Clevo 2700c schematic
Notice
The company reserves the right to revise this publication or to change its contents without notice.
Information contained herein is for reference only and does not constitute a commitment on the part
of the manufacturer or any subsequent vendor. They assume no responsibility or liability for any
errors or inaccuracies that may appear in this publication nor are they in anyway responsible for
any loss or damage resulting from the use (or misuse) of this publication.
This publication and any accompanying software may not, in whole or in part, be reproduced, translated, transmitted or reduced to any machine readable form without prior consent from the vendor,
manufacturer or creators of this publication, except for copies kept by the user for backup purposes.
Brand and product names mentioned in this publication may or may not be copyrights and/or registered trademarks of their respective companies. They are mentioned for identification purposes only
and are not intended as an endorsement of that product or its manufacturer.
©March, 2001
Preliminary Version
Contents
Chapter 1: Introduction ........................... 1 - 1
System specifications (general) ................... 1 - 2
Chapter 2: Chipset and
Mainboard information ............................ 2 - 1
CPU...............................................................2 - 1
Chipsets........................................................2 - 3
SiS630S ............................................................ 2 - 3
PC Card Chipset - PCI1410 ............................. 2 - 1 1
Ports............................................................ 2 - 13
Mainboard....................................................2 - 14
Mainboard components list ............................... 2 - 14
Mainboard photo .............................................. 2 - 15
Chapter 3: Disassembly.......................... 3 - 1
Size chart for screws and hex nuts: .................... 3 - 1
Disassembly steps .......................................3 - 2
S teps to remove the CD-ROM/DVD-ROM : .......... 3 - 2
Step s to remove the CPU:................................... 3 - 2
Step s to remove the FDD:................................... 3 - 2
Step s to remove the HDD:................................... 3 - 3
Step s to remove the inverter board:..................... 3 - 3
Step s to remove the LCD panel:.......................... 3 - 3
Step s to remove the mainboard:.......................... 3 - 4
Removal Procedures ....................................3 - 5
Remove the battery............................................. 3 - 5
Remove the keyboard......................................... 3 - 6
Remove the HDD assembly ................................ 3 - 7
Remove the CD-ROM\DVD-ROM assembly ......... 3 - 8
Remove the heat sink ......................................... 3 - 9
Applying a heat sink pad .................................... 3 - 9
Remove the CPU .............................................. 3 - 10
Reinstall the CPU ............................................. 3 - 10
Separate the notebook base in two ................... 3 - 11
Remove the FDD assembly............................... 3 - 14
Remove the CD-ROM tray ................................ 3 - 14
Remove the Fan ............................................... 3 - 14
Remove the mainboard and
tray from the bottom case ................................. 3 - 15
Remove the mainboard
from the mainboard tray ................................... 3 - 16
The LCD Panel ...........................................3 - 17
Remove the LCD panel frame ........................... 3 - 17
Remove LCD panel from the LCD panel case.... 3 - 18
Remove the LCD panel from the bracket ........... 3 - 20
Appendix A: Mechanical Drawings and
Parts Lists ................................................A - 1
2200C ...........................................................A - 1
Bottom Half assembly and parts list ..................... A - 1
LCD panel (12.1”) assembly and parts list........... A - 2
LCD panel (13.1” , 15.3”) assembly and
parts list ............................................................. A - 3
LCD panel (14.1”) assembly and parts list........... A - 4
Keyboard and T ouchp ad assembly .....................A - 5
Keyboard and T ouchp ad assembly parts list........A - 6
FDD assembly and parts list ............................... A - 7
HDD assembly and parts list ............................... A - 8
CD-ROM assembly and parts list......................... A - 9
DVD-ROM assembly and parts list ....................A - 10
2700C .........................................................A - 11
Bottom half assembly and parts list ................... A - 11
LCD panel (13.3”) assembly and parts list........ A - 12
LCD panel (14.1”) assembly and parts list......... A - 13
Keyboard and T ouchp ad assembly ................... A - 14
Keyboard and T ouchp ad parts list ..................... A - 15
FDD Assembly and parts list .............................A - 16
HDD assembly and parts list ............................. A - 17
CD-ROM Assembly and parts list ...................... A - 18
DVD-ROM assembly and parts list ....................A - 19
Appendix B: Schematic Diagrams .........B - 1
Appendix C: Switch Settings ..................C - 1
Clock Settings (SW6)........................................ C - 1
Panel ID Settings (SW7) ................................... C - 2
Chapter 1: Introduction
This manual covers information you will need to service or upgrade your Notebook Computer.
Information about operating the computer (e.g. getting started, etc...) is in the User’s Manual. Driver
Information is also found in the User’s Manual. The User’s Manual is shipped with the computer.
Operating Systems (Windows ME, Windows 2000, etc.) have their own manuals as do application
software. If you have any questions regarding those, please consult their user’s manual.
This manual is intended for service personnel who have completed sufficient training to
undertake maintenance and inspection of personal computers. It is organized to allow you to look up
basic information for servicing and/or upgrading components of the notebook computer. The following information is covered.
– Specifications
– Chipset and Mainboard information
Introduction
– Disassembly
– Mechanical drawings and Parts Lists
– Schematic Diagrams
– Switch Settings
1 - 1
Service Manual
System specifications (general)
The main unit of the Model 2200C/2700C Notebook PC has the following components:
– Intel FC-PGA370 Pentium III with AGP technology-based mainboard, using the SiS630S
chipset solution supporting SDRAM with 0MB on-board DRAM, expandable to 32MB, 64MB,
96MB, 128MB, 192MB, 256MB, or 512MB using one or two expansion SODIMMs
– user-installed modules: CD-ROM or DVD or CD-RW ROM
– main storage (HDD) bay: principal HDD 2.5” 12.7/9.5mm, supports PIO mode 4/ATA-33/66/
100 (Ultra DMA) and Master mode IDE.
– User interfaces
- one internal keyboard, 84 keys (depending on the language)
- one built-in touchpad
- one 1024x768 XGA Color TFT LCD with CCFT backlight, size 13.3” or 14.1”, supports
IDCT
– Power Solutions
1 - 2
- power bay: battery pack
- AC adapter
Introduction
CPU ( FC-PGA370 )
Intel Celeron-450 (1.6V)
Intel Celeron-500 (1.6V)
Intel Celeron-550 (1.6V)
Intel Pentium III-600 (1.65V)
Intel Pentium III-650 (1.65V)
Intel Pentium III-700 (1.65V)
Intel Pentium III-750 (1.65V)
Intel Pentium III-800 (1.65V)
Intel Pentium III-850 (1.65V)
Intel Pentium III-866 (1.65V)
Intel Pentium III-933 (1.65V)
Memory
L2 Cache (on die)
Celeron(.18) series 128KB
Keyboard
Keys 84
Fn key support YES
Integrated numeric keypad YES
Inverted “T” layout cursor keys YES
HDD
Easy change module 6GB or up
Drive size 2.5”
Height maximum 12.7mm
Average access time <13ms>
Interface PCI local bus master IDE with ultra
DMA33/ 66/100
FDD
Easy change module 3.5" 1.44MB
Pentium III series 256KB
On board RAM 0MB
Upgradable to 512MB
T ouchPad
built-i n x 1
interface PS/2
CD-ROM (MKE CR175)24X
Easy change module
CD type 12.8cm
Height 12.7mm
Data transfer rate 3600KB/s (max)
Random access time <100m>
Compliance Multimedia PC-2 Spec.
1 - 3
Service Manual
Transport drawer type load/eject
Interface PCI local bus master IDE
BIOS
InSyde 256KB
Display
LCD/CRT (simultaneous) YES
VGA/EGA/CGA/Hercules compatible YES
AGP 3D graphics accelerator YES
Adjustable brightness YES (standard)
LCD\TFT
Backlight CCFT
Size 13.3” or 14.1”
Resolution 1024x768
Speaker-out Jack YES
Microphone-in Jack YES
Power Supply
AC adapter
AC-in 100-240V/47-63Hz
Capacity 6 5W
Battery pack NiMH/Li-Ion
Power Saving Management
Doze mode YES
PS/2 Sleep mode YES
Suspend/Resume mode YES
Suspend to HDD mode YES
Hot key control suspend YES
Closing LCD display off YES
Color (CRT) 16,77M
Monitor 1280x1024
Support IDCT
Audio
Built-in 2 speakers and 1 microphone YES
3D, Sound Blaster compatible YES
1 - 4
APM ver 1.2 support YES
ACPI Ver 1.0b support YES
Ports
Serial port x 1
IrDA/SIR/ASK/FIR x 1
Parallel port x 1
15 pin external video port x 1
External 101/102 keyboard port/ PS/2 mouse x 1
PC Card Standard Type I or Type II x 1
Modem (RJ-11) port for MDC x 1 (optional)
USB connector x 2
speaker-out jack x 1
microphone-in jack x 1
LAN (RJ45) port x 1
Physical
Dimension 308 mm(W)
254 mm(D)
37.5 mm(H)
Weight 3.2KG (with Lithium-lon battery)
Introduction
1 - 5
Notes
Chipset and Mainboard information
Chapter 2: Chipset and Mainboard information
CPU
The 2200C/2700C Notebook PC uses the Intel Mobile Pentium III/Celeron (.18) processor in an FCPGA370 package.
The Intel Mobile Pentium III/Celeron (.18) processor features an integrated L2 cache (256KB for
Pentium III and 128KB for Celeron (.18)) and a 64-bit high performance system bus.
The Mobile Pentium III/Celeron (.18) processor’s 64-bit wide Low Power Gunning Transceiver Logic
system bus is compatible with the SIS630S AGP Set and provides a glue-less, point-to-point interface
for an I/O bridge/memory controller.
The Intel Pentium III and Celerons (.18) processors are fully compatible with all software written for
the Pentium processor with MMX technology, Pentium processor, Intel486 microprocessor, and
Intel386 microprocessor. In addition, they provide improved multimedia & communication performance. Their features:
– Performance improved over existing mobile processors
- Supports the Intel Architecture with Dynamic Execution
- Supports the Intel Architecture MMX technology
– Integrated primary (L1) instructions and data caches
- 4-way set associative, 32-byte line size, 1 line per sector
- 16-Kbyte instruction cache and 16-Kbyte writeback data cache
- Cacheable range programmable by processor programmable registers
– Integrated second level (L2) cache
- 4-way set associative, 32-byte line size, 1 line per sector
- Operated at full core speed
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Service Manual
- 128/256-Kbyte, ECC protected cache data array
– Low Power GTL+ system bus interface
- 64-bit data bus, 100-MHz operation
- Uniprocessor, two loads only (processor and I/O bridge/memory controller)
- Short trace length and low capacitance allows for single ended termination
– Voltage reduction technology
– Pentium III processor clock control
- Quick Start for low power, low exit latency clock ‘throttling’
- Deep Sleep mode for extremely low power dissipation
– Thermal diode for measuring processor temperature
2 - 2
Chipset and Mainboard information
Chipset s
SiS630S
The single chipset, SiS630S, provides a high performance/low cost Desktop solution for the Intel Slot
1 and socket 370 series CPU based systems by integrating a high performance North Bridge, advanced hardware 2D/3D GUI engine, Super-South bridge or an external AGP4X Slot. In addition,
SiS630S provides a system-on-chip solution that complies with the Easy PC Initiative which supports Instantly Available/OnNow PC technology, USB, Legacy Removal and Slotless Design and
FlexATX form factor.
By integrating the UltraAGP
TM
technology and advanced 64-bit graphic display interface, SiS630S
delivers AGP 4x performance and memory bandwidth of up to 1 GB/s. In addition, SiS also supports
an extra AGP Slot that supports 4X and Fast Write transactions. Furthermore, SiS630S provides
powerful hardware decoding DVD accelerator to improve the DVD playback performance. In addition
to providing the standard interface for CRT monitors, SiS630S also provides the Digital Flat Panel
Port (DFP) for a standard interface between a personal computer and a digital flat panel monitor.
SiS630S adopts Share System Memory Architecture which can flexibly utilize the frame buffer size
up to 64MB.
The “Super-South Bridge” in SiS630S integrates all peripheral controllers/accelerators /interfaces.
SiS630S provides a total communication solution including 10/100Mb Fast Ethernet for Office requirement and 1Mb HomePNA for Home Networking. SiS630S offers AC’97 compliant interface that
comprises digital audio engine with 3D-hardware accelerator, on-chip sample rate converter, and
professional wavetable along with separate modem DMA controller. SiS630S also provides interface
to Low Pin Count (LPC) operating at 33 MHz clock which is the same as PCI clock on the host, and
dual USB host controllers with six USB ports that deliver better connectivity and 2 x 12Mb band-
2 - 3
Service Manual
width.
The built-in fast PCI IDE controller supports the ATA PIO/DMA, and the Ultra DMA33/66/100
function that supports the data transfer rate up to 100 MB/s. It provides the separate data path for
two IDE channels that can eminently improve the performance under the multi-tasking environment.
The following illustrates the system block diagram
Features
Host Interface Controller
– Supports Intel Slot 1/Socket370 Pentium II/!!! CPUs
– Synchronous Host/DRAM Clock Scheme
– Asynchronous Host/DRAM Clock Scheme
Integrated DRAM Controller
– 3-DIMM/6-Bank of 3.3V SDRAM
2 - 4
– Supports Memory Bus up to 133 MHz
– System Memory Size up to 3 GB
– Up to 512MB per Row
– Supports 16Mb, 64Mb, 128Mb, 256Mb, 512Mb SDRAM Technology
– Suspend-to-RAM (STR)
– Relocatable System Management Memory Region
– Programmable Buffer Strength for CS#, DQM[7:0], WE#, RAS#, CAS#, CKE, MA[14:0] and
MD[63:0]
– Shadow RAM Size from 640KB to 1MB in 16KB increments
– Two Programmable PCI Hole Areas
Integrated A.G.P . Compliant T arget/66Mhz Host-to-PCI Bridge
– AGP v2.0 Compliant
– Supports Graphic Window Size from 4MBytes to 256MBytes
– Supports Pipelined Process in CPU-to-Integrated 3D A.G.P. VGA Access
– Supports 8 Way, 16 Entries Page Table Cache for GART to Enhance Integrated A.G.P. VGA
Controller Read/Write Performance
– Supports PCI-to-PCI Bridge Function for Memory Write from 33Mhz PCI Bus to Integrated
A.G.P. VGA
– Supports Additional AGP slot with 4X and Fast Write Transaction
Meet PC99 Requirements
PCI 2.2 Specification Compliant
High Performance PCI Arbiter
– Supports up to 4 PCI Masters
– Rotating Priority Arbitration Scheme
Chipset and Mainboard information
– Advanced Arbitration Scheme Minimizing Arbitration Overhead.
– Guaranteed Minimum Access Time for CPU And PCI Masters
Integrated Host-T o-PCI Bridge
– Zero Wait State Burst Cycles
– CPU-to-PCI Pipeline Access
– 256B to 4KB PCI Burst Length for PCI Masters
– PCI Master Initiated Graphical Texture Write Cycles Re-mapping
– Reassembles PCI Burst Data Size into Optimized Block Size
Fast PCI IDE Master/Slave Controller
– Supports PCI Bus Mastering
2 - 5
Service Manual
– Native Mode and Compatibility Mode
– PIO Mode 0, 1, 2 , 3, 4
– Multiword DMA Mode 0, 1, 2
– Ultra DMA 33/66/100
– Two Independent IDE Channels Each with 16 DW FIFO
Virtual PCI-to-PCI Bridge
Integrated Ultra AGP VGA for Hardware 2D/3D Video/Graphics Accelerators
– Supports Tightly Coupled 64 Bits Host Interface to VGA to Speed Up GUI Performance and
Video Playback Frame Rate
– AGP v. 2.0 Compliant
– Zero-Wait-State 128x4 Post-Write Buffer with Write Combine Capability
– Zero-Wait-State 128x4 2-Way Read Ahead Cache Capability
– Re-locatable Memory-Mapped and I/O Address Decoding
– Flexible Design Shared Frame Buffer Architecture for Display Memory
2 - 6
– Shared System Memory Area up to 64MB
– Built-in 8K Bytes Texture Cache
– Supports High Quality Dithering
– Supports Bump Mapping
– Supports 8/16/24/32 BPP RGB/ARGB Texture Format
– Supports Video YUV Texture in All Supported Texture Formats
– 128-Bit 2D Engine with a Full Instruction Set
– Maximum 64 MB Frame Buffer with Linear Addressing
– Supports Hardware DVD Accelerator
– Supports Single Frame Buffer Architecture
– Supports Two Independent Video Windows with Overlay Function and Scaling Factors
– Supports YUV-To-RGB Color Space Conversion
– Supports Graphic and Video Overlay Function
– Supports CD/DVD to TV Playback Mode
– Simultaneous Graphic and TV Video Playback Overlay
– Supports RGB555, RGB565, YUV422 and YUV420 Video Playback Format
– Supports Filtered Horizontal Up and Down Scaling Playback
– Supports DVD Sub-Picture Playback Overlay
– Supports DVD Playback Auto-Flipping
– Built-in Two Video Playback Line Buffers
– Built-in Programmable 24-bit True-Color RAMDAC up to 270 MHz Pixel Clock RAMDAC
Snoop Function
– Built-in Dual-Clock Generator
– Supports Multiple Adapters and Multiple Monitors
– Built-in PCI Multimedia Interface
Chipset and Mainboard information
– Supports Digital Flat Panel Port for Digital Monitor (LCD Panel)
TM
– Built-in VESA Plug and Display for CH7003, PanelLink
and LVDS Digital Interface
– Built-in Secondary CRT Controller for Independent Secondary CRT, LCD or TV digital
output
– Supports VESA Standard Super High Resolution Graphic Modes
- 640x480 16/256/32K/64K/16M colors 120 Hz NI
- 800x600 16/256/32K/64K/16M colors 120 Hz NI
- 1024x768 256/32K/64K/16M colors 120 Hz NI
- 1280x1024 256/32K/64K/16M colors 85 Hz NI
- 1600x1200 256/32K/64K/16M colors 85 Hz NI
- 1920x1440 8bbp/16bbp 60NI
2 - 7
Service Manual
– Low Resolution Modes
– Supports Virtual Screen up to 4096x4096
– Fully Directx 7.0 Compliant
– Efficient and Flexible Power Management with ACPI Compliance
Low Pin Count Interface
– Forwards PCI I/O and Memory Cycles into LPC Bus
– Translates 8-/16-bit DMA Cycles into PCI Bus Cycles
Advanced PCI H/W Audio & Modem
Advanced Power Management
– Meets ACPI 1.0 Requirements
– Meets APM 1.2 Requirements
– ACPI Sleep States Include S1, S3, S4, S5
– CPU Power States Include C0, C1, C2 C3
– Power Button with Override
2 - 8
– RTC Day-of-Month, Month-of-Year Alarm
– 24-bit Power Management Timer
– LED Blinking in S0,S1 and S3 States
– System Power-Up Events Include: Power Button, Hot-Key, Keyboard Password/ Hot-Key,
RTC Alarm, Modem Ring-In, SMBALT#, LAN, PME#, AC’97 Wake-Up and USB
– Wake-Up
– Software Watchdog Timer
– Power Supply’98 Support
– PCI Bus Power Management Interface Spec. 1.0
Integrated DMA Controller
– Two 8237A Compatible DMA Controllers
– 8/16- bit DMA Data Transfer
– Distributed DMA Support
Integrated Interrupt Controller
– Two 8237A Compatible DMA Controllers
– Two 8259A Compatible Interrupt Controllers
– Level- or Edge-Triggered Programmable
– Serial IRQ
– Interrupt Sources Re-routable to Any IRQ Channel
Three 8254 Compatible Programmable 16-bit Counters
– System Timer Interrupt
– Generate Refresh Request
– Speaker Tone Output
Integrated Keyboard Controller
Chipset and Mainboard information
– Hardwired Logic Provides Instant Response
– Supports PS/2 Mouse Interface
– Password Security and Password Power-Up
– System Sleep and Power-Up by Hot-Key
– KBC and PS2 Mouse Can Be Individually Disabled
Integrated Real Time Clock (RTC) with 256B CMOS SRAM
– Supports ACPI Day-of-Month and Month-of-Year Alarm
– 256 Bytes of CMOS SRAM
– Provides RTC H/W Year 2000 Solution
Universal Serial Bus Host Controller
2 - 9
Service Manual
– OpenHCI Host Controller with Root Hub
– Two USB Host Controllers
– Six USB Ports
– Supports Legacy Devices
– Over Current Detection
I2C Bus/SMBUS Series Interface
Integrated Fast Ethernet Controller and MAC Interface
– Plug and Play Compatible
– High-Performance 32-Bit PCI Bus Master Architecture with Integrated Direct Memory
– Supports Big Endian and Little Endian Byte Alignments
– Implements Optional PCI 3.3v Auxiliary Power Source 3.3Vaux Pin And Optional PCI
– Supports Software, Enhanced Software, and Automatic Polling Schemes to Internal
– PHY Status Monitor and Interrupt
– Supports 10base-T, 100base-Tx
2 - 10
NAND T ree for Ball Connectivity Testing
672-Balls BGA Package
1.8V Core with Mixed 3.3V and 5V I/O CMOS T echnology
PC Card Chipset - PCI1410
– The PCI1410 supports the following features:
– Ability to wake from D3 hot and D3 cold
– Fully compatible with the Intel 430TX (Mobile Triton II) chipset
– A 144-Pin Low-Profile QFP (PGE), 144-ball MicroStar Ball Grid Array (GGU) package, or
209-ball MicroStar Ball Grid Array (GHK) package
– 3.3-V core logic with universal PCI interfaces compatible with 3.3-V and 5-V PCI signaling
environments
– Mix-and-match 5-V/3.3-V 16-bit PC Cards and 3.3-V CardBus Cards
– Single PC Card or CardBus slot with hot insertion and removal
– Burst transfers to maximize data throughput on the PCI bus and the CardBus bus
– Parallel PCI interrupts, parallel ISA IRQ and parallel PCI interrupts, serial ISA IRQ with
parallel PCI interrupts, and serial ISA IRQ and PCI interrupts
– Serial EEPROM interface for loading subsystem ID and subsystem vendor ID
Chipset and Mainboard information
– Pipelined architecture allows greater than 130M bps sustained throughput from CardBus-to-
PCI and from PCI-to-CardBus
– Interface to parallel single-slot PC Card power interface switches like the TI TPS2211
– Up to five general-purpose I/Os
– Programmable output select for CLKRUN
– Five PCI memory windows and two I/O windows available to the 16-bit PC Card socket
– Two I/O windows and two memory windows available to the CardBus socket
– Exchangeable Card Architecture (ExCA) compatible registers are mapped in memory and I/
O space
– Intel 82365SL-DF and 82365SL register compatible
– Distributed DMA (DDMA) and PC/PCI DMA
2 - 11
Service Manual
– 16-Bit DMA on the PC Card socket
– Ring indicate, SUSPEND, PCI CLKRUN, and CardBus CCLKRUN
– Socket activity LED pins
– PCI Bus Lock (LOCK)
– Advanced Submicron, Low-Power CMOS Technology
– Internal Ring Oscillator
2 - 12
Ports
Chipset and Mainboard information
1
2 3 4 5
6 7 8
9
1. Mic-in, headphone
2. USB
3. IEEE 1394
4. TV out
5. Dual USB
6. External monitor
7. Parallel
8. PS/2
9. AC adapter
2 - 13
Service Manual
Mainboard
Mainboard components list
1. Microphone connector
2. MDC to RJ-11 connector
3. Panel connector
4. Invertor power connector
5. Heat sink fan connector
6. Second Fan connector
7. VR
8. ICS1893 Lan PHY
9. 1394 PHY
10. Core logic SiS630s
11 . Thermal IC TC 1066
12. Audio Codec
13. IR
14 . TI4410 (PCMCIA + 1394 Controller)
15. K/B Controller M33867
16. HDD connector
17. K/B connector
18. CMOS battery
19. Choke (for power)
20. MDC connector
21. CPU and Memory frequency switch
22. CPU V_Core switch
23. FDD connector
24. Gold figen (for debug card)
25. Indicative LED and touchpad connector
26. Internal Speaker connector
27. CD-ROM connector
2 - 14
Mainboard photo
Chipset and Mainboard information
6
1
2
3
4
5
7
13
12
9
10
8
11
16
17
14
15
18
19
20
21
22
23
24
27
25 26
2 - 15
Notes
Chapter 3: Disassembly
Disassembly
To make the disassembly process easier each section may have a box in the page margin. Information contained in the
amount of screws involved. A
procedure. A
All screw and nuts used in the assembly of the Notebook Computer are assigned a letter. If
you encounter any problems reassembling the machine, refer to this table to make sure you are
using the proper screw or nut.
@ boxes inform you what tools will be needed for a given procedure and the
i box lists the components that are important for that particular
contains information that may be helpful to you. Examples are shown on the left.
Size chart for screws and hex nuts:
retteL eziS retteL eziS
A
B
C
D
.mm5x7.1
.mm2x2
.mm3x2
.mm4x2
J
K
L
M
.mm6x5.2
.mm8x5.2
.mm41x5.2
.mm32x5.2
@
This box lists the tools
needed and the amount
of screws used.
Note
Information in thie box
will give possible useful
information.
i
This box lists the
names of the relevant
parts.
E
F
G
H
.mm5x2
.mm01x2
.mm3x5.2
.mm4x5.2
I
.mm5x5.2
N
O
P
Q
R
.mm5.3x6.2
.mm4x3
wercsknistaeH
tunxehffodnatS
).mm11(dutsxeH
3 - 1
Service Manual
Disassembly steps
Note
Remember to wear an
anti-static wrist strap
and remove all power
sources when working
on the computer
From the list below choose the component that you want to disassemble, then follow the steps
listed and go to the appropriate page for detailed instruction.
Steps to remove the CD-ROM/DVD-ROM :
Remove the battery p 3-5
Remove the keyboard p 3-6
Remove the CD-ROM/DVD-ROM assembly p 3-8
Steps to remove the CPU:
Remove the battery p 3-5
Remove the keyboard p 3-6
Remove the heat sink p 3-9
Remove the CPU p 3-10
Steps to remove the FDD:
Remove the battery p 3-5
3 - 2
Remove the keyboard p 3-6
Remove the HDD assembly p 3-7
Seperate thenotebook base in two p 3-11
Remove the FDD assembly from the mainboard p 3-14
Steps to remove the HDD:
Remove the keyboard p 3-6
Remove the HDD assembly p 3-7
Steps to remove the inverter board:
Remove the battery p 3-5
Remove the LCD panel frame p 3-17
Remove the LCD panel from the LCD panel case p 3-18 (up to step 4)
Steps to remove the LCD panel:
Remove the LCD panel frame p 3-17
Remove the LCD panel and bracket from the LCD panel case p 3-18
Remove the LCD panel from the bracket p 3-20
Remove the LCD panel
Disassembly
3 - 3
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