .............................................................................................................................. 3-5

Removing the Keyboard & Heat Plate ..................................................................................................................................3-5

Changing the CPU (Mainboard Versions 4 ~ 5) .................................................................................................................. 3-6

General Disassembly: Removing & Replacing the LCD Module ............................................................................................3-8

Replacing the LCD .................................................................................................................................................................. 3-10

12.1” Disassembly.............................................................................................................................................................. 3-10

13.3” Disassembly............................................................................................................................................................. 3-10

Removing the Inverter Board .......................................................................................................................................... 3-10

General Disassembly: Top Cover Assembly ............................................................................................................................ 3-12

Separating the Top Cover Assembly.................................................................................................................................... 3-12

General Disassembly: Top Cover Components ...................................................................................................................... 3-14

TouchPad................................................................................................................................................................................. 3-14

Microphone ............................................................................................................................................................................ 3-14

General Disassembly: Bottom Cover Assembly...................................................................................................................... 3-16

HDD Bracket ........................................................................................................................................................................... 3-16

Mainboard .............................................................................................................................................................................. 3-16

Optional Fax/Modem Module, The Power Board, The IR Board, and IO Bracket......................................................... 3-18

Fax/Modem Modem (not shown) .................................................................................................................................. 3-18

The Power Board .............................................................................................................................................................. 3-18

The IR Board ...................................................................................................................................................................... 3-18

The IO Bracket ................................................................................................................................................................... 3-18

table of contents

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Module Disassembly ..................................................................................................................................................................3-20

HDD Module ...........................................................................................................................................................................3-20

Removing the HDD Module.............................................................................................................................................3-20

Replacing/Upgrading the Cartridge .................................................................................................................................... 3-21

HDD Module Assembly....................................................................................................................................................3-22

Setting Up a New HDD for the First Time ......................................................................................................................3-23

Switches & Connectors .........................................................................................................................................................3-24

Chapter 4: Troubleshooting

Before You Begin ........................................................................................................................................................................... 4-2

Tools ...........................................................................................................................................................................................4-2

System Troubleshooting Chart ..................................................................................................................................................... 4-3

Pre-POST Assistant ........................................................................................................................................................................ 4-4

AC Power LED Fails .................................................................................................................................................................. 4-5

AC/DC Adapter ................................................................................................................................................................... 4-5

AC Power & Charge LEDs Fail ................................................................................................................................................ 4-6

Checking the Power Board ............................................................................................................................................... 4-6

Checking the Fuses ............................................................................................................................................................ 4-6

Checking the Battery Pack and its Cabling .................................................................................................................. 4-10

Checking the Battery Pack........................................................................................................................................ 4-10

Checking the Cabling ................................................................................................................................................. 4-11

Checking the System Board ............................................................................................................................................ 4-11

LCD Screen Failure to Display ............................................................................................................................................... 4-12

Checking the LCD to System Board Connection .......................................................................................................... 4-12

Checking the Inverter Board ........................................................................................................................................... 4-13

Checking the LCD Screen ................................................................................................................................................ 4-14

POST — Testing the System ....................................................................................................................................................... 4-15

No Errors Found During the POST ........................................................................................................................................ 4-15

POST Error Beeps & Screen Messages .............................................................................................................................. 4-16

Post-POST Problems ...................................................................................................................................................................4-24

PC Card Socket Malfunction.................................................................................................................................................4-25

Sound Output Failure .............................................................................................................................................................4-26

Checking the Software Configuration............................................................................................................................4-26

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Preface

Checking the Volume ....................................................................................................................................................... 4-26

Checking the Speaker Cable .......................................................................................................................................... 4-27

Suspend Function Failure ......................................................................................................................................................4-28

Charge LED Failure.................................................................................................................................................................4-28

Appendix A: Part Lists
Appendix B: Circuit Diagrams

LIST OF FIGURES

Fig. 1 – 1 Front View ............................................................................................................................................................1-6

Fig. 1 - 2 Bottom View ........................................................................................................................................................1-6

Fig. 1 – 3 Left View ............................................................................................................................................................... 1-7

Fig. 1 – 4 Right View ............................................................................................................................................................ 1-7

Fig. 1 – 5 Rear View ............................................................................................................................................................. 1-7

Fig. 2 – 1 System Block Diagram ....................................................................................................................................... 2-1

Fig. 2 – 2 Chipset Site Diagrams................................................................................................................................... 2-2,3

Fig. 3 – 1 Releasing the Keyboard & Removing the Heat Plate...................................................................................3-5

Fig. 3 – 2 CPU &SW1 ........................................................................................................................................................... 3-7

Fig. 3 – 3 Removing the LCD Module ...............................................................................................................................3-9

Fig. 3 – 4 Separating the LCD & Frame........................................................................................................................... 3-11

Fig. 3 – 5 Top Cover Disassembly (Bottom Screws)...................................................................................................... 3-13

Fig. 3 – 6 Top Cover Disassembly (Top Screws) ............................................................................................................ 3-13

Fig. 3 – 7 Top Cover Assembly ........................................................................................................................................ 3-15

Fig. 3 – 8 Bottom Cover Assembly ..................................................................................................................................3-17

Fig. 3 – 9 Final Separation ............................................................................................................................................... 3-19

Fig. 3 – 10 Removing the HDD ......................................................................................................................................... 3-20

Fig. 3 – 11 HDD Module Disassembly.............................................................................................................................. 3-21

list of figures

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Fig. 3 – 12 HDD Module Assembly.................................................................................................................................. 3-22

Fig. 3 – 13 Ports & Connectors (top views) .................................................................................................................... 3-24

Fig. 3 – 14 Ports & Connectors (bottom views).............................................................................................................. 3-25

Fig. 4 – 1 Troubleshooting Flowchart ...............................................................................................................................4-3

Fig. 4 – 2 Adapter’s Check Points ................................................................................................................................... 4-5

Fig. 4 – 3 Power Components .......................................................................................................................................... 4-7

Fig. 4 - 4 Battery Circuitry ................................................................................................................................................ 4-10

Fig. 4 - 5 LCD to Mainboard Connection ...................................................................................................................... 4-12

Fig. 4 - 6 Inverter Board Component Sites ................................................................................................................... 4-13

Fig. 4 – 7 Startup Screen: The POST ............................................................................................................................... 4-15

Fig. 4 – 8 Speaker Connector on Mainboard ...............................................................................................................4-27

Fig. A – 1 3200 Bottom Assembly .................................................................................................................................... A-2

Fig. A – 2 3200 Bottom Assembly Parts List ................................................................................................................... A-3

Fig. A – 3 3200 Top Case Assembly ................................................................................................................................ A-4

Fig. A – 4 3200 Top Case Assembly Parts List ............................................................................................................... A-5

Fig. A – 5 3200 12.1” LCD Assembly................................................................................................................................. A-6

Fig. A – 6 3200 12.1” LCD Assembly Parts List.................................................................................................................A-7

Fig. A – 7 3200 13.3” LCD Assembly................................................................................................................................ A-8

Fig. A – 8 3200 13.3” LCD Assembly Parts List............................................................................................................... A-9

Fig. A – 9 3200 CD-ROM Assembly ................................................................................................................................A-10

Fig. A – 10 3200 CD-ROM Assembly .................................................................................................................................A-11

Fig. A – 11 3200 FDD Assembly ........................................................................................................................................ A-12

Fig. A – 12 3200 FDD Assembly Parts List ....................................................................................................................... A-13

Fig. A – 13 3200 HDD Assembly ....................................................................................................................................... A-14

Fig. A – 14 3200 HDD Assembly Parts List ...................................................................................................................... A-15

list of figures

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Preface

list of tables

LIST OF TABLES

Table 3 – 1 CPU Switch Settings ..........................................................................................................................................3-6

Table 4 – 1 Pre-POST Problems ........................................................................................................................................... 4-4

Table 4 – 2 Adapter Contacts ............................................................................................................................................... 4-5

Table 4 – 3 Inverter Board Check Areas ........................................................................................................................... 4-13

Table 4 – 4 Fatal Error Messages ...................................................................................................................................... 4-16

Table 4 – 5 Non-Fatal Error Messages .................................................................................................................... 4-17,18,19

Table 4 – 6 Phoenix BIOS POST Default Test Points (displayed on debug card) ......................................... 4-20,21,22,23

Table 4 – 7 Post-POST Problems ....................................................................................................................................... 4-24

Table 4 – 8 Possible PC Card Problems & Solutions ..................................................................................................... 4-25

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1 Introduction

This manual covers the information you need to service or upgrade the Notebook Computer. Information about
operating the computer (e.g. getting started, and the Setup utility) is in the User’s Manual. Information about
drivers (e.g. VGA & audio) is also found in User’s Manual. That manual is shipped with the computer.

Operating systems (e.g. DOS, Windows 9x, Windows NT 4.0, OS/2 Warp, UNIX, etc.) have their own manuals as do
application software (e.g. word processing and database programs). If you have questions about those programs,
you should consult those manuals.

The notebook is designed to be upgradable. It supports Pentium

™

II CPUs of different speeds and different types of
LCD screens: TFT color from a variety of manufacturers and in a variety of resolution/color configurations. In
addition, system memory, hard disk, and BIOS are also upgradable. See Chapter 3, “Disassembly,” for a detailed
description of the upgrade procedures for each specific component.

Please note the warning and safety information indicated by the “M” symbol.
The balance of this chapter reviews the computer’s technical specifications and external features.

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Introduction

SYSTEM SPECIFICATIONS

CPU

mPGA Package Intel Celeron: 300 ~ 400 MHz

Intel Dixon: 300 ~ 400 MHz

MEMORY

L1 cache (in CPU) 16KB code + 16KB data
L2 cache Celeron: 128KB on die SRAM

(integrated with CPU) Dixon: 256KB on die SRAM

RAM base 0MB (onboard)
RAM expansion 2 small outline DIMM sockets (144 pin)

DIMM sizes: 32MB, 64MB, 128MB
standards: TSOP package, 3.3-volt
modes: SDRAM
speed: 10ns or faster
use: singly or mixed or identical pairs
maximum expansion: 256MB

BIOS

512KB Flash ROM
support: Plug ‘n Play 1.0a, LBA, APM 1.2, ACPI

specifications

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VIDEO

memory 4MB/8MB SGRAM

chipset ATI Mobility-P AGP (with 3D, AGP & ZV support/proprietary driver)
architecture 64-bit 2x AGP bus with Windows Acceleration
display TFT (active matrix)

12.1” SVGA, (800x600) at 24-bit color (TrueColor)

13.3”/XGA, (1024x768) at 32-bit color (TrueColor)

DRIVES

HDD module removable 2½” (9.5mm) , PCI local bus IDE interface

Device Bay
CD-ROM module full size (5.25”) ATAPI interface tray-loading mechanism,

access time below 100ms

or DVD

†

module full size (5.25”) ATAPI interface tray-loading mechanism,

access time below 100ms

or FDD module removable 3.5”, 1.44 MB with 3-Mode support
or LS-120 module removable 3½” (12.7mm height), 120MB PCI local bus IDE interface

† with Software MPEG support

AUDIO

chipset Yamaha YMF744B (DS-XG), proprietary driver
architecture 32-bit PCI bus
type 64-voice dual-audio engine, AC-3 speaker virtualization, PnP, up to 20-bit ADCDAC

audio resolution, I2S/zoomed video, high quality MIDI synthesis

sampling max. record & playback up to 48 KHz stereo (WAVE audio)
3D HRTF 3-D positional audio under DirectX™ 5.0
compatibility Sound Blaster Pro™ legacy audio, MS Windows Sound System™
interface speakers (phones), microphone, line-in
speakers 2 built-in: 0.5W stereo amp.

specifications

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Introduction

I/O

USB 2 ports, compliant with UHCI 1.1, USB 1.0 & PCI 2.1
Serial 1 9-pin, 16C550 compatible
Serial 2 infrared, IrDA v 1.1, FIR, SIR compatible
Parallel 25-pin, ECP, EPP, output-only, bi-directional
CRT 15-pin VGA
PS/2 6-pin, mini-din, mouse or keyboard
expansion 120-pin, proprietary port replicator

PC Card one Type I or Type II socket, PC Card 3.0, ZV port & CardBus compliant

INTERFACE

keyboard 87-key or 90-key (depending on the language)

Windows 95 compliant with embedded numeric keypad

pointing device PS/2 TouchPad (built-in), MS-Mouse compatible

POWER SYSTEM

adapters (external) universal, auto-sensing switching

input: 90-240VAC @47- 63Hz
output: 55W, 19V, 2.8A

battery pack(s) 36S (Ni-MH) or 202 (Li-Ion) form factor “smart” battery or compatible

“smart battery” with intelligent charging control and battery gauge circuit

battery charge time Fast (system off) approx. 2 hours per battery, 2000mA ±200mA

Slow (system on) approx. 5 hours per battery, 700mA ± 50mA
(based on a 4000mA smart battery)

life per charge approx. 100 minutes per battery (based on an Intel Dixon-256 333 MHz CPU,

running “ZD BatteryMark 2.0”” software in the Windows 98 operating system)

management BIOS control, APM ver 1.2

levels: full-on, standby, suspend-to-RAM/suspend-to-disk (0 volt)

specifications

¯

Advanced Users

Actual battery life per
charge may differ from this
figure. It will vary depend­ing on the condition of the
battery, the environment,
setup, and working habits.

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OTHER FEATURES (OPTIONAL)

56K Fax/Data/Voice modem

ENVIRONMENT

operating temp. 0oC to 35oC (32oF to 95oF)
storage temp. -10

o

C to 65oC (14oF to 149oF)

operating humidity 40% to 80%, non-condensing
storage humidity 10% to 90%, non-condensing
altitude 8000 feet
shock (unpacked) 5G (11 + 1 microsecond pulse)

PHYSICAL

dimensions 306mm(w) x 232mm(d) x 29.8mm(h)
weight 2.28Kg (with battery, FDD &HDD)

specifications

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Introduction

external locator

FRONT VIEW

FIG. 1 – 1

1. Cover latch

2. LCD

3. Speakers

4. On/Off switch

5. Microphone

6. LED status indicators

7. Keyboard

8. TouchPad & buttons

EXTERNAL LOCATOR

The following figures show the external locations of the computer’s main subsystems.

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BOTTOM VIEW

FIG. 1 - 2

9. Device bay

10. Battery bay

11. RAM bay

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LEFT VIEW

FIG. 1 – 3

1. PS/2 port

2. Fan

3. USB port

4. PC Card slot

5. HDD module

6. Audio line-in jack

7. Phone jack

8. Mic jack

RIGHT VIEW

FIG. 1 – 4

9. CD-ROM module (option)
or DVD ROM module (option)
or FDD module (option)
or LS-120 module (option)

REAR VIEW

FIG. 1 – 5

10. Kensington lock port

11. IrDA (serial 2) port

12. Fax/Modem (option)

13. COM (serial 1) port

14. Parallel port

15. Expansion port

16. External monitor port

17. Adapter port

external locator

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Introduction

notes

NOTES:

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2 Chipset

The computer is completely AT-compatible. Its chipset supports a high-performance PCI bus video interface and
state-of-the-art power management features. This chapter mainly describes the following major system components:

• CPU • Core logic chipset • Supporting chips

The following figures are the system block diagram and the component site diagram. These provide an overview of
the computer’s layout and a practical locator for chipset components.

SYSTEM BLOCK D IAGRAM

FIG. 2 – 1

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Chipset

CHIPSET SITE D IAGRAM

FIG. 2 – 2

1. Pentium II CPU

2. DIP switch

3. CMOS battery

4. BIOS chip
AMD AM29LV004BT

block diagram

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CHIPSET SITE D IAGRAM

FIG. 2 – 2 (CONT.)

5. Super I/O controller
SMSC FDC37N869

6. Video controller
ATI RAGE Mobility

7. PC Card controller
Ricoh RL5C475A

8. Audio controller
YAMAHA YMF744B

9. Core Logic chip
82443BX (North Bridge)

10. Core Logic chip
82371EB (South Bridge)

11. Keyboard controller
H8/3434

12. SDRAM DIMM socket

13. SDRAM DIMM socket

component sites

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Chipset

CPU - INTEL MOBILE DIXON/CELERON

The Notebook uses the Intel Mobile Dixon/Celeron processor in a Micro PGA1 package. The Intel Mobile Dixon/
Celeron processor features an integrated L2 cache (256KB for Dixon and 128KB for Celeron) and a 64-bit high
performance system bus.

The Mobile Dixon/Celeron processor’s 64-bit wide Low Power Gunning Transceiver Logic system bus is compat­ible with the 440BX AGPSet and provides a glue-less, point-to-point interface for an I/O bridge/memory controller.

The Intel Mobile Dixon and Celeron processors are fully compatible with all software written for the Pentium
processor with MMX technology, Pentium processor, Intel486 microprocessor, and Intel386 microprocessor. In
addition, they provide improved multimedia & communications performance. They feature:

• Performance improved over existing mobile processors

- Supports the Intel Architecture with Dynamic Execution

- Supports the Intel Architecture MMX technology

• Integrated primary (L1) instructions and data caches

- 4-way set associative, 32-byte line size, 1 line per sector

- 16-Kbyte instruction cache and 16-Kbyte writeback data cache

- Cacheable range programmable by processor programmable registers

• Integrated second level (L2) cache

- 4-way set associative, 32-byte line size, 1 line per sector

- Operated at full core speed

- 256-Kbyte, ECC protected cache data array

• Low Power GTL+ system bus interface

- 64-bit data bus, 66-MHz operation

- Uniprocessor, two loads only (processor and I/O bridge/memory controller)

- Short trace length and low capacitance allows for single ended termination

• Voltage reduction technology

• Pentium II processor clock control

- Quick Start for low power, low exit latency clock “throttling”

- Deep Sleep mode for extremely low power dissipation

• Thermal diode for measuring processor temperature

CPU

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CORE LOGIC CHIPSET - INTEL 440BX AGPSET

The Intel 440BX AGPset consists of the BX System Controller (443BX) and the PCI ISA IDE Xcelerator (PIIX4E).
The AGPset forms a Host-to-PCI bridge and provides the second level cache control and a full function 64-bit data
path to main memory.

NORTH BRIDGE AGPSET SYSTEM CONTROLLER, 443BX

The BX System Controller (443BX) integrates the cache and main memory DRAM control functions and provides
bus control to transfer between the CPU, cache, main memory, AGP bus and the PCI Bus.

Features

• Supports the Pentium II processor family host bus at 100MHz and 66 MHz at 3.3V

• PCI 2.1 compliant

• Integrated Data Path

• Integrated DRAM controller

- 8Mbytes to 256Mbytes main memory

- 64Mbit DRAM/SDRAM technology support

- EDO and SDRAM DRAM support

- Integrated programmable-strength for DRAM interface

- CAS-Before-RAS refresh, extended CBR and self refresh for EDO

- CAS-Before-RAS and self refresh for SDRAM

• Fully synchronous, minimum latency 30/33 MHz PCI bus interface

- Five PCI bus masters (including PIIX4)

- 10 DWord PCI-to-DRAM read prefetch buffer

- 18 DWord PCI-DRAM post buffer

- Multi-Transaction timer to support multiple short PCI transactions

• AGP Features

- AGP 1.0 compliant

- 66/133 MHz data transfer capability

- Supports concurrent CPU, AGP and PCI transactions

• Power Management Features

- Dynamic stop clock support

- Suspend to RAM (STR)

- Suspend to Disk (STD)

- Power On Suspend (POS)

- Internal clock control

- SDRAM and EDO self refresh during suspend

- ACPI support

- Compatible SMRAM (C_SMRAM) and Extended SMRAM (E_SMRAM)

- SMM write-back cacheable in E_SMRAM mode up to 1MB

• Supports the Universal Serial Bus (USB)

• 492 Pin BGA 440BX AGPset with integrated data paths

core logic chipset

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Chipset

SOUTH BRIDGE, PCI ISA IDE XCELERATOR, PIIX4E

The PCI ISA IDE Xcelerator (PIIX4E) is a multi-function PCI device implementing a PCI-to-ISA bridge function, a
PCI IDE function, a Universal Serial Bus host/hub function, and an Enhanced Power Management function. As a
PCI-to-ISA bridge, the PIIX4E integrates many common I/O functions found in ISA-based PC systems - a seven
channel DMA Controller, two 82C59 Interrupt Controllers, an 8254 Timer/Counter, and a Real Time Clock. In
addition to compatible transfers, each DMA channel supports Type F transfers. The PIIX4E also contains full
support for both PC/PCI and Distributed DMA protocols implementing PCI based DMA. The Interrupt Controller
has Edge or Level sensitive and programmable inputs and fully supports the use of an external I/O Advanced
Programmable Interrupt Controller (APIC) and Serial Interrupts. Chip select decoding is provided for BIOS, Real
Time Clock, Keyboard Controller, second external Microcontroller, as well as 2 Programmable Chip Selects. The
PIIX4 provides full Plug and Play compatibility. The PIIX4E can be configured as a Subtractive Decode bridge. This
allows the use of a subtractive decode PCI-to-PCI bridge such as the 82380 chipset which implements a PCI/ISA
docking station environment.

The PIIX4E supports two IDE connectors for up to four IDE devices providing an interface for IDE hard disks and
ROMs. Up to four IDE devices can be supported in Bus Master mode. The PIIX4E contains support for “Ultra
DMA” synchronous DMA compatible devices.

The PIIX4E contains a Universal Serial Bus (USB) Host Controller that is Universal Host Controller Interface
(UHCI) compatible. The Host Controller’s root hub has two programmable USB ports.

The PIIX4E supports Enhanced Power Management, including full Clock Control, Device Management for up to
14 devices, and Suspend and Resume logic with Power On Suspend, Suspend to RAM or Suspend to Disk. It fully
supports Operating System Directed Power Management via the Advanced Configuration and Power Interface
(ACPI) specification. The PIIX4E integrates both a System Management Bus (SMBus) Host and Slave interface for
serial communication with other devices.

core logic chipset

Features

• Supports Pentium and Pentium II Microprocessors

- 440BX ISA kit

• Power Management Logic

- Global and local device management

- Suspend/resume logic

- Supports thermal alarm

- Support for external microcontroller

- Full support for Advanced Configuration and Power Interface (ACPI) Specification and OS Directed Power Management

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• Multifunction PCI to ISA Bridge

- Supports PCI at 30 MHz and 33 MHz

- Supports PCI Rev 2.1 specification

- Supports Full ISA or Extended I/O (EIO) Bus

- Supports full positive decode or subtractive decode of PCI

- Supports ISA/EIO at 1/4 of PCI frequency

• Supports both mobile and desktop deep green environments

- 3.3 V operation with 5 V tolerant buffers

- Ultra-low power for mobile environments

- Power-On Suspend and Soft-OFF for desktop environment

- All registers readable/restorable for proper resume from 0 V suspend

• Integrated IDE Controller

- Independent Timing of up to 4 drives

- PIO Mode 4 transfers up to 14 Mbytes/s

- Supports “Ultra 33” Synchronous DMA mode transfers up to 33 MBytes/sec

- Integrated 8 x 32-bit buffer for IDE PCI Burst

- Supports glue-less “Swap-Bay” option with full electrical isolation

• Enhanced DMA Controller

- Two 8237 DMA controllers

- Supports PCI DMA with 3 PC/PCI channels and Distributed DMA protocols (simultaneously)

- Fast Type-F DMA for reduced PCI bus usage

• Interrupt Controller based on two 82C59

- 15 interrupt support

- Independently programmable for Edge/Level sensitivity

- Supports optional external I/O APIC

- Serial interrupt input

• Timers based on 82C54

- System Timer, Refresh Request, Speaker Tone Output

• USB

- Two USB 1.0 ports for serial transfers at 12 or 1.5 Mbit/sec

- Supports legacy keyboard and mouse software with USB-based keyboard and mouse

- Supports UHCI Design Guide Revision 1.1 Interface

• SMBus

- Host interface allows CPU to communicate via SMBus

- Slave interface allows external SMBus master to control resume events

• Real-Time Clock

- 256 Byte Battery-Pack CMOS SRAM

- Includes Date Alarm

- Two 8-byte Lockout Ranges

• Microsoft Win95/98 compliant

core logic chipset

2

2 – 8

Chipset

supporting chip - PC Card

SUPPORTING CHIPS

The following subsections describe major supporting chips:

• Ricoh 5C475 PCI-CardBus Bridge

• SMSC FDC37N869 PC 99 Compliant 5V and 3.3V Super I/O Controller with Infrared Support

• ATI 3D RAGE Mobility Graphics Controller

• Yamaha744B DS-XG Audio Controller

RICOH 5C475 PCI-CARDBUS BRIDGE

The 5C475 is a PC card controller offering a single chip solution as a bridge between PCI bus and CardBus. The
5C475 includes a PC Card 95 compliant socket interface and a bridge function to the PCI bus of 33MHz. The 5C475
can support the 32-bit CardBus (Card-32) and the 16-bit PC card (Card-16) without external buffers.

Concerning the card control interface, the 5C475’s register is compatible with the Intel 82365SL and Ricoh’s
RF5C396/366 in order to maintain backward compatibility with the existing 16-bit PC Card compliant with
PCMCIA2.1/JEIDA4.2. All PC card interface signals are individually buffered to allow direct connection to CardBus
and Hot insertion/removal without external buffers. The 5C475 also allows direct connection to PCI bus.

The PCI interface and PC card socket interface have their own power supply terminals that can be powered at
either 3.3V or 5V for compatibility with 3.3V and 5V signaling environments. The core logic is powered at 3.3V.

The 5C475 allows the system to be equipped with the high performance multimedia PC cards like the Video capture
card. It features:

• PC98 compliant

- PC98 Design Guide compliant (Subsystem ID, Subsystem Vender ID)

- ACPI 1.0 and PCI Bus Power Management 1.0 compliant

• Low Power consumption

- Hardware Suspend

- CLKRUN#, CCLKRUN# support

• High-performance

• Single Chip PCI-CardBus Bridge

- PCMCIA PC-Card 95 socket support

- CardBus (Card-32) Card and 16-bit (PCMCIA2.1/JEIDA4.2) Card support

2

2 – 9

supporting chip - PC Card

• PCI Bus Interface

- Compliant with PCI Local Bus Specification 2.1

- The maximum frequency 33MHz

- PCI Master/Target protocol support

- Direct connection to PCI bus

• CardBus PC card Bridge

- Compliant with PCMCIA PC Card 95/CardBus Standard Specification

- Compliant with Yenta register set Rev2.2

- The maximum frequency 33MHz

- CardBus Master/Target protocol support

- Transfer transactions

- All memory read/write transaction (bi-direction)

- I/O read/write transaction (bi-direction)

- Configuration read/write transaction (PCI-Card)

- 2 programmable memory windows

- 2 programmable I/O windows

• PC Card-16 Bridge

• Compliant with PCMCIA PC Card 95 CardBus (PC Card-16) Standard Specification

- 5 programmable memory windows

- 2 programmable I/O windows

- Compliant with i82365SL compatible register set / ExCA TM

• System Interrupt

- INTA# support for PCI system interrupt

- IRQn support for ISA system interrupt (Non shared IRQn pins)

- Serialized IRQ support

• 3.3V/5V Mixed Voltage Operation at 33Mhz

• GPIO support

• Posting Write and Prefetching Read support

• Plug and Play support

• 16-bit Legacy mode (3E0/3E2 I/O port) support

• PCIway Legacy DMA support

2

2 – 10

Chipset

SMSC FDC37N869 PC 99 COMPLIANT 5V AND 3.3V SUPER I/O CONTROLLER WITH INFRARED SUPPORT

The FDC37N869 features:

supporting chip - super I/O

• 5 volt and 3.3 volt operation

• Intelligent auto power management

• 16 bit address qualification

• 2.88MB Super I/O Floppy Disk Controller

- Licensed CMOS 765B Floppy Disk Controller

- Software and register compatible with SMSC proprietary
82077AA compatible core

- Supports one Floppy Drive directly

- Configurable Open Drain/Push-Pull Output Drivers

- Supports Vertical Recording Format

- 16 byte data FIFO

- 100% IBM compatibility

- Detects all overrun and underrun conditions

- Sophisticated Power Control Circuitry (PCC) including
multiple power-down modes for reduced power
consumption

- DMA enable logic

- Data rate and drive control registers

- Swap drives A and B

- Non-burst mode DMA option

- 48 Base I/O address, 15 IRQ and 4 DMA options

- Forceable write protect and disk change controls

• Floppy disk available on parallel port pins ACPI compliant

• Enhanced digital data separator

- 2Mbps, 1Mbps, 500 Kbps, 300 Kbps, 250 Kbps data rates

- Programmable precompensation modes

• Serial ports

- Two high speed NS16C550 compatible UARTs with send/
receive 16 Byte FIFOs

- Supports 230k and 460k baud

- Programmable baud rate generator

- Modem control circuitry

• Infrared communications controller

- IrDA v1.2 (4Mbps), HPSIR, ASKIR, Consumer IR Support

- 2 IR Ports

- 96 base I/O address, 15 IRQ options and 4 DMA options

• Multi-mode parallel port with ChiProtect

- Standard Mode

- IBM PC/XT PC/AT and PS/2 compatible bi-directional
parallel port

- Enhanced Parallel Port (EPP) compatible

- EPP 1.7 and EPP 1.9 (IEEE 1284 compliant)

- Enhanced Capabilities Port (ECP) compatible (IEEE 1284
compliant)

- Incorporates ChiProtect Circuitry for Protection Against
Damage Due to Printer Power-On

- 192 base I/O address, 16 IRQ and 4 DMA options

• Game port select logic

- 48 base I/O addresses

• General Purpose Address Decoder

- 16-byte block decode

2

2 – 11

supporting chip - video

ATI RAGE MOBILITY GRAPHICS CONTROLLER

The ATI RAGE Mobility delivers superior 3D acceleration through comprehensive 3D support including a host of
3D special effects. It also incorporates comprehensive support for Intel’s Accelerated Graphics Port (AGP) - 1X or
2X mode with sidebands. Together with extensive support for motion video and DVD playback, the RAGE Mobility
is the best choice for DVD notebooks.

The RAGE Mobility supports Tri-View in that it can output to LCD, CRT and TV simultaneously. It also includes
two CRT controllers to fully support all dual display functionality.

ATI’s RAGE Mobility family of graphic controllers provides the highest performance as measured by 2D/3D
WinBench, frame rates in 3D and DVD, and CPU utilization for DVD. 2D performance is 30 to 60 percent faster
than that of competitive products, and 3D performance is three to ten times faster. Software DVD playback is
performed at full frame rates with very low CPU utilization even on a Pentium II 266Mhz system.

ATI has focused on improving performance that is meaningful to the application, rather than intermediate measures
such as triangles per second, bandwidth, and bus width, which often does not translate into usable performance.

With power savings from integration of memory, LVDS, TV-out, DVD, and comprehensive power management
features such as ACPI/On Now, block-by-block activity based power control, the RAGE Mobility has state-of-the-

art low power performance. It has the following main features:

• High integration results in a low cost and small footprint single
component graphics subsystem, ideal for full range of note
book designs.

• PCI version 2.1 with full bus mastering and scatter/gather sup­port.

• Bi-endian support for compliance on a variety of processor
platforms.

• Fast response to host commands through:

- 512-level command FIFO

- 32-bit wide memory-mapped registers

- Programmable flat or paged memory model with linear
frame buffer access

• Primary triple 8-bit palette DAC with gamma correction for true
WYSIWYG color. Pixel rates up to 230 Mhz.

• Secondary triple 8-bit DAC for simultaneous Composite and S­Video, or RGB outputs for TV/VCR.

• Support for SDRAM and SGRAM at up to 125 Mhz memory clock
across a 64-bit interface, providing bandwidths up to 1GB/sec,
or 150 Mhz across a 32-bit interface.

• Flexible graphics memory configurations: 4MB up to 8MB
SDRAM/SGRAM.

• Memory upgrade via industry standard SGRAM SO-DIMM,
for reduced board area and higher memory speeds.

• DDC1 and DDC2B+ for plug and play monitors.

• External Spread Spectrum chip support to reduce EMI on
digital interface.

• Power management with full VESA DPMS and EPA Energy
Star compliance.

• Integrated hardware diagnostic tests performed
automatically upon initialization.

• High quality components through built-in SCAN, IDDQ, CRC
and chip diagnostics.

• Single chip solution in 0.25um, 2.5V CMOS technology.

• Comprehensive HDKs, SDKs and utilities augmented by full
engineering support.

• Fully compliant with relevant sections of PC 98 and PC 99.

2

2 – 12

Chipset

supporting chip - audio

YAMAHA YMF744B DS-XG

The YMF744B (DS-1S) is a high performance audio controller for the PCI Bus. DS-1S consists of two separated
functional blocks. One is the PCI audio block and the other is the Legacy Audio block. PCI Audio block allows
Software Driver to handle maximum of 73 concurrent audio streams with the Bus Master DMA engine. The PCI
Audio Engine converts the sampling rate of each audio stream and the streams are mixed without utilizing the CPU
or causing system latency. By using the Software Driver from YAMAHA, PCI Audio provides 64-voice XG wavetable
synthesizer with Reverb and variation. It also supports DirectSound hardware accelerator, Downloadable Sound
(DLS) and DirectMusic accelerator.

Legacy Audio block supports FM Synthesizer, Sound Blaster Pro, MPU401 UART mode and Joystick function in
order to provide hardware compatibility for numerous PC games on real DOS without any software driver. To
achieve legacy DMAC compatibility on the PCI, DS-1S supports both PC/PCI and Distributed DMA protocols. DS­1S also supports Serialized IRQ for legacy IRQ compatibility.

DS-1S supports the connection to AC’97s which provides high quality DAC, ADC and analog mixing, and it can
connect two AC’97. In addition, it supports consumer IEC958, Audio Digital Interface (SPDIF), to connect exter­nal audio equipment by digital. It has the following features:

• PCI 2.2 compliant

• PC’98/PC’99 specification compliant

• PCI Bus Power Management rev. 1.0 compliant (support D0, D2
and D3 state)

• Supports clock run

• PCI Bus Master for PCI audio

- True full duplex playback and capture with dif ferent
sampling rate

- Maximum 64-voice XG capital wavetable

- Synthesizer including GM compatibility

- DirectSound Hardware Acceleration

- DirectMusic Hardware Acceleration

- Downloadable Sound (DLS) level-1

• Legacy audio compatibility

- FM synthesizer

- Hardware Sound Blaster Pro compatibility

- MPU401 UART mode MIDI interface

- Joystick

• Supports PC/PCI and Distributed DMA for legacy DMAC (8237)
emulation

• Supports serialized IRQ

• Supports I2S serial input for Zoomed Video Port

• Supports Consumer IEC958 Output (SPDIF OUT)

• Supports Consumer IEC958 Input (SPDIF IN)

• Supports AC’97 Interface (AC-Link) Revision 2.1

• Multiple CODEC (Connectable two AC’97s)

• Hardware volume control

• EEPROM interface

• Single crystal operation (24.576Mhz)

• 3.3V power supply (5V tolerant)

3

3 – 1

3 Disassembly

This chapter provides step-by-step instructions for disassembling parts and subsystems. When it comes to reassembly,
reverse the procedures (unless otherwise indicated).

We suggest you completely review any procedure before you take the computer apart.
The computer comes in three (3) versions: 3200, 3400 and 3600. The principal differences between them are cosmetic

and minor structural variations of the top and bottom covers. As appropriate, these differences are noted in the side­bars. Additional component information is available in Appendix A: Part Lists or Appendix B: Circuit Diagrams.

CPU Upgrades: To upgrade and change the switch settings, you only need to remove the keyboard and heat plate.

Note: When re-assembling, make sure the heat plate is not “distorted” and is fastened securely.

LCD Upgrades (all versions): There are no switches, only remove the keyboard and heat plate.

Changing the LCD module itself, only requires minimal deconstruction.

Illustrations: To enhance procedural clarity, the illustrations in this chapter do not include all components. Mylar

insulation and adhesive attachments are not shown unless they are critical to the disassembly
process. For information about these parts, please refer to

Appendix A: Part Lists

.

3

3 – 2

Disassembly

The disassembly procedures appear in the following order:

• LCD Module – LCD assembly, inverter

• Top Cover – TouchPad assembly

• Bottom Cover – mainboard, IR board, power board

• Modules – HDD

All disassembly procedures assume that the system is turned OFF, and disconnected from any power supply (the
battery is removed too). We also assume that the CD/DVD-ROM or FDD/LS-120 modules are removed as well as the
HDD. All of these procedures are described in the User’s Manual which accompanies the system.

CONNECTIONS

Connections within the computer are one of four types:

Locking collar sockets for ribbon connectors To release these connectors, use a small flat-head screwdriver to

gently pry the locking collar away from its base. When replacing
the connection, make sure the connector is oriented in the same
way. The pin1 side is usually

not

indicated.

Pressure sockets for multi-wire connectors To release this connector type, grasp it at its head and gently rock

it from side to side as you pull it out.

Do not pull on the wires

themselves.

When replacing the connection, do not try to force it.

The socket only fits one way.

Pressure sockets for ribbon connectors To release these connectors, use a small pair of needle-nose pli-

ers to gently lift the connector away from its socket. When replac­ing the connection, make sure the connector is oriented in the
same way. The pin1 side is usually

not

indicated.

Board-to-board or multi-pin sockets To separate the boards, gently rock them from side to side as you

pull them apart. If the connection is very tight, use a small flat­head screwdriver

- use enough force to start the separation.

procedures

3

3 – 3

MAINTENANCE PRECAUTIONS

The following precautions are a reminder.
To avoid personal injury or damage to the notebook while performing a removal and/or replacement job, take the
following precautions:

1. Don't drop it. Perform your repairs and/or upgrades on a stable surface. If the computer falls, the case and other components

could be damaged.

2. Don't overheat it. Note the proximity of any heating elements. Keep the computer out of direct sunlight.

3. Avoid interference. Note the proximity of any high capacity transformers, electric motors, and other strong magnetic fields. These

can hinder proper performance and damage components and/or data. You should also monitor the position of magnetized tools
(i.e. screwdrivers).

4. Keep it dry. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly damaged.

5. Be careful with power. Avoid accidental shocks, discharges or explosions.

•Before removing or servicing any part from the notebook, turn the notebook off and detach any adapters (AC/DC or car adapter).

• To prevent the notebook from being turned on accidentally, remove the battery module

before

you start a removal or replace-

ment procedure.

• Only use a power adapter approved for use with this computer.

• Make sure the AC adapter has a steady, uninterrupted power supply and is grounded.

• When you want to unplug the power cord or any cable/wire, be sure to disconnect it by the plug head. Do not pull on the wire.

• Be sure the socket and any extension cord(s) you use can support the total current load of all connected devices.

6. Peripherals/Modules – Turn off and detach any peripherals. Remove all modules and power units.

7. Beware of static discharge. ICs, such as the CPU and main support chips, are vulnerable to static electricity. Before handling any

part in the notebook, discharge any static electricity inside the notebook. When handling a printed circuit board, do not use gloves
or other materials which allow static electricity buildup. We suggest that you use an anti-static wrist strap instead.

8. Beware of corrosion. As you perform your job, avoid touching any connector leads. Even the cleanest hands produce oils which

can attract corrosive elements.

9. Keep your work environment clean. Tobacco smoke, dust or other air-born particulate matter is often attracted to charged

surfaces, reducing performance.

10. Keep track of the components. When removing or replacing any part, be careful not to leave small parts, such as screws, loose

inside the notebook.

BATTERY PRECAUTIONS

Only use batteries designed for this computer. The wrong battery type may explode, leak or damage the computer.
Recharge the battery using an approved system. Incorrect recharging may make the battery explode.
Always dispose of batteries carefully. Batteries may explode or leak if exposed to fire, or improperly handled or discarded.
Do not try to repair a battery. Damaged or defective batteries should be replaced.

precautions

3

3 – 4

Disassembly

CLEANING

Do not apply cleaner directly to the computer, use a soft clean cloth.
Do not use volatile (petroleum distillates) or abrasive cleaners on any part of the computer.

MAINTENANCE TOOLS

The following tools are recommended when working on the notebook:

M3 Phillips-head screwdriver
M2.5 Phillips-head screwdriver (magnetized)*
M2 Phillips-head screwdriver
Small flat-head screwdriver
Pair of needle-nose pliers
anti-static wrist-strap
* note Maintenance Precaution #3.

precautions

3

3 – 5

A

B

C

ñ ññ ñ

D

E

F-J

GENERAL DISASSEMBLY: UNDER THE KEYBOARD

REMOVING THE KEYBOARD & HEAT PLATE

keyboard & heat plate

RELEASING THE KEYBOARD &

REMOVING THE HEAT PLATE

FIG. 3 – 1

1. Use a flat head screw­driver to release the
keyboard catches at
points A~D.

2. Carefully slide and
lift the keyboard
slightly up and to­wards the LCD. Use
the flat-head screw­driver to release key­board cable’s locking
collar (E). Set the
keyboard aside until
re-assembly.

3. With the philips­head screwdriver, re­move screws F~J.

Stop here if you only need to
replace /upgrade the CPU.

þ

Tip

This procedure involves:

screws 5
connectors: 1

3

3 – 6

Disassembly

CHANGING THE CPU (MAINBOARD VERSIONS 3 ~5)

The removable CPU fits into a FoxConn mPGA1 socket.
When changing it, you must use a CPU tool.

Be sure to note the position of Pin 1.
CPU settings are controlled from SW1.
Before making any changes, note the mainboard version and use the appropriate switch setting table as shown below.

CPU Switches

speed

(MHz)

Typ e 1 2 3 4 5

6

(Keyboard)

7 8

233

on

off off

on

off

off =

US & others

(default)

on =

Japan (only)

on

off

266

on on on

off off

on

off

300

on

off

on

off off

on

off

333

on on

off off off

on

off

366

on

off off off off

on

off

400 Dixon off

on on on on

off off

400 Celeron off

on on on

off

on

off

433

*

Celeron off off

on on

off off

on

466

*

Celeron off

on

off

on

off off

on

*

Requires mainboard version 4.4A or later.
Also requires mainboard BIOS update to version 1.01.26 and
H8 keyboard BIOS update to version 1.20 to allow for thermal throttling.

TABLE 3 - 1

CPU SWITCH SETTINGS

CPU Switches

speed

(MHz)

Type 1 2 3 4 5

6

(Keyboard)

7 8

233

on

off off

on

off

off =

US &

others

(default)

on =

Japan

(only)

(reserved)

266

on on on

off off

300

on

off

on

off off

333

on on

off of f off

366

on

off off off off

400 Dixon off

on on on on

400 Celeron off

on on on

off

Use this table for mainboard versions 4.3A and earlier

CPU upgrades

3

3 – 7

ñ

ð

CPU & SW1

FIG. 3 – 2

CPU upgrades

3

3 – 8

Disassembly

LCD module

GENERAL DISASSEMBLY:
REMOVING & REPLACING THE LCD MODULE

The LCD module can be removed with only a little more disassembly after you’ve removed the keyboard and heat
plate:

1. Using a flat-head screwdriver, pry the status panel (A) forward slightly.

2. Lift the status panel up and set it aside.

3. Remove the hinge covers (B & C). Use the flat-head screwdriver to flex the cover up and back slightly.

4. Disconnect controller connector JLCD1(D to E) and inverter connector JINV1 (F to G).

5. Remove the four (4) hinge screws (H ~ K), set them aside and lift the LCD module away from the body.

Note: the LCD’s ground connector (L).

If you are upgrading the LCD module to different size, stop here. The entire module should be replaced, including the
rear panel and frame. The new module uses different components, but connects in the same way as the original. Refer
to Appendix A for specific part numbers.

If you are only replacing the LCD panel with one of the same size, continue to page 3-9.

MODEL 3400 NOTE:

The status panel is inte­grated into the top cover.
However, removing hinge
cover “B” opens a space
large enough to pull through
the LCD power and control­ler cables.

3

3 – 9

B

C

,

H-I

F

A

G

-

J-K

L

ø

REMOVING THE LCD MODULE

FIG. 3 – 3

þ

Tip

This procedure involves:
screws 4
connectors: 2

LCD module

3

3 – 10

Disassembly

REPLACING THE LCD

The LCD module has two elements, the LCD itself, and its inverter card.
First separate the LCD module from the main body of the computer as described on pages 3-4 and 3-5.
If you are upgrading to a different LCD, this entire assembly, except for the hinge elements (G&H) and possibly the

inverter card (I), will be replaced.

12.1” DISASSEMBLY

This LCD is attached directly to the rear panel of the LCD module.

1. Remove the 4 rubber caps (A~D) and frame screws under them.
2 Snap off the LCD frame (E). As you do this, make sure the cover latch (F) doesn’t spring out. There are snaps on all

sides.

3. Disconnect the panel from the inverter board (G to H).

4. Remove the 4 LCD anchor screws (I~L), and lift the LCD (M) away from the rear panel (N).

5. Disconnect the LCD controller cable (O).

13.3” DISASSEMBLY

This LCD is mounted in a frame, which in turn attaches to the rear panel of the module.

1. Remove the 4 rubber caps (A~D) and frame screws under them.
2 Snap off the LCD frame (E). As you do this, make sure the cover latch (F) doesn’t spring out. There are snaps on all

sides.

3. Disconnect the panel from the inverter board (G to H).

4. Disconnect the LCD power cable from the inverter board (P to Q). Note: this cable is wrapped with the LCD
controller cable (R).

5. Remove the frame anchor screws (S&T) and lift the LCD panel (U) and frame away from the rear panel (V).

6. Remove the frame screws (W~Z)

REMOVING THE INVERTER BOARD

The inverter board is anchored to the rear panel of the LCD module with adhesive tape. If you need to remove it for
testing or replacement, make sure the system is disconnected from all power sources (including batteries). You should
disconnect all leads from the inverter before removing it from the LCD module. The inverter board itself is housed in
protective mylar. This package is itself glued together so separate it carefully to avoid tearing.

LCD module

3

3 – 11

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

Y

X

Z

A

B

C

D

E

F

G

H

W

V

LCD module

SEPARATING THE LCD & FRAME

FIG. 3 – 4

Left: 12.1” LCD module
Right: 13.3” LCD module

þ

Tip

This procedure involves:

12.1” 13.3”
screws 8 10
connectors: 2 2

3

3 – 12

Disassembly

GENERAL DISASSEMBLY: TOP COVER ASSEMBLY

The Top Cover Assembly contains the TouchPad and daughterboards for the Status Panel LEDs and the Power
Switch. However other components are only accessible after the Top Cover Assembly is removed.

Remove the keyboard, status panel, heat plate and LCD module as described on pages 3-5 and 3-9.

SEPARATING THE TOP COVER ASSEMBLY

1. If you haven’t already done so, remove the battery and DVD, CD-ROM, FDD or LS-120 module.

2. Turn the notebook body upside-down. Remove 13 screws (A~M).

3. Remove the 4 screws on the rear panel (N~Q).

4. Return the notebook to its upright position and remove the 2 screws in the status-panel area (R&S) and the 3
screws on the back edge (T~V).

5. Disconnect the on-board microphone at JINTMIC1 (W).

Note: This connection is anchored with tape to conform to heat-sink spacing.

6. Disconnect the touchpad connector at CN3 (X).

top cover & TouchPad

3400 MODEL NOTE

The equivalents of screws R
& S are located on the un­derside of the notebook
(roughly between screws J &
K and K & L respectively).

3

3 – 13

B

C

D

E

F

G

R

S

V

T

H

I

J

K

L

M

P - Q

A

N - O

X

W

U

top cover & TouchPad

TOP COVER DISASSEMBLY

(BOTTOM SCREWS)

FIG. 3 – 5

þ

Tip

This procedure involves:
screws 5
connectors 2

þ

Tip

This procedure involves:
screws 17

TOP COVER DISASSEMBLY

(TOP SCREWS)

FIG. 3 – 6

3

3 – 14

Disassembly

top cover assembly

GENERAL DISASSEMBLY: TOP COVER COMPONENTS

The 2 TouchPad daughterboards in this assembly are unlikely to require any service.

TOUCHPAD

The TouchPad module is in 2 parts: the TouchPad itself and the “mouse” buttons.
To take them out of the top cover assembly, first separate the top cover assembly as described on pages 3-12 and 3-13.

1. Disconnect the ribbon connector at J1 (A) on the mouse button board or J1 (B) on the TouchPad board.
Note: these connector sockets flip up to release the ribbon.

2. Remove the 4 screws (C~F) on the mouse board.

3. The TouchPad board is held in place by a collar (G) on the outer surface of the top cover. To remove this collar,
we recommend using a flat-head screwdriver to gently free the collar’s tabs which extend to the underside (seen
in the accompanying graphic).

MODEL 3400 & 3600 NOTE

To remove the TouchPad
board, remove the 2 screws
anchoring its bracket. Slide
the bracket either towards
the keyboard space (3600),
or to the left (3400) to re­lease it.

MICROPHONE

The on-board microphone (H) is anchored in place with tape.
No special tools are needed to remove it.

3

3 – 15

A

B

E - F

G

H

C - D

top cover assembly

TOP COVER ASSEMBLY

FIG. 3 – 7

þ

Tip

The TouchPad module has:

buttons Pad

board board

screws 4 2 (for

(3400

& 3600)

connectors 2 1

3

3 – 16

Disassembly

bottom cover

GENERAL DISASSEMBLY: BOTTOM COVER ASSEMBLY

The Bottom cover assembly includes the mainboard, HDD bracket, the IR board, power board, PCMCIA socket, and
optional fax/modem module (not shown).

HDD BRACKET

The HDD bracket is held in place with a single screw.

1. Remove the HDD bracket anchor screw (A).

2. Lift the HDD bracket & HDD door assembly away from the mainboard.

Note: The mylar insulation between the bottom of the bracket and the mainboard should remain attached to

the bracket- there are only 2 strips of adhesive tape holding it to the mainboard.

MAINBOARD

The lines connecting some of these components are taped in position. As you disconnect/remove them, note how this
is done. This is especially important in the area close to the CPU. If the lines are incorrectly positioned, the heat sink
will not fit,

3. Disconnect the speaker connector C from socket B.

4. Disconnect the fan (F) from socket G.

5. Remove screws H and I.

6. Angle the mainboard up from the right side. As you do so, flex the bottom case near the fax/modem port (J).
When there is enough clearance, pull the mainboard in slightly to clear the ports on the left edge (K).

3

3 – 17

D

A

I

H

G

B

F

E

C

J

õ

K

bottom cover

BOTTOM COVER ASSEMBLY

FIG. 3 – 8

þ

Tip

Separating the mainboard
from the bottom cover in­cludes:
screws 3
connectors 2

3

3 – 18

Disassembly

OPTIONAL FAX/MODEM MODULE, THE POWER BOARD, THE IR BOARD, AND IO BRACKET

These are the remaining components which can be separated from the mainboard. None of these parts are service­able. If any develop problems, the entire daughterboard should be replaced.

Note: The PC Card socket is soldered directly to the mainboard and so is not removeable.

FAX/MODEM MODULE (NOT SHOWN)

This daughterboard connects to the mainboard through the surface mounted socket at point A and then to the fax/
modem port through cable connector B. It is held in place with a single screw at point C.

THE POWER BOARD

This daughterboard (D) connects to the mainboard through two multi-pin sockets E&F. To separate the daughterboard,
gently rock it from side to side as you pull it up from the mainboard. The underside of the power board also has a strip
of mylar insulation which should not be removed.

THE IR BOARD

This small daughterboard (G) contains the IrDA port and the ON/OFF switch. It is attached to the IO Bracket with
two screws, H&I. It connects to the mainboard through cable J to socket IR1 (K).

THE IO BRACKET

This bracket, L, is held to the mainboard by six nuts (M~R).

bottom daughterboards

3

3 – 19

C

D

F

A

G

E

B

M-R

H-I

J

K

L

bottom daughterboards

FINAL SEPARATION

FIG. 3 – 9

þ

Tip

This procedure involves:
screws 9
connectors 2

3

3 – 20

Disassembly

÷

HDD

MODULE DISSASSEMBLY

We are not including specific instructions for the FDD, LS-120, CD-ROM and DVD-ROM modules. If any upgrade or
replacement is required, the entire module should be replaced.

If for some reason a specific part must be replaced, refer to the “exploded” drawings in Appendix A for the position
and part number.

HDD MODULE

A detailed description of how to disassemble this module is included in the User’s Manual Chapter 6: Extras. We
strongly recommend reviewing that document. It includes additional information on how to setup the hard disk for
use. Those instructions may be more current than those provided here.

The section which follows is “lifted” from the 1st version of the User’s manual.

REMOVING THE HDD MODULE

To remove the HDD cartridge:

1. Make sure the computer is turned off.

2. Open the HDD bay door.

3. Unfurl the mylar pull-tab and use it to pull the HDD module out .

M

Removal Warning

Don’t try to remove the
hard disk (HDD) while the
system is on. This will make
the system “crash”, result­ing in data loss or damage.

REMOVING THE HDD

FIG. 3 – 10

Refer to the text in the ac­companying instructions.

M

Warranty Warning

Under some warranty con­ditions, the user may not
remove the hard disk. If this
applies, note any indica­tions that the warranty has
been violated.

3

3 – 21

A

B

C

D

HDD

M

Contamination

Warning

Do not touch the HDD’s
connector pins or elec­tronic components. Even
the cleanest hands have
oils which may attract cor­rosive particles.

REPLACING/UPGRADING THE CARTRIDGE

You can replace your HDD with another 2.5", 9.5mm high IDE HDD.
If you’re too harried or a bit of a techno-phobe, or the system is still under warranty, contact your dealer to purchase

or replace your current HDD with an upgrade.
If you intend to do the work yourself, you will need the following:

A clean, dry, and level work area.
A small philips-head screwdriver.
A very thin flat-head screwdriver.
You should also wear an anti-static wrist-strap (available from most computer supply centers).

TAKING IT APAR T

After you’ve removed the HDD module,

1. Remove the four (4) bracket screws (A~D),
and set them aside.

2. Carefully flex the bracket to release the HDD.
(Do not shake it!)

HDD MODULE DISASSEMBLY

FIG. 3 – 11

For instructions, refer to the
accompanying text.

3

3 – 22

Disassembly

1

2

3

÷

HDD MODULE ASSEMBLY

When you’re ready to install a new hard disk,

1. Hold the HDD by its edges and orient it so that the connector pin side faces the open end of the
bracket.

2. Settle the bracket around the module. In the correct position, the holes in the bracket’s sides
line-up with the module’s screw holes.

3. To fit into the HDD bay, the hard disk’s sides must not extend outside the bracket.

M

HDD JumperWarning

Some (usually older) HDDs
have a small jumper
switch. It must be set to
“master” or the system
may not correctly recog­nize the drive. Check your
drive’s documentation.

HDD MODULE ASSEMBLY

FIG. 3 – 12

1. cartridge frame

2. HDD (electronics face­down)

3. connector

Refer to the text in the ac­companying instructions.

HDD

3

3 – 23

SETTING UP A NEW HDD FOR THE FIRST TIME

Before you can use a new HDD for the first time, you have to do two things:

• tell the computer about the HDD (refer to Chapter 4: Firmware).

• prepare the HDD to accept data (refer to your operating system manual).

Use the following directions to prepare the new HDD for use.

HARDWARE

After you replace or upgrade the HDD, turn the system
on and configure it for the newly-installed HDD using
Setup. Refer to Chapter 4: Firmware.

528MB OR LARGER HDDS & LBA MODE

The notebook automatically assumes any HDD 528MB
or larger uses LBA Mode. If the HDD was formatted on
an older system which did not use LBA mode, use the
Setup utility (refer to Chapter 4: Firmware) to manually
adjust the LBA setting for the Primary Master. If you
don’t, the system will not “see” it correctly.

The default, “Auto” type setting uses LBA mode. Use
this if you’re preparing a “fresh” HDD.

SOFTWARE

A hard disk must be partitioned, and formatted before
use.

PARTITIONING

To partition the HDD, use the utility from your operat­ing system (e.g. Microsoft’s fdisk command) to do this.

Note: If you want to use the Save to Disk Partition fea­ture, refer to Chapter 5: Power before you partition the
HDD.

FORMATTING

To format, use the utility from your operating system
(e.g. Microsoft’s format/s command). Consult your op­erating system’s manual for more information on its par­titioning and formatting utilities.

M

Save to Disk

Warning

Whenever you install a dif­ferent hard disk that has
a Save to Disk partition on
it, make sure you follow
the procedures detailed in
Chapter 4: Firmware and
Chapter 5: Power.

HDD

3

3 – 24

Disassembly

1

2 3 4 5 6 7

8

9

10

11

12

25

18

16

13

14

15

17

19

22

21

20

23 24

INVERTER BOARD (TOP)

POWER BOARD

(TOP)

MAINBOARD (TOP)

switches & connectors

PORTS & CONNECTORS

(TOP VIEWS)

FIG. 3 – 13

Mainboard

1. PS/2 port

2. DC-in 19V

3. VGA port

4. Port Replicator port

5. Parallel port

6. Serial 1 (COM1) port

7. Fax/Modem Port

8. JINV1 to #24 (inverter)

9. JLCD1 to LCD

10. JMODEM4 to Fax/Modem

11. JIR1 to #26 (IR Board)

12. JMODEM2 to Fax/Modem

13. USB port

14. JINTMIC to onboard mic

15. JFAN to fan

16. PCMCIA connection

17. JINTKB1 to Keyboard

18. JBAY1 to modules

19. JDD1 to #34 (Power)

20. INTSPK1 to speakers

21. JHDD1 to Hard Disk Drive

22. JDD2 to #36 (Power)

Inverter Board

23. CN2 to #8 (Mainboard)

24. CN1 to LCD power

IR Board

25. JIR1 to #11 (Mainboard)

Charger Board

26. CN3 to TouchPad

SWITCHES & CONNECTORS

The following figures show the locations of the mainboard
and principal daughterboard’s switches and connectors.

26

3

3 – 25

27

!!

28

29

30

31

32

!"

!#

INVERTER BOARD (BOTTOM)

POWER BOARD

(BOTTOM)

MAINBOARD (BOTTOM)

switches & connectors

PORTS & CONNECTORS

(BOTTOM VIEWS)

FIG. 3 – 14

Mainboard

27. IrDA port

28. JDIM1 RAM bay 1

29. JDIM2 RAM bay 2

30. Jack1 audio line-in

31. Jack2 phones

32. Jack3 ext. microphone

Charger Board

33. CN1 to #19 (Mainboard)

34. CN4 to mian battery pack

35. CN2 to #22 (Mainboard)

3

3 – 26

Disassembly

NOTES:

notes

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4 – 1

4 Troubleshooting

If you are having trouble diagnosing and solving problems, this chapter has several tools which should help:

• Troubleshooting chart – a system flow chart indicating the location of possible system abnormalities.

• Pre-POST assistant – a rundown of possible problems before the POST and solutions.

• POST assistant – a listing of beeps and error messages and their definitions.

• Post-POST assistant – a rundown of possible problems after the POST and solutions.

This chapter does not tell you how to disassemble the notebook. For those procedures, go back to Chapter 3:
Disassembly.

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Troubleshooting

4 – 2

BEFORE YOU BEGIN

Before you start a troubleshooting job, be sure that:

• All peripheral devices are disconnected from the notebook. (They should be tested separately.)

• You have reviewed the safety precautions in the beginning of Chapter 3: Disassembly.

TOOLS

In addition to the tools listed in Chapter 3, troubleshooting jobs may call for some additional devices:

• Multimeter

• Transistor checker

• Oscilloscope (100 MHz)

• Soldering/de-soldering station (30W)

precautions & tools

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4 – 3

SYSTEM TROUBLESHOOTING CHART

Use the following troubleshooting flow chart to locate the problem areas systematically.

flow-chart

TROUBLESHOOTING FLOWCHART

FIG. 4 – 1

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Troubleshooting

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pre-POST

PRE-POST ASSISTANT

This section describes possible problems before the Power-On-Self-Test (POST) and ways to solve them.

TABLE 4 – 1

PRE-POST PROBLEMS

Possible Problems Possible Causes

AC power LED fails The AC/DC adapter has malfunctioned.

AC power & charge LEDs fail

1. The power board has failed.

2. The battery pack has malfunctioned or its
connection to the power board is bad.

3. There is a short circuit in the system board.

LCD screen fails to display

1. There is a bad connection between the LCD screen
and the system board.

2. The inverter board has failed.

3. The LCD screen has malfunctioned.

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AC/DC adapter

AC POWER LED FAILS

Under normal conditions, plugging in the AC/DC adapter makes the AC Power LED light up. If it fails to light up, it
is possible that the AC/DC adapter is malfunctioning. If you think this is the case, try the following:

• Make sure the power cord to the adapter is securely plugged into a properly grounded socket.

• Make sure the adapter is completely connected to the adapter port on the computer.

• Check the adapter’s contacts.

AC/DC ADAPTER

The AC/DC adapter serves as both the system power source and the battery pack charger. Check the adapter’s
contacts to see if the AC/DC adapter has failed. (Figure 4-2)

TABLE 4 – 2

ADAPTER CONTACTS

ADAPTER’S CHECK POINTS

FIG. 4 – 2

Pin 2

Pin 1

Contact Assignment Description

inner ring (Pin 1) 20V +20V/2.8A The adapter is in CV (constant voltage mode).
outer ring (Pin 2) GND

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Troubleshooting

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power

AC POWER & CHARGE LEDS FAIL

There may be other problems responsible for a system status LED’s failure to appear:

• The power board failed.

• The battery pack malfunctioned or its connection with the power board is bad.

• There is a short circuit in the system board.
Try the following troubleshooting procedures.

CHECKING THE POWER BOARD

A blown fuse or an incorrect output voltage on the power board may cause the system status LEDs’ malfunction.

CHECKING THE FUSES

If the fuses are blown, replace them. See the figures on the next page for the location of the fuses on the power
board. Each fuse is stamped with a rating.

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4 – 7

power board

POWER COMPONENTS

FIG. 4 – 3

1. F1 fuse for adapter’s output

2. JAC1 for AC adapter plug

3. CN1 to Mainboard

4. CN2 to Mainboard

5. CN4 for primary battery

6. F1 fuse for +12V

7. F2 fuse for primary battery

8. CN3 for TouchPad switch

Power Board
bottom

Power Board
top

2

3

4

6

5

8

1

7

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CN1 Power Board to M/B (on the Power Board)

Pin Signal Pin Signal

1 VIN 2 VIN
3GND4 VIN
5GND6GND
7VA8VA
9VA10VA

11 GND 12 GND
13 GND 14 GND
15 SHUTDOWN 16 SMBCLK

17 SMBDATA 18 BATVOLT
19 CHAGEN 20 CURSEN

21 DDON 22 BATFULL
23 BATTEMP 24 BATTYPE
25 +1.8VS 26 SUSB#
27 GND 28 CPU-ONL
29 GND 30 +1.6VS

CN3 TouchPad Switch Connector (on the Power Board)

Pin Signal

1 +5VS
2TPADCLK
3 TPADDATD
4 LID-RSUM
5GND

power board

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4 – 9

CN2 Power Board to M/B (on the Power Board)

Pin Signal Pin Signal

1 TPADCLK 2 TPADDATA
3 +5VS 4 LID-RSUM#
5+5V6+5V
7 +5V 8 +5V
9 +5VH8 10 GND
11 GND 12 GND

13 GND 14 +12V
15 GND 16 GND
17 GND 18 GND
19 GND 20 +3.3V
21 +3.3V 22 +3.3V
23 +3.3V 24 +3.3V
25 GND 26 3S2P_ON
27 GND 28 GND
29 +2.5V 30 +2.5VS

CN4 Power Board to Battery Connector on the Power Board)

Pin Signal

1GND
2BATTEMP
3BDATA

4BCLK

5VB

power board

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4 – 10

battery

CHECKING THE BATTERY PACK AND ITS CABLING

A malfunctioning battery pack or a bad connection between the battery pack and the power board may be the cause
of the LEDs’ failure.

CHECKING THE BATTERY PACK

Whether the battery pack functions well or not can be checked by measuring the voltage across battery contacts
BAT and GND. Figure 4-3, on page 4-7, shows the battery pack connector’s location and its associated fuse. Figure
4-4 below is the battery circuit diagram. The measured voltage should be between 9V to 16.8V. (The voltage for a
fully charged Ni-MH battery pack is around 9.6V while Li-Ion battery is around 10.8V for 3S2P or 14.4V for 4S2P.)
If the supply voltage is still not in the correct range, replace the faulty battery pack.

BATTERY C IRCUITRY

FIG. 4 - 4

Li-Ion Battery

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status panel & inverter

CHECKING THE CABLING

If the battery pack is functioning properly, check if the measured voltage across pins 1 to 5 of connector CN4 on the
power board (Fig. 4-3) is the same as the voltage measured for the battery pack. If the measured voltages are not the
same, check if the fuse on the power board has been damaged.

CHECKING THE SYSTEM BOARD

Automatic short-circuit protection

may have been activated by a short circuit occurring in the system. The system cannot
be turned on with automatic short-circuit protection activated. If you detect a short circuit in the system board, fix the
problem accordingly.

JLCD1

JINV1

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LCD & system board

LCD SCREEN FAILURE TO DISPLAY

The LCD screen’s inability to display may be due to any of the following problems:

• There is bad connection between the LCD screen and the system board

• The inverter board has malfunctioned

• The LCD screen has malfunctioned

CHECKING THE LCD TO SYSTEM BOARD CONNECTION

A bad connection between the LCD screen and the system board may be the cause of the LCD screen’s failure to
display. If the LCD control signal cable is frayed or is not properly plugged into connector JLCD1 on the system
board (Figure 4-5 ), either situation may have caused the LCD not to display. Replace the cable if it is frayed or plug
it in if it is loose. If the problem still persists, proceed with the rest of the checking job.

LCD TO MAINOARD

CONNECTION

FIG. 4 – 5

JLCD1

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4 – 13

LCD & inverter

CHECKING THE INVERTER BOARD

Table 4-3 suggests areas where problems may occur and provides corresponding corrective actions. The compo­nent sites of the inverter board are shown in Figure 4-6.

TABLE 4 – 3

INVERTER BOARD

CHECK AREAS

M

Warning

Inverter boards have high­voltage areas. To prevent
electrical shock, do not
touch the board when the
system is on.

INVERTER BOARD

COMPONENT SITES

FIG. 4 - 6

CN1

JINV1

CN2

CN1 Inverter to JINV1 on
M/B

Pin Signal

1VIN DC
2BRGHT
3ON/OFF
4GND

Area to Check Action

Fuse 1.0A (F1) Check the fuse and replace it if necessary.

Connector CN1

Check if the voltages of all the pins of this connector are correct. (see the
following figure). If any of the pins presents an incorrect voltage, check if
the connection between the inverter board and the system board is OK. If
the connecting cable is loose or frayed, plug it in or replace it. If the
problem still persists, replace the inverter board.

Connector CN2

Check if the cable connecting the LCD lamp to the inverter board is well
plugged into connector CN2. If there is no connection problem, replace
the inverter board.

F1

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Troubleshooting

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LCD status

CHECKING THE LCD SCREEN

If you found no problems with the inverter board and its connection to the system board and the LCD lamp, and the
LCD still doesn’t work, it is possible that the LCD screen itself may have malfunctioned. Replace the LCD screen to
see if the problem can be solved. If the problem persists, send the notebook to the nearest service center for repair.

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4 – 15

POST

POST — TESTING THE SYSTEM

Each time the system is powered on, it automatically performs a Power-On-Self-Test (POST). The POST tests major
system hardware and checks the system configuration.

Error beeps and messages If the system can’t pass the POST, an error beep or message may be issued or displayed.

This will indicate the problem with the system.

If any major component malfunctions, send the notebook to the nearest service center for replacement.

NO ERRORS FOUND DURING THE POST

The BIOS will initialize the video, sound a single short beep, and show a message if the system passes the POST. The
system then will attempt to boot. If there is a problem which prevents the system from booting, it will tell you to run
Setup. A sample screen message is shown below.

STARTUP SCREEN: THE POST

FIG. 4 – 7

If you choose the Quiet Boot op­tion (not available for all mod­els) in the Setup utility, you will
only see an abbreviated version
of this screen.

1. BIOS information

2. CPU type

3. memory status

4. HDD identification notice

5. error notice (example)

6. Enter

Setup

cue - appears

only during POST

Note: your POST may identify dif­ferent components.

Phoenix BIOS 4.Ø Release 6.Ø
Copyright 1985-1999 Phoenix Technologies Ltd.
All Rights Reserved.

Notebook Computer Version 1.00.1.00

01.19-1.00.06
CPU = Intel(R) Mobile Pentium(R) II Processor 333 MHZ

64ØK System RAM Passed
63M Extended RAM Passed
Ø256K Cache SRAM Passed
System BIOS shadowed
Video BIOS shadowded
Mouse initialized
Fixed Disk Ø: FUJITSU MHH2032AT
ATAPI CD-ROM: TOSHIBA 1902-B
WARNING
ERROR
Parallel Port configuration changed

Press <F2> to enter SETUP, <F12> to enter BOOT MENU

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Troubleshooting

4 – 16

error beeps

POST ERROR BEEPS & SCREEN MESSAGES

Errors, fatal or non-fatal, can occur during the POST. All fatal errors and some non-fatal errors are communicated
through a series of audible beeps. Table 4-4 below lists the error beep messages. Fatal errors do not allow the system
to continue the boot process.

Most displayed errors as listed in Table 4-5 (pages 4-17 to 4-19) and Table 4-6 (pages 4-20 to 4-23), allow the system
to continue the boot process. The system will halt after one of the screen messages and cannot usually be rebooted
until a physical change is made in the system.

For most errors there will be only one message displayed. However, a second message may appear: RUN SETUP. If
this message occurs, press F2 to run Setup.

TABLE 4 – 4

FATAL E RROR MESSAGES

Error Code Beep Sequence Description

16 1-2-2-3 BIOS ROM checksum

20 1-3-1-1 Test DRAM refresh

22 1-3-1-3 Test 8742 Keyboard controller

2C 1-3-4-1 RAM failure on address line xxxx

2E 1-3-4-3

RAM failure on DATA bits xxxx of low byte

of

memory bus

30 1-4-1-1 RAM failure on DATA bits xxxx of high type of memory bus

46 2-1-2-3 Check ROM copyright notice

58 2-2-3-1 Test for unexpected interrupts

each beep group is separated by a pause

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4 – 17

TABLE 4 – 5

NON-FATAL ERROR MESSAGES

non-fatal error messages

Meassage Description & Suggested Solution

nnnn

Cache SRAM Passed

description:

Where

nnnn

is the amount of system cache in kilobytes successfully

tested.

Diskette drive A error or Diskette drive B error

description:
solution:

Drive A: or B: is present but fails the BIOS POST diskette tests.
Check to see that the drive is defined with the proper diskette type in

Setup

and

that the diskette drive is attached correctly.

Entering SETUP...

description: Starting

Setup

Program.

Extended RAM failed at offset:

nnnn

description:
solution:

The extended memory is either not working, or is imporperly configured.
Enter the

Setup

and allow the system to redetect the memory. Check that any
DIMM modules are properly seated in their sockets. Try restarting the system. If
the problem persists, remove the DIMMs and reboot. Replace any faulty
DIMMs.

nnnn

Extended RAM Passed

description:

Where

nnnn

is the amount of RAM in kilobytes successfully tested.

Failing Bits:

nnnn

description:

solution:

Where hex number

nnnn

is a map of the bits at the RAM address (in System,
Extended, or Shadow memory) which failed the memory test. Each 1 (one) in the
map indicates a failed bit.
Turn off the system and remove any DIMMs. Restart the system. If the problem
disappears, replace the DIMMs one at a time to identify the defective module.
Replace any defective DIMMs.

Fixed Disk Ø Failure or Fixed Disk 1 Failure or Fixed
Disk Controller Failure

description:
solution:

The hard disk is not working, or is not properly configured.
Check that the HDD is properly attached. Run

Setup

to make sure the HDD is

correctly configured.

Incorrect Dirve A type - run SETUP

description: Type of floppy drive A: not correctly identified in

Setup

.

Invalid NVRAM media type

description: Problem with NVRAM (CMOS) access.

Keyboard Controller Error

description:
solution:

The keyboard controller failed test.
You may have to replace keyboard or controller.

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TABLE 4 – 5 (CONT.)

NON-FATAL ERROR M ESSAGES

non-fatal error messages

Meassage Description & Suggested Solution

Keyboard Error

description:
solution:

The keyboard is not working.
Reboot the computer. If the problem persists, replace the computer.

Keyboard Error

nn

description:

solution:

The BIOS discovered a stuck key and displays the scan code nn for the stuck
key.
Try toggling the keys. Reboot the computer. If the problem persists, replace the
keyboard.

Keyboard Locked - Unlock Key Switch

description: Unlock the system to proceed.

Monitor type does not match CMOS- run

SETUP

description: The monitor type is not correctly identified in

Setup

.

Operating system not found

description:
solution:

The operating system cannot be found on either drive A: or drive C:.
Enter

Setup

and make sure the HDD and drive A: are properly identified.

Parity Check 1

description: A parity error was found in the system bus. The BIOS attempts to locate the

address and display it on the screen. If it cannot locate the address, it displays
????.

Parity Check 2

description: A parity error was found in the system bus. The BIOS attempts to locate the

address and display it on the screen. If it cannot locate the address, it displays
????.

Press <F1> to resume, <F2> to

Setup

description: Displayed after any recoverable error message. Press <F1> to start the boot

process or <F2> to enter

Setup

and change any settings.

Press <F2> to enter

SETUP,

<F12> to enter Boot Menu

description: Optional message displayed during POST. Can be turned off in

Setup

.

Previous boot incomplete-Default configuration used

description:

solution:

The previous POST did not complete successfully. The POST loads defult values
and offers to run

Setup

. If the failure was caused by incorrect values and they
are not corrected, the next boot will likely fail. On systems with control of wait
states, improper

Setup

can also terminate POST and cause this error on the next
boot.
Run

Setup

and verify the wait-state configuration is correct. This error is cleared

the next time the system is booted.

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4 – 19

TABLE 4 – 5 (CONT.)

NON-FATAL ERROR MESSAGES

non-fatal error messages

Meassage Description & Suggested Solution

Real time clock error

description:
solution:

The on-board clock fails the BIOS test.
May require board repair.

Shadow RAM failed at offset:

nnnn

description:

solution:

The shadow RAM failed at the offset

nnnn

of the 64K block at which the error
was detected.
Try to restart the system. Check that the DIMMs are properly seated.

nnnn

Shadow RAM Passed

description: Where

nnnn

is the amount of shadow RAM in kilobytes successfully tested.

System battery is dead - Replace and run

SETUP

description:
solution:

The CMOS clock battery indicator shows the battery is dead.
Replace the battery and run

Setup

to reconfigure the system.

System BIOS shadowed

description: System BIOS copied to shadow RAM.

System cache error - Cache disabled

description: RAM cache failed the BIOS test and has been disabled.

System CMOS checksum bad - run

SETUP

description:

solution:

The CMOS has been corrupted or incorrectly modified, perhaps by an
application program that changes data stored in the CMOS.
Run

Setup

to reconfigure the system either by getting the Default Values and/or

making your own selections.

System RAM failed at offset:

nnnn

description: The system RAM failed at the offset

nnnn

of the 64K block at which the error

was detected.

nnnn

System RAM passed

description: Where

nnnn

is the amount of system RAM in kilobytes successfully tested.

System timer error

description:
solution:

The timer test failed.
Go to

Setup

and reset the Date and Time fields.

UMB upper limit segment address:

nnnn

description: Displays the address

nnnn

of the upper limit of Upper Memory Blocks,
indicating released segments of the BIOS which may be reclaimed by a virtual
memory manager.

Video BIOS shadowed

description: Video BIOS successfully copied to shadow RAM.

"

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Troubleshooting

4 – 20

TABLE 4 – 6

PHOENIX BIOS POST

DEFAULT T EST POINTS

(DISPLAYED ON DEBUG CARD)

POST error messages

edoCrorrE noitinifeD

20edomlaeryfireV

40epytUPCteG

60erawdrahmetsysezilaitinI

80

htiwsretsigertespihcezilaitinI

seulavTSOPlaitini

90galfTSOPniteS

A0sretsigerUPCezilaitinI

B0ehcacUPCelbanE

C0seulavTSOPlaitiniotsehcacezilaitinI

E0O/IezilaitinI

F0EDIsublacolehtezilaitinI

01tnemeganaMrewoPezilaitinI

11

htiwsretsigeretanretladaoL

seulavTSOPlaitini

21

drowlortnocUPCerotseR

toobmrawgnirud

41rellortnocdraobyekezilaitinI

61

muskcehcMORSOIB

)3-2-2edocpeeb(

81noitazilaitiniremit4528

A1noitazilaitinirellortnocAMD7328

C1

elbammargorpteseR

rellortnocpurretni

edoCrorrE noitinifeD

021-1-3edochserferMARDtseT

22

rellortnocdraobyek7428tseT

)3-1-3edocpeeb(

42BG4otretsigegtnemgesSEteS

82MARDezisotuA

A2MARDesabK215raelC

C2

'xxxxenilsserddanoeruliafMAR

)1-4-3edocpeeb(

E2

wolfo'xxxxstibatadnoeruliafMAR

subyromemfoetyb

)3-4-3edocpeeb(

03

hgihfo'xxxxstibatadnoeruliafMAR

subyromemfoetyb

)1-1-4edocpeeb(

23ycneuqerfkcolcsubUPCtseT

43MARSOMCtseT

53sretsigertespihcetanretlaezilaitinI

63nwodtuhstratsmraW

73)ylnoBM(tespihcehtezilaitinieR

83MORSOIBmetsyswodahS

93)ylnoBM(ehcacehtezilaitinieR

A3ehcacezisotuA

C3sretsigertespihcdecnavdaerugifnoC

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4 – 21

POST error messages

TABLE 4 – 6(CONT.)

PHOENIX BIOS POST

DEFAULT T EST POINTS

(DISPLAYED ON DEBUG CARD)

edoCrorrE noitinifeD

D3seulavSOMChtiwsretsigeretanretladaoL

04deepsUPClaitiniteS

24srotcevtpurretniezilaitinI

44stpurretniSOIBezilaitini

64

ecitonthgirypocMORkcehC

)3-2-1-2edocpeeb(

74sMORnoitpoICProfreganamezilaitinI

84SOMCtsniaganoitarugifnocoedivkcehC

94seciveddnasubICPezilaitinI

A4metsysnisretpadaoedivllaezilaitinI

B4neercs™tooBteiuQyalpsiD

C4MORSOIBoedivwodahS

E4ecitonthgirypocyalpsiD

05deepsdnaepytUPCyalpsiD

15draobASIEezilaitinI

25draobyektseT

45delbanefikcilcyekteS

65draobyekelbanE

85

stpurretnidetcepxenuroftseT

)1-3-2-2edocpeeb(

A5"puteSretneot2FsserP"tpmorpyalpsiD

C5K046dna215neewtebMARtseT

edoCrorrE noitinifeD

06yromemdednetxetseT

26senilsserddayromemdednetxetseT

461hctaPresUotpmuJ

66sretsigerehcacdecnavdaerugifnoC

86sehcacUPCdnalanretxeelbanE

A6ezisehcaclanretxeyalpsiD

C6egassemwodahsyalpsiD

E6stnemgeselbasopsid-nonyalpsiD

07segassemrorreyalpsiD

27srorrenoitarugifnocrofkcehC

47kcolcemit-laertseT

67srorredraobyekrofkcehC

A7nokcolyeKroftseT

C7srotcevtpurretnierawdrahroftseT

E7tneserpfirossecorpoctseT

08stropO/IdraobnoelbasiD

28strop232SRlanretxellatsnidnatceteD

48stroplellaraplanretxellatsnidnatceteD

58secivedASIPnPelbitapmoc-CPezilaitinI

68stropO/Idraobnoezilaitini-eR

88aeraataDSOIBezilaitinI

"

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Troubleshooting

4 – 22

TABLE 4 – 6(CONT.)

PHOENIX BIOS POST

DEFAULT T EST POINTS

(DISPLAYED ON DEBUG CARD)

edoCrorrE

noitinifeD

A8aeraataDSOIBdednetxEezilaitinI

C8rellortnocyppolfezilaitinI

09rellortnocksiddrahezilaitinI

19rellortnocksiddrahsub-lacolezilaitinI

292hctaPresUotpmuJ

39sdraobrossecorp-itlumrofELBATPMdliuB

49enilsserdda02AelbasiD

59toobrofMOR-DCllatsnI

69retsigertnemgesSEeguhraelC

89sMORnoitporofhcraeS

A9sMORnoitpowodahS

C9tnemeganaMrewoPputeS

E9stpurretnierawdrahelbanE

0AyadofemitteS

2AkcolyeKkcehC

4AetarcitamepytezilaitinI

8Atpmorp2FesarE

AAekortsyek2FrofnacS

CAretnEPUTES

EAgalfTSOP-noraelC

0BsrorrerofkcehC

POST error messages

edoCrorrE noitinifeD

2B

enodTSOP

metsysgnitarepotooboteraperp-

4BpeebenO

5Bunem™tooBitluMyalpsiD

6B)lanoitpo(drowssapkcehC

8BelbatrotpircsedlabolgraelC

CBsrekcehcytirapraelC

EB)lanoitpo(neercsraelC

FBsrednimerpukcabdnasurivkcehC

0C91TNIhtiwtoobyrT

0DrorrereldnahtpurretnI

2DrorretpurretninwonknU

4DrorretpurretnignidneP

6DrorreMORnoitpoezilaitinI

8DrorrenwodtuhS

ADevomkcolbdednetxE

CDrorre01nwodtuhS

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4 – 23

TABLE 4 – 6(CONT.)

PHOENIX BIOS POST

DEFAULT T EST POINTS

(DISPLAYED ON DEBUG CARD)

The table below is for the boot block in the Flash ROM.

POST error messages

edoCrorrE noitinifeD

2EtespihcehtezilaitinI

3EretnuochserferezilzitinI

4EhsalFdecroFrofkcehC

5EMORfosutatsWHkcehC

6EKOsiMORSOIB

7EtsetMARetelpmocaoD

8EnoitazilaitiniMEOoD

9ErellortnoctpurretniezilaitinI

AEedocpartstoobehtnidaeR

BEsrotcevllaezilaitinI

CEmargorphsalFehttooB

DEecivedtoobehtezilaitinI

EEKOdaersawedoctooB

"

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Troubleshooting

4 – 24

TABLE 4 – 7

POST-POST PROBLEMS

post-POST errors

POST-POST PROBLEMS

This section describes possible problems the user might encounter after the POST and suggests problem-solving
methods. Possible problems and possible causes leading to them are outlined below.

Problems Possible Causes

PCMCIA socket fails to work

1. Something wrong with the socket.

2. Something wrong with the card in use.

Speakers fail to output sound

1. The audio driver is not properly installed.

2. The volume control key combinations are not properly adjusted.

3. The speaker cables are loose or frayed.

Charge LED fails to display

1. The battery pack has malfunctioned.

2. The AC/DC adapter has malfunctioned.

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4 – 25

TABLE 4 – 8

POSSIBLE PC CARD PROBLEMS &

SOLUTIONS

PC Cards

PC CARD SOCKET MALFUNCTION

The faulty conditions the user might encounter when using the PC Card socket are listed below along with corre­sponding solutions.

Possible faulty condition Solution

Failure to insert the card into the socket If the card cannot be inserted into the socket, check for

obstructions. If the system was reassembled, recheck if there is
anything wrong with the reassembly procedures, or send the
notebook to the nearest service center for repair.

Failure to read from an inserted card 1. Check if the card is properly inserted.

2. Check if the card is configured with appropriate drivers.
(For software installation, see the User's Manual.)

3. Check with the card vendor to see if the card is damaged.

4. If the card is still not readable, send the notebook to
the nearest service center for repair.

Data reading error (SRAM card) 1. Replace the SRAM card's battery if necessary.

2. Check with the card vendor to see if the card is damaged.

3. If the problem persists, send the notebook to the
nearest service center for repair.

"

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4 – 26

SOUND OUTPUT FAILURE

The notebook’s internal audio unit consists of the audio circuitry, built-in speakers, and built-in microphone. If the
user cannot receive sound from the notebook’s internal speakers, it may be due to any of the following problems:

• The audio chip is not configured with the supplied audio driver.

• The volume control key combinations (Fn + F3, Fn + F5 & Fn + F6) are not properly adjusted.

• The speaker cables are loose or frayed.

CHECKING THE SOFTWARE CONFIGURATION

To work, the audio unit should be configured with the audio driver on the Device Drivers and Tools CD-ROM
supplied with the notebook. The audio driver installation is described in the User’s Manual. Install the driver if the
user failed to do so. If the problem persists, continue checking.

CHECKING THE VOLUME

The sound cannot be heard if the volume control key combinations are not properly adjusted. Adjust the volume to
the point you will be able to receive sound. If you still cannot hear any sound from the speaker, check the speakers’
cable connections.

If you are using earphones or self-powered speakers, make sure they are properly set up.

sound

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4 – 27

CHECKING THE SPEAKER CABLE

If the speaker cables are not properly plugged into their connector, or they are frayed, the speakers may not work.
First locate connector JINTSPK1 on the mainboard, then check if the speaker cables are loose or frayed. Replace
each cable if it is frayed or plug it in if it is loose.

speakers

SPEAKER CONNECTOR ON MAINBOARD

FIG. 4 – 8

1. JINTSPK1 for both speakers

2. Speakers

LOCATING SPEAKER CONNECTOR IN THE BOTTOM COVER

1. Dissassemble the bottom cover. (See Chapter 3: Disassembly.)

2. The figure below shows how the speakers are connected.

1

2

2

"

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Troubleshooting

4 – 28

suspend & battery status

SUSPEND FUNCTION FAILURE

Pressing the suspend key combination will enable the system to enter Suspend mode after few seconds. The power
status LED will not light if the system is in Save to Disk mode. If the system can’t enter Suspend mode it may be
because the Power Savings in your BIOS setup are not set properly. If any of the current settings are wrong, change
them.

CHARGE LED FAILURE

If the Charge LED doesn’t turn green after the battery pack has been recharged for about 3 hours with power off or
6 hours with power on, there are several possible explanations:

• The battery pack is malfunctioning.

• The AC/DC adapter is malfunctioning.

• The Charge LED is malfunctioning.

Replace the battery pack and recharge the new one. If the Charge LED still does not turn green after the necessary
recharge time, check or replace the AC/DC adapter. If the problem persists with the new AC/DC adapter, check the
Charge LED or send the notebook to the nearest service center for repair.

A

A – 1

Appendix A Part Lists

This appendix breaks down the notebook’s construction into a series of “exploded” illustrations. The com­ponent part numbers are indicated in the tables opposite the drawings.

Note: This section indicates the manufacturer’s part numbers. Your organization may use a different

system, so be sure to cross-check any relevant documentation.

Note: Some assemblies may have parts in common (especially screws). However, the part lists do not

indicate the total number of duplicated parts used.

Note: Be sure to check any update notices. The parts shown in these illustrations are appropriate for the

system at the time of publication. Over the product life, some parts may be improved or re­configured, resulting in new part numbers.

A

A – 2

Parts

general assembly

3200 BOTTOM ASSEMBLY

FIG. A – 1

33

33

49

49

48

48

49

49

50

50

27

27

27

1

7

2

11

11

13

13

8

9

10

10

12

12

15

43

16

17

18

21

42

41

40

25

25

23

23

35

35

21

22

22

20

16

19

14

6

2
3

4

5

2

26

25

27

34

34

47

47

30

2

31

31

32

32

29

29

36

22

28

27

44

46

21

21

45

45

27

38

18

18

21

21

18

18

39

39

37

41

41

24

24

18

18

A

A – 3

top cover assembly

3200 BOTTOM ASSEMBLY PARTS LIST

FIG. A – 2

33-32027-000

33-32027-000

33-32030-000

33-32030-000

33-32029-000

33-32029-000

50
51

49

48

35-B6120-4R0

35-B6120-4R0

33-32006-002

33-32006-002

PART NO

PART NO

03-DIXON-740

03-DIXON-740

77-32004-00X

77-32004-00X

REMARK

REMARK

43-32007-002

43-32007-002

33-32014-000

33-32014-000

77-32000-11X

77-32000-11X

79-3200C-210

79-3200C-210

40-32003-000

40-32003-000

40-32008-000

40-32008-000

77-32001-00X

77-32001-00X

43-32008-001

43-32008-001

39-32006-003

39-32006-003

47-32001-030

47-32001-030

35-B2120-9R0

35-B2120-9R0

35-B6120-5R0

35-B6120-5R0

39-32014-000

39-32014-000

79-3202B-012

79-3202B-012

47-32001-010

47-32001-010

39-32017-000

39-32017-000

79-3200S-042

79-3200S-042

35-19120-170

35-19120-170

34-96002-000

34-96002-000

ITEM

1
2
3
4

6
7
8
9

11

13
14

12

10

15
16
17
18

20
21
22
23

19

5

SPEAKER RUBBER,PVC V3.0 320 (L)

SPEAKER RUBBER,PVC V3.0 320 (L)

PART NAME

PART NAME

38-32001-000

38-32001-000

79-3200H-032

79-3200H-032

23-A3518-034

23-A3518-034

35-B6120-2R5

35-B6120-2R5

39-32009-000

39-32009-000

39-96A31-000

39-96A31-000

39-32013-000

39-32013-000

39-32016-002

39-32016-002

47-32001-070

47-32001-070

40-32001-000

40-32001-000

45-32008-001

45-32008-001

79-3200R-030

79-3200R-030

33-32013-000

33-32013-000

35-21120-125

35-21120-125

39-32012-000

39-32012-000

38-32002-000

38-32002-000

39-32011-001

39-32011-001

79-3200K-020

79-3200K-020

38-99H02-000

38-99H02-000

47-32001-080

47-32001-080

39-32015-002

39-32015-002

38-99H03-000

38-99H03-000

47-32001-120

47-32001-120

25

27
28

26

29
30

33

32

31

34
35
36
37

40

39

41
42

38

43
44

46
47

45

39-32010-001

39-32010-001

24

SHIELDING PLATE FOR I/O BRACKET

SHIELDING PLATE FOR I/O BRACKET

EMI FINGER 29X5.8X0.8mm

EMI FINGER 29X5.8X0.8mm

EMI FINGER 72X5.8X0.8mm

EMI FINGER 72X5.8X0.8mm

BOTTOM CASE

BOTTOM CASE

LCD LOCK BUTTON PC+ABS 320

LCD LOCK BUTTON PC+ABS 320

SCREW M2*5L K1 BZ ICT NY

SCREW M2*5L K1 BZ ICT NY

SCREW M2*9L K1 BZ ICT

SCREW M2*9L K1 BZ ICT

BATTERY LOCK KNOB

BATTERY LOCK KNOB

LI-ION BATTERY PACK

LI-ION BATTERY PACK

RUBBER FOOT,SILICONE 320

RUBBER FOOT,SILICONE 320

MAIN BOARD ASS'Y V4.0 320

MAIN BOARD ASS'Y V4.0 320

CD-ROM ASS'Y TOS 24X 320

CD-ROM ASS'Y TOS 24X 320

CABLE FOR MODEM TO M/B V2.0 320

CABLE FOR MODEM TO M/B V2.0 320

POWER BOARD MYLAR, MYLAR 320

POWER BOARD MYLAR, MYLAR 320

POWER BOARD ASS'Y V4.0 320

POWER BOARD ASS'Y V4.0 320

BATTERY CONN. MYLAR 320

BATTERY CONN. MYLAR 320

FILE BAY SHIELDING PLATE,SUS 320

FILE BAY SHIELDING PLATE,SUS 320

SPEAK ASS'Y V3.0 320

SPEAK ASS'Y V3.0 320

CABLE FOR IR TO M/B V1.0 320

CABLE FOR IR TO M/B V1.0 320

IR BOARD ASS'Y V5.0 320

IR BOARD ASS'Y V5.0 320

HEX STUD SUM22 NI-PL 10mm

HEX STUD SUM22 NI-PL 10mm

IC CPU 366MHZ UPGA 615P

IC CPU 366MHZ UPGA 615P

SCREW M2*4L KI BZ ICT

SCREW M2*4L KI BZ ICT

I/O BRACKET, SUS 320

I/O BRACKET, SUS 320

SCREW M2*17L R BNI ICT

SCREW M2*17L R BNI ICT

I/O DOOR

I/O DOOR

K/B SPONGE

K/B SPONGE

PCMCIA (T) SPRING 0.2mm,SUS 990H

PCMCIA (T) SPRING 0.2mm,SUS 990H

SPEAKER (R) SPONGE 320

SPEAKER (R) SPONGE 320

BOTTOM CASE MYLAR

BOTTOM CASE MYLAR

BOTTOM HEAT SINK AL 320

BOTTOM HEAT SINK AL 320

RAM COVER ASS'Y

RAM COVER ASS'Y

PRODUCT LABEL FOR DIST

PRODUCT LABEL FOR DIST

SPRING 0.25MM SUS 320

SPRING 0.25MM SUS 320

CD-ROM LOCK ,POM 320

CD-ROM LOCK ,POM 320

SCREW M2*2.6L K1 BZ ICT

SCREW M2*2.6L K1 BZ ICT

IRDA LENS, GEPC 960A

IRDA LENS, GEPC 960A

SCREW M2*12.5L F NI ICT

SCREW M2*12.5L F NI ICT

FAN+CON. 35*35*7mm 5V 0.12V 0.034M3/MIN

FAN+CON. 35*35*7mm 5V 0.12V 0.034M3/MIN

HDD BRACKET ASS'Y 320

HDD BRACKET ASS'Y 320

CD-ROM LOCK KNOB

CD-ROM LOCK KNOB

TOP HEAT SINK, ASS'Y 320

TOP HEAT SINK, ASS'Y 320

LCD LOCK. POM 320

LCD LOCK. POM 320

LCD HOOK PUSH. POM 320

LCD HOOK PUSH. POM 320

SPEAKER (L) SPONGE 320

SPEAKER (L) SPONGE 320

PCMCIA (B) SPRING 0.2mm,SUS 990H

PCMCIA (B) SPRING 0.2mm,SUS 990H

PCMCIA DOOR PC+ABS 320

PCMCIA DOOR PC+ABS 320

SPRING

SPRING

ƒ 3.0 SUS 320

3.0 SUS 320

BATTERY LOCK ,POM 320

BATTERY LOCK ,POM 320

A

A – 4

Parts

general assembly

3200 TOP CASE A SSEMBLY

FIG. A – 3

2

21

20

19
18

17

22

4

3

10

6

5

7

10

16

15

14

6

1

9

8

11

12

13

10

A

A – 5

general assembly

3200 TOP CASE A SSEMBLY P ARTS LIST

FIG. A – 4

TOUCHPAD SHIELDING ASS'Y

TOUCHPAD BUTTOM (R)

TOUCHPAD BUTTOM (L)

39-32008-011

39-32008-001

79-320TP-002

PART NO

REMARK

REMARK

1

LED COVER

7

6

5

4

3

2

ITEM

SCREW M2*2.6L K1 BZ ICT

HINGER COVER (R)

HINGER COVER (R)

KEYBOARD(WIN95)

POWER KNOB

LED TOP LENS (R)

PART NAME

PART NAME

14
15

12
13

TOP CASE

9

10
11

8

SCREW M2*4L K1 BZ ICT

CABLE FOR CLICK BOARD

CABLE FOR CLICK BOARD

CABLE FOR POWER TO T/P V1.0 320

HINGER COVER (L)

MICRO PHONE

22

19

21

20

18

17

16

CLICK BOARD HIMILON

CLICK BOARD HIMILON

CD-ROM BRACKET 320

SCREW M2*5L F BZ TAP

CLICK BOARD ASS'Y V4.0

CLICK BOARD ASS'Y V4.0

TOUCH PAD

LED FRONT LENS

27

30

28
29

25
26

24

23

LED TOP LENS (L)

47-32001-050

80-32000-012

33-32007-000

49-66000-021
35-26720-5R0

39-32026-001
77-32003-014

43-32016-001
43-32009-001

39-32031-011

35-B6120-2R5

39-32025-011

39-32025-001

39-32005-002

39-32029-002

39-32019-002

35-B6120-4R0

79-3200I-052

39-32018-000

A

A – 6

Parts

LCD

3200 12.1” LCD ASSEMBLY

FIG. A – 5

7

7

7

3

4

4

4

1

9

8

15

14

19

12

12

12

16

21

20

18

13

17

13

12

11

10

6

5

7

2

1

3

4

A

A – 7

LCD

3200 12.1” LCD ASSEMBLY

PARTS LIST

FIG. A – 6

by customer

by customer

40-32011-000

INVERTER KAPTON,KAPTON 320

35-B6120-6R0
39-32001-002
35-B9125-6R0
47-32001-020
50-422216-151
77-32002-003
35-B1130-4RB
47-32001-100

40-32006-002
33-32002-001

35-B6120-4R0
35-B9125-6R0
43-32021-002
33-32004-002
25-90002-003
79-3200Y-013
79-3200Y-023

33-32003-001
39-32003-002

DISPLAY LABEL FOR BACK COVER

TM121SV-02L04

LCD BACK COVER for SANYO

SECC 320

LCD BRACKET(L) FOR 12.1

HINGE(L) ASS'Y 320

HINGE(R) ASS'Y 320

MAGNET NI-COATIONG

MAGNET NI-COATIONG

LCD BRACKET(FRONT) SUS320

V1.0

CABLE FOR SAN.121 AND INVERTER

SCREW,M2.5*4L,K1,BNI,ICT,NY

SCREW,M2.5*4L,K1,BNI,ICT,NY

SCREW,M2.0*4.0L,K1,BZ,ICT

SCREW,M2.0*4.0L,K1,BZ,ICT

SECC 320

LCD BRACKET(R) FOR 12.1

LCD BRACKET(R) FOR 12.1

INVERTER MYLAR 320

LCD SAN. 12.1 SPONGE 320

SCREW,M3*4L,K1,NI,ICT

SCREW,M3*4L,K1,NI,ICT

INVERTER CARD ASS'Y V2.0 320

LCD FRONT COVER 12.1"

SILICONE 320

LCD F-CVR RUBBER

SCREW,M2.5*0.45P*6L,K1,BN,ICT,NY

SCREW,M2.5*0.45P*6L,K1,BN,ICT,NY

12.1

LCD SAN./TM121SV-02L04 S-TFT

LCD SAN./TM121SV-02L04 S-TFT

SCREW,M2.0-6.0L,K1,BZ,ICT

SCREW,M2.0-6.0L,K1,BZ,ICT

REMARK

REMARK

PART NO

1

ITEM

2

4

3

5

7

6

10

9

12

11

13

8

15

14

16

18

17

19

20
21

PART NAME

PART NAME

A

A – 8

Parts

LCD

3200 13.3” LCD ASSEMBLY

FIG. A – 7

28

4

1

4

3

4

11

27

26

25

24

23

9

15

19

7

8

11

11

11

16

13

5

12

13

14

22

21

18

17

20

17

13

10

6

2

1

3

4

A

A – 9

LCD

3200 13.3” LCD ASSEMBLY

PARTS LIST

FIG. A – 8

40-32015-000

LCD KAPTON FOR HYU 13.3"

EMI GASKETS

by customer

CONDUCTIVE CLOTH TYPE L80*30

47-32004-050

CONDUCTIVE CLOTH TYPE L60*50

47-26804-000

47-32004-070

EMI RUBBER

47-32004-060

LCD 13.3" BOTTOM SPONGE

47-32001-110

SECC 320

13.3 LCD

SILICONE 320

DISPLAY LABEL FOR BACK COVER

35-B6120-6RO
39-32002-002
35-B9125-6RO
47-32001-020
47-32001-090
50-43326-135
77-32002-003
40-32011-000
45-82004-000
40-32006-002

35-B6120-3RO
43-32023-002
35-B6120-4RO
25-90002-003
33-32023-000
33-32017-000
35-B9125-4RA
79-3200Y-023
33-32016-000
79-3200Y-013

39-32004-003

LCD BACK COVER H=7.5 FOR HYU

HINGE(R) ASS'Y 320

LCD BRACKET(R) FOR 13.3"

HINGE(L) ASS'Y 320

SCREW,M2.5*4L,K1,BNI,ICT,NY

LCD BRACKET(L) FOR 13.3"

LCD MAGNET BRACKET

MAGNET NI-COATIONG

SCREW,M2.0*4.0L,K1,BZ,ICT

COAXIAL CABLE FOR HYU.

SCREW,M2*3L,K1,BZ,ICT,NY

ELECTRIC SHOCK CAUTION 82H
INVERTER MYLAR 320

INVERTER KAPTON, KAPTON 320

INVERTER CARD ASS'Y V2.0 320

LCD,T,HY,HT13X13-203,13.3

LCD FRONT COVER 13.3"

LCD F-CVR RUBBER

SCREW,M2.5*0.45P*6L,K1,BN,ICT,NY

LCD HYU.13.3" SPONGE

SCREW,M2.0*6.0L,K1,BZ,ICT

28

27

26

25

24

23

22

REMARK

PART NO

ITEM

1

2

4

3

5

7

6

10

9

12

11

13

8

15

14

16

18

17

19
20
21

PART NAME

A

A – 10

Parts

CD-ROM module

3200 CD-ROM ASSEMBLY

FIG. A – 9

1

3

2

4

4

5

6

A

A – 11

CD-ROM module

3200 CD-ROM ASSEMBLY

PARTS LIST

FIG. A – 10

REMARK

84-I4002-A12

79-3200C-220

PART NO

39-32021-001

35-B6120-5R0

77-32005-003

35-B6120-2R5

PART NAME

ITEM

1

3

2

5

7

6

CD-ROM HOUSING

4

SCREW M2.0*5L K1 BZ ICT NY

CD/DVD-ROM CVT BOARD

SCREW M2.0*2.6L K1 BZ ICT

CD-ROM 5.25" 24X 12.7MM XM-1902B

CD-ROM BEZEL ASS'Y FOR TOS.

A

A – 12

Parts

FDD module

3200 FDD ASSEMBLY

FIG. A – 11

4

1

5

3

5

6

2

A

A – 13

FDD module

3200 FDD ASSEMBLY

PARTS LIST

FIG. A – 12

REMARK

REMARK

PART NO

PART NO

FDD HOUSING

FDD HOUSING

PART NAME

PART NAME

FDD 3.5" 1.44MB 12.7MM,360RPM

FDD 3.5" 1.44MB 12.7MM,360RPM

SCREW M2.6*3.5L F NI ICT

SCREW M2.6*3.5L F NI ICT

FPC CABLE FOR FDD V3.0

FPC CABLE FOR FDD V3.0

SCREW M2.0*4.0L K1 BZ ICT

SCREW M2.0*4.0L K1 BZ ICT

1
2

4

6

5

3

ITEM

7

FDD SHIELDING PLATE SUS 320

FDD SHIELDING PLATE SUS 320

85-10175-010

39-32022-001

35-21126-350

43-32002-003

35-B6120-4R0

35-B6120-4R0

33-32011-000

A

A – 14

Parts

HDD module

3200 HDD ASSEMBLY

FIG. A – 13

8

1

2

6

3

4

5

6

7

A

A – 15

HDD module

3200 HDD ASSEMBLY

PARTS LIST

FIG. A – 14

REMARK

REMARK

Q'TY /SET

Q'TY /SET

PART NO.

PART NO.

ITEM

ITEM

PART NAME

PART NAME

MATERIAL (SPEC.)

MATERIAL (SPEC.)

1

1

1
1

1
1

1

1

40-32002-002
79-3200H-021

85-00284-741
35-B1130-4RB

39-32027-002

40-32005-000

33-32008-001

45-32006-000

21HDD FRAME

4

6

5

8

7

SCREW
HDD BRACKET

3 LABEL FOR HDD DOOR 320

HDD HANDLE,MYLAR 320

2.5" HDD 4.34GB ATA-4 9.5MM

HDD DOOR PC+ABS 320

HDD BRACKET MYLAR 320

A

A – 16

Parts

NOTES:

notes