Clevo 2800, 2850, 2820 Service Manual

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2800/2820/2850

Notebook Computer

Service Manual

Preface

NOTICE

The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this publication nor are they in anyway responsible for any loss or damage resulting from the use (or misuse) of this publication.

This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmitted or reduced to any machine readable form without prior consent from the vendor, manufacturer or creators of this publication, except for copies kept by the user for backup purposes.

Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks of their respective companies. They are mentioned for identification purposes only and are not intended as an endorsement of that product or its manufacturer.

First Edition ©January, 2000

Trademarks

Intel

, Pentium® and Pentium® with MMX™ technology are registered trademarks of Intel Corporation.

IBM® and OS/2® are registered trademarks of IBM Corporation. MS-DOS®, Windows®, Windows® 95 and Windows NT™ are registered trademarks of Microsoft Corporation. SystemSoft® and CardWizard® are registered trademarks of SystemSoft Corporation.

Other brand and product names are trademarks and/or registered trademarks of their respective companies.

copyrights

ABOUT THIS MANUAL

This manual is intended for service personnel who have completed sufficient training to undertake the maintenance and inspection of personal computers.

It is organized to allow you to look up basic information for servicing and/or upgrading components of the notebook computer. The following information is included:

Chapter 1, Introduction, provides general information about the location of system elements and their specifications.

Chapter 2, Chipset, briefly describes the computer’s core logic, memory and supporting chipset.

Chapter 3, Disassembly, provides step-by-step instructions for disassembling parts and subsystems and how to up-

grade elements of the system.

Chapter 4, Troubleshooting, provides recommendations on how to solve possible system problems.

Appendix A, Part Lists

Appendix B, 2800 Circuit Diagrams

Appendix C, 2820/2850 Circuit Diagrams

the manual

iii

Preface

1 Introduction

This manual covers the information you need to service or upgrade the 2800/2820/2850 Notebook Computer. Information about operating the computer (e.g. getting started, and the Setup utility) is in the User’s Manual. Information about drivers (e.g. VGA & audio) is also found in User’s Manual. That manual is shipped with the computer.

Operating systems (e.g. DOS, Windows 9x, Windows NT 4.0, OS/2 Warp, UNIX, etc.) have their own manuals as do application software (e.g. word processing and database programs). If you have questions about those programs, you should consult those manuals.

The notebook is designed to be upgradable. The 2800 supports Intel Pentium II & Celeron CPUs of different speeds and 12.1” & 14.1” TFT color LCD screens. The 2820 supports Intel Pentium III & Celeron CPUs of different speeds and 12.1” & 14.1” TFT color LCD screens while the 2850 supports Intel Pentium III & Celeron CPUs of different speeds and 15.1” TFT color LCD screens. In addition, system memory, hard disk, and BIOS are also upgradable. See Chapter 3, “Disassembly,” for a detailed description of the upgrade procedures for each specific component.

Please note the warning and safety information indicated by the “

The balance of this chapter reviews the computer’s technical specifications and external features.

M” symbol.

1 – 1

Introduction

SYSTEM SPECIFICATIONS

CPU (2800) (2820 & 2850)

Package MicroPGA1 MicroPGA2

Type Pentium II, 300MHz~400MHz Pentium III, 450MHz or faster

Celeron, 300MHz~400MHz Celeron, 450MHz or faster

MEMORY

L1 cache (in CPU) 16KB code + 16KB data 16KB code + 16KB data

L2 cache Pentium II: 256KB SRAM Pentium III: 256KB SRAM

(on die) Celeron: 128KB SRAM Celeron: 128KB SRAM

RAM base 0MB (onboard) same

RAM expansion 2 S.O.DIMM sockets (144 pin) same

DIMM sizes: 32MB, 64MB, 128MB same standards: 3.3-volt same modes: SDRAM same speed: 66MHz or faster speed: 100MHz or faster use: singly, mixed* or identical pairs same maximum expansion: 256MB same

*Both must be the same speed

CORE LOGIC

440BX AGPset, 66MHz 440BX AGPset, 100MHz

1 – 2

specifications

BIOS

512KB Flash ROM, Plug ‘n Play 1.0a, LBA, APM 1.2, ACPI

VIDEO

memory 4MB/8MB SGRAM chipset ATI 3D Rage LT Pro AGP (with 3D, AGP & ZV support/proprietary driver) architecture 64-bit 2x AGP bus with Windows Acceleration display TFT (active matrix)

12.1” SVGA, (800 x 600) at 24-bit color (TrueColor)

14.1” XGA, (1024 x 768) at 32-bit color (TrueColor)

15.1” XGA, (1024 x 768) at 32-bit color (TrueColor)

DRIVES

HDD module semi-removable 2½” (9.5mm) , PCI local bus IDE interface FDD module 3.5”, 1.44MB (3-mode)

Device Bay CD-ROM module 24X, full size (5.25”) ATAPI interface tray-loading mechanism,

access time below 100ms

or DVD module 4X or faster, full size (5.25”) ATAPI interface tray-loading mechanism,

access time below 100ms (with software MPEG support)

AUDIO

chipset Yamaha YMF744B (DS-XG), proprietary driver architecture 32-bit PCI bus type 64-voice dual-audio engine, AC-3 speaker virtualization, PnP, up to 20-bit ADCDAC

audio resolution, I

sampling max. record & playback up to 48 KHz stereo (WAVE audio) 3D HRTF 3-D positional audio under DirectX™ 5.0 compatibility Sound Blaster Pro™ legacy audio, MS Windows Sound System™ interface speakers (phones), microphone, line-in speakers 2 built-in: 0.5W stereo amp.

S/zoomed video, high quality MIDI synthesis

specifications

1 – 3

Introduction

I/O

USB 2 ports, compliant with UHCI 1.1, USB 1.0 & PCI 2.1 Serial 1 9-pin, 16C550 compatible Serial 2 infrared, IrDA v 1.1, FIR, SIR compatible Parallel 25-pin, ECP, output-only, bi-directional CRT 15-pin VGA PS/2 6-pin, mini-din, mouse or keyboard

PC Card one Type I or Type II socket, PC Card 3.0, ZV port & CardBus compliant

INTERFACE

keyboard 87-key or 90-key (depending on the language)

Windows 95 compliant with embedded numeric keypad

pointing device PS/2 TouchPad (built-in), MS-Mouse compatible

POWER SYSTEM

adapters (external) universal, auto-sensing switching

input: 90-240VAC @47- 63Hz

¯¯

Advanced Users

Actual battery life per charge may differ from this figure. It will vary depending on the system configuration, the condition of the battery, the environment, setup, and working habits.

battery pack(s) Li-Ion: smart battery with gauge circuit

battery charge time Fast (system off) approx. 2.5 hours per battery, 2000mA ±200mA

life per charge approx. 2.5hrs per battery (based on an Intel Pentium III 500 MHz CPU,

output: 60W, 20V, 3A

Ni-MH: dumb battery without gauge circuit

Slow (system on) approx. 7 hours per battery, 700mA ± 50mA (based on a 3000mA smart battery)

running “ZD BatteryMark 3.0” software in the Windows 98 operating system)

1 – 4

management BIOS control, APM ver 1.2

levels: full-on, standby, suspend-to-RAM/suspend-to-disk (0 volt)

specifications

OTHER FEATURES (OPTIONAL)

56K Fax/Data/Voice modem

10/100 Mbps PCI Ethernet Controller

ENVIRONMENT

operating temp. 0oC to 35oC (32oF to 95oF)

storage temp. -10

operating humidity 40% to 80%, non-condensing

storage humidity 10% to 90%, non-condensing

altitude 8000 feet

shock (unpacked) 5G (11 + 1 microsecond pulse)

C to 65oC (14oF to 149oF)

PHYSICAL

2800

dimensions 312mm(w) x 262mm(d) x 34.5mm(h)

weight 2.95Kg (with Li-Ion battery, FDD, HDD, CD-ROM & 14.1” LCD)

(12.1”/14.1” LCD capable):

2820 (12.1”/14.1” LCD capable):

dimensions 312mm(w) x 262mm(d) x 36/37.5mm(h)

weight 2.95Kg (with Li-Ion battery, FDD, HDD, CD-ROM & 14.1” LCD)

2850 (15.1” LCD):

dimensions 326mm(w) x 267mm(d) x 37.5mm(h)

weight 3.22Kg (with Li-Ion battery, FDD, HDD, CD-ROM & 15.1” LCD)

specifications

1 – 5

Introduction

FRONT VIEW

FIG. 1 – 1

1. LCD

2. Cover latch

3. Speakers

4. On/Off switch

5. LED system status indicators

6. Keyboard

7. TouchPad & buttons

8. LED power status indicators

9. Microphone

10. Audio line-in jack

11. Mic jack

12. Phone jack

EXTERNAL LOCATOR

The following figures show the external locations of the computer’s main subsystems.

OTTOM VIEW

FIG. 1 - 2

13. Device bay

14. Battery bay

15. RAM bay

1 – 6

external locator

10811 12

LEFT VIEW

FIG. 1 – 3

1. Kensington lock port

51 2 3 4

2. PC Card slot

3. IrDA (serial 2) port

4. USB ports

5. FDD

IGHT VIEW

FIG. 1 – 4

6. CD-ROM module (option) or DVD ROM module (option)

7. Adapter port

9 12

EAR VIEW

FIG. 1 – 5

8. PS/2 port

9. COM (serial 1) port

10. Parallel port

11. Fan

12. External monitor port

13. Fax/Modem (option)

14. LAN port (option)

external locator

1 – 7

Introduction

NOTES:

1 – 8

notes

2 Chipset

The computer is completely AT-compatible. Its chipset supports a high-performance PCI bus video interface and state-of-the-art power management features. This chapter mainly describes the following major system components:

• CPU • Core logic chipset • Supporting chips

The following figures are the system block diagram and the chipset site diagram. These provide an overview of the computer’s layout and a practical locator for chipset components.

SYSTEM BLOCK DIAGRAM

FIG. 2 – 1

2 – 1

Chipset

CHIPSET SITE DIAGRAM

1. Video SGRAM

2. Video Controller

ATI Rage LT Pro

3. PCI-CardBus Bridge Ricoh 5C475

4. LAN Controller AMD PCnet™ Fast III AM79C973

5. Core Logic chip 82443BX

6. Keyboard Controller Hitachi HB/3434

7. SW1 & SW2

8. CN28 DIMM socket “0”

9. CN29 DIMM socket “1”

10. Core Logic chip 82371EB (2800) 82371MB (2820 & 2850)

11. Audio controller YAMAHA YMF744B

12. Super I/O controller SMSC FDC37N869

13. 4MB FLASH ROM BIOS AMD AM29LV004BT

14. Audio CODEC AKM AK4543 VQ

FIG. 2 – 2

1314

2 – 2

component sites

CHIPSET SITE DIAGRAM (CONT.)

IG. 2 – 2

15. LAN Transformer LF-H71P

16. Video SGRAM

17. CPU

component sites

2 – 3

Chipset

CPU - INTEL MOBILE PENTIUM III/PENTIUM II/CELERON

The 2800 uses the Intel Mobile Pentium II/Celeron processor in a microPGA1 package. The Intel Mobile Pentium II/Celeron processor features an integrated L2 cache (256KB for Pentium II and 128KB for Celeron) and a 64-bit high performance system bus.

The 2820 & 2850 use the Intel Mobile Pentium III/Celeron processor in a microPGA2 package. The Intel Mobile Pentium III/Celeron processor features an integrated L2 cache (256KB for Pentium III and 128KB for Celeron) and a 64-bit high performance system bus.

The Mobile Pentium III/Pentium II/Celeron processor’s 64-bit wide Low Power Gunning Transceiver Logic system bus is compatible with the 440BX AGPSet and provides a glue-less, point-to-point interface for an I/O bridge/ memory controller.

The Intel Mobile PentiumIII/Pentium II/Celeron processors are fully compatible with all software written for the Pentium processor with MMX technology, Pentium processor, Intel486 microprocessor, and Intel386 microprocessor. In addition, they provide improved multimedia & communications performance. They feature:

• Performance improved over existing mobile processors

- Supports the Intel Architecture with Dynamic Execution

- Supports the Intel Architecture MMX technology

• Integrated primary (L1) instructions and data caches

- 4-way set associative, 32-byte line size, 1 line per sector

- 16-Kbyte instruction cache and 16-Kbyte writeback data cache

- Cacheable range programmable by processor programmable registers

• Integrated second level (L2) cache

- 4-way set associative, 32-byte line size, 1 line per sector

- Operated at full core speed

- 128/256-Kbyte, ECC protected cache data array

• Low Power GTL+ system bus interface

- 64-bit data bus, 66-MHz operation

- Uniprocessor, two loads only (processor and I/O bridge/memory controller)

- Short trace length and low capacitance allows for single ended termination

• Voltage reduction technology

• Pentium III processor clock control

- Quick Start for low power, low exit latency clock “throttling”

- Deep Sleep mode for extremely low power dissipation

• Thermal diode for measuring processor temperature

2 – 4

CPU

CORE LOGIC CHIPSET - INTEL 440BX AGPSET

The Intel 440BX AGPset consists of the BX System Controller (443BX) and the PCI ISA IDE Xcelerator (PIIX4E/ PIIX4M). The AGPset forms a Host-to-PCI bridge and provides the second level cache control and a full function 64-bit data path to main memory.

NORTH BRIDGE, AGPSET SYSTEM CONTROLLER, 443BX

The BX System Controller (443BX) integrates the cache and main memory DRAM control functions and provides bus control to transfer between the CPU, cache, main memory, AGP bus and the PCI Bus.

Features

• Supports the host bus of the Pentium II & III processor families at 66MHz and 100MHz at 3.3V respectively

• PCI 2.1 compliant

• Integrated Data Path

• Integrated DRAM controller

- 8Mbytes to 256Mbytes main memory

- 64Mbit DRAM/SDRAM technology support

- EDO and SDRAM DRAM support

- Integrated programmable-strength for DRAM interface

- CAS-Before-RAS refresh, extended CBR and self refresh for

EDO

- CAS-Before-RAS and self refresh for SDRAM

• Fully synchronous, minimum latency 30/33 MHz PCI bus interface

- Five PCI bus masters (including PIIX4)

- 10 DWord PCI-to-DRAM read prefetch buffer

- 18 DWord PCI-DRAM post buffer

- Multi-Transaction timer to support multiple short PCI transactions

• AGP Features

- AGP 1.0 compliant

- 66/133 MHz data transfer capability

- Supports concurrent CPU, AGP and PCI transactions

• Power Management Features

- Dynamic stop clock support

- Suspend to RAM (STR)

- Suspend to Disk (STD)

- Power On Suspend (POS)

- Internal clock control

- SDRAM and EDO self refresh during suspend

- ACPI support

- Compatible SMRAM (C_SMRAM) and Extended SMRAM (E_SMRAM)

- SMM write-back cacheable in E_SMRAM mode up to 1MB

• Supports the Universal Serial Bus (USB)

• 492 Pin BGA 440BX AGPset with integrated data paths

core logic chipset

2 – 5

Chipset

SOUTH BRIDGE, PCI ISA IDE XCELERATOR, 82371EB/MB (PIIX4E/M)

The 2800 uses the 82371EB (PIIX4E) while the 2820 & 2850 use 82371MB (PIIX4M). The PCI ISA IDE Xcelerator (PIIX4E/PIIX4M) is a multi-function PCI device implementing a PCI-to-ISA bridge function, a PCI IDE function, a Universal Serial Bus host/hub function, and an Enhanced Power Management function. As a PCI-to-ISA bridge, the PIIX4E/PIIX4M integrates many common I/O functions found in ISA-based PC systems - a seven channel DMA Controller, two 82C59 Interrupt Controllers, an 8254 Timer/Counter, and a Real Time Clock. In addition to compatible transfers, each DMA channel supports Type F transfers. The PIIX4E/PIIX4M also contains full support for both PC/PCI and Distributed DMA protocols implementing PCI based DMA. The Interrupt Controller has Edge or Level sensitive and programmable inputs and fully supports the use of an external I/O Advanced Programmable Interrupt Controller (APIC) and Serial Interrupts. Chip select decoding is provided for BIOS, Real Time Clock, Keyboard Controller, second external Microcontroller, as well as 2 Programmable Chip Selects. The PIIX4 provides full Plug and Play compatibility. The PIIX4E/PIIX4M can be configured as a Subtractive Decode bridge. This allows the use of a subtractive decode PCI-to-PCI bridge such as the 82380 chipset which implements a PCI/ISA docking station environment.

The PIIX4E/PIIX4M supports two IDE connectors for up to four IDE devices providing an interface for IDE hard disks and ROMs. Up to four IDE devices can be supported in Bus Master mode. The PIIX4E/PIIX4M contains support for “Ultra DMA” synchronous DMA compatible devices.

The PIIX4E/PIIX4M contains a Universal Serial Bus (USB) Host Controller that is Universal Host Controller Interface (UHCI) compatible. The Host Controller’s root hub has two programmable USB ports.

2 – 6

core logic chipset

The PIIX4E/PIIX4M supports Enhanced Power Management, including full Clock Control, Device Management for up to 14 devices, and Suspend and Resume logic with Power On Suspend, Suspend to RAM or Suspend to Disk. It fully supports Operating System Directed Power Management via the Advanced Configuration and Power Interface (ACPI) specification. The PIIX4E/PIIX4M integrates both a System Management Bus (SMBus) Host and Slave interface for serial communication with other devices.

Features

• Supports Pentium, Pentium II & Pentium III Microprocessors

- 440BX ISA kit

• Power Management Logic

- Global and local device management

- Suspend/resume logic

- Supports thermal alarm

- Support for external microcontroller

- Full support for Advanced Configuration and Power Interface (ACPI) Specification and OS Directed Power Management

• Multifunction PCI to ISA Bridge

- Supports PCI at 30 MHz and 33 MHz

- Supports PCI Rev 2.1 specification

- Supports Full ISA or Extended I/O (EIO) Bus

- Supports full positive decode or subtractive decode of PCI

- Supports ISA/EIO at 1/4 of PCI frequency

• Supports both mobile and desktop deep green environments

- 3.3 V operation with 5 V tolerant buffers

- Ultra-low power for mobile environments

- Power-On Suspend and Soft-OFF for desktop environment

- All registers readable/restorable for proper resume from 0 V suspend

• Integrated IDE Controller

- Independent Timing of up to 4 drives

- PIO Mode 4 transfers up to 14 Mbytes/s

- Supports “Ultra 33” Synchronous DMA mode transfers up to 33 MBytes/sec

- Integrated 8 x 32-bit buffer for IDE PCI Burst

- Supports glue-less “Swap-Bay” option with full electrical isolation

• Enhanced DMA Controller

- Two 8237 DMA controllers

- Supports PCI DMA with 3 PC/PCI channels and Distributed DMA protocols (simultaneously)

- Fast Type-F DMA for reduced PCI bus usage

• Interrupt Controller based on two 82C59

- 15 interrupt support

- Independently programmable for Edge/Level sensitivity

- Supports optional external I/O APIC

- Serial interrupt input

• Timers based on 82C54

- System Timer, Refresh Request, Speaker Tone Output

• USB

- Two USB 1.0 ports for serial transfers at 12 or 1.5 Mbit/sec

- Supports legacy keyboard and mouse software with USB-

based keyboard and mouse

- Supports UHCI Design Guide Revision 1.1 Interface

• SMBus

- Host interface allows CPU to communicate via SMBus

- Slave interface allows external SMBus master to control re-

sume events

• Real-Time Clock

- 256 Byte Battery-Pack CMOS SRAM

- Includes Date Alarm

- Two 8-byte Lockout Ranges

• Microsoft Win95/98 compliant

core logic chipset

2 – 7

Chipset

SUPPORTING CHIPS

The following subsections describe major supporting chips:

• Ricoh 5C475II PCI-CardBus Bridge

• SMSC FDC37N869 PC 99 Compliant 5V and 3.3V Super I/O Controller with Infrared Support

• ATI RAGE LT Pro Graphics Controller

• Yamaha744B DS-XG Audio Controller

RICOH 5C475 PCI-CARDBUS BRIDGE

The R5C475II is a PC card controller offering a single chip solution as a bridge between PCI bus andCardBus. The R5C475II includes a PC Card 95/97 compliant socket interface and a bridge function to the PCI bus of 33MHz. The R5C475II can support the 32-bit CardBus(Card-32) and the 16-bit PC card(Card-16) without external buffers.

Concerning the 16-bit card control interface, the R5C475II‘s register is compatible with the Intel 82365SL and Ricoh’s RF5C396/366 in order to maintain backward compatibility with the existing 16-bit PC Card compliant with PCMCIA2.1/JEIDA4.2. All PC card interface signals are individually buffered to allow direct connection to CardBus and Hot insertion/removal without external buffers. The R5C475II also allows direct connection to PCI bus.

The PCI and PC Card socket interfaces have their own power supply terminals that can be powered at either 3.3V or 5V for compatibility with 3.3V and 5V signaling environments. The core logic is powered at 3.3V or 2.5V.

The R5C475II allows the system to be equipped with the high performance multimedia PC cards like the Video capture card, and 100 BASE LAN card. It features:

2 – 8

•PC97/98/99 compliant – PC99 Design Guide compliant (Subsystem ID, Subsystem

Vender ID) – ACPI 1.0 and PCI Bus Power Management 1.0 compliant – Global Reset support

• Low Power consumption – Hardware Suspend – CLKRUN#,CCLKRUN# support – VCC-COREC

• High-performance

• Single Chip PCI-CardBus Bridge

supporting chip - PC Card

– PCMCIA PC-Card 95/97 sockets support – CardBus(Card-32) Card and 16-bit(PCMCIA2.1/JEIDA4.2)

Card work at the same time

– Bridge function between PCI bus and CardBus

• PCI Bus Interface – Complian t with PCI Local Bus Specification2.2 – The maximum frequency 33MHz – PCI Master/Target protocol support – Separated PCI configuration each socket – Direct connection to PCI bus – 3.3V interface (5V tolerant)

• CardBus PC card Bridge – PC Card Standard 95/97 compliant – Compliant with Yenta register set Rev2.2 – The maximum frequency 33MHz – CardBus Master/Target protocol support – Transfer transactions

- All memory read/write transaction(bi-direction)

- I/O read/write transaction(bi-direction)

- Configuration read/write transaction(PCI ® Card)

- 2 programmable memory windows

- 2 programmable I/O windows

• PC Card-16 Bridge – Compliant with PCMCIA PC Card 95/97 Standard Specification – 5 programmable memory windows – 2 programmable I/O windows – Compliant with i82365SL compatible register set / ExCA

• System Interrupt – INTA# support for PCI system interrupt – IRQn support for ISA system interrupt (Non shared IRQn pins) – Serialized IRQ support

• 3.3V/5V Mixed Voltage Operation at 33MHz

• GPIO support

• Posting Write and Prefetching Read support

• Plug and Play support

• 16-bit Legacy mode (3E0/3E2 I/O port) support

• Zoomed Video Port support – Bypass type

• PCIway Legacy DMA support

supporting chip - PC Card

2 – 9

Chipset

SMSC FDC37N869 PC 99 COMPLIANT 5V AND 3.3V SUPER I/O CONTROLLER WITH INFRARED SUPPORT

The FDC37N869 features:

• Serial ports

• 5 volt and 3.3 volt operation

• Intelligent auto power management

• 16 bit address qualification

• 2.88MB Super I/O Floppy Disk Controller

- Licensed CMOS 765B Floppy Disk Controller

- Software and register compatible with SMSC proprietary 82077AA compatible core

- Supports one Floppy Drive directly

- Configurable Open Drain/Push-Pull Output Drivers

- Supports Vertical Recording Format

- 16 byte data FIFO

- 100% IBM compatibility

- Detects all overrun and underrun conditions

- Sophisticated Power Control Circuitry (PCC) including multiple power-down modes for reduced power consumption

- DMA enable logic

- Data rate and drive control registers

- Swap drives A and B

- Non-burst mode DMA option

- 48 Base I/O address, 15 IRQ and 4 DMA options

- Forceable write protect and disk change controls

• Floppy disk available on parallel port pins ACPI compliant

• Enhanced digital data separator

- 2Mbps, 1Mbps, 500 Kbps, 300 Kbps, 250 Kbps data rates

- Programmable precompensation modes

- Two high speed NS16C550 compatible UARTs with send/ receive 16 Byte FIFOs

- Supports 230k and 460k baud

- Programmable baud rate generator

- Modem control circuitry

• Infrared communications controller

- IrDA v1.2 (4Mbps), HPSIR, ASKIR, Consumer IR Support

- 2 IR Ports

- 96 base I/O address, 15 IRQ options and 4 DMA options

• Multi-mode parallel port with ChiProtect

- Standard Mode

- IBM PC/XT PC/AT and PS/2 compatible bi-directional parallel port

- Enhanced Parallel Port (EPP) compatible

- EPP 1.7 and EPP 1.9 (IEEE 1284 compliant)

- Enhanced Capabilities Port (ECP) compatible (IEEE 1284 compliant)

- Incorporates ChiProtect Circuitry for Protection Against Damage Due to Printer Power-On

- 192 base I/O address, 16 IRQ and 4 DMA options

• Game port select logic

- 48 base I/O addresses

• General Purpose Address Decoder

- 16-byte block decode

2 – 10

supporting chip - super I/O

ATI RAGE LT PRO GRAPHICS CONTROLLER

The RAGE LT Pro is a highly integrated graphics accelerator with superior support for 3D and motion video — ideal for notebooks and LCD desktops. It incorporates comprehensive support for Intel’s Accelerated Graphics Port (AGP), including 1X or 2X mode with sidebands.

Delivering superior 3D acceleration and comprehensive 3D support, the RAGE LT Pro includes a triangle set-up engine, single-pass trilinear filtering, six perspectively correct texturing modes, video texturing, Gouraud and specular shading, and a host of 3D special effects.

The best choice for DVD notebooks and LCD desktops, the RAGE LT Pro’s DVD features include motion compensation, acceleration for soft DVD, integrated TV-out with Macrovision and support for third-party MPEG-2 decoders via the ATI Multimedia Channel (AMC).

Using Tri-View™ the RAGE LT Pro can output to LCD, CRT, and TV simultaneously. It also includes two output controllers so that any two display devices can have different images and/or refresh rate.

It has the following main features:

• First mobile accelerator to use AGP 2X (133MHz) in AGP Texturing with sideband signals to realize all the benefits of AGP.

• First mobile accelerator to deliver full motion soft DVD using motion compensation circuitry.

• First mobile acccelerator with integrated LVDS transmitter.

• Innovative Dynamic Power Management with ACPI compliance.

• Superior 3D performance acheived through a hardware setup engine and a 4KB on-chip texture cache.

• Superior 2D performance with support of 100MHz SGRAM.

• TFT and DSTN panel interface support for up to 1280x1024 resolutions.

• Integrated ImpacTV2-quality TV output provides optimal image quality via programmable 6 tap flicker filter, resolution modes scale down from 1024x768 and 16:9 wide mode support. Direct YUV422 mode, Macrovision 7.01 and CGMS support.

• Support for 2, 4, or 8MB frame buffers, and integrated 230MHz DAC.

• High quality ratiometric expansion that fits source images to any panel resolution.

supporting chip - video

2 – 11

Chipset

YAMAHA YMF744B DS-XG

The YMF744B (DS-1S) is a high performance audio controller for the PCI Bus. DS-1S consists of two separated functional blocks. One is the PCI audio block and the other is the Legacy Audio block. PCI Audio block allows Software Driver to handle maximum of 73 concurrent audio streams with the Bus Master DMA engine. The PCI Audio Engine converts the sampling rate of each audio stream and the streams are mixed without utilizing the CPU or causing system latency. By using the Software Driver from YAMAHA, PCI Audio provides 64-voice XG wavetable synthesizer with Reverb and variation. It also supports DirectSound hardware accelerator, Downloadable Sound (DLS) and DirectMusic accelerator.

Legacy Audio block supports FM Synthesizer, Sound Blaster Pro, MPU401 UART mode and Joystick function in order to provide hardware compatibility for numerous PC games on real DOS without any software driver. To achieve legacy DMAC compatibility on the PCI, DS-1S supports both PC/PCI and Distributed DMA protocols. DS1S also supports Serialized IRQ for legacy IRQ compatibility.

DS-1S supports the connection to AC’97s which provides high quality DAC, ADC and analog mixing, and it can connect two AC’97. In addition, it supports consumer IEC958, Audio Digital Interface (SPDIF), to connect external audio equipment by digital. It has the following features:

2 – 12

• PCI 2.2 compliant

• PC’98/PC’99 specification compliant

• PCI Bus Power Management rev. 1.0 compliant (support D0, D2 and D3 state)

• Supports clock run

• PCI Bus Master for PCI audio

• Legacy audio compatibility

supporting chip - audio

- True full duplex playback and capture with different sampling rate

- Maximum 64-voice XG capital wavetable

- Synthesizer including GM compatibility

- DirectSound Hardware Acceleration

- DirectMusic Hardware Acceleration

- Downloadable Sound (DLS) level-1

- FM synthesizer

- Hardware Sound Blaster Pro compatibility

- MPU401 UART mode MIDI interface

- Joystick

• Supports PC/PCI and Distributed DMA for legacy DMAC (8237) emulation

• Supports serialized IRQ

• Supports I

• Supports Consumer IEC958 Output (SPDIF OUT)

• Supports Consumer IEC958 Input (SPDIF IN)

• Supports AC’97 Interface (AC-Link) Revision 2.1

• Multiple CODEC (Connectable two AC’97s)

• Hardware volume control

• EEPROM interface

• Single crystal operation (24.576Mhz)

• 3.3V power supply (5V tolerant)

serial input for Zoomed Video Port

3 Disassembly

This chapter provides step-by-step instructions for disassembling parts and subsystems. When it comes to reassembly, reverse the procedures (unless otherwise indicated).

We suggest you completely review any procedure before you take the computer apart. The computer comes in two (2) models: 2800 and 2820/2850 and several “variations”:

The 280 is based on the P entium II CPU. Differ ent versions may have cosmetic and minor structural variations of the top and bottom covers (mostly concerning LCD panel sizes). As appropriate, these differences are noted in the sidebars. When servicing, be sure to note the mainboard v ersion. This may affect CPU switch settings. Additional component information is available in Appendix A: Part Lists or Appendix B: Circuit Diagrams.

The 2820/2850 is based on the Pentium III. Like the earlier model, there may also be variations. However, unlike the 2800, there are no CPU switch adjustments.

CPU Upgrades: To upgrade, you only need to remove the keyboard, heat plate and heatsink. For the 280 model, the

CPU switch settings can be accesed through the RAM bay opening.

Note: When re-assembling, make sure the heat plate is not “distorted” and is fastened securely.

LCD Upgrades (all versions): All switches are accessable throuth the RAM bay opening. Connections are under the status panel.

The LCD/ top cover assembly is anchored with four (4) externally accessable screws.

Illustrations: To enhance procedural clarity, the illustrations in this chapter do not include all components. Mylar

insulation and adhesive attachments are not shown unless they are critical to the disassembly process. For information about these parts, please refer to

Appendix A: Part Lists

3 – 1

Disassembly

The disassembly procedures appear in the following order:

• Keyboard – CPU upgrade/replacement

• LCD Module – LCD assembly, inverter

• Top Cover – TouchPad assembly

• Bottom Cover – HDD, FDD, mainboard, and DC/DC board

• Connector Locator

All disassembly procedures assume that the system is turned OFF, and disconnected from any power supply (the battery is removed too). We also assume that the CD/DVD-ROM module is removed. All of these procedures are described in the User’s Manual which accompanies the system.

CONNECTIONS

Connections within the computer are one of four types:

Locking collar sockets for ribbon connectors To release these connectors, use a small flat-head screwdriver

to gently pry the locking collar away from its base. When replacing the connection, make sure the connector is oriented in the same way. The pin1 side is usually

Pressure sockets for multi-wire connectors To release this connector type, grasp it at its head and gently

rock it from side to side as you pull it out.

wires themselves.

force it. The socket only fits one way.

Pressure sockets for ribbon connectors To release these connectors, use a small pair of needle-nose

pliers to gently lift the connector away from its socket. When replacing the connection, make sure the connector is oriented in the same way. The pin1 side is usually

Board-to-board or multi-pin sockets To separate the boards, gently rock them from side to side as you

pull them apart. If the connection is very tight, use a small flathead screwdriver

When replacing the connection, do not try to

- use just enough force to start the separation.

not

indicated.

Do not pull on the

not

indicated.

3 – 2

procedures

MAINTENANCE PRECAUTIONS

The following precautions are a reminder. To avoid personal injury or damage to the notebook while performing a removal and/or replacement job, take the following precautions:

1. Don't drop it. Perform your repairs and/or upgrades on a stable surface. If the computer falls, the case and other components

could be damaged.

2. Don't overheat it. Note the proximity of any heating elements. Keep the computer out of direct sunlight.

3. Avoid interference. Note the proximity of any high capacity transformers, electric motors, and other strong magnetic fields. These

can hinder proper performance and damage components and/or data. You should also monitor the position of magnetized tools (i.e. screwdrivers).

4. Keep it dry. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly damaged.

5. Be careful with power. Avoid accidental shocks, discharges or explosions.

•Before removing or servicing any part from the notebook, turn the notebook off and detach any adapters (AC/DC or car adapter).

• To prevent the notebook from being turned on accidentally, remove the battery module ment procedure.

• Only use a power adapter approved for use with this computer.

• Make sure the AC adapter has a steady, uninterrupted power supply and is grounded.

• When you want to unplug the power cord or any cable/wire, be sure to disconnect it by the plug head. Do not pull on the wire.

• Be sure the socket and any extension cord(s) you use can support the total current load of all connected devices.

6. Peripherals/Modules – Turn off and detach any peripherals. Remove all modules and power units.

7. Beware of static discharge. ICs, such as the CPU and main support chips, are vulnerable to static electricity. Before handling any

part in the notebook, discharge any static electricity inside the notebook. When handling a printed circuit board, do not use gloves or other materials which allow static electricity buildup. We suggest that you use an anti-static wrist strap instead.

8. Beware of corrosion. As you perform your job, avoid touching any connector leads. Even the cleanest hands produce oils which

can attract corrosive elements.

9. Keep your work environment clean. Tobacco smoke, dust or other air-born particulate matter is often attracted to charged

surfaces, reducing performance.

10. Keep track of the components. When removing or replacing any part, be careful not to leave small parts, such as screws, loose

inside the notebook.

before

you start a removal or replace-

BATTERY PRECAUTIONS

Only use batteries designed for this computer. The wrong battery type may explode, leak or damage the computer. Recharge the battery using an approved system. Incorrect recharging may make the battery explode. Always dispose of batteries carefully. Batteries may explode or leak if exposed to fire, or improperly handled or discarded. Do not try to repair a battery. Damaged or defective batteries should be replaced.

precautions

3 – 3

Disassembly

CLEANING

Do not apply cleaner directly to the computer, use a soft clean cloth. Do not use volatile (petroleum distillates) or abrasive cleaners on any part of the computer.

MAINTENANCE TOOLS

The following tools are recommended when working on the notebook:

M3 Phillips-head screwdriver M2.5 Phillips-head screwdriver (magnetized)* M2 Phillips-head screwdriver Small flat-head screwdriver Pair of needle-nose pliers anti-static wrist-strap * note Maintenance Precaution #3.

3 – 4

precautions

GENERAL DISASSEMBLY: UNDER THE KEYBOARD

REMOVING THE KEYBOARD & HEAT PLATE

1. Make sure the computer is turned off.

2. Remove the rubber caps and screws on the status panel.

3. Carefully angle the status panel up and then the keyboard.

4. Flip the keyboard face-down to expose the HDD and heatplate.

5. Use a flat-head screw driver to pry up the collar of the keyboard’s ribbon connector. Then set the keyboard aside.

6. Using the philipshead screwdriver again, remove the 5 screws anchoring the heat plate.

2 2 2

RELEASING THE KEYBOARD & REMOVING

HEAT PLATE

THE

FIG. 3 – 1

Tip

This procedure involves:

Stop here if you only need to replace /upgrade the CPU.

screws 8 connectors: 1

keyboard & heat plate

3 – 5

Disassembly

CHANGING THE CPU

The CPU is further protected by cooling-fan/heatsink. To remove it, again angle the status panel up. Lift the cooling-fan/heatsink up slightly and pull it forward. If you

want to completely remove the cooling-fan/heatsink, disconnect it from its power supply at connection CN7.

Note: the cooling-fan/heatsink has a small “lip” overhanging the mainboard.

The removable CPU fits into a µPGA socket. When changing it, use a small flat-head screwdriver to carefully turn the pin-lock to the release position. As you

remove the old CPU, be sure to note the position of the CPU’s “Pin 1”. Make sure any replacement CPU is also properly locked into position.

CPU settings for the Intel Pentium II -based 2800 are controlled from SW1 which is accessible from the RAM bay on the notebook’s bottom.

The Pentium III-based 2820/2850 models auto-detect the CPU, so there are no CPU- switches to adjust. Before making any changes, note the mainboard version and use the appropriate switch settings shown in Table 3-1.

3 – 6

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TABLE 3 - 1

CPU

FIG. 3 – 2

Note the Pin1 location

SW1

FIG. 3 – 3

CPU upgrades

3 – 7

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Disassembly

GENERAL DISASSEMBLY: REMOVING & REPLACING THE LCD MODULE

The LCD module can be removed with only a little more disassembly after you’ve removed the keyboard and heat plate:

1. Lift the status panel up, disconnect the status panel board at CN8 (A) and the left speaker at CN12(B). Set it aside.

2. Remove the hinge covers (C, D & E). Use the flat-head screwdriver to flex the cover up and back slightly.

4. Disconnect controller connector CN11(F to G) and inverter connector CN6 (H to I).

5. Remove the two (2) rear screws (J ~ K), set them aside. Note: On models 2800 & 2820 these are the upper rear screws.

6. Remov e the four (4) hinge scr e ws (L ~ O), set them aside and lift the LCD module away from the body. Note: On the 2850 model, screws M & O are on the bottom panel.

TABLE 3 - 2

LCD & MISCELLANEOUS

SWITCH SETTINGS

3 – 8

LCD module

If you are upgrading the LCD module to different size, stop here. The entire module should be replaced, including the rear panel and frame. The new module uses different components, but connects in the same way as the original. Refer to Appendix A for specific part numbers.

If you are only replacing the LCD panel with one of the same size, continue to page 3-9.

Depending on your replacement module, you may need to adjust SW2 settings in the RAM bay. Refer to Table 3-2:

REMOVING THE LCD MODULE

FIG. 3 – 4

Tip

This procedure involves: screws 6 connectors: 2

LCD module

3 – 9

Disassembly

REPLACING THE LCD

The LCD module has two elements, the LCD itself, and its inverter card. First separate the LCD module from the main body of the computer as described on pages 3-4 and 3-5. If you are upgrading to a different LCD, this entire assembly, except for the side frame and hinge elements and

possibly the inverter card, will be replaced.

12.1” DISASSEMBLY (NOT SHOWN)

This LCD is attached directly to the rear panel of the LCD module.

1. Remove the 6 rubber caps and frame screws under them.

2 Snap off the LCD frame. As you do this, make sure the cover latch doesn’t spring out. There are snaps on all sides.

3. Disconnect the panel from the inverter board.

4. Remove the 4 LCD anchor screws, and lift the LCD away from the rear panel.

14.1 & 15.1” DISASSEMBLY (SHOWN)

This LCD is mounted in a frame, which in turn attaches to the rear panel of the module.

1. Remove the 7 rubber caps (A~G) and frame screws under them.

2 Snap off the LCD frame (H). As you do this, make sure the cover latches (I & J) doesn’t spring out. There are

snaps on all sides.

3. Disconnect the panel from the inverter board (K).

4. Remove the frame and hinge anchor screws (L ~Q) and lift the LCD panel (R) and frame away from the rear panel (S).

6. Remove the frame screws (T~U)

3 – 10

REMOVING THE INVERTER BOARD

The inverter board is anchored to the rear panel of the LCD module with two screws. If you need to remove it for testing or replacement, make sur e the system is disconnected from all po wer sour ces (including batteries). You should disconnect all leads from the inverter befor e removing it from the LCD module. The inv erter board itself is housed in protective mylar. This package is itself may be glued together, so separate it carefully to avoid tearing.

LCD module

SEPARATING THE LCD & FRAME

FIG. 3 – 5

This procedure involves:

screws 17 connectors: 2

Tip

15.1”

LCD module

3 – 11

Disassembly

GENERAL DISASSEMBLY: TOP COVER ASSEMBLY

The Top Cover Assembly contains the TouchPad and daughterboards for the Status Panel LEDs and the Power Switch. However other components are only accessible after the Top Cover Assembly is removed.

Remove the keyboard, status panel, heat plate and LCD module as described on pages 3-5 and 3-9.

SEPARATING THE TOP COVER ASSEMBLY

1. If you haven’t already done so, remove the battery and DVD/CD-ROM, or spacer module.

2. Remove the heat plate (A) and CPU fan (B) assembly (disconnect the fan at CN6).

3. Remove the LCD module (refer to pages 3-8 and 3-9).

4. Turn the notebook body upside-down. For model 2850, remove 11 screws (C~M). For models 2800 & 2820, remove 13 screws (C~O).

5. Remove the 2 screws on the rear panel (the lower outer corner screws 2800 & 2820 versions only).

6. Return the notebook to its upright position and disconnect the TouchPad to mainboard connector at CN18 (P).

3 – 12

top cover & TouchPad

TOP COVER D ISASSEMBLY

(BOTTOM SCREWS)

FIG. 3 – 6

This procedure involves: screws 11 (2850) or 13 (2800 & 2820)

This procedure involves: connector(s) 1

Tip

TOP COVER D ISASSEMBLY

(TOP SCREWS)

FIG. 3 – 7

Tip

3 – 13top cover & TouchPad

Disassembly

GENERAL DISASSEMBLY: TOP COVER COMPONENTS

The 2 TouchPad daughterboards in this assembly are unlikely to require any service.

TOUCHPAD

The TouchPad module is in 2 parts: the TouchPad itself and the “mouse” buttons. To tak e them out of the top co v er assembly, first separate the top cov er assembly as described on pages 3-12 and 3-13.

1. Remove the 8 screws anchoring the TouchPad assembly (A~H)

2. Lift the TouchPad assembly away from the top cover.

3. To remove the TouchPad itself, remove the tape anchoring the ribbon connector, then release the connector on the electronic component-side of the TouchPad (the connector’s collar flips up). (I)

4. The “mouse” button PC board is anchored to the assembly by two screws (J & K).

3 – 14

top cover assembly

TOP COVER ASSEMBLY

A - H

FIG. 3 – 8

The TouchPad module has:

screws 10 connectors 1

Tip

3 – 15top cover assembly

Disassembly

GENERAL DISASSEMBLY: BOTTOM COVER ASSEMBLY

The Bottom cover assembly includes the mainboar d, HDD module, FDD module, power board, PCMCIA socket, and optional fax/modem module (not shown).

HDD MODULE

The HDD module (A) is held in place with two screws.

1. Remove the HDD module anchor screws (B & C).

2. Lift the HDD module away from the mainboard, disconnecting from pressure connector CN19 (D).

Note: The mylar insulation between the bottom of the module and the mainboard should remain attached to

the mainboard- there there are no serviceable components under it.

FDD MODULE

The FDD module (E) is held in place with two screws.

1. Remove the FDD module anchor screws (F & G). (front right & left rear)

2. Release the locking collar on the FDD’s ribbon connector, CN21 (H).

3. Lift the FDD module away from the mainboard.

Note: The mylar insulation between the bottom of the module and the mainboard should remain attached to

the mainboard- there there are no serviceable components under it.

4. If you are replacing the FDD, you should also r emov e the module’s side brackets (I & J), which ar e secured with 2 screws each.

3 – 16

MAINBOARD & FRAME (NOT SHOWN)

The mainboard & frame assembly also includes the DC/DC board. To remove them from the bottom cover,

1. Disconnect the onboard microphone at CN22 and the backup battery at CN23.

2. Remove 4 screws (left-rear corner, near battery terminal, behind PS/2 connector, and near drive-bay latch) and the two stantion posts near the CPU.

3. Lift the mainboard & frame assembly up and away from the bottom cover.

To separate the mainboard, DC/DC board and frame, You only need to remove the hex nuts around the rear ports. Then separate the mainboard and DC/DC board.

bottom cover

BOTTOM COVER ASSEMBLY

FIG. 3 – 9

Separating the mainboard from the bottom cover includes: screws 3 connectors 2

Tip

bottom cover

3 – 17

Disassembly

((

(

((

HDD

Jumper Warning

Some (usually older) HDDs have a small jumper switch. It must be set to “master” or the system may not correctly recognize the drive. Check your drive’s documentation.

HDD MODULE ASSEMBLY

When you’re ready to install a new hard disk,

TAKING IT APART

After you’ve removed the HDD module,

1. Remove the four (4) bracket screws (A~D), and set them aside.

2. Remove screws E &F and carefully pull off the HDD adapter board (G).

3. Gently tilt the HDD up and pull it out of the frame.

HDD MODULE ASSEMBLY

FIG. 3 – 10

Note: This operation is conducted

with the electronics side face down.

3 – 18

HDD

))

)

))

SETTING UP A NEW HDD FOR THE FIRST TIME

Before you can use a new HDD for the first time, you have to do two things:

• tell the computer about the HDD (refer to the User’s Manual Chapter 3: Firmware).

• prepare the HDD to accept data (refer to your operating system manual).

Use the following directions to prepare the new HDD for use.

HARDWARE

After you replace or upgrade the HDD, turn the system on and configure it for the newly-installed HDD using Setup. R efer to the User’s Manual Chapter 3: Firmware.

528MB OR LARGER HDDS & LBA MODE

The notebook automatically assumes any HDD 528MB or larger uses LBA Mode. If the HDD was formatted on an older system which did not use LBA mode, use the Setup utility to manually adjust the LBA setting for the Primary Master. If you don’t, the system will not “see” it correctly.

The default, “Auto” type setting uses LBA mode. Use this if you’re preparing a “fresh” HDD.

SOFTWARE

A hard disk must be partitioned, and formatted before use.

PARTITIONING

To partition the HDD, use the utility from your operating system (e.g. Microsoft’s fdisk command) to do this.

Note: If you want to use the Save to Disk Partition fea-

ture, refer to the User’s Manual’s Chapter 4: Power before you partition the HDD.

FORMATTING

To format, use the utility from your operating system (e.g. Microsoft’s format/s command). Consult your operating system’s manual for more information on its partitioning and formatting utilities.

((

(

((

Save to Disk

Warning

Whenever you install a different hard disk that has a Save to Disk partition on it, make sure you follow the procedures detailed in the User’s Manual Chapter 3: Firmware and Chapter 4: Power.

HDD

3 – 19

Disassembly

SWITCHES & CONNECTORS

These figures show the locations of the principal switches and connectors.

SWITCHES & CONNECTORS

FIG. 3 – 11

Mainboard (top view)

1. CN1 LAN port

2. CN2 Fax/Modem port

3. CN3 VGA port

4. CN5 to Fax/Modem card

5. CN7 to CPU fan

6. CN12 to #35 (Status Panel)

7. CN11 to LCD panel

8. CN6 to #38 (Inverter)

9. CN8 to #33 (Status)

10. CN9 to #27 (DC/DC)

11. CN13 to CD/DVD-ROM

12. IrDA port

13. CN14 USB port

14. CN17 USB port

15. CN19 to HDD

16. CN18 to TouchPad

17. CPU socket

18. CN15 to Fax/Modem card

19. CN16 to keyboard

20. CN20 to main battery

21. CN21 to FDD

22. CN 22 to on-board mic

23. CN 23 to CMOS battery

24. CN24 line-in

25. CN25 microphone

26. CN26 phones

4 5

MAINBOARD (TOP)

DC/DC BOARD

29 30

(TOP)

3 – 20

24 25 26

switches & connectors

STATUS PANEL (BOTTOM)

STATUS BOARD

(TOP)

DC/DC BOARD

(BOTTOM)

MAINBOARD (BOTTOM)

10C

SWITCHES & CONNECTORS

(CONT.)

FIG. 3 – 12

DC/DC Board

27. CN4 to #6 (Mainboard)

28. Parallel port

29. Serial 1 (COM1) port

30. PS/2 port

31. DC-in 19V

32. SW1 system power switch

Status Panel

33. CN2 to #9 (Mainboard)

34. Left speaker to #6 (Mainboard)

35. CN3 to Close-cover switch

36. Close-cover switch

37. CN1 to Right speaker

Inverter Board

38. CN2 to #8 (Mainboard)

39. CN1 to LCD power

Mainboard (bottom)

40. CN27 PC Card

41. CN28 RAM slot “0”

42. CN29 RAM slot “1”

INVERTER BOARD (BOTTOM)

2425

switches & connectors

3 – 21

Disassembly

NOTES:

3 – 22

notes

4 Troubleshooting

If you are having trouble diagnosing and solving problems, this chapter has several tools which should help:

• Troubleshooting chart – a system flow chart indicating the location of possible system abnormalities.

• Pre-POST assistant – a rundown of possible problems before the POST and solutions.

• POST assistant – a listing of beeps and error messages and their definitions.

• Post-POST assistant – a rundown of possible problems after the POST and solutions.

This chapter does not tell you how to disassemble the notebook. For those procedures, go back to Chapter 3: Disassembly.

4 – 1

Troubleshooting

BEFORE YOU BEGIN

Before you start a troubleshooting job, be sure that:

• All peripheral devices are disconnected from the notebook. (They should be tested separately.)

• You have reviewed the safety precautions in the beginning of Chapter 3: Disassembly.

TOOLS

In addition to the tools listed in Chapter 3, troubleshooting jobs may call for some additional devices:

• Multimeter

• Transistor checker

• Oscilloscope (100 MHz)

• Soldering/de-soldering station (30W)

4 – 2

precautions & tools

SYSTEM TROUBLESHOOTING CHART

Use the following troubleshooting flow chart to locate the problem areas systematically.

TROUBLESHOOTING FLOWCHART

FIG. 4 – 1

flow-chart

4 – 3

3. The LCD screen has malfunctioned.

Troubleshooting

PRE-POST ASSISTANT

This section describes possible problems before the Power-On-Self-Test (POST) and ways to solve them.

Possible Problems Possible Causes

AC power LED fails The AC/DC adapter has malfunctioned.

TABLE 4 – 1

RE-POST PROBLEMS

AC power & charge LEDs fail

LCD screen fails to display

1. The DC/DC board has failed.

2. The battery pack has malfunctioned or its connection to the DC/DC board is bad.

3. There is a short circuit in the mainboard.

1. There is a bad connection between the LCD screen and the mainboard.

2. The inverter board has failed.

4 – 4

pre-POST problems

AC POWER LED FAILS

Under normal conditions, plugging in the AC/DC adapter makes the AC Power LED light up. If it fails to light up, it is possible that the AC/DC adapter is malfunctioning. If you think this is the case, try the following:

• Make sure the power cord to the adapter is securely plugged into a properly grounded socket.

• Make sure the adapter is completely connected to the adapter port on the computer.

• Check the adapter’s contacts.

AC/DC ADAPTER

The AC/DC adapter serves as both the system power source and the battery pack charger. Check the adapter’s contacts to see if the AC/DC adapter has failed. (Figure 4-2)

Contact Assignment Description

inner ring (Pin 1) 20V +20V/3A The adapter is in CV (constant voltage mode).

outer ring (Pin 2) GND

Pin 1

TABLE 4 – 2

DAPTER CONTACTS

ADAPTER’S CHECK POINTS

FIG. 4 – 2

Pin 2

AC/DC adapter

4 – 5

Troubleshooting

AC POWER & CHARGE LEDS FAIL

There may be other problems responsible for a system status LED’s failure to appear:

• The DC/DC board failed.

• The battery pack malfunctioned or its connection with the mainboard is bad.

• There is a short circuit in the mainboard.

Try the following troubleshooting procedures.

CHECKING THE DC/DC BOARD

A blown fuse or an incorrect output voltage on the DC/DC board may cause the system status LEDs’ malfunction. If either of the two situations occurs, replace the DC/DC board or send the board to the service center near you.

4 – 6 DC/DC board

DC/DC Board (top)

POWER COMPONENTS

FIG. 4 – 3

1. CN5 DC/DC board to M/B

3. CN1 for DC IN Jack

3. F2 Fuse for AC-IN

DC/DC Board (bottom)

Mainboard (top)

DC/DC board

4 – 7

Troubleshooting

69 VIN 70 VIN

CN5 DC/DC Board to M/B (on the DC/DC Board)

Pin Signal Pin Signal

1 RIA 2 GND 3 LPSTROBE# 4 LPD0 5 LPACK# 6 LPD1 7 LPBUSY 8 LPD2 9 LPPE 10 LPD3 11 LPSLCT 12 LPD4

13 LPAFD# 14 LPD5 15 LPERROR# 16 LPD6

17 LPINIT# 18 LPD7

19 LPSLCTIN# 20 GND

21 SUSB# 22 V_CORE 23 DCD1# 24 NC 25 DSR1# 26 DTR1# 27 RXD1 28 RTS1# 29 CTS1# 30 TXD1

31 RING1# 32 PS2_DATA 33 KBDATA 34 PS2_CLK 35 KBCLK 36 EXTFDDPWR# 37 H8SHDN 38 LPTDRV2 39 GND 40 PWRSW#

41 V_H8 42 +5V 43 +12V 44 +5V 45 GND 46 GND 47 VA 48 VA 49 GND 50 VA

51 GND 52 GND 53 +3V 54 +3V 55 GND 56 +3V 57 GND 58 GND 59

61 +5VS 62 +5VS

63 +3VS 64 +3VS 65 GND 66 +3VS 67 VIN 68 VIN

+5VS

CN1 DC IN JACK

Pin Signal

1 +20V

2 GND

3 GND

4 – 8

DC/DC board

CHECKING THE BATTERY PACK AND ITS CABLING

A malfunctioning battery pack or a bad connection between the battery pack and the power board may be the cause of the LEDs’ failure.

CHECKING THE BATTERY PACK

Whether the battery pack functions well or not can be checked by measuring the voltage across battery contacts BAT and GND. Figure 4-3, on page 4-7, shows the battery pack connector’s location and its associated fuse. Figure 4-4 below is the battery circuit diagram. The measured voltage should be between 9V to 16.8V. (The voltage for a fully charged Ni-MH battery pack is around 9.6V while Li-Ion battery is around 14.4V for 4S2P.) If the supply voltage is still not in the correct range, replace the faulty battery pack.

BATTERY CIRCUITRY

FIG. 4 - 4

Li-Ion Battery

battery

4 – 9

Troubleshooting

CHECKING THE CABLING

If the battery pack is functioning properly, check if the measured voltage across pins 1 to 5 of connector CN20 on the mainboard (Fig. 4-3) is the same as the voltage measured for the battery pack. If the measured voltages are not the same, check if the fuse on the power board has been damaged.

CHECKING THE MAINBOARD

Automatic short-circuit protection may have been activated by a short circuit occurring in the system. The system cannot be turned on with automatic short-circuit protection activated. If you detect a short circuit in the mainboard, fix the problem accordingly.

4 – 10 battery

LCD SCREEN FAILURE TO DISPLAY

The LCD screen’s inability to display may be due to any of the following problems:

• There is bad connection between the LCD screen and the mainboard

• The inverter board has malfunctioned

• The LCD screen has malfunctioned

CHECKING THE LCD TO MAINBOARD CONNECTION

A bad connection between the LCD screen and the mainboard may be the cause of the LCD screen’s failure to display. If the LCD control signal cable is frayed or is not properly plugged into connector CN13 on the system board (Figure 4-5 ), either situation may have caused the LCD not to display. Replace the cable if it is frayed or plug it in if it is loose. If the problem still persists, proceed with the rest of the checking job.

JINV1

JLCD1

CN13

LCD

TO MAINOARD

CONNECTION

FIG. 4 – 5

LCD & mainboard

4 – 11

the inverter board.

Troubleshooting

Warning

Inverter boards have highvoltage areas. To prevent electrical shock, do not touch the board when the system is on.

TABLE 4 – 3

NVERTER BOARD

CHECK AREAS

CHECKING THE INVERTER BOARD

Table 4-3 suggests areas where problems may occur and provides corresponding corrective actions. The component sites of the inverter board are shown in Figure 4-6.

Area to Check Action

Fuse 1.0A (F1) Check the fuse and replace it if necessary.

Check if the voltages of all the pins of this connector are correct. (see the following figure). If any of the pins presents an incorrect voltage, check if

Connector CN2

Connector CN1

the connection between the inverter board and the system board is OK. If the connecting cable is loose or frayed, plug it in or replace it. If the problem still persists, replace the inverter board.

Check if the cable connecting the LCD lamp to the inverter board is well plugged into connector CN1. If there is no connection problem, replace

INVERTER BOARD COMPONENT SITES

FIG. 4 – 6

4 – 12 LCD & inverter

CN1

CN5

CN2

CN2 Inverter to CN5 on M/B

Pin Signal

1 VIN

2 VIN

3 GND

4 INT_VCC

5 PANEL_ON

6 BRIGHT

JLCD1

CHECKING THE LCD SCREEN

If you found no problems with the inverter board and its connection to the mainboard and the LCD lamp, and the LCD still doesn’t work, it is possible that the LCD screen itself may have malfunctioned. Replace the LCD screen to see if the problem can be solved. If the problem persists, send the notebook to the nearest service center for repair.

LCD status

4 – 13

Troubleshooting

POST — TESTING THE SYSTEM

Each time the system is powered on, it automatically performs a Power-On-Self-Test (POST). The POST tests major system hardware and checks the system configuration.

STARTUP SCREEN: THE POST

SAMPLE SCREEN)

(

IG. 4 – 7

If you choose the Quiet Boot option (not available for all models) in the Setup utility, you will

only see an abbreviated version of this screen.

1. BIOS information

2. CPU type

3. memory status

4. HDD identification notice

5. error notice (example)

6. Enter Setup cue - appears only during POST

Error beeps and messages

If any major component malfunctions, send the notebook to the nearest service center for replacement.

If the system can’t pass the POST, an error beep or message may be issued or displayed. This will indicate the problem with the system.

NO ERRORS FOUND DURING THE POST

The BIOS will initialize the video, sound a single short beep, and show a message if the system passes the POST. The system then will attempt to boot. If there is a problem which prevents the system from booting, it will tell you to run Setup. A sample screen message is shown below.

Notebook Computer Version 1.00.1.00

01.19-1.00.06 CPU = Intel(R) Mobile Pentium(R) II Processor 333 MHZ

64ØK System RAM Passed 63M Extended RAM Passed Ø256K Cache SRAM Passed System BIOS shadowed Video BIOS shadowded Mouse initialized Fixed Disk Ø: FUJITSU MHH2032AT ATAPI CD-ROM: TOSHIBA 1902-B WARNING ERROR Parallel Port configuration changed

Press <F2> to enter SETUP, <F12> to enter BOOT MENU

}

Note: your POST may identify dif-

ferent components.

4 – 14

POST

POST ERROR BEEPS & SCREEN MESSAGES

each beep group is separated by a pause

Errors, fatal or non-fatal, can occur during the POST. All fatal errors and some non-fatal errors are communicated through a series of audible beeps. Table 4-4 below lists the error beep messages. Fatal errors do not allow the system to continue the boot process.

Error Code Beep Sequence Description

16 1-2-2-3 BIOS ROM checksum

20 1-3-1-1 Test DRAM refresh

22 1-3-1-3 Test 8742 Keyboard controller

2C 1-3-4-1 RAM failure on address line xxxx

2E 1-3-4-3

30 1-4-1-1 RAM failure on DATA bits xxxx of high type of memory bus

46 2-1-2-3 Check ROM copyright notice

58 2-2-3-1 Test for unexpected interrupts

Most displayed errors as listed in Table 4-5 (pages 4-16 to 4-18) and Table 4-6 (pages 4-19 to 4-22), allow the system to continue the boot process. The system will halt after one of the screen messages and cannot usually be rebooted until a physical change is made in the system.

For most errors there will be only one message displayed. However, a second message may appear: RUN SETUP. If this message occurs, press F2 to run Setup.

RAM failure on DATA bits xxxx of low byte

of memory bus

TABLE 4 – 4

ATAL ERROR MESSAGES

POST error beeps

4 – 15

Troubleshooting

You may have to replace keyboard or controller.

Meassage Description & Suggested Solution

TABLE 4 – 5

ON-FATAL ERROR MESSAGES

nnnn Cache SRAM Passed

Diskette drive A error or Diskette drive B error

Entering SETUP...

Extended RAM failed at offset: nnnn

nnnn Extended RAM Passed

Failing Bits: nnnn

Fixed Disk Ø Failure or Fixed Disk 1 Failure or Fixed Disk Controller Failure

Incorrect Dirve A type - run SETUP

Invalid NVRAM media type

description:

description: solution:

description: Starting Setup Program.

description: solution:

description:

solution:

description: solution:

description: Type of floppy drive A: not correctly identified in Setup.

description: Problem with NVRAM (CMOS) access.

nnnn is the amount of system cache in kilobytes successfully

Where

tested.

Drive A: or B: is present but fails the BIOS POST diskette tests.

Check to see that the drive is defined with the proper diskette type in Setup and that the diskette drive is attached correctly.

The extended memory is either not working, or is imporperly configured. Enter the Setup and allow the system to redetect the memory. Check that any DIMM modules are properly seated in their sockets. Try restarting the system. If

the problem persists, remove the DIMMs and reboot. Replace any faulty DIMMs.

nnnn is the amount of RAM in kilobytes successfully tested.

Where

Where hex number nnnn is a map of the bits at the RAM address (in System, Extended, or Shadow memory) which failed the memory test. Each 1 (one) in the map indicates a failed bit.

Turn off the system and remove any DIMMs. Restart the system. If the problem

disappears, replace the DIMMs one at a time to identify the defective module. Replace any defective DIMMs.

The hard disk is not working, or is not properly configured.

Check that the HDD is properly attached. Run Setup to make sure the HDD is

correctly configured.

4 – 16

Keyboard Controller Error

POST error messages

description: solution:

The keyboard controller failed test.

Meassage Description & Suggested Solution

the next time the system is booted.

Keyboard Error

Keyboard Error nn

Keyboard Locked - Unlock Key Switch

Monitor type does not match CMOS- run SETUP

Operating system not found

Parity Check 1

Parity Check 2

Press <F1> to resume, <F2> to Setup

Press <F2> to enter SETUP, <F12> to enter Boot Menu

Previous boot incomplete-Default configuration used

description: solution:

description:

solution:

description: Unlock the system to proceed.

description: The monitor type is not correctly identified in Setup.

description: solution:

description: A parity error was found in the system bus. The BIOS attempts to locate the

description: Displayed after any recoverable error message. Press <F1> to start the boot

description: Optional message displayed during POST. Can be turned off in Setup.

description:

solution:

The keyboard is not working. Reboot the computer. If the problem persists, replace the computer.

The BIOS discovered a stuck key and displays the scan code nn for the stuck key. Try toggling the keys. Reboot the computer. If the problem persists, replace the keyboard.

The operating system cannot be found on either drive A: or drive C:. Enter Setup and make sure the HDD and drive A: are properly identified.

address and display it on the screen. If it cannot locate the address, it displays ????.

process or <F2> to enter Setup and change any settings.

The previous POST did not complete successfully. The POST loads defult values and offers to run Setup. If the failure was caused by incorrect values and they are not corrected, the next boot will likely fail. On systems with control of wait states, improper Setup can also terminate POST and cause this error on the next boot. Run Setup and verify the wait-state configuration is correct. This error is cleared

TABLE 4 – 5 (CONT.)

ON-FATAL ERROR MESSAGES

POST error messages

4 – 17

Troubleshooting

Video BIOS shadowed

Video BIOS successfully copied to shadow RAM.

Meassage Description & Suggested Solution

TABLE 4 – 5 (CONT.)

ON-FATAL ERROR MESSAGES

Real time clock error

Shadow RAM failed at offset: nnnn

nnnn Shadow RAM Passed

System battery is dead - Replace and run SETUP

System BIOS shadowed

System cache error - Cache disabled

System CMOS checksum bad - run SETUP

System RAM failed at offset: nnnn

nnnn System RAM passed

System timer error

UMB upper limit segment address: nnnn

description: solution:

description:

solution:

description: Where nnnn is the amount of shadow RAM in kilobytes successfully tested.

description: solution:

description: System BIOS copied to shadow RAM.

description: RAM cache failed the BIOS test and has been disabled.

description:

solution:

description: The system RAM failed at the offset nnnn of the 64K block at which the error

description: Where nnnn is the amount of system RAM in kilobytes successfully tested.

description: solution:

description: Displays the address nnnn of the upper limit of Upper Memory Blocks,

The on-board clock fails the BIOS test. May require board repair.

The shadow RAM failed at the offset nnnn of the 64K block at which the error was detected. Try to restart the system. Check that the DIMMs are properly seated.

The CMOS clock battery indicator shows the battery is dead. Replace the battery and run Setup to reconfigure the system.

The CMOS has been corrupted or incorrectly modified, perhaps by an application program that changes data stored in the CMOS. Run Setup to reconfigure the system either by getting the Default Values and/or making your own selections.

was detected.

The timer test failed. Go to Setup and reset the Date and Time fields.

indicating released segments of the BIOS which may be reclaimed by a virtual memory manager.

4 – 18

description:

POST error messages

Error Code Definition

interrup controller

Configure advanced chipset registers

Error Code Definition

02 Verify real mode

04 Get CPU type

06 Initialize system hardware

09 Set in POST flag

0A Initialize CPU registers

0B Enable CPU cache

0C Initialize caches to initial POST values

0E Initialize I/O

0F Initialize the local bus IDE

10 Initialize Power Management

14 Initialize keyboard controller

18 8254 timer initialization

1A 8237 DMA controller initialization

Initialize chipset registers with initial POST values

Load alternate registers with initial POST values

Restore CPU control word during warm boot

BIOS ROM checksum (beep code 2-2-3)

Reset programmable

20 Test DRAM refresh code 3-1-1

24 Set ES segment gegister to 4GB

28 Autosize DRAM

2A Clear 512K base DRAM

32 Test CPU bus clock frequency

34 Test CMOS RAM

35 Initialize alternate chipset registers

36 Warm start shutdown

37 Reinitialize the chipset (MB only)

38 Shadow system BIOS ROM

39 Reinitialize the cache (MB only)

3A Autosize cache

Test 8247 keyboardcontroller (beep code 3-1-3)

RAM failure on address line xxxx'

(beep code 3-4-1)

RAM failure on data bits xxxx' of low byte of memory bus

(beep code 3-4-3)

RAM failure on data bits xxxx' of high byte of memory bus

(beep code 4-1-1)

TABLE 4 – 6

HOENIX BIOS POST

EFAULT TEST POINTS

(DISPLAYED ON DEBUG CARD)

POST error codes

4 – 19

Troubleshooting

Test RAM between 512 and 640K

Initialize BIOS Data area

TABLE 4 – 6(CONT.)

HOENIX BIOS POST

EFAULT TEST POINTS

(DISPLAYED ON DEBUG CARD)

Error Code Definition

3D Load alternate registers with CMOS values

40 Set initial CPU speed

42 Initialize interrupt vectors

44 initialize BIOS interrupts

47 Initialize manager for PCI option ROMs

48 Check video configuration against CMOS

49 Initialize PCI bus and devices

4A Initialize all video adapters in system

4B Display QuietBoot™ screen

4C Shadow video BIOS ROM

4E Display copyright notice

50 Display CPU type and speed

51 Initialize EISA board

52 Test keyboard

54 Set key click if enabled

56 Enable keyboard

Check ROM copyright notice (beep code 2-1-2-3)

Test for unexpected interrupts (beep code 2-2-3-1)

Error Code Definition

60 Test extended memory

62 Test extended memory address lines

64 Jump to UserPatch1

66 Configure advanced cache registers

68 Enable external and CPU caches

6A Display external cache size

6C Display shadow message

6E Display non-disposable segments

70 Display error messages

72 Check for configuration errors

74 Test real-time clock

76 Check for keyboard errors

7A Test for Keylock on

7C Test for hardware interrupt vectors

7E Test coprocessor if present

80 Disable onboard I/O ports

82 Detect and install external RS232 ports

84 Detect and install external parallel ports

85 Initialize PC-compatible PnP ISA devices

4 – 20

POST error codes

5A Display prompt "Press F2 to enter Setup"

86 Re-initialize onboard I/O ports

Shutdown 10 error

Error Code Definition

Check for errors

Initialize extended BIOS data area

Initialize floppy controller

initialize hard disk controller

Error Code Definition

B4 One beep

POST done

- prepare to boot operating system

Initialize local-bus hard disk controller

Jump to user patch2

Build MPTABLE for multi-processor boards

Disable A20 address line

Install CD-ROM for boot

Clear huge ES segment register

Search for option ROMs

Shadow option ROMs

Set up power management

Enable hardware interrupts

Set time & day

Check keylock

Initialize typematic rate

Erase F2 prompt

Scan for F2 keystroke

Enter Setup

Clear on-POST flag

B5 Display MultiBoot™ menu

B6 Check password (optional)

B8 Clear global descriptor table

BC Clear parity checkers

BE Clear screen (optional)

BF Check virus and backup reminders

C0 Try boot with INT 19

D0 Interrupt handler error

D2 Unknown interrupt error

D4 Pending interrupt error

D6 Initialize option ROM error

D8 Shutdown error

DA Extended block move

TABLE 4 – 6(CONT.)

HOENIX BIOS POST

EFAULT TEST POINTS

(DISPLAYED ON DEBUG CARD)

POST error codes

4 – 21

Troubleshooting

Boot code was read OK

The table below is for the boot block in the Flash ROM.

Error Code Definition

TABLE 4 – 6(CONT.)

HOENIX BIOS POST

EFAULT TEST POINTS

(DISPLAYED ON DEBUG CARD)

E2 Initialize the chipset

E3 Initizlize refresh counter

E4 Check for Forced Flash

E5 Check HW status of ROM

E6 BIOS ROM is OK

E7 Do a complete RAM test

E8 Do OEM initialization

E9 Initialize interrupt controller

EA Read in the bootstrap code

EB Initialize all vectors

EC Boot the Flash program

ED Initialize the boot device

4 – 22

POST error codes

POST-POST PROBLEMS

2. The AC/DC adapter has malfunctioned.

This section describes possible problems the user might encounter after the POST and suggests problem-solving methods. Possible problems and possible causes leading to them are outlined below.

Problems Possible Causes

PCMCIA socket fails to work

Speakers fail to output sound

Charge LED fails to display

1. Something wrong with the socket.

2. Something wrong with the card in use.

1. The audio driver is not properly installed.

2. The volume control key combinations are not properly adjusted.

3. The speaker cables are loose or frayed.

1. The battery pack has malfunctioned.

TABLE 4 – 7

OST-POST PROBLEMS

Pre-POST problems

4 – 23

Troubleshooting

nearest service center for repair.

PC CARD SOCKET MALFUNCTION

The faulty conditions the user might encounter when using the PC Card socket are listed below along with corresponding solutions.

Possible faulty condition Solution

TABLE 4 – 8

OSSIBLE PC CARD PROBLEMS &

OLUTIONS

Failure to insert the card into the socket If the card cannot be inserted into the socket, check for

obstructions. If the system was reassembled, recheck if there is anything wrong with the reassembly procedures, or send the notebook to the nearest service center for repair.

Failure to read from an inserted card 1. Check if the card is properly inserted.

2. Check if the card is configured with appropriate drivers. (For software installation, see the User's Manual.)

3. Check with the card vendor to see if the card is damaged.

4. If the card is still not readable, send the notebook to the nearest service center for repair.

Data reading error (SRAM card) 1. Replace the SRAM card's battery if necessary.

2. Check with the card vendor to see if the card is damaged.

3. If the problem persists, send the notebook to the

4 – 24 PC cards

SOUND OUTPUT FAILURE

The notebook’s internal audio unit consists of the audio circuitry, built-in speakers, and built-in microphone. If the user cannot receive sound from the notebook’s internal speakers, it may be due to any of the following problems:

• The audio chip is not configured with the supplied audio driver.

• The volume control key combinations (Fn + F3, Fn + F5 & Fn + F6) are not properly adjusted.

• The speaker cables are loose or frayed.

CHECKING THE SOFTWARE CONFIGURATION

To work, the audio unit should be configured with the audio driver on the Device Drivers and Tools CD-ROM supplied with the notebook. The audio driver installation is described in the User’s Manual. Install the driver if the user failed to do so. If the problem persists, continue checking.

CHECKING THE VOLUME

The sound cannot be heard if the volume control key combinations are not properly adjusted. Adjust the volume to the point you will be able to receive sound. If you still cannot hear any sound from the speaker, check the speakers’ cable connections.

If you are using earphones or self-powered speakers, make sure they are properly set up.

audio

4 – 25

Troubleshooting

CHECKING THE SPEAKER CABLES

If the speaker cables are not properly plugged into their connectors, or they are frayed, the speakers may not work. First locate the speaker connectors, then check if the speaker cables are loose or frayed. Replace each cable if it is frayed or plug it in if it is loose.

LOCATING THE SPEAKERS AND THEIR CABLE CONNECTORS

To locate the speakers and their connectors, you need to remove the status panel and the keyboard. Refer to Chapter 3, Disassembly for information on the removal procedures.The speakers are on the status panel. The right speaker

connects to the status LED board (on the status panel) at connector CN1 and then to the mainboard at connector CN8 on its upper middle area while the left speaker connects to the mainboard at connector CN12 on its upper left area.

1. right speaker

2. left speaker

4 – 26

SPEAKERS

FIG. 4 – 8

(connects to CN1 on the LED status board and then to CN8 on the mainboard)

(connects to CN12 on the mainboard)

audio

2800 Status Panel

2820/2850 Status Panel

status LED board

SUSPEND FUNCTION FAILURE

Pressing the suspend key combination will enable the system to enter Suspend mode after few seconds. The power status LED will not light if the system is in Save to Disk mode. If the system can’t enter Suspend mode it may be because the Power Savings in your BIOS setup are not set properly. If any of the current settings are wrong, change them.

CHARGE LED FAILURE

If the Charge LED doesn’t turn green after the battery pack has been recharged for about 3 hours with power off or 6 hours with power on, there are several possible explanations:

• The battery pack is malfunctioning.

• The AC/DC adapter is malfunctioning.

• The Charge LED is malfunctioning.

Replace the battery pack and recharge the new one. If the Charge LED still does not turn green after the necessary recharge time, check or replace the AC/DC adapter. If the problem persists with the new AC/DC adapter, check the Charge LED or send the notebook to the nearest service center for repair.

suspend function

4 – 27

Troubleshooting

NOTES:

4 – 28 suspend & battery status

Appendix A 2800/2820

Part Lists

This appendix breaks down the notebook’s construction into a series of illustrations. The component part numbers are indicated in the tables opposite the drawings.

Note: This section indicates the manufacturer’s part numbers. Your organization may use a different

system, so be sure to cross-check any relevant documentation.

Note: Some assemblies may have parts in common (especially screws). However, the part lists do not

indicate the total number of duplicated parts used.

Note: Be sure to check any update notices. The parts shown in these illustrations are appropriate for the

system at the time of publication. Over the product life, some parts may be improved or reconfigured, resulting in new part numbers.

A – 1

Parts

2800 FRONT

FIG. A – 1

A – 2

front assembly

2820 FRONT

FIG. A – 2

front assembly

A – 3

Parts

2800 LCD ASSEMBLY

FIG. A – 3

A – 4

lcd assembly

2820 LCD ASSEMBLY

FIG. A – 4

A – 5lcd assembly

Parts

2800 WORK ASSEMBLY

FIG. A – 5

A – 6

work assembly

2820 WORK ASSEMBLY

FIG. A – 6

work assembly

A – 7

Parts

2800 TOP COVER A SSEMBLY

FIG. A – 7

A – 8

top cover assembly

2820 TOP COVER A SSEMBLY

FIG. A – 8

top cover assembly

A – 9

Parts

2800 BOTTOM COVER ASSEMBLY

FIG. A – 9

A – 10

bottom cover assembly

2820 BOTTOM COVER ASSEMBLY

FIG. A – 10

bottom cover assembly

A – 11

Parts

2800 STATUS PANEL ASSEMBLY

FIG. A – 11

2820 STATUS PANEL ASSEMBLY

FIG. A – 12

A – 12

status panel

2800 MAINBOARD ASSEMBLY

FIG. A – 13

2820 MAINBOARD ASSEMBLY

FIG. A – 14

mainboard

A – 13

Parts

2800 BRACKET ASSEMBLY

FIG. A – 15

2820 BRACKET ASSEMBLY

FIG. A – 16

A – 14

bracket

2800/2820 REAR ASSEMBLY

FIG. A – 17

rear assembly

A – 15

Parts

2800/2820 BOTTOM ASSEMBLY

FIG. A – 18

A – 16

bottom

2820 HDD ASSEMBLY

FIG. A – 19

2800 HDD ASSEMBLY

FIG. A –20

HDD assembly

A – 17

Parts

2820/2800 FDD ASSEMBLY

FIG. A – 21

A – 18

FDD assembly

2820/2800 CD-ROM ASSEMBLY

FIG. A – 22

CD-ROM assembly

A – 19

Parts

NOTES:

A – 20

notes

Appendix B 2850

Part Lists

This appendix breaks down the notebook’s construction into a series of illustrations. The component part numbers are indicated in the tables opposite the drawings.

Note: This section indicates the manufacturer’s part numbers. Your organization may use a different

system, so be sure to cross-check any relevant documentation.

Note: Some assemblies may have parts in common (especially screws). However, the part lists do not

indicate the total number of duplicated parts used.

Note: Be sure to check any update notices. The parts shown in these illustrations are appropriate for the

system at the time of publication. Over the product life, some parts may be improved or reconfigured, resulting in new part numbers.

B – 1

Parts

2850 KEYBOARD

FIG. B – 1

PARTS

PARTS NUMBER

A.35-B9125-4R0 B.35-B1125-22A C. D. E.35-49120-100 F.35-41125-3R0 G.

NAME

DESCRIPTION

SCREW M2.5*4.0L K1 BNI SCREW M2.5*22L KI NI NY CENTER COVER ASS'Y K/B SCREW M2*10L B BN NY M2.5*3L*0.45P BIND HEAD HDD MODULE

Q'TY

2 1 1 1 1 1 1

B – 2

keyboard assembly

PARTS

PARTS NUMBER

A.35-41120-130 B.33-28201-002 C.79-282HE-0A2

D. E. F.35-B9125-17A

NAME

DESCRIPTION

SCREW M2*13L B NI NY TOP HEAT PLATE TOP HEAT SINK & FAN CABLE COVER ASS'Y \M+2A544\M+2C5E9\M+2A562\M+2A6A8\M+2AB7E SCREW M2.5*17L KI NY

Q'TY

4 1 1 1 1 1

2850 HEAT SINK

FIG. B – 2

heat sink assembly

B – 3

Clevo 2800, 2850, 2820 Service Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

NOTICE

ABOUT THIS MANUAL

RELATED DOCUMENTS

table of contents

1 Introduction

specifications

ENVIRONMENT

PHYSICAL

external locator

2 Chipset

CPU - INTEL MOBILE PENTIUM III/PENTIUM II/CELERON

CORE LOGIC CHIPSET - INTEL 440BX AGPSET

NORTH BRIDGE, AGPSET SYSTEM CONTROLLER, 443BX

SOUTH BRIDGE, PCI ISA IDE XCELERATOR, 82371EB/MB (PIIX4E/M)

SUPPORTING CHIPS

RICOH 5C475 PCI-CARDBUS BRIDGE

SMSC FDC37N869 PC 99 COMPLIANT 5V AND 3.3V SUPER I/O CONTROLLER WITH INFRARED SUPPORT

YAMAHA YMF744B DS-XG

3 Disassembly

CONNECTIONS

MAINTENANCE PRECAUTIONS

BATTERY PRECAUTIONS

CLEANING

MAINTENANCE TOOLS

REMOVING THE KEYBOARD & HEAT PLATE

CHANGING THE CPU

Disassembly

REPLACING THE LCD

REMOVING THE INVERTER BOARD

SEPARATING THE TOP COVER ASSEMBLY

TOUCHPAD

HDD MODULE

FDD MODULE

HDD MODULE ASSEMBLY

TAKING IT APART

SETTING UP A NEW HDD FOR THE FIRST TIME

HARDWARE

528MB OR LARGER HDDS & LBA MODE

SOFTWARE

PARTITIONING

FORMATTING

switches & connectors

notes

4 Troubleshooting

BEFORE YOU BEGIN

TOOLS

SYSTEM TROUBLESHOOTING CHART

PRE-POST ASSISTANT

AC POWER LED FAILS

AC/DC adapter

AC POWER & CHARGE LEDS FAIL

CHECKING THE DC/DC BOARD

CHECKING THE BATTERY PACK AND ITS CABLING

CHECKING THE BATTERY PACK

CHECKING THE CABLING

CHECKING THE MAINBOARD

LCD SCREEN FAILURE TO DISPLAY

CHECKING THE LCD TO MAINBOARD CONNECTION

CHECKING THE INVERTER BOARD

CHECKING THE LCD SCREEN

NO ERRORS FOUND DURING THE POST

POST ERROR BEEPS & SCREEN MESSAGES

POST-POST PROBLEMS

PC CARD SOCKET MALFUNCTION

SOUND OUTPUT FAILURE

CHECKING THE SOFTWARE CONFIGURATION

CHECKING THE VOLUME

CHECKING THE SPEAKER CABLES

LOCATING THE SPEAKERS AND THEIR CABLE CONNECTORS

SUSPEND FUNCTION FAILURE

CHARGE LED FAILURE

NOTES: