The EP9315 is an ARM920T-based system-on-a-chip
design with a large peripheral set targeted to a variety of
applications:
•Thin Client Computers for Business and Home
•Internet Radio
•Internet Access Devices
•Industrial Computers
•Specialized Terminals
•Point-of-sale Terminals
•Test and Measurement Equipment
The ARM920T microprocessor core with separate
16-kbyte, 64-way set-associative instruction and data
caches is augmented by the MaverickCrunch™ coprocessor, enabling high-speed floating point
calculations.
MaverickKey
solution to the growing concern o ver sec ure web conten t
and commerce. With Internet security playing an
important role in the delivery of digital media such as
™
unique hardware programmed IDs are a
books or music, traditional software methods are quickly
becoming unreliable. The MaverickKey unique IDs
provide OEMs with a method of utilizing specific
hardware IDs such as those assigned for SDMI (Secure
Digital Music Initiative) or any other authentication
mechanism.
A high-performance 1/10/100-Mbps Ethernet media
access controller (EMAC) is included along with external
interfaces to SPI, I
2
S audio, Raster/LCD, IDE storage
peripherals, keypad, and touchscreen. A three-port USB
2.0 Full Speed Host (OHCI) (12 Mbits per second) and
three UARTs are included as well.
The EP9315 is a high-performance, low-power, RISCbased, single-chip computer built around an ARM920T
microprocessor core with a maximum operating clock
rate of 200 MHz (184 MHz for industrial conditions). The
ARM core operates from a 1.8 V supply, while the I/O
operates at 3.3 V with power usage between 100 mW
and 750 mW (dependent on speed).
Table A. Change History
RevisionDateChanges
PP1January 2004Initial Release.
PP2July 2004
PP3Febuary 2005Update electrical characteristics based upon more complete characterization data.
PP4March 2005Minor correction to block diagram on page 1. DD7 changed to pull down.
The ARM920T is a Harvard architecture processor with
separate 16-kbyte instruction and data caches with an 8word line length but a unified memory. The processor
utilizes a five-stage pipeline consisting of fetch, decode,
execute, memory, and write stages. Key features include:
•ARM (32-bit) and Thumb (16-bit compressed)
Instruction Sets
•32-bit Advanced Micro-Controller Bus Architecture
(AMBA)
•16-kbyte Instruction Cache with Lockdown
•16-kbyte Data Cache (pro grammable write-throu gh or
write-back) with Lockdown
•MMU for Linux
®
, Microsoft® Windows® CE and Other
Operating Systems
•Translation Look Aside Buffers with 64 Data and 64
Instruction Entries
•Programmable Page Sizes of 1 Mbyte, 64 kbyte,
4 kbyte, and 1 kbyte
•Independent Lockdown of TLB Entries
MaverickCrunch™ Math Engine
The MaverickCrunch Engine is a mixed-mode
coprocessor designed primarily to accelerate the math
processing required to rapidly encode digital audio
formats. It accelerates single and double precision
integer and floating point operations plus an integer
multiply-accumulate (MAC) instruction that is
considerably faster than the ARM920T's native MAC
instruction. The ARM920T coprocessor interface is
utilized thereby sharing its memory interface and
instruction stream. Hardware forwarding and interlock
allows the ARM to handle looping and addressing while
MaverickCrunch handles computation. Features include:
•IEEE-754 single and double precision floating point
•32 / 64-bit integer
•Add / multiply / compare
•Integer MAC 32-bit input with 72-bit accumulate
•Integer Shifts
•Floating point to/from integer conversion
•Sixteen 64-bit register files
•Four 72-bit accumulators
MaverickKey™ Unique ID
MaverickKey unique hardware programmed IDs are a
solution to the growing concern over secure web content
and commerce. With Internet security playing an
important role in the delivery of digital media such as
books or music, traditional software methods are quick ly
becoming unreliable. The MaverickKey unique IDs
provide OEMs with a method of utilizing specific
hardware IDs such as those assigned for SDMI (Secure
Digital Music Initiative) or any other authentication
mechanism.
Both a specific 32-bit ID as well as a 128-bit random ID is
programmed into the EP9315 through the use of laser
probing technology. These IDs can then be used to
match secure copyrighted content with the ID of the
target device the EP9315 is powering, and then deliver
the copyrighted information over a secure connection. In
addition, secure transactions can benefit by also
matching device IDs to server IDs. MaverickKey IDs
provide a level of hardware security required for today’s
Internet appliances.
General Purpose Memory Interface (SDRAM,
SRAM, ROM, FLASH)
The EP9315 features a unified memory address model
where all memory devices are accessed over a common
address/data bus. A separate internal po rt is dedicated to
the read-only Raster/LCD refresh engine, while the rest
of the memory accesses are performed via the Processor
bus. The SRAM memory controller supports 8, 16 and
32-bit devices and accommodates an internal boot ROM
concurrently with 32-bit SDRAM memory.
•1-4 banks of 32-bit 66 or 100 MHz SDRAM
•One internal port dedicated to the Raster/LCD
Refresh Engine (Read Only)
•Address and data bus shared between SDRAM,
SRAM, ROM, and FLASH memory
•NOR FLASH memory supported
Table B. General Purpose Memory Interface Pin Assignments
Pin MnemonicPin Description
SDCLKSDRAM Clock
SDCLKENSDRAM Clock Enable
SDCSn[3:0]SDRAM Chip Selects 3-0
RASnSDRAM RAS
CASnSDRAM CAS
SDWEnSDRAM Write Enable
CSn[7:6] and CSn[3:0]Chip Selects 7, 6, 3, 2, 1, 0
AD[25:0]Address Bus 25-0
DA[31:0]Data Bus 31-0
DQMn[3:0]SDRAM Output Enables / Data Masks
WRnSRAM Write Strobe
RDnSRAM Read / OE Strobe
WAITnSRAM Wait Input
The IDE Interface provides an industry-standard
connection to two AT Advanced Packet Interface (ATAPI)
compliant devices. The IDE port will attach to a master
and a slave device. The internal DMA controller performs
all data transfers using the Ultra DMA modes. The
interface supports the following operating modes:
•PIO Mode 0 thru 4
•Ultra DMA Modes 0 thru 3
Table C. IDE Interface Pin Assignments
Pin MnemonicPin Description
DD[15-0]IDE Data bus
IDEDA[2-0]IDE Device address
IDECSn[0,1]IDE Chip Select 0 and 1
DIORnIDE Read Strobe
DIOWnIDE Write Strobe
DMACKnIDE DMA acknowledge
Ethernet Media Access Controller (MAC)
The MAC subsystem is compliant with the ISO/TEC
802.3 topology for a single shared medium with several
stations. Multiple MII-compliant PHYs are supported.
Features include:
•Supports 1/10/100 Mbps transfer rates for home /
small-business / large-business applications
•Interfaces to an off-chip PHY through industry
standard Media Independent Interface (MII)
Table D. Ethernet Media Access Controller Pin Assignments
Pin MnemonicPin Description
MDCManagement Data Clock
MDIOManagement Data I/O
RXCLKReceive Clock
MIIRXD[3:0]Receive Data
RXDVALReceive Data Valid
RXERRReceive Data Error
TXCLKTransmit Clock
MIITXD[3:0]Transmit Data
TXENTransmit Enable
TXERRTransmit Error
CRSCarrier Sense
CLDCollision Detect
Serial Interfaces (SPI, I2S and AC ’97)
The SPI port can be configured as a master or a slave,
®
supporting the National Semi conductor
®
Texas Instruments
signaling protocols.
, Motorola® and
The AC'97 port supports multiple codecs for multicha nnel
audio output with a single stereo input. Three I
2
S ports
can be configured to support six channel 24-bit audio.
These ports are multiplexed so that I
2
S port 0 will take
over either the AC'97 pins or the SPI pins. The second
and third I2S ports' serial input and serial output pins are
multiplexed with EGPIO[4,5,6,13]. The clocks supplied in
the first I2S port are also used for the second and third
I2S ports.
•Normal Mode: One SPI Port and one AC’97 Port
2
•I
S on SSP Mode: One AC’97 Port and up to three I2S
Ports
2
•I
S on AC’97 Mode: One SPI Port and up to three I2S
Ports
Table E. Audio Interfaces Pin Assignment
Normal Mode
Pin
Name
SCLK1SPI Bit ClockI2S Serial ClockSPI Bit Clock
SFRM1SPI Frame Clock I2S Frame ClockSPI Frame Clock
SSPRX1 SPI Serial Input I2S Serial InputSPI Serial Input
SSPTX1
ARSTnAC'97 ResetAC'97 ResetI2S Master Clock
ABITCLK AC'97 Bit Clock AC'97 Bit ClockI2S Serial Clock
ASYNC
ASDI
ASDO
Pin
Description
SPI Serial
Output
AC'97 Frame
Clock
AC'97 Serial
Input
AC'97 Serial
Output
I2S on SSP
Mode
Pin Description Pin Description
I2S Serial OutputSPI Serial Output
(No I2S Master
Clock)
AC'97 Frame
Clock
AC'97 Serial Input I2S Serial Input
AC'97 Serial
Output
I2S on AC'97
Mode
I2S Frame Clock
I2S Serial Output
Raster / LCD Interface
The Raster / LCD interface provides data and interface
signals for a variety of display types. It features fully
programmable video interface timing for non-interlaced
flat panel or dual scan displays. Resolutions up to
1024 x 768 are supported from a unified SDRAM based
frame buffer. A 16-bit PWM provides control for LCD
panel contrast. LCD specific features include:
•Timing and interface signals for digital LCD and TFT
displays
•Full programmability for either non-interlaced or dualscan color and grayscale flat panel displays
•Dedicated data path to SDRAM controller for
improved system performance
•Pixel depths of 4, 8, 16, or 24 bits per pixel or 256
levels of grayscale
•Hardware Cursor up to 64 x 64 pixels
•256 x 18 Color Lookup Table
•Hardware Blinking
•8-bit interface to low end panel
Table F. LCD Interface Pin Assignments
Pin MnemonicPin Description
SPCLKPixel Clock
P[17:0]Pixel Data Bus [17:0]
HSYNC / LP
VCSYNC / FP
BLANKComposite Blank
BRIGHTPulse Width Modulated Brightness
Horizontal
Synchronization / Line Pulse
Vertical or Composite
Synchronization / Frame Pulse
Graphics Accelerator
The EP9315 contains a hardware graphics acceleration
engine that improves graphic performance by handling
block copy, block fill and hardware line draw operations.
The Graphics Accelerator is used in the system to offload graphics operations from the processor.
Pixel depths supported by the Graphics Accelerator are
4, 8, 16 or 24 bits per pixel. The 24 bits per pixel mode
can be operated as packed (4 pixels every 3 words) or
unpacked (1 pixel per word with the high byte unused.)
The block copy operations of the Graphics Accelerator
are similar to a DMA (Direct Memory Access) transfer
that understands pixel organization, block width,
transparency, and transformation from 1bpp to higher 4,
8, 16 or 24bpp.
The line draw operations also allow for solid lines or
dashed lines. The colors for line drawing can be either
foreground color and background color or foreground
color with the background being transparent.
only interrupts the processor when a meaningful change
occurs. The touch screen hardware may be disabled and
the switch matrix and ADC controlled directly if desired.
Features include:
•Support for 4-, 5-, 7-, or 8-wire analog resistive touch
screens.
•Flexibility - unused lines may be used for temperature
sensing or other functions.
•Touch screen interrupt function.
Table G. Touch Screen Interface with 12-bit Analog-to-Digital
Converter Pin Assignments
Pin MnemonicPin Description
Xp, XmTouch screen ADC X Axis
Yp, YmTouch screen ADC Y Axis
SXp, SXm
SYp, SYm
Touch screen ADC X Axis
Voltage Feedback
Touch screen ADC Y Axis
Voltage Feedback
64-Key Keypad Interface
The keypad circuitry scans an 8 x 8 array of 64 normally
open, single-pole switches. Any one or two keys
depressed will be de-bounced and decoded. An interrupt
is generated whenever a stable set of depressed keys is
detected. If the keypad is not utilized, the 16 column/row
pins may be used as general purpose I/O. The Keypad
interface:
•Provides scanning, debounce, and decoding for a 64key switch array.
•Scans an 8-row by 8-column matrix.
•May decode 2 keys at once.
•Generates an interrupt when a new stable key is
determined.
•Also generates a 3-key reset interrupt.
Table H. 64-Key Keypad Interface Pin Assignments
Pin Mnemonic
COL[7:0]
ROW[7:0]
Pin
Description
Key Matrix Column
Inputs
Key Matrix Row
Inputs
Alternative Usage
General Purpose I/O
General Purpose I/O
Touch Screen Interface with 12-bit Analogto-digital Converter (ADC)
The touch screen interface performs all sampling,
averaging, ADC range checking, and control for a wide
variety of analog resistive touch screens. This controller
Three 16550-compatible UARTs are supplied. Two
provide asynchronous HDLC (High-level Data Link
Control) protocol support for full-duplex transmit and
receive. The HDLC receiver handles framing, address
matching, CRC checking, control-octet transparency, and
optionally passes the CRC to the host at the end of the
packet. The HDLC transmitter handles framing, CRC
generation, and control-octet transparency. The host
must assemble the frame in memory before
transmission. The HDLC receiver and transmitter use the
UART FIFOs to buffer the data streams. A third IrDA
compatible UART is also supplied.
•UART1 supports modem bit rates up to 115.2 Kbps,
supports HDLC and includes a 16-byte FIFO for
receive and a 16-byte FIFO for transmit. Interrupts are
generated on Rx, Tx, and modem status change.
•UART2 contains an IrDA encoder operating at eith er
the slow (up to 115 Kbps), medium (0.576 or 1.152
Mbps), or fast (4 Mbps) IR data rates. It also has a 16byte FIFO for receive and a 16-byte FIFO for transmit.
•UART3 supports HDLC and includes a 16-byte FIFO
for receive and a 16-byte FIFO for transmit. Interrupts
are generated on Rx and Tx.
®
Triple Port USB Host
The USB Open Host Controller Interface (Open HCI)
provides full speed serial communications ports at a
baud rate of 12 Mbits/sec. Up to 127 USB devices
(printer, mouse, camera, keyboard, etc.) and USB hubs
can be connected to the USB host in the USB “tieredstart” topology.
This includes the following features:
•Compliance with the USB 2.0 specification
•Compliance with the Open HCI Rev 1.0 specification
•Supports both low speed (1.5 Mbp s) and full speed
-
(12 Mbps) USB device connections
•Root HUB integrated with 3 downstream USB ports
•Transceiver buff ers integrated, over-current protection
on ports
•Supports power management
•Operates as a master on the bus
The Open HCI host controller initializes the master DMA
transfer with the AHB bus:
•Fetches endpoint descriptors and transfer descriptors
•Accesses endpoint data from system memory
•Accesses the HC communication area
•Writes status and retire transfer descriptor
Table I. Universal Asynchronous Receiver/Transmitters Pin
Pin MnemonicPin Name - Description
TXD0UART1 Transmit
RXD0UART1 Receive
CTSn
DSRn / DCDn
DTRnUART1 Data Terminal Ready
RTSnUART1 Ready To Send
EGPIO[0] / RIUART1 Ring Indicator
low, level-sensitive inputs. GPIO may be programmed as
active-high level-sensitive, active-low level-sensitive,
rising-edge-triggered, falling-edge-triggered, or combined
rising/falling-edge-triggered.
•Supports 64 interrupts from a variety of sources (such
as UARTs, GPIO, and key matrix)
•Routes interrupt sources to either the ARM920T’s
IRQ or FIQ (Fast IRQ) inputs
The Watchdog Timer insures proper operation by
requiring periodic attention to prevent a reset-on-timeout.
General Purpose Input/Output (GPIO)
The 16 EGPIO pins may each be configured individually
as an output, an input, or an interrupt input. Port F may
Two 16-bit timers operate as free running down-counters
or as periodic timers for fixed interval interrupts and have
a range of 0.03 ms to 4.27 seconds.
One 32-bit timer, plus a 6-bit prescale counter, has a
range of 0.03 µs to 73.3 hours.
One 40-bit debug timer , plu s 6-bit prescale co unter, has a
range of 1.0 µs to 12.7 days.
Interrupt Controller
The interrupt controller allows up to 64 interrupts to
generate an Interrupt Request (IRQ) or Fast Interrupt
Request (FIQ) signal to the processor core. Thirty-two
hardware priority assignments are provided fo r assisting
be configured as GPIO. Each Port F pin may be
configured individually as an output, input or an interrupt
input.
There are 23 pins that may be used as alternate input s or
outputs, but do not support interrupts. These pins are:
• Key Matrix ROW[7:0], COL[7:0]
• Ethernet MDIO
• Both LED Outputs
• Two-wire Clock and Data
• SLA [1:0]
6 pins may alternatively be used as inputs only:
• CTSn, DSRn / DCDn
• 4 Interrupt Lines
IRQ vectoring, and two levels are provided for FIQ
vectoring. This allows time critical interrupts to be
processed in the shortest time possible. Internal
interrupts may be programmed as active-high or active-
Table P. General Purpose Input/Output Pin Assignment
Pin MnemonicPin Name - Description
EGPIO[15:0]
FGPIO[7:0]
Note: Port F defaults as PCMCIA pins. Port F must be
configured by software to be used as GPIO.
Expanded General Purpose Input / Output
Pins with Interrupts
Expanded General Purpose Input / Output
Pins with Interrupts
Reset and Power Management
The chip may be reset through the PRSTn pin or through
the open drain common reset pin, RSTOn.
Clocks are managed on a peripheral-by-peripheral basis
and may be turned off to conserve power.
The processor clock is dynamically adjustable from 0 to
200 MHz (184 MHz for industrial conditions).
Table Q. Reset and Power Management Pin Assignments
Pin MnemonicPin Name - Description
PRSTnPower On Reset
RSTOn
User Reset In/Out – Open Drain –
Preserves Real Time Clock value
Hardware Debug Interface
The JTAG interface allows use of ARM’s Multi-ICE or
other in-circuit emulators.
Note: The JTAG interface does not support boundary scan.
Table R. Hardware Debug Interface
Pin MnemonicPin Name - Description
TCKJTAG Clock
TDIJTAG Data In
TDOJTAG Data Out
TMSJTAG Test Mode Select
TRSTnJTAG Port Reset
Internal Boot ROM
12-channel DMA Controller
The DMA module contains 12 separate DMA channels.
Ten of these may be used for peripheral-to-memory or
memory-to-peripheral access. Two of these are
dedicated to memory-to-memory transfers. Each DMA
channel is connected to the 16-bit DMA request bus.
The request bus is a collection of requests, Serial Audio,
and UARTs. Each DMA channel can be used
independently or dedicated to any request signal. For
each DMA channel, source and destination addressing
can be independently programmed to increment,
decrement, or stay at the same value. All DMA
addresses are physical, not virtual addresses.
PCMCIA Interface
The EP9315 has a single PCMCIA port which can be
used to access either 8 or 16-bit devices.
Table S. PCMCIA Interface
Pin Mnemonic Pin Name - Description
VS1 Voltage sense
VS2 Voltage sense
MCD1 Card detect
MCD2 Card detect
MCBVD1 Voltage detection / status change
MCBVD2 Voltage detection
MCDIR Data transceiver direction control
MCDAENn Data bus transceiver enable
MCADENn Address bus transceiver enable
MCREGn Memory card register
MCEHn Memory card high byte select
MCELn Memory card low byte select
IORDnI/O card read
IOWRn I/O card write
MCRDnMemory card read
MCWRn Memory card write
READYReady / interrupt
WP Write protect
MCWAITn Wait Input
MCRESETn Card reset
The Internal 16-kbyte ROM allows booting from FLASH
memory, SPI or UART. Consult the EP93xx User’s
Manual for operational details
(All grounds = 0 V, all voltages with respect to 0 V)
ParameterSymbolMinMaxUnit
RVDD
Power Supplies
Total Power Dissipation (Note 1)-2W
Input Current per Pin, DC (Except supply pins)-±10mA
Output current per pin, DC-±50mA
Digital Input voltage(Note 2)-0.3RVDD+0.3V
Storage temperature-40+125°C
Note: 1. Includes all power generated due to AC and/or DC output loading.
2. The power supply pins are at recommended maximum values.
3. At ambient temperatures above 70° C, total power dissipation must be limited to less than 2.5 Watts.
CVDD
VDD_PLL
VDD_ADC
-
-
-
-
3.96
2.16
2.16
3.96
V
V
V
V
WARNING: Operation beyond these limits may result in permanent damage to the device.
Normal operation is not guaranteed at these extremes.
Recommended Operating Conditions
(All grounds = 0 V, all voltages with respect to 0 V)
ParameterSymbolMinTypMaxUnit
RVDD
Power Supplies
Operating Ambient Temperature - Commercial
Operating Ambient Temperature - Industrial
Processor Clock Speed - CommercialFCLK--200MHz
Processor Clock Speed - IndustrialFCLK--184MHz
System Clock Speed - CommercialHCLK--100MHz
System Clock Speed - IndustrialHCLK--92MHz
This data sheet contains one or more timing diagrams. The following key explains the components used in these
diagrams. Any variations are clearly labe lled when they occur. Therefore, no additional meaning should be attached
unless specifically stated.
Clock
High to Low
High/Low to High
Bus Change
Bus Valid
Undefined/Invalid
Valid Bus to Tristate
Bus/Signal Omission
Figure 1. Timing Diagram Drawing Key
Timing Conditions
Unless specified otherwise, the following conditions are true for all timing measurem e nts.
•T
= 0 to 70° C
A
• CVDD = VDD_PLL = 1.8V
•RVDD = 3.3V
• All grounds = 0 V
• Logic 0 = 0 V, Logic 1 = 3.3 V
• Output loading = 50 pF
• Timing reference levels = 1.5 V
• The Processor Bus Clock (HCLK) is programmable and is set by the user. The frequen cy is typica lly between
33 MHz and 100 MHz (92 MHz for industrial conditions).
Figure 2 through Figure 5 define the timings associated with all phases of the SDRAM. The following table contains the
values for the timings of each of the SDRAM modes.
ParameterSymbolMinTypMaxUnit
SDCLK high time
SDCLK low time
SDCLK rise/fall time
Signal delay from SDCLK rising edge time
Signal hold from SDCLK rising edge time
DQMn delay from SDCLK rising edge time
DQMn hold from SDCLK rising edge time
DA valid setup to SDCLK rising edge time
DA valid hold from SDCLK rising edge time
AD setup to CSn assert time
AD hold from CSn deassert time
RDn assert time
CSn to RDn delay time
CSn assert to DQMn assert delay time
DA setup to RDn deassert time
DA hold from RDn deassert time
See “Timing Conditions” on page 14 for definition of HCLK.
t
ADs
t
ADh
t
RDpw
t
RDd
t
DQMd
t
DAs
t
DAh
EP9315
Enhanced Universal Platform SOC Processor
0--ns
t
HCLK
-
--3ns
--1ns
t
+ 12
HCLK
0--ns
t
HCLK
-
× (WST1 + 2)
--ns
-ns
-ns
AD
CSn
WRn
RDn
DQMn
DA
WAIT
t
ADs
t
RDd
t
DQMd
t
DAs
Figure 6. Static Memory Single Word Read Cycle Timing Measurement
AD setup to WRn assert time
AD hold from WRn deassert time
WRn deassert to CSn deassert time
CSn to WRn assert delay time
WRn assert time
CSn to DQMn assert delay time
WRn deassert to DA transition time
WRn assert to DA valid
AD
CSn
WRn
t
ADs
t
WRd
t
ADs
t
ADh
t
CSh
t
WRd
t
WRpw
t
DQMd
t
DAh
t
DAV
t
- 3
HCLK
t
× 2
HCLK
7
--2ns
-
--1ns
t
HCLK
--8ns
t
WRpw
t
HCLK
-
--ns
-
× (WST1 + 1)
-
t
CSh
-ns
-ns
-ns
-ns
t
ADh
RDn
DQMn
DA
WAIT
t
DQMd
t
DAV
Figure 7. Static Memory Single Word Write Cycle Timing Measurement
AD setup to CSn assert time
CSn assert to Address transition time
Address assert time
AD transition to CSn deassert time
AD hold from CSn deassert time
RDn assert time
CSn to RDn delay time
CSn assert to DQMn assert delay time
DA setup to AD transition time
DA setup to RDn deassert time
DA hold from AD transition time
DA hold from RDn deassert time
AD setup to WRn assert time
WRn/DQMn deassert to AD transition time
AD hold from WRn deassert time
CSn hold from WRn deassert time
CSn to WRn assert delay time
WRn assert time
WRn deassert time
CSn to DQMn assert delay time
DQMn assert time
DQMn deassert time
WRn / DQMn deassert to DA transition time
WRn / DQMn assert to DA valid time
AD setup to CSn assert time
CSn assert to AD transition time
AD transition to CSn deassert time
AD hold from CSn deassert time
RDn assert time
CSn to RDn delay time
CSn assert to DQMn assert delay time
DA setup to AD transition time
DA to RDn deassert time
DA hold from AD transition time
DA hold from RDn deassert time
AD setup to WRn assert time
WRn/DQMn deassert to AD transition time
AD hold from WRn deassert time
CSn hold from WRn deassert time
CSn to WRn assert delay time
WRn assert time
WRn deassert time
CSn to DQMn assert delay time
DQMn assert time
DQMn deassert time
WRn / DQMn deassert to DA transition time
WRn / DQMn assert to DA valid time
CSn assert to Address 1 transition time
Address assert time
AD transition to CSn deassert time
AD hold from CSn deassert time
CSn to RDn delay time
CSn to DQMn assert delay time
DA setup to AD transition time
DA setup to CSn deassert time
DA hold from AD transition time
DA hold from RDn deassert time
Note: These characteristics are valid when the Page Mode Enable (Burst Mode) bit is set. See the User 's Guide for details.
AD setup to WRn assert time
AD hold from WRn deassert time
WRN/DQMn deassert to AD transition time
CSn hold from WRn deassert time
CSn to WRn assert delay time
CSn to DQMn assert delay time
DQMn assert time
DQMn deassert time
WRn assert time
WRn deassert time
WRn/DQMn deassert to DA transition time
WRn/DQMn assert to DA valid time
t
ADs
t
ADh
t
ADd
t
CSh
t
WRd
t
DQMd
t
DQpwL
t
DQpwH
t
WRpwL
t
WRpwH
t
DAh
t
DAv
Note: These characteristics are valid when the Page Mode Enable (Burst Mode) bit is set. See the User's Guide for details.
AD setup to signal transition time
Attribute access time
Attribute hold time
Attribute space pre-charge delay time
Common access time
Common hold time
Common space pre-charge delay time
I/O access time
I/O hold time
I/O space pre-charge delay time
MCDIR hold time
DA setup to MCRDn / IORDn rising edge
DA hold from MCRDn / IORDn rising edge
t
ADs
t
t
t
t
t
t
t
t
t
t
MCDh
t
t
0--ns
A
H
p
A
H
p
A
H
p
[(AA + 1) × t
[(HA + 1) × t
(PA + 1) × t
[(AC + 1) × t
[(HC + 1) × t
(PC + 1) × t
[(AI + 1) × t
[(HI + 1) × t
(PI + 1) × t
] - 14(AA + 1) × t
HCLK
] - 3(HA + 1) × t
HCLK
HCLK
] - 14(AC + 1) × t
HCLK
] - 3(HC + 1) × t
HCLK
HCLK
] - 14(AI + 1) × t
HCLK
] - 3(HI + 1) × t
HCLK
HCLK
(PA + 1) × t
(PC + 1) × t
(PI + 1) × t
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
-ns
-ns
-ns
-ns
-ns
-ns
-ns
-ns
-ns
0--ns
s
h
10--ns
0--ns
AD
MCADENn/
MCDAENn
MCEHn/
MCELn/
MCREGn
MCRDn/
IORDn
MCDIR
DA
(in)
MCWAITn (see Note 1)
t
ADs
t
p
t
A
t
s
t
H
t
MCDh
t
h
Figure 17. PCMCIA Read Cycle Timing Measurement
Note: 1 - MCWAITn asserted will extend the MCRD / IORD strobe time.
AD setup to signal transition time
Attribute access time
Attribute hold time
Attribute space pre-charge delay time
Common access time
Common hold time
Common space pre-charge delay time
I/O access time
I/O hold time
I/O space pre-charge delay time
MCDIR hold time
DATA invalid delay time
t
ADs
t
MCDh
t
DAfo
EP9315
Enhanced Universal Platform SOC Processor
0--ns
t
A
t
H
t
p
t
A
t
H
t
p
t
A
t
H
t
p
[(AA + 1) × t
[(HA + 1) × t
(PA + 1) × t
[(AC + 1) × t
[(HC + 1) × t
(PC + 1) × t
[(AI + 1) × t
[(HI + 1) × t
(PI + 1) × t
] - 14(AA + 1) × t
HCLK
] - 3(HA + 1) × t
HCLK
HCLK
] - 14(AC + 1) × t
HCLK
] - 3(HC + 1) × t
HCLK
HCLK
] - 14(AI + 1) × t
HCLK
] - 3(HI + 1) × t
HCLK
HCLK
(PA + 1) × t
(PC + 1) × t
(PI + 1) × t
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
-ns
-ns
-ns
-ns
-ns
-ns
-ns
-ns
-ns
0--ns
0--ns
t
ADs
AD
MCEHn/
MCELn/
MCREGn
t
p
MCWRn/
IOWRn
MCDIR
DA
(out)
MCWAITn (see Note 1)
Figure 18. PCMCIA Write Cycle Timing Measurement
Note: 1 - MCWAITn asserted will extend the MCWR / IOWR strobe time.
Cycle time(min)(Notes 1, 4, 5)
Address valid to DIORn / DIOWn setup(min)(Note 4)
DIORn / DIOWn pulse width 8-bit(min)(Note 1, 4)
DIORn / DIOWn recovery time(min)(Note 1, 4)
DIOWn data setup(min)(Note 4)
DIOWn data hold(min)
DIORn data setup(min)
DIORn data hold(min)
DIORn data high impedance state(max)(Note 2, 4)
DIORn / DIOWn to address valid hold(min)(Note 4)
Read Data Valid to IORDY (min)
active (if IORDY initially low after t
IORDY Setup time(Note 3, 4)
IORDY Pulse Width(max)(Note 4)
IORDY assertion to release(max)
DIOWn assert to data valid(max)
)(Note 4)
A
t
t
t
DDV
t
RD
t
t
t
Mode 0
(in ns)
t
0
t
1
t
2
2i
t
3
t
4
t
5
t
6
6z
t
9
A
B
C
12501250125012501250
Mode 1
(in ns)
Mode 2
(in ns)
600383330180120
7050303025
2902902908070
---7025
6045303020
00000
2020202020
00000
3030303030
2015101010
00000
3535353535
55555
1010101010
Note: 1. t0 is the minimum total cycle time, t2 is the minimum DIORn / DIOWn assertion time, and t2i is the minimum DIORn / DIOWn
negation time. A host implementation shall lengthen t
and/or t2i to ensure that t0 is equal to or greater than the value
2
reported in the devices IDENTIFY DEVICE data. A device implementation shall support any legal host implementation.
Mode 3
(in ns)
Mode 4
(in ns)
2. This parameter specifies the time from the negation edge of DIORn to the time that the data bus is released by the device.
3. The delay from the activation of DIORn or DIOWn until the state of IORDY is first sampled. If IORDY is inactive then the host
shall wait until IORDY is active before the register transfer cycle is completed. If the device is not driving IORDY negated at
after the activation of DIORn or DIOWn, then t5 shall be met and tRD is not applicable. If the device is driving IORDY
the t
A
negated at the time t
after the activation of DIORn or DIOWn, then tRD shall be met and t5 is not applicable.
A
4. Timings based upon software control. See User’s Guide.
5. ATA / ATAPI standards prior to ATA / ATAPI-5 inadvertently specified an incorrect value for mode 2 time t
Note: 1. Device address consists of signals IDECS0n, IDECS1n and IDEDA (2:0)
2. Data consists of DD (7:0)
3. The negation of IORDY by the device is used to extend the register transfer cycle. The determination of whether the cycle is
to be extended is made by the host after t
are described in the following three cases:
3-1 Device never negates IORDY, devices keeps IORDY released: no wait is generated.
3-2 Device negates IORDY before t
and may be asserted for no more than t
3-3 Device negates IORDY before t
before release: wait generated. The cycle completes after IORDY is reasserted. For cycles where a wait is generated
and DIORn is asserted, the device shall place read data on DD (7:0) for t
Figure 19. Register Transfer to/from Device
from the assertion of DIORn or DIOWn. The assertion and negation or IORDY
A
, but causes IORDY to be asserted before tA. IORDY is released prior to negation
A
A
before release: no wait generated.
C
. IORDY is released prior to negation and may be asserted for no more than t
Cycle time(min)(Note 1, 4)
Address valid to DIORn / DIOWn setup(min)(Note 4)
DIORn / DIOWn 16-bit(min)(Note 1, 4)
DIORn / DIOWn recovery time(min)(Note 1, 4)
DIOWn data setup(min)(Note 4)
DIOWn data hold(min)
DIORn data setup(min)
DIORn data hold(min)
DIORn data high impedance state(max)(Note 2, 4)
DIORn / DIOWn to address valid hold(min)(Note 4)
Read Data Valid to IORDY (min)
active (if IORDY initially low after t
IORDY Setup time(Note 3, 4)
IORDY Pulse Width(max)(Note 4)
IORDY assertion to release(max)
DIOWn assert to data valid(max)
)(Note 4)
A
t
t
0
t
1
t
2
t
2i
t
3
t
4
t
5
t
6
t
6z
t
9
t
RD
t
A
t
B
t
C
DDV
Mode 0
(in ns)
600383240180120
1651251008070
12501250125012501250
Mode 1
(in ns)
Mode 2
(in ns)
7050303025
---7025
6045303020
00000
2020202020
00000
3030303030
2015101010
00000
3535353535
55555
1010101010
Note: 1. t0 is the minimum total cycle time, t2 is the minimum DIORn / DIOWn assertion time, and t2i is the minimum DIORn / DIOWn
negation time. A host implementation shall lengthen t
and/or t2i to ensure that t0 is equal to or greater than the value
2
reported in the devices IDENTIFY DEVICE data. A device implementation shall support any legal host implementation.
2. This parameter specifies the time from the negation edge of DIORn to the time that the data bus is released by the device.
3. The delay from the activation of DIORn or DIOWn until the state of IORDY is first sampled. If IORDY is inactive then the host
shall wait until IORDY is active before the register transfer cycle is completed. If the device is not driving IORDY negated at
the t
after the activation of DIORn or DIOWn, then t5 shall be met and tRD is not applicable. If the device is driving IORDY
A
negated at the time t
after the activation of DIORn or DIOWn, then tRD shall be met and t5 is not applicable.
A
4. Timings based upon software control. See User’s Guide.
Note: 1. Device address consists of signals IDECS0n, IDECS1n and IDEDA (2:0)
2. Data consists of DD (15:0)
3. The negation of IORDY by the device is used to extend the register transfer cycle. The determination of whether the cycle is
to be extended is made by the host after t
are described in the following three cases:
3-1 Device never negates IORDY, devices keeps IORDY released: no wait is generated.
3-2 Device negates IORDY before t
and may be asserted for no more than t
3-3 Device negates IORDY before t
before release: wait generated. The cycle completes after IORDY is reasserted. For cycles where a wait is generated
and DIORn is asserted, the device shall place read data on DD (15:0) for t
Figure 20. PIO Data Transfer to/from Device
from the assertion of DIORn or DIOWn. The assertion and negation or IORDY
A
, but causes IORDY to be asserted before tA. IORDY is released prior to negation
A
A
before release: no wait generated.
C
. IORDY is released prior to negation and may be asserted for no more than t
Figure 21 through Figure 30 define the timings associated with all phases of Ultra DMA bursts. The following table
contains the values for the timings for each of the Ultra DMA modes.
Timing reference levels = 1.5 V
ParameterSymbol
Cycle time allowing for asymmetry and clock variations
(from DSTROBE edge to DSTROBE edge)
Two-cycle time allowing for clock variations (from rising edge to next
rising edge or from falling edge to next falling edge of DSTROBE)
Cycle time allowing for asymmetry and clock variations
(from HSTROBE edge to HSTROBE edge)
Two-cycle time allowing for clock variations (from rising edge to next
rising edge or from falling edge to next falling edge of HSTROBE)
Data setup time at recipient (Read)
Data hold time at recipient (Read)
Data valid setup time at sender (Write)(Note 2)
(from data valid until STROBE edge)
Data valid hold time at sender (Write)(Note 2)
(from STROBE edge until data may become invalid)
First STROBE time (for device to first negate DSTROBE from STOP
during a data in burst)
Limited interlock time(Note 3)
Interlock time with minimum(Note 3)
Unlimited interlock time(Note 3)
Maximum time allowed for output drivers to release
(from asserted or negated)
Minimum delay time required for output
Drivers to assert or negate (from released)
Envelope time (from DMACKn to STOP and HDMARDYn during data in
burst initiation and from DMACKn to STOP during data out burst initiation)
Ready-to-final-STROBE time (no STROBE edges shall be sent this long
after negation of DMARDYn)
Ready-to-pause time
(that recipient shall wait to pause after negating DMARDYn)
Maximum time before releasing IORDY
Minimum time before driving STROBE(Note 4)
Setup and hold times for DMACKn (before assertion or negation)
Time from STROBE edge to negation of DMARQ or assertion of STOP
(when sender terminates a burst)
t
CYCRD
t
2CYCRD
t
CYCWR
t
2CYCWR
t
DS
t
DH
t
DVS
t
DVH
t
FS
t
LI
t
MLI
t
UI
t
AZ
t
ZAH
t
ZAD
t
ENV
t
RFS
t
RP
t
IORDYZ
t
ZIORDY
t
ACK
t
SS
Mode 0
(in ns)
Mode 1
(in ns)
Mode 2
(in ns)
Mode 3
(in ns)
min maxmin maxmin maxmin max
112-73-54-39-
230-154-115-86-
230-170-130-100-
460-340-260-200-
15-10-7-7-
8-8-8-8-
70-48-30-20-
6-6-6-6-
0230020001700130
0150015001500100
20-20-20-20-
0-0-0-0-
-10-10-10-10
20-20-20-20-
0-0-0-0-
2070207020702055
-75-70-60-60
160-125-100-100-
-20-20-20-20
0-0-0-0-
20-20-20-2050-50-50-50-
Note: 1. Timing parameters shall be measured at the connector of the sender or receiver to which the parameter applies.
2. The test load for t
DVS
and t
shall be a lumped capacitor load with no cable or receivers. Timing for t
DVH
DVS
and t
DVH
shall be
met for all capacitive loads from 15 to 40 pf where all signals have the same capacitive load value.
3. t
, t
and tLI indicate sender-to-recipient or recipient-to-sender interlocks, i.e., either sender or recipient is waiting for the
UI
MLI
other to respond with a signal before proceeding. t
time-out that has a defined minimum. t
4. t
may be greater than t
ZIORDY
ENV
is a limited time-out that has a defined maximum.
LI
since the device has a pull up on IORDYn giving it a known state when released.
is an unlimited interlock that has no maximum time value. t
TXCLK cycle time
TXCLK high time
TXCLK low time
TXCLK to signal transition delay time
TXCLK rise/fall time
RXCLK cycle time
RXCLK high time
RXCLK low time
RXDVAL / RXERR setup time
RXDVAL / RXERR hold time
RXCLK rise/fall time
MDC cycle time
MDC high time
MDC low time
MDC rise/fall time
MDIO setup time (STA sourced)
MDIO hold time (STA sourced)
MDC to MDIO signal transition delay time
(PHY sourced)
t
TX_per
t
TX_high
t
TX_low
t
TXd
t
TXrf
t
RX_per
t
RX_high
t
RX_low
t
RXs
t
RXh
t
RXrf
t
MDC_per
t
MDC_high
t
MDC_low
t
MDCrf
t
MDIOs
t
MDIOh
t
MDIOd
EP9315
Enhanced Universal Platform SOC Processor
MinTypMax
10 Mbit
mode
100 Mbit
mode
10 Mbit
mode
100 Mbit
mode
10 Mbit
mode
100 Mbit
mode
--40040--ns
140142002026026ns
140142002026026ns
0010102525ns
----55ns
--40040--ns
140142002026026ns
140142002026026ns
1010----ns
1010----ns
----55ns
--400400--ns
160160----ns
160160----ns
----55ns
1010----ns
1010----ns
----300300ns
Unit
STA - Station - Any device that contains an IEEE 802.11 conforming Medium Access Control (MAC) and physical layer
(PHY) interface to the wireless medium.
The following table contains the values for the timings of each of the SPI modes.
ParameterSymbolMinTypMaxUnit
SCLK cycle time
SCLK high time
SCLK low time
SCLK rise/fall time
Data from master valid delay time
Data from master setup time
Data from master hold time
Data from slave setup time
Data from slave hold time
SCLK cycle time
SCLK high time
SCLK low time
SCLK rise/fall time
SCLK to LRCLK assert delay time
Hold between SCLK assert then LRCLK deassert
or
Hold between LRCLK deassert then SCLK assert
SDI to SCLK deassert setup time
SDI from SCLK deassert hold time
SCLK assert to SDO delay time
SDO from SCLK assert hold time
ABITCLK input cycle time
ABITCLK input high time
ABITCLK input low time
ABITCLK input rise/fall time
ASDI setup to ABITCLK falling
ASDI hold after ABITCLK falling
ASDI input rise/fall time
ABITCLK rising to ASDO / ASYNC valid, C
ASYNC / ASDO rise/fall time, C
t
= 55 pFt
L
t
clk_hightclk_low
clk_per
= 55 pFt
L
Enhanced Universal Platform SOC Processor
t
clk_per
t
clk_high
t
clk_low
t
clkrf
t
s
t
h
t
rfin
co
rfout
-81.4-ns
36-45ns
36-45ns
2-6ns
10--ns
10--ns
2-6ns
2-15ns
2-6ns
EP9315
ABITCLK
ASDI
ASDO
ASYNC
t
clkrf
t
clkrf
t
co
t
rfout
Figure 36. AC ‘97 Configuration Timing Measurement
TCK clock period
TCK clock high time
TCK clock low time
TMS / TDI to clock rising setup time
Clock rising to TMS / TDI hold time
JTAG port clock to output
JTAG port high impedance to valid output
JTAG port valid output to high impedance
2. Primary Datum C and seating plane are defined by the spherical crowns of the solder balls.
3. Dimension b is measured at the maximum solder ball diameter, parallel to Primary Datum C.
4. There shall be a minimum clearance of 0.25 mm between the edge of the solder ball and the body edge.
5. Reference Document: JEDEC MO-151, BAL-2
352 Pin BGA Pinout (Bottom View)
The following table shows the 352 pin BGA pinout. (For better understanding, compare the coordinates on the x and y
axis on Figure 40, "352 PIN BGA PINOUT", on page 57 with Figure 40, "352 Pin PBGA Pin Diagram", on page 55.
• VDD_core is CVDD.
• VDD_ring is RVDD.
• All core and ring grounds are connected together and are labelled GND.
• Other special power requirements are clearly labelled (i.e. H18=ADC_VDD and H19=ADC_GND).
The following section focuses on the EP9315 pin signals
from two viewpoints - the pin usage and pad
characteristics, and the pin m ultiplexing usage. The first
table (Table S) is a summary of all the EP9315 pin
signals. The second table (Table T) illustrates the pin
signal multiplexing and configuration options.
Ta b l e S is a summary of the EP9315 pin signals, which
illustrates the pad type and pad pull type (if any). The
symbols used in the table are defined as follo ws. (Note: A
blank box means Not Applicable (NA) or, for Pull Type,
No Pull (NP).)
.
Pin NameBlock
TCKJTAGIPD JTAG clock in
TDIJTAGIPD JTAG data in
TDOJTAG4maJTAG data out
TMSJTAGIPD JTAG test mode select
TRSTnJTAGIPD JTAG reset
BOOT[1:0]SystemIPD Boot mode select in
XTALIPLLAMain oscillator input
XTALOPLLAMain oscillator output
VDD_PLLPLLPMain oscillator power, 1.8V
GND_PLLPLLGMain oscillator ground
RTCXTALIRTCARTC oscillator input
RTCXTALORTCARTC oscillator output
WRnE BUS4maSRAM Write strobe out
RDnEBUS4maSRAM Read / OE strobe out
WAITnEBUSIPU SRAM Wait in
AD[25:0]EBUS8maShared Address bus out
DA[31:0]EBUS8maPU Shared Data bus in/out
CSn[3:0]EBUS4maPU Chip select out
CSn[7:6]EBUS4maPU Chip select out
DQMn[3:0]EBUS8maShared data mask out
SDCLKSDRAM8maSDRAM clock out
SDCLKENSDRAM8maSDRAM clock enable out
SDCSn[3:0]SDRAM4maSDRAM chip selects out
RASnSDRAM8maSDRAM RAS out
CASnSDRAM8maSDRAM CAS out
SDWEnSDRAM8maSDRAM write enable out
P[17:0]Raster4maPU Pixel data bus out
Table S. Pin Descriptions
Pad
Pull
Type
Type
Description
Under the Pad Type column:
•A - Analog pad
•P - Power pad
•G - Ground pad
•I - Pin is an input only
•I/O - Pin is input/output
•4mA - Pin is a 4 mA output driver
•8mA - Pin is an 8 mA output driver
•12mA - Pin is an 12 mA output driver
See the text description for additional information about
bi-directional pins.
Under the Pull Type Column:
•PU - Resistor is a pull up to the RVDD supply
•PD - Resistor is a pull down to the RGND supply
Table S. Pin Descriptions (Continued)
Pad
Pin NameBlock
SPCLKRaster12maPU Pixel clock in/out
HSYNCRaster8maPU Horizontal synchronization / line pulse out
V_CSYNCRaster8maPU
BLANKRaster8maPU Composite blanking signal out
BRIGHTRaster4maPWM brightness control out
PWMOUTPWM8maPulse width modulator output
Xp, XmADCATouchscreen ADC X axis
Yp, YmADCATouchscreen ADC Y axis
sXp, sXmADCATouchscreen ADC X axis feedback
sYp, sYmADCATouchscreen ADC Y axis feedback
VDD_ADCADCPTouchscreen ADC power, 3.3V
GND_ADCADCGTouchscreen ADC ground
COL[7:0]Key8maPU Key matrix column inputs
ROW[7:0]Key8maPU Key matrix row outputs
USBp[2:0]USBAUSB positive signals
USBm[2:0]USBAUSB negative signals
TXD0UART14maTransmit out
RXD0UART1IPU Receive in
CTSnUART1IPU Clear to send / transmit enable
DSRnUART1IPU Data set ready / Data Carrier Detect
DTRnUART14maData Terminal Ready output
RTSnUART14maReady to send
TXD1UART24maTransmit / IrDA output
RXD1UART2IPU Receive / IrDA input
TXD2UART34maTransmit
RXD2UART3IPU Receive
MDCEMAC4maManagement data clock
Type
Pull
Type
Vertical or composite synchronization / frame
pulse out
MDIOEMAC4maPU Management data input/output
RXCLKEMACIPD Receive clock in
MIIRXD[3:0]EMACIPD Receive data in
RXDVALEMACIPD Receive data valid
RXERREMACIPD Receive data error
TXCLKEMACIPU Transmit clock in
MIITXD[3:0]EMACIPD Transmit data out
TXENEMAC4maPD Transmit enable
TXERREMAC4maPD Transmit error
CRSEMACIPD Carrier sense
CLDEMACIPU Collision detect
GRLEDLED12maGreen LED
RDLEDLED12maRed LED
EECLKEEPROM4maPU EEPROM / Two-wire Interface clock
EEDATEEPROM4maPU EEPROM / Two-wire Interface data
ABITCLKAC978maPD AC97 bit clock
ASYNCAC978maPD AC97 frame sync
ASDIAC97IPD AC97 Primary input
ASDOAC 978maPU AC97 output
ARSTnAC978maAC97 reset
SCLK1SPI18maPD SPI bit clock
SFRM1SPI18maPD SPI Frame Clock
SSPRX1SPI1IPD SPI input
SSPTX1SPI18maSPI output
INT[3:0]INTIPD External interrupts
PRSTnSysconIPU Power on reset
RSTOnSyscon4maUser Reset in out - open drain
SLA[1:0]EEPROM4maFlash programming voltage control
VS1PCMCIAIPU Volta ge sense
VS2PCMCIAIPU Volta ge sense
MCD1PCMCIAIPU Card detect
MCD2PCMCIAIPU Card detect
MCBVD1PCMCIAIPU Voltage detection / status change
MCBVD2PCMCIAIPU Voltage detection
MCDIRPCMCIA4maData transceiver direction control
MCDAENnPCMCIA4maData bus transceiver enable
MCADENnPCMCIA4maAddress bus transceiver enable
MCREGnPCMCIA4maPU Memory card register
MCEHnPCMCIA4maPU Memory card high byte select
MCELnPCMCIA4maPU Memory card low byte select
IORDnPCMCIA4maPU I/O card read
IOWRnPCMCIA4maPU I/O card write
MCRDnPCMCIA4maPU Memory card read
MCWRnPCMCIA4maPU Memory card write
READYPCMCIAIPU Ready / interrupt
WPPCMCIAIPU Write protect
MCWAITnPCMCIAIPU Wait Input
MCRESETnPCMCIA4maCard reset
Type
Pull
Type
Description
Table S. Pin Descriptions (Continued)
Pad
Pin NameBlock
EGPIO[15:0]GPIOI/O, 4 ma PU Enhanced GPIO
DD[15:8]IDE8maPU IDE data bus
DD7IDE8maPD IDE data bus
DD[6:0]IDE8maPU IDE data bus
IDEDA[2:0]IDE8maIDE Device address output
IDECS0nIDE8maIDE Chip Select 0 output
IDECS1nIDE8maIDE Chip Select 1 output
DIORnIDE8maIDE Read strobe output
DIOWnIDE8maIDE Write strobe output
DMACKnIDE8maIDE DMA acknowledge output
IORDYIDEIPU IDE ready input
CVDDPowerPDigital power, 1.8V
RVDDPowerPDigital power, 3.3V
CGNDGroundGDigital ground
RGNDGroundGDigital ground
°C to +70°C352-pin PBGA
°C to +70°C352-pin PBGALead Free
°C to +85°C352-pin PBGA
°C to +85°C352-pin PBGALead Free
EP9315 — CBZ
Lead Material:
Z = Lead Free
Part Number
Product Line:
Embedded Processor
Note: Go to the Cirrus Logic Internet site at http://www.cirrus.com to find contact information for your local sales representative.
Package Ty pe:
B = 352-Ball, Plastic Ball Grid Array (27 mm x 27 mm)
Temperature Range:
C = Commercial Version
E = Extended Operating Version
I = Industrial Operating Version
Contacting Cirrus Logic Support
For all product questions and inquiries contact a Cirrus Logic Sales Representative.
To find one nearest you go to www.cirrus.com
IMPORTANT NOTICE
"Preliminary" product information describes products that are in production, but for which full characterization data is not yet available. Cirrus Logic, Inc. and its subsidiaries
("Cirrus") believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided "AS
IS" without warranty of any kind (express or implied). Customers are advised to obtain the latest versio n o f re levant information to verify, before placing orde rs, th at information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including
those pertaining to warranty, indemn ification, and limitation of liability. No resp onsibility is assumed by Cirrus for the use of this information, including use of this information
as the basis for manufac ture or s ale of an y it ems, o r for inf ri ngement of pa te nts o r oth er r ight s of thi rd p arti es. This docume nt i s t he pr oper ty o f Cir rus a nd by fur nis hin g
this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or other intellectual property rights.
Cirrus owns the copyrights associated with the infor mation contained herein and gives consent for copies to be made of the information only for use within your organization
with respect to Cirrus integrated circuits or other products of Cirrus. This consent does not extend to other copying such as copying for general distribution, advertising or
promotional purposes, or for creating any work for resale.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERT Y
OR ENVIRONMENTAL DAMAGE ("CRITICAL APP LICATIONS"). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN AIRCRAFT SYSTEMS, MILITARY APPLICATIONS, PRODUCTS SURGICALLY IMPLANTED INTO THE BODY, AUTOMOTIVE SAFETY OR SECURITY DEVICES, LIFE
SUPPORT PRODUCTS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY
AT THE CUSTOMER'S RISK AND CIRRUS DISCLAIMS AND MAKES NO WAR RANTY, EXPRESS, STATUTORY OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR PARTICULAR PURPOSE, WITH REGARD TO ANY CIRRUS PRODUCT THAT IS USED IN SUCH A MANNER. IF
THE CUSTOMER OR CUSTOMER'S CUSTOMER USES OR PERMITS THE USE OF CIRRUS PRODUCTS IN CRITICAL APPLICATIONS, CUSTOMER AGREES, BY
SUCH USE, TO FULLY INDEMNIFY CIRRUS, ITS OFFICERS, DIRECTORS, EMPLOYEES, DISTRIBUTORS AND OTHER AGENTS FROM ANY AND ALL LIABILITY,
INCLUDING ATTORNEYS' FEES AND COST S, THA T MA Y RE SULT FROM OR ARISE IN CONNECTION WITH THESE US ES .
Cirrus Logic, Cirrus, MaverickCrunch, MaverickKey, and th e Cirru s Logic logo d esigns a re tradem ar ks of Cirrus Log ic, Inc. All other brand and product names in this document may be trademarks or service marks of their respective owners.
Microsoft and Windows are registered trademarks of Microsoft Corporation.
Microwire is a trademark of National Semiconductor Corp. National Semiconductor is a registered trademark of National Semiconductor Corp.
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Motorola and SPI are registered tradema rk s of Moto ro la , Inc .
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