l Super on-chip Integration for low cost and low count bill of
materials
l 32-Bit RISC Processor performs audio decode and system
management functions
l 16-bit DSP for audio special effects
l 80 Kbytes internal SRAM, and 256 Kbytes internal ROM
l Interfaces to external SDRAM or EDO DRAM (for shock
protection), and to external ROM/FLASH (for custom
program storage)
l CD serial interface with advanced pattern matching and
software error handling
l Integrated DAC functionality
l Simultaneous 4 channels PCM audio output and IEC-958
output.
l Large number of GPIO pins for servo control, key scan, LCD
control, etc.
l Three serial control/status ports
l Sophisticated clock management and low power
consumption
l Supports ISO9660 and multi-session write methods
l Low power 0.18 micron technology
l 100-pin MQFP package
l 100-pin LQFP package
Description
The CS7410 is a true system-on-a-chip for the CDbased digital audio market. With a powerful RISC processor, one DSP, integrated audio ∆Σ modulator, large
internal SRAM and program ROM, and glueless interface to popular CD chip sets, the CS7410 is a complete
single chip low-power programmable audio decoder.
This powerful architecture is easily capable of MP3,
WMA, and other future audio formats. The CS7410’s
flexible architecture and low power consumption make it
an ideal low-cost solution for a wide range of player applications. For portable audio systems, the memory
interface can be used to add DRAM or SRAM for Electronic Shock Protection (ESP). A flexible set of interfaces
are available for end-user I/O such as a keypad and LCD
control for use in mass market CD players, boom boxes,
and shelf-top systems.
ORDERING INFORMATION
CS7410-CM0° to 70° C100-pin MQFP
CS7410-CQ0° to 70° C100-pin LQFP
IMPORTANT NOTICE
“Preliminary” product information describes products that are in production, but for which full characterization data is not yet available. “Advance” product infor-
mation describes products that are in development and subject to development changes. Cirrus Logic, Inc. and its subsidiaries (“Cirrus”) believe that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty
of any kind (express or implied). Customers are advised to obtain the latest version of relevant information to verify, before placing orders, that information being
relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement, and limitation of liability. No responsibility is assumed by Cirrus for the use of this information, including use of this
information as the basis for manufacture or sale of any items, or for infringement of patents or other rights of third parties. This document is the property of Cirrus
and by furnishing this information, Cirrus grants no license, express or implied under any patents, mask work rights, copyrights, trademarks, trade secrets or
other intellectual property rights. Cirrus owns the copyrights of the information contained herein and gives consent for copies to be made of the information only
for use within your organization with respect to Cirrus integrated circuits or other parts of Cirrus. This consent does not extend to other copying such as copying
for general distribution, advertising or promotional purposes, or for creating any work for resale.
An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the “Foreign Exchange and Foreign Trade Law” is to be exported or taken out of Japan. An export license and/or quota needs to be
obtained from the competent authorities of the Chinese Government if any of the products or technologies described in this material is subject to the PRC Foreign
Trade Law and is to be exported or taken out of the PRC.
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE
PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). CIRRUS PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF CIRRUS PRODUCTS
IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK.
Cirrus Logic, Cirrus, and the Cirrus Logic logo designs are trademarks of Cirrus Logic, Inc. All other brand and product names in this document may be trademarks or service marks of their respective owners.
Table 15. CD Interface.................................................................................................................. 34
DS553PP13
CS7410
Table 16. Dedicated General Purpose I/O Pins............................................................................35
Table 17. Redefined General Purpose Pins..................................................................................35
Table 18. Power and Ground........................................................................................................36
4DS553PP1
1. CHARACTERISTICS AND SPECIFICATIONS
1.1AC AND DC PARAMETRIC SPECIFICATIONS
(AGND, DGND=0V, all voltages with respect to 0V)
1.1.1Absolute Maximum Rating
SymbolDescriptionMin.Max.Unit
CS7410
VDD
VDD
V
I
I
I
I
O
T
SOL
T
VSOL
T
STOR
T
AMB
P
TOT
IO
CORE
Power Supply Voltage on I/O ring-0.54.6Volts
Power Supply Voltage on core logic and PLL -0.52.5Volts
Digital Input Applied Voltage (power applied)-0.55.5Volts
Digital Input Forced Current-1010mA
Digital Output Forced Current-5050mA
Lead Soldering Temperature260
Vapor Phase Soldering Temperature235
Storage Temperature (no power applied)-40125
Ambient Temperature (power applied)070
o
C
o
C
o
C
o
C
Power consumption1W
CAUTION: Operating beyond these Minimum and Maximum limits can result in permanent damage to
the device. Cirrus Logic recommends that CS7410 devices operate at the settings described in the next table.
1.1.2RECOMMENDED OPERATING CONDITIONS
ParameterSymbolMinTypMaxUnits
Supply Voltage, IOV
Supply Voltage, core and PLLV
Ambient Temperature (power applied)T
DR_CKO Period22ns
Output Delay from DR_CKO active edge19ns
M_D[15:0] delay from DR_CKO19ns
M_D[15:0] valid time after DR_CKO5ns
M_D[15:0] setup to DR_CKO13ns
M_D[15:0] hold time after DR_CKO0ns
Table 1. SDRAM Characterization Data
CS7410
DR_CKO
M_WE_L
M_A
DR_RAS_L
DR_CAS_L
M_D
(write)
M_D
(read)
t
msur
t
mper
t
mco
t
mdow
t
mhr
Figure 1. SDRAM Timing
t
mhw
DS553PP17
DR_CKO
DR_RAS_L
DR_CAS_L
M_A
M_D
M_WE_L
CS7410
Figure 2. SDRAM Load Mode
8DS553PP1
DR_CKO
DR_RAS_L
DR_CAS_L
CS7410
M_A
M_D
M_WE_L
DR_CKO
DR_RAS_L
ADRAS
ADCAS
D0
Figure 3. SDRAM Burst Write
Dn...D1
DR_CAS_L
M_A
M_D
M_WE_L
ADRASADCAS
D1Dn...D2
Figure 4. SDRAM Burst Read
DS553PP19
DR_CKO
DR_RAS_L
DR_CAS_L
M_A
M_D
M_WE_L
CS7410
Figure 5. SDRAM Refresh
10DS553PP1
1.1.4.2Serial Interface
SymbolDescriptionMinTypMaxUnit
t
clk_per
t
DMs
t
DMh
t
DSs
t
CMs
t
DSh
SER2_CLK
(CPOL=0)
SER2_CLK
(CPOL=1)
Clock period66ns
Master-mode data setup28ns
Master-mode data hold28ns
Slave-mode data setup15ns
Master chip select to clock setup28ns
Slave mode data hold0ns
t
CMs
Table 2. Serial Interface Characterization Data
t
clk_per
CS7410
SER2_DO
(master)
SER2_DI
(slave)
SER2_CS
t
DMs
t
DSs
MSBLSB
t
t
DMh
DSh
Figure 6. Serial Interface Timing Diagram
LSBMSB
DS553PP111
1.1.4.3EDO DRAM interface
SymbolDescriptionMinTypMaxUnit
t
RAS
t
RP
t
RCL
t
CAS
t
CPN
t
CAH
t
ASR
t
RAH
t
ASC
t
AA
t
CAC
t
CSR
t
CHR
t
CRH
t
WDS
t
WDH
t
WS
t
WH
t
ROE
t
OER
t
DCH
RAS low time72ns
RAS high pulse time40ns
RAS fall to CAS fall38ns
CAS low time30ns
CAS high time15ns
CAS fall to address row29ns
Address row to RAS fall10ns
RAS fall to address column18ns
second address column (burst) to CAS fall 10ns
Column address to data setup35ns
CAS fall to data setup17ns
CAS fall to RAS fall19ns
RAS fall to CAS rise18ns
CAS rise to RAS rise6ns
Write data setup to CAS fall12ns
Write data hold to CAS fall29ns
Write enable setup to CAS fall13ns
Write enable hold to CAS fall20ns
RAS fall to OE fall-55ns
RAS rise to OE rise-55ns
Read data hold to CAS rise0ns
CS7410
Table 3. EDO DRAM Characterization Data
Note:Values shown are for minimum internal clock period (11ns) and all programmed wait states enabled.
12DS553PP1
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