Clevo 2800, 2850, 2820 Service Manual
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2800/2820/2850
Notebook Computer
Service Manual
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Preface
NOTICE
The company reserves the right to revise this publication or to change its contents without notice. Information contained herein is for reference only and does not constitute a commitment on the part of the manufacturer or any
subsequent vendor. They assume no responsibility or liability for any errors or inaccuracies that may appear in this
publication nor are they in anyway responsible for any loss or damage resulting from the use (or misuse) of this
publication.
This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmitted
or reduced to any machine readable form without prior consent from the vendor, manufacturer or creators of this
publication, except for copies kept by the user for backup purposes.
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Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks of
their respective companies. They are mentioned for identification purposes only and are not intended as an endorsement of that product or its manufacturer.
First Edition ©January, 2000
Trademarks
®
Intel
, Pentium® and Pentium® with MMX™ technology are registered trademarks of Intel Corporation.
IBM® and OS/2® are registered trademarks of IBM Corporation.
MS-DOS®, Windows®, Windows® 95 and Windows NT™ are registered trademarks of Microsoft Corporation.
SystemSoft® and CardWizard® are registered trademarks of SystemSoft Corporation.
Other brand and product names are trademarks and/or registered trademarks of their respective companies.
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copyrights
ABOUT THIS MANUAL
This manual is intended for service personnel who have completed sufficient training to undertake the maintenance
and inspection of personal computers.
It is organized to allow you to look up basic information for servicing and/or upgrading components of the notebook
computer. The following information is included:
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Chapter 1, Introduction, provides general information about the location of system elements and their specifications.
Chapter 2, Chipset, briefly describes the computer’s core logic, memory and supporting chipset.
Chapter 3, Disassembly, provides step-by-step instructions for disassembling parts and subsystems and how to up-
grade elements of the system.
Chapter 4, Troubleshooting, provides recommendations on how to solve possible system problems.
Appendix A, Part Lists
Appendix B, 2800 Circuit Diagrams
Appendix C, 2820/2850 Circuit Diagrams
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the manual
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Preface
RELATED DOCUMENTS
You may also need to consult the following manuals for additional information:
User’s Manual
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The standard manufacturer’s configuration includes a printed Concise User’s Manual (usually in the language of the
destination market) and a complete ‘expanded’ User’s Manual on an accompanying CD-ROM.
Both the Concise User’s Manual and the CD-ROM based ‘expanded’ User’s Manual describe the notebook’s basic features and the procedures for operating the computer. The ‘expanded’ manual also describes the installation & operation of the utility programs and how to upgrade the system’s RAM and HDD.
Last Resort: The Manufacturer
If you can’t find the information you need in these documents or your up-line source, contact the manufacturer at:
www.clevo.com.tw
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related
TABLE OF CONTENTS
Preface
Cover .................................................................................................................................................................................................... i
Notice .................................................................................................................................................................................................. ii
About This Manual ............................................................................................................................................................................ iii
Related Documents........................................................................................................................................................................... iv
Table of Contents................................................................................................................................................................................ v
Chapter 1: Introduction
System Specifications ......................................................................................................................................................................1-2
CPU .............................................................................................................................................................................................1-2
Memory ......................................................................................................................................................................................1-2
Core Logic ...................................................................................................................................................................................1-2
BIOS .............................................................................................................................................................................................1-3
Video ...........................................................................................................................................................................................1-3
Drives .......................................................................................................................................................................................... 1-3
Audio...........................................................................................................................................................................................1-3
I/O ...............................................................................................................................................................................................1-4
Interface ......................................................................................................................................................................................1-4
Power System .............................................................................................................................................................................1-4
Other Features (optional) ...........................................................................................................................................................1-5
Environment .....................................................................................................................................................................................1-5
Physical ............................................................................................................................................................................................1-5
External Locator ...............................................................................................................................................................................1-6
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Chapter 2: Chipset
CPU - Intel Mobile Pentium III/Pentium II/Celeron....................................................................................................................... 2-4
Core Logic Chipset - Intel 440BX AGPset ..................................................................................................................................... 2-5
North Bridge, AGPset System Controller, 443BX.................................................................................................................... 2-5
table of contents
v
Preface
South Bridge, PCI ISA IDE Xcelerator, 82371EB/MB (PIIX4E/M) .............................................................................................. 2-6
Supporting Chips ............................................................................................................................................................................ 2-8
Ricoh 5C475 PCI-CardBus Bridge............................................................................................................................................2-8
SMSC FDC37N869 PC 99 ....................................................................................................................................................... 2-10
Compliant 5V and 3.3V Super I/O Controller with Infrared Support .................................................................................. 2-10
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ATI RAGE LT Pro Graphics Controller ....................................................................................................................................... 2-11
YAMAHA YMF744B DS-XG ..................................................................................................................................................... 2-12
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Chapter 3: Disassembly
Connections ....................................................................................................................................................................................3-2
Maintenance Precautions ........................................................................................................................................................ 3-3
Battery Precautions ...................................................................................................................................................................3-3
Cleaning .................................................................................................................................................................................... 3-4
Maintenance Tools.................................................................................................................................................................... 3-4
General Disassembly: Under the Keyboard ................................................................................................................................3-5
Removing the Keyboard & Heat Plate .................................................................................................................................... 3-5
Changing the CPU .................................................................................................................................................................... 3-6
General Disassembly: Removing & Replacing the LCD Module................................................................................................ 3-8
Replacing the LCD ................................................................................................................................................................... 3-10
12.1” Disassembly .............................................................................................................................................................. 3-10
14.1 & 15.1” Disassembly ................................................................................................................................................... 3-10
Removing the Inverter Board ............................................................................................................................................ 3-10
General Disassembly: Top Cover Assembly .............................................................................................................................. 3-12
Separating the Top Cover Assembly ..................................................................................................................................... 3-12
General Disassembly: Top Cover Components......................................................................................................................... 3-14
TouchPad ................................................................................................................................................................................. 3-14
General Disassembly: Bottom Cover Assembly ........................................................................................................................ 3-16
HDD Module............................................................................................................................................................................ 3-16
FDD Module............................................................................................................................................................................. 3-16
Mainboard & Frame (not shown) .......................................................................................................................................... 3-16
Switches & Connectors ................................................................................................................................................................3-20
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table of contents
Chapter 4: Troubleshooting
Before You Begin ............................................................................................................................................................................ 4-2
Tools ........................................................................................................................................................................................... 4-2
System Troubleshooting Chart ...................................................................................................................................................... 4-3
Pre-POST Assistant ......................................................................................................................................................................... 4-4
AC Power LED Fails ................................................................................................................................................................... 4-5
AC/DC Adapter .................................................................................................................................................................... 4-5
AC Power & Charge LEDs Fail ..................................................................................................................................................4-6
Checking the DC/DC Board ................................................................................................................................................4-6
Checking the Battery Pack and its Cabling ...................................................................................................................... 4-9
Checking the Battery Pack ............................................................................................................................................ 4-9
Checking the Cabling .................................................................................................................................................. 4-10
Checking the Mainboard ................................................................................................................................................. 4-10
LCD Screen Failure to Display.................................................................................................................................................. 4-11
Checking the LCD to Mainboard Connection................................................................................................................... 4-11
Checking the Inverter Board ............................................................................................................................................. 4-12
Checking the LCD Screen .................................................................................................................................................. 4-13
POST — Testing the System ......................................................................................................................................................... 4-14
No Errors Found During the POST .......................................................................................................................................... 4-14
POST Error Beeps & Screen Messages ................................................................................................................................. 4-15
Post-POST Problems..................................................................................................................................................................... 4-23
PC Card Socket Malfunction...................................................................................................................................................4-24
Sound Output Failure ..............................................................................................................................................................4-25
Checking the Software Configuration ..............................................................................................................................4-25
Checking the Volume ........................................................................................................................................................4-25
Checking the Speaker Cable ............................................................................................................................................4-26
Suspend Function Failure ....................................................................................................................................................... 4-27
Charge LED Failure.................................................................................................................................................................. 4-27
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Appendix A: Part Lists
Appendix B: 2800 Circuit Diagrams
Appendix C: 2820/2850 Circuit Diagrams
table of contents
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1 Introduction
This manual covers the information you need to service or upgrade the 2800/2820/2850 Notebook Computer.
Information about operating the computer (e.g. getting started, and the Setup utility) is in the User’s Manual. Information about drivers (e.g. VGA & audio) is also found in User’s Manual. That manual is shipped with the computer.
Operating systems (e.g. DOS, Windows 9x, Windows NT 4.0, OS/2 Warp, UNIX, etc.) have their own manuals as do
application software (e.g. word processing and database programs). If you have questions about those programs,
you should consult those manuals.
The notebook is designed to be upgradable. The 2800 supports Intel Pentium II & Celeron CPUs of different speeds
and 12.1” & 14.1” TFT color LCD screens. The 2820 supports Intel Pentium III & Celeron CPUs of different speeds
and 12.1” & 14.1” TFT color LCD screens while the 2850 supports Intel Pentium III & Celeron CPUs of different
speeds and 15.1” TFT color LCD screens. In addition, system memory, hard disk, and BIOS are also upgradable. See
Chapter 3, “Disassembly,” for a detailed description of the upgrade procedures for each specific component.
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Please note the warning and safety information indicated by the “
The balance of this chapter reviews the computer’s technical specifications and external features.
M” symbol.
1 – 1
Introduction
SYSTEM SPECIFICATIONS
CPU (2800) (2820 & 2850)
Package MicroPGA1 MicroPGA2
Type Pentium II, 300MHz~400MHz Pentium III, 450MHz or faster
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Celeron, 300MHz~400MHz Celeron, 450MHz or faster
MEMORY
L1 cache (in CPU) 16KB code + 16KB data 16KB code + 16KB data
L2 cache Pentium II: 256KB SRAM Pentium III: 256KB SRAM
(on die) Celeron: 128KB SRAM Celeron: 128KB SRAM
RAM base 0MB (onboard) same
RAM expansion 2 S.O.DIMM sockets (144 pin) same
DIMM sizes: 32MB, 64MB, 128MB same
standards: 3.3-volt same
modes: SDRAM same
speed: 66MHz or faster speed: 100MHz or faster
use: singly, mixed* or identical pairs same
maximum expansion: 256MB same
*Both must be the same speed
CORE LOGIC
440BX AGPset, 66MHz 440BX AGPset, 100MHz
1 – 2
specifications
BIOS
512KB Flash ROM, Plug ‘n Play 1.0a, LBA, APM 1.2, ACPI
VIDEO
memory 4MB/8MB SGRAM
chipset ATI 3D Rage LT Pro AGP (with 3D, AGP & ZV support/proprietary driver)
architecture 64-bit 2x AGP bus with Windows Acceleration
display TFT (active matrix)
12.1” SVGA, (800 x 600) at 24-bit color (TrueColor)
14.1” XGA, (1024 x 768) at 32-bit color (TrueColor)
15.1” XGA, (1024 x 768) at 32-bit color (TrueColor)
DRIVES
HDD module semi-removable 2½” (9.5mm) , PCI local bus IDE interface
FDD module 3.5”, 1.44MB (3-mode)
Device Bay
CD-ROM module 24X, full size (5.25”) ATAPI interface tray-loading mechanism,
access time below 100ms
or DVD module 4X or faster, full size (5.25”) ATAPI interface tray-loading mechanism,
access time below 100ms (with software MPEG support)
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AUDIO
chipset Yamaha YMF744B (DS-XG), proprietary driver
architecture 32-bit PCI bus
type 64-voice dual-audio engine, AC-3 speaker virtualization, PnP, up to 20-bit ADCDAC
audio resolution, I
sampling max. record & playback up to 48 KHz stereo (WAVE audio)
3D HRTF 3-D positional audio under DirectX™ 5.0
compatibility Sound Blaster Pro™ legacy audio, MS Windows Sound System™
interface speakers (phones), microphone, line-in
speakers 2 built-in: 0.5W stereo amp.
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S/zoomed video, high quality MIDI synthesis
specifications
1 – 3
Introduction
I/O
USB 2 ports, compliant with UHCI 1.1, USB 1.0 & PCI 2.1
Serial 1 9-pin, 16C550 compatible
Serial 2 infrared, IrDA v 1.1, FIR, SIR compatible
Parallel 25-pin, ECP, output-only, bi-directional
CRT 15-pin VGA
PS/2 6-pin, mini-din, mouse or keyboard
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PC Card one Type I or Type II socket, PC Card 3.0, ZV port & CardBus compliant
INTERFACE
keyboard 87-key or 90-key (depending on the language)
Windows 95 compliant with embedded numeric keypad
pointing device PS/2 TouchPad (built-in), MS-Mouse compatible
POWER SYSTEM
adapters (external) universal, auto-sensing switching
input: 90-240VAC @47- 63Hz
¯¯
Advanced Users
Actual battery life per
charge may differ from this
figure. It will vary depending on the system configuration, the condition of the
battery, the environment,
setup, and working habits.
battery pack(s) Li-Ion: smart battery with gauge circuit
battery charge time Fast (system off) approx. 2.5 hours per battery, 2000mA ±200mA
life per charge approx. 2.5hrs per battery (based on an Intel Pentium III 500 MHz CPU,
output: 60W, 20V, 3A
Ni-MH: dumb battery without gauge circuit
Slow (system on) approx. 7 hours per battery, 700mA ± 50mA
(based on a 3000mA smart battery)
running “ZD BatteryMark 3.0” software in the Windows 98 operating system)
1 – 4
management BIOS control, APM ver 1.2
levels: full-on, standby, suspend-to-RAM/suspend-to-disk (0 volt)
specifications
OTHER FEATURES (OPTIONAL)
56K Fax/Data/Voice modem
10/100 Mbps PCI Ethernet Controller
ENVIRONMENT
operating temp. 0oC to 35oC (32oF to 95oF)
storage temp. -10
operating humidity 40% to 80%, non-condensing
storage humidity 10% to 90%, non-condensing
altitude 8000 feet
shock (unpacked) 5G (11 + 1 microsecond pulse)
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C to 65oC (14oF to 149oF)
PHYSICAL
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2800
dimensions 312mm(w) x 262mm(d) x 34.5mm(h)
weight 2.95Kg (with Li-Ion battery, FDD, HDD, CD-ROM & 14.1” LCD)
(12.1”/14.1” LCD capable):
2820 (12.1”/14.1” LCD capable):
dimensions 312mm(w) x 262mm(d) x 36/37.5mm(h)
weight 2.95Kg (with Li-Ion battery, FDD, HDD, CD-ROM & 14.1” LCD)
2850 (15.1” LCD):
dimensions 326mm(w) x 267mm(d) x 37.5mm(h)
weight 3.22Kg (with Li-Ion battery, FDD, HDD, CD-ROM & 15.1” LCD)
specifications
1 – 5
Introduction
FRONT VIEW
FIG. 1 – 1
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1. LCD
2. Cover latch
3. Speakers
4. On/Off switch
5. LED system status indicators
6. Keyboard
7. TouchPad & buttons
8. LED power status indicators
9. Microphone
10. Audio line-in jack
11. Mic jack
12. Phone jack
EXTERNAL LOCATOR
The following figures show the external locations of the computer’s main subsystems.
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OTTOM VIEW
B
FIG. 1 - 2
13. Device bay
14. Battery bay
15. RAM bay
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external locator
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10811 12
LEFT VIEW
FIG. 1 – 3
1. Kensington lock port
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2. PC Card slot
3. IrDA (serial 2) port
4. USB ports
5. FDD
IGHT VIEW
R
FIG. 1 – 4
6. CD-ROM module (option)
or DVD ROM module (option)
7. Adapter port
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EAR VIEW
R
FIG. 1 – 5
8. PS/2 port
9. COM (serial 1) port
10. Parallel port
11. Fan
12. External monitor port
13. Fax/Modem (option)
14. LAN port (option)
external locator
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Introduction
NOTES:
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1 – 8
notes
2 Chipset
The computer is completely AT-compatible. Its chipset supports a high-performance PCI bus video interface and
state-of-the-art power management features. This chapter mainly describes the following major system components:
• CPU • Core logic chipset • Supporting chips
The following figures are the system block diagram and the chipset site diagram. These provide an overview of the
computer’s layout and a practical locator for chipset components.
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SYSTEM BLOCK DIAGRAM
FIG. 2 – 1
2 – 1
Chipset
CHIPSET SITE DIAGRAM
1. Video SGRAM
2. Video Controller
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ATI Rage LT Pro
3. PCI-CardBus Bridge
Ricoh 5C475
4. LAN Controller
AMD PCnet™ Fast III
AM79C973
5. Core Logic chip
82443BX
6. Keyboard Controller
Hitachi HB/3434
7. SW1 & SW2
8. CN28 DIMM socket “0”
9. CN29 DIMM socket “1”
10. Core Logic chip
82371EB (2800)
82371MB (2820 & 2850)
11. Audio controller
YAMAHA YMF744B
12. Super I/O controller
SMSC FDC37N869
13. 4MB FLASH ROM BIOS
AMD AM29LV004BT
14. Audio CODEC
AKM AK4543 VQ
FIG. 2 – 2
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component sites
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CHIPSET SITE DIAGRAM (CONT.)
IG. 2 – 2
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15. LAN Transformer
LF-H71P
16. Video SGRAM
17. CPU
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component sites
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Chipset
CPU - INTEL MOBILE PENTIUM III/PENTIUM II/CELERON
The 2800 uses the Intel Mobile Pentium II/Celeron processor in a microPGA1 package. The Intel Mobile Pentium
II/Celeron processor features an integrated L2 cache (256KB for Pentium II and 128KB for Celeron) and a 64-bit
high performance system bus.
The 2820 & 2850 use the Intel Mobile Pentium III/Celeron processor in a microPGA2 package. The Intel Mobile
Pentium III/Celeron processor features an integrated L2 cache (256KB for Pentium III and 128KB for Celeron) and
a 64-bit high performance system bus.
The Mobile Pentium III/Pentium II/Celeron processor’s 64-bit wide Low Power Gunning Transceiver Logic system
bus is compatible with the 440BX AGPSet and provides a glue-less, point-to-point interface for an I/O bridge/
memory controller.
The Intel Mobile PentiumIII/Pentium II/Celeron processors are fully compatible with all software written for the
Pentium processor with MMX technology, Pentium processor, Intel486 microprocessor, and Intel386 microprocessor. In addition, they provide improved multimedia & communications performance. They feature:
• Performance improved over existing mobile processors
- Supports the Intel Architecture with Dynamic Execution
- Supports the Intel Architecture MMX technology
• Integrated primary (L1) instructions and data caches
- 4-way set associative, 32-byte line size, 1 line per sector
- 16-Kbyte instruction cache and 16-Kbyte writeback data cache
- Cacheable range programmable by processor programmable registers
• Integrated second level (L2) cache
- 4-way set associative, 32-byte line size, 1 line per sector
- Operated at full core speed
- 128/256-Kbyte, ECC protected cache data array
• Low Power GTL+ system bus interface
- 64-bit data bus, 66-MHz operation
- Uniprocessor, two loads only (processor and I/O bridge/memory controller)
- Short trace length and low capacitance allows for single ended termination
• Voltage reduction technology
• Pentium III processor clock control
- Quick Start for low power, low exit latency clock “throttling”
- Deep Sleep mode for extremely low power dissipation
• Thermal diode for measuring processor temperature
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CPU
CORE LOGIC CHIPSET - INTEL 440BX AGPSET
The Intel 440BX AGPset consists of the BX System Controller (443BX) and the PCI ISA IDE Xcelerator (PIIX4E/
PIIX4M). The AGPset forms a Host-to-PCI bridge and provides the second level cache control and a full function
64-bit data path to main memory.
NORTH BRIDGE, AGPSET SYSTEM CONTROLLER, 443BX
The BX System Controller (443BX) integrates the cache and main memory DRAM control functions and provides
bus control to transfer between the CPU, cache, main memory, AGP bus and the PCI Bus.
Features
• Supports the host bus of the Pentium II & III processor families
at 66MHz and 100MHz at 3.3V respectively
• PCI 2.1 compliant
• Integrated Data Path
• Integrated DRAM controller
- 8Mbytes to 256Mbytes main memory
- 64Mbit DRAM/SDRAM technology support
- EDO and SDRAM DRAM support
- Integrated programmable-strength for DRAM interface
- CAS-Before-RAS refresh, extended CBR and self refresh for
EDO
- CAS-Before-RAS and self refresh for SDRAM
• Fully synchronous, minimum latency 30/33 MHz PCI bus interface
- Five PCI bus masters (including PIIX4)
- 10 DWord PCI-to-DRAM read prefetch buffer
- 18 DWord PCI-DRAM post buffer
- Multi-Transaction timer to support multiple short PCI transactions
• AGP Features
- AGP 1.0 compliant
- 66/133 MHz data transfer capability
- Supports concurrent CPU, AGP and PCI transactions
• Power Management Features
- Dynamic stop clock support
- Suspend to RAM (STR)
- Suspend to Disk (STD)
- Power On Suspend (POS)
- Internal clock control
- SDRAM and EDO self refresh during suspend
- ACPI support
- Compatible SMRAM (C_SMRAM) and Extended SMRAM
(E_SMRAM)
- SMM write-back cacheable in E_SMRAM mode up to 1MB
• Supports the Universal Serial Bus (USB)
• 492 Pin BGA 440BX AGPset with integrated data paths
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core logic chipset
2 – 5
2
Chipset
SOUTH BRIDGE, PCI ISA IDE XCELERATOR, 82371EB/MB (PIIX4E/M)
The 2800 uses the 82371EB (PIIX4E) while the 2820 & 2850 use 82371MB (PIIX4M). The PCI ISA IDE Xcelerator
(PIIX4E/PIIX4M) is a multi-function PCI device implementing a PCI-to-ISA bridge function, a PCI IDE function, a
Universal Serial Bus host/hub function, and an Enhanced Power Management function. As a PCI-to-ISA bridge, the
PIIX4E/PIIX4M integrates many common I/O functions found in ISA-based PC systems - a seven channel DMA
Controller, two 82C59 Interrupt Controllers, an 8254 Timer/Counter, and a Real Time Clock. In addition to compatible transfers, each DMA channel supports Type F transfers. The PIIX4E/PIIX4M also contains full support for
both PC/PCI and Distributed DMA protocols implementing PCI based DMA. The Interrupt Controller has Edge or
Level sensitive and programmable inputs and fully supports the use of an external I/O Advanced Programmable
Interrupt Controller (APIC) and Serial Interrupts. Chip select decoding is provided for BIOS, Real Time Clock,
Keyboard Controller, second external Microcontroller, as well as 2 Programmable Chip Selects. The PIIX4 provides
full Plug and Play compatibility. The PIIX4E/PIIX4M can be configured as a Subtractive Decode bridge. This allows
the use of a subtractive decode PCI-to-PCI bridge such as the 82380 chipset which implements a PCI/ISA docking
station environment.
The PIIX4E/PIIX4M supports two IDE connectors for up to four IDE devices providing an interface for IDE hard
disks and ROMs. Up to four IDE devices can be supported in Bus Master mode. The PIIX4E/PIIX4M contains
support for “Ultra DMA” synchronous DMA compatible devices.
The PIIX4E/PIIX4M contains a Universal Serial Bus (USB) Host Controller that is Universal Host Controller Interface (UHCI) compatible. The Host Controller’s root hub has two programmable USB ports.
2 – 6
core logic chipset
The PIIX4E/PIIX4M supports Enhanced Power Management, including full Clock Control, Device Management
for up to 14 devices, and Suspend and Resume logic with Power On Suspend, Suspend to RAM or Suspend to Disk.
It fully supports Operating System Directed Power Management via the Advanced Configuration and Power Interface (ACPI) specification. The PIIX4E/PIIX4M integrates both a System Management Bus (SMBus) Host and Slave
interface for serial communication with other devices.
Features
• Supports Pentium, Pentium II & Pentium III Microprocessors
- 440BX ISA kit
• Power Management Logic
- Global and local device management
- Suspend/resume logic
- Supports thermal alarm
- Support for external microcontroller
- Full support for Advanced Configuration and Power Interface (ACPI) Specification and OS Directed Power Management
• Multifunction PCI to ISA Bridge
- Supports PCI at 30 MHz and 33 MHz
- Supports PCI Rev 2.1 specification
- Supports Full ISA or Extended I/O (EIO) Bus
- Supports full positive decode or subtractive decode of PCI
- Supports ISA/EIO at 1/4 of PCI frequency
• Supports both mobile and desktop deep green environments
- 3.3 V operation with 5 V tolerant buffers
- Ultra-low power for mobile environments
- Power-On Suspend and Soft-OFF for desktop environment
- All registers readable/restorable for proper resume from 0
V suspend
• Integrated IDE Controller
- Independent Timing of up to 4 drives
- PIO Mode 4 transfers up to 14 Mbytes/s
- Supports “Ultra 33” Synchronous DMA mode transfers up to
33 MBytes/sec
- Integrated 8 x 32-bit buffer for IDE PCI Burst
- Supports glue-less “Swap-Bay” option with full electrical isolation
• Enhanced DMA Controller
- Two 8237 DMA controllers
- Supports PCI DMA with 3 PC/PCI channels and Distributed
DMA protocols (simultaneously)
- Fast Type-F DMA for reduced PCI bus usage
• Interrupt Controller based on two 82C59
- 15 interrupt support
- Independently programmable for Edge/Level sensitivity
- Supports optional external I/O APIC
- Serial interrupt input
• Timers based on 82C54
- System Timer, Refresh Request, Speaker Tone Output
• USB
- Two USB 1.0 ports for serial transfers at 12 or 1.5 Mbit/sec
- Supports legacy keyboard and mouse software with USB-
based keyboard and mouse
- Supports UHCI Design Guide Revision 1.1 Interface
• SMBus
- Host interface allows CPU to communicate via SMBus
- Slave interface allows external SMBus master to control re-
sume events
• Real-Time Clock
- 256 Byte Battery-Pack CMOS SRAM
- Includes Date Alarm
- Two 8-byte Lockout Ranges
• Microsoft Win95/98 compliant
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core logic chipset
2 – 7
2
Chipset
SUPPORTING CHIPS
The following subsections describe major supporting chips:
• Ricoh 5C475II PCI-CardBus Bridge
• SMSC FDC37N869 PC 99 Compliant 5V and 3.3V Super I/O Controller with Infrared Support
• ATI RAGE LT Pro Graphics Controller
• Yamaha744B DS-XG Audio Controller
RICOH 5C475 PCI-CARDBUS BRIDGE
The R5C475II is a PC card controller offering a single chip solution as a bridge between PCI bus andCardBus. The
R5C475II includes a PC Card 95/97 compliant socket interface and a bridge function to the PCI bus of 33MHz. The
R5C475II can support the 32-bit CardBus(Card-32) and the 16-bit PC card(Card-16) without external buffers.
Concerning the 16-bit card control interface, the R5C475II‘s register is compatible with the Intel 82365SL and
Ricoh’s RF5C396/366 in order to maintain backward compatibility with the existing 16-bit PC Card compliant with
PCMCIA2.1/JEIDA4.2. All PC card interface signals are individually buffered to allow direct connection to CardBus
and Hot insertion/removal without external buffers. The R5C475II also allows direct connection to PCI bus.
The PCI and PC Card socket interfaces have their own power supply terminals that can be powered at either 3.3V
or 5V for compatibility with 3.3V and 5V signaling environments. The core logic is powered at 3.3V or 2.5V.
The R5C475II allows the system to be equipped with the high performance multimedia PC cards like the Video
capture card, and 100 BASE LAN card. It features:
2 – 8
•PC97/98/99 compliant
– PC99 Design Guide compliant (Subsystem ID, Subsystem
Vender ID)
– ACPI 1.0 and PCI Bus Power Management 1.0 compliant
– Global Reset support
• Low Power consumption
– Hardware Suspend
– CLKRUN#,CCLKRUN# support
– VCC-COREC
• High-performance
• Single Chip PCI-CardBus Bridge
supporting chip - PC Card
– PCMCIA PC-Card 95/97 sockets support
– CardBus(Card-32) Card and 16-bit(PCMCIA2.1/JEIDA4.2)
Card work at the same time
– Bridge function between PCI bus and CardBus
• PCI Bus Interface
– Complian t with PCI Local Bus Specification2.2
– The maximum frequency 33MHz
– PCI Master/Target protocol support
– Separated PCI configuration each socket
– Direct connection to PCI bus
– 3.3V interface (5V tolerant)
• CardBus PC card Bridge
– PC Card Standard 95/97 compliant
– Compliant with Yenta register set Rev2.2
– The maximum frequency 33MHz
– CardBus Master/Target protocol support
– Transfer transactions
- All memory read/write transaction(bi-direction)
- I/O read/write transaction(bi-direction)
- Configuration read/write transaction(PCI ® Card)
- 2 programmable memory windows
- 2 programmable I/O windows
• PC Card-16 Bridge
– Compliant with PCMCIA PC Card 95/97 Standard Specification
– 5 programmable memory windows
– 2 programmable I/O windows
– Compliant with i82365SL compatible register set / ExCA
• System Interrupt
– INTA# support for PCI system interrupt
– IRQn support for ISA system interrupt (Non shared IRQn pins)
– Serialized IRQ support
• 3.3V/5V Mixed Voltage Operation at 33MHz
• GPIO support
• Posting Write and Prefetching Read support
• Plug and Play support
• 16-bit Legacy mode (3E0/3E2 I/O port) support
• Zoomed Video Port support
– Bypass type
• PCIway Legacy DMA support
2
supporting chip - PC Card
2 – 9
2
Chipset
SMSC FDC37N869 PC 99 COMPLIANT 5V AND 3.3V SUPER I/O CONTROLLER WITH INFRARED SUPPORT
The FDC37N869 features:
• Serial ports
• 5 volt and 3.3 volt operation
• Intelligent auto power management
• 16 bit address qualification
• 2.88MB Super I/O Floppy Disk Controller
- Licensed CMOS 765B Floppy Disk Controller
- Software and register compatible with SMSC proprietary
82077AA compatible core
- Supports one Floppy Drive directly
- Configurable Open Drain/Push-Pull Output Drivers
- Supports Vertical Recording Format
- 16 byte data FIFO
- 100% IBM compatibility
- Detects all overrun and underrun conditions
- Sophisticated Power Control Circuitry (PCC) including
multiple power-down modes for reduced power
consumption
- DMA enable logic
- Data rate and drive control registers
- Swap drives A and B
- Non-burst mode DMA option
- 48 Base I/O address, 15 IRQ and 4 DMA options
- Forceable write protect and disk change controls
• Floppy disk available on parallel port pins ACPI compliant
• Enhanced digital data separator
- 2Mbps, 1Mbps, 500 Kbps, 300 Kbps, 250 Kbps data rates
- Programmable precompensation modes
- Two high speed NS16C550 compatible UARTs with send/
receive 16 Byte FIFOs
- Supports 230k and 460k baud
- Programmable baud rate generator
- Modem control circuitry
• Infrared communications controller
- IrDA v1.2 (4Mbps), HPSIR, ASKIR, Consumer IR Support
- 2 IR Ports
- 96 base I/O address, 15 IRQ options and 4 DMA options
• Multi-mode parallel port with ChiProtect
- Standard Mode
- IBM PC/XT PC/AT and PS/2 compatible bi-directional
parallel port
- Enhanced Parallel Port (EPP) compatible
- EPP 1.7 and EPP 1.9 (IEEE 1284 compliant)
- Enhanced Capabilities Port (ECP) compatible (IEEE 1284
compliant)
- Incorporates ChiProtect Circuitry for Protection Against
Damage Due to Printer Power-On
- 192 base I/O address, 16 IRQ and 4 DMA options
• Game port select logic
- 48 base I/O addresses
• General Purpose Address Decoder
- 16-byte block decode
2 – 10
supporting chip - super I/O
ATI RAGE LT PRO GRAPHICS CONTROLLER
The RAGE LT Pro is a highly integrated graphics accelerator with superior support for 3D and motion video —
ideal for notebooks and LCD desktops. It incorporates comprehensive support for Intel’s Accelerated Graphics Port
(AGP), including 1X or 2X mode with sidebands.
Delivering superior 3D acceleration and comprehensive 3D support, the RAGE LT Pro includes a triangle set-up
engine, single-pass trilinear filtering, six perspectively correct texturing modes, video texturing, Gouraud and specular shading, and a host of 3D special effects.
The best choice for DVD notebooks and LCD desktops, the RAGE LT Pro’s DVD features include motion compensation, acceleration for soft DVD, integrated TV-out with Macrovision and support for third-party MPEG-2 decoders via the ATI Multimedia Channel (AMC).
Using Tri-View™ the RAGE LT Pro can output to LCD, CRT, and TV simultaneously. It also includes two output
controllers so that any two display devices can have different images and/or refresh rate.
It has the following main features:
2
• First mobile accelerator to use AGP 2X (133MHz) in AGP Texturing with sideband signals to realize all the benefits of AGP.
• First mobile accelerator to deliver full motion soft DVD using motion compensation circuitry.
• First mobile acccelerator with integrated LVDS transmitter.
• Innovative Dynamic Power Management with ACPI compliance.
• Superior 3D performance acheived through a hardware setup
engine and a 4KB on-chip texture cache.
• Superior 2D performance with support of 100MHz SGRAM.
• TFT and DSTN panel interface support for up to 1280x1024 resolutions.
• Integrated ImpacTV2-quality TV output provides optimal image quality via programmable 6 tap flicker filter, resolution
modes scale down from 1024x768 and 16:9 wide mode support. Direct YUV422 mode, Macrovision 7.01 and CGMS support.
• Support for 2, 4, or 8MB frame buffers, and integrated 230MHz
DAC.
• High quality ratiometric expansion that fits source images to
any panel resolution.
supporting chip - video
2 – 11
2
Chipset
YAMAHA YMF744B DS-XG
The YMF744B (DS-1S) is a high performance audio controller for the PCI Bus. DS-1S consists of two separated
functional blocks. One is the PCI audio block and the other is the Legacy Audio block. PCI Audio block allows
Software Driver to handle maximum of 73 concurrent audio streams with the Bus Master DMA engine. The PCI
Audio Engine converts the sampling rate of each audio stream and the streams are mixed without utilizing the CPU
or causing system latency. By using the Software Driver from YAMAHA, PCI Audio provides 64-voice XG wavetable
synthesizer with Reverb and variation. It also supports DirectSound hardware accelerator, Downloadable Sound
(DLS) and DirectMusic accelerator.
Legacy Audio block supports FM Synthesizer, Sound Blaster Pro, MPU401 UART mode and Joystick function in
order to provide hardware compatibility for numerous PC games on real DOS without any software driver. To
achieve legacy DMAC compatibility on the PCI, DS-1S supports both PC/PCI and Distributed DMA protocols. DS1S also supports Serialized IRQ for legacy IRQ compatibility.
DS-1S supports the connection to AC’97s which provides high quality DAC, ADC and analog mixing, and it can
connect two AC’97. In addition, it supports consumer IEC958, Audio Digital Interface (SPDIF), to connect external audio equipment by digital. It has the following features:
2 – 12
• PCI 2.2 compliant
• PC’98/PC’99 specification compliant
• PCI Bus Power Management rev. 1.0 compliant (support D0, D2
and D3 state)
• Supports clock run
• PCI Bus Master for PCI audio
• Legacy audio compatibility
supporting chip - audio
- True full duplex playback and capture with different
sampling rate
- Maximum 64-voice XG capital wavetable
- Synthesizer including GM compatibility
- DirectSound Hardware Acceleration
- DirectMusic Hardware Acceleration
- Downloadable Sound (DLS) level-1
- FM synthesizer
- Hardware Sound Blaster Pro compatibility
- MPU401 UART mode MIDI interface
- Joystick
• Supports PC/PCI and Distributed DMA for legacy DMAC (8237)
emulation
• Supports serialized IRQ
• Supports I
• Supports Consumer IEC958 Output (SPDIF OUT)
• Supports Consumer IEC958 Input (SPDIF IN)
• Supports AC’97 Interface (AC-Link) Revision 2.1
• Multiple CODEC (Connectable two AC’97s)
• Hardware volume control
• EEPROM interface
• Single crystal operation (24.576Mhz)
• 3.3V power supply (5V tolerant)
2S
serial input for Zoomed Video Port
3 Disassembly
This chapter provides step-by-step instructions for disassembling parts and subsystems. When it comes to reassembly, reverse the procedures (unless otherwise indicated).
We suggest you completely review any procedure before you take the computer apart.
The computer comes in two (2) models: 2800 and 2820/2850 and several “variations”:
The 280 is based on the P entium II CPU. Differ ent versions may have cosmetic and minor structural variations of the
top and bottom covers (mostly concerning LCD panel sizes). As appropriate, these differences are noted in the sidebars. When servicing, be sure to note the mainboard v ersion. This may affect CPU switch settings. Additional component information is available in Appendix A: Part Lists or Appendix B: Circuit Diagrams.
The 2820/2850 is based on the Pentium III. Like the earlier model, there may also be variations. However, unlike
the 2800, there are no CPU switch adjustments.
CPU Upgrades: To upgrade, you only need to remove the keyboard, heat plate and heatsink. For the 280 model, the
CPU switch settings can be accesed through the RAM bay opening.
Note: When re-assembling, make sure the heat plate is not “distorted” and is fastened securely.
LCD Upgrades (all versions): All switches are accessable throuth the RAM bay opening. Connections are under the status panel.
The LCD/ top cover assembly is anchored with four (4) externally accessable screws.
Illustrations: To enhance procedural clarity, the illustrations in this chapter do not include all components. Mylar
insulation and adhesive attachments are not shown unless they are critical to the disassembly
process. For information about these parts, please refer to
Appendix A: Part Lists
.
3
3 – 1
Disassembly
The disassembly procedures appear in the following order:
• Keyboard – CPU upgrade/replacement
• LCD Module – LCD assembly, inverter
• Top Cover – TouchPad assembly
• Bottom Cover – HDD, FDD, mainboard, and DC/DC board
• Connector Locator
3
All disassembly procedures assume that the system is turned OFF, and disconnected from any power supply (the
battery is removed too). We also assume that the CD/DVD-ROM module is removed. All of these procedures are
described in the User’s Manual which accompanies the system.
CONNECTIONS
Connections within the computer are one of four types:
Locking collar sockets for ribbon connectors To release these connectors, use a small flat-head screwdriver
to gently pry the locking collar away from its base. When replacing the connection, make sure the connector is oriented in the
same way. The pin1 side is usually
Pressure sockets for multi-wire connectors To release this connector type, grasp it at its head and gently
rock it from side to side as you pull it out.
wires themselves.
force it. The socket only fits one way.
Pressure sockets for ribbon connectors To release these connectors, use a small pair of needle-nose
pliers to gently lift the connector away from its socket. When
replacing the connection, make sure the connector is oriented
in the same way. The pin1 side is usually
Board-to-board or multi-pin sockets To separate the boards, gently rock them from side to side as you
pull them apart. If the connection is very tight, use a small flathead screwdriver
When replacing the connection, do not try to
- use just enough force to start the separation.
not
indicated.
Do not pull on the
not
indicated.
3 – 2
procedures
MAINTENANCE PRECAUTIONS
The following precautions are a reminder.
To avoid personal injury or damage to the notebook while performing a removal and/or replacement job, take the
following precautions:
1. Don't drop it. Perform your repairs and/or upgrades on a stable surface. If the computer falls, the case and other components
could be damaged.
2. Don't overheat it. Note the proximity of any heating elements. Keep the computer out of direct sunlight.
3. Avoid interference. Note the proximity of any high capacity transformers, electric motors, and other strong magnetic fields. These
can hinder proper performance and damage components and/or data. You should also monitor the position of magnetized tools
(i.e. screwdrivers).
4. Keep it dry. This is an electrical appliance. If water or any other liquid gets into it, the computer could be badly damaged.
5. Be careful with power. Avoid accidental shocks, discharges or explosions.
•Before removing or servicing any part from the notebook, turn the notebook off and detach any adapters (AC/DC or car adapter).
• To prevent the notebook from being turned on accidentally, remove the battery module
ment procedure.
• Only use a power adapter approved for use with this computer.
• Make sure the AC adapter has a steady, uninterrupted power supply and is grounded.
• When you want to unplug the power cord or any cable/wire, be sure to disconnect it by the plug head. Do not pull on the wire.
• Be sure the socket and any extension cord(s) you use can support the total current load of all connected devices.
6. Peripherals/Modules – Turn off and detach any peripherals. Remove all modules and power units.
7. Beware of static discharge. ICs, such as the CPU and main support chips, are vulnerable to static electricity. Before handling any
part in the notebook, discharge any static electricity inside the notebook. When handling a printed circuit board, do not use gloves
or other materials which allow static electricity buildup. We suggest that you use an anti-static wrist strap instead.
8. Beware of corrosion. As you perform your job, avoid touching any connector leads. Even the cleanest hands produce oils which
can attract corrosive elements.
9. Keep your work environment clean. Tobacco smoke, dust or other air-born particulate matter is often attracted to charged
surfaces, reducing performance.
10. Keep track of the components. When removing or replacing any part, be careful not to leave small parts, such as screws, loose
inside the notebook.
before
you start a removal or replace-
3
BATTERY PRECAUTIONS
Only use batteries designed for this computer. The wrong battery type may explode, leak or damage the computer.
Recharge the battery using an approved system. Incorrect recharging may make the battery explode.
Always dispose of batteries carefully. Batteries may explode or leak if exposed to fire, or improperly handled or discarded.
Do not try to repair a battery. Damaged or defective batteries should be replaced.
precautions
3 – 3
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