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Page 2
VS-SA61BA60
SOT-227
www.vishay.com
Vishay Semiconductors
Single Phase Fast Recovery Bridge (Power Modules), 61 A
FEATURES
• Fast recovery time characteristic
• Electrically isolated base plate
• Simplified mechanical designs, rapid assembly
• UL pending
• Excellent power/volume ratio
• Compliant to RoHS Directive 2011/65/EU
• Designed and qualified for industrial and consumer level
PRODUCT SUMMARY
I
T(AV)
TypeModules - Bridge, Fast
61 A
DESCRIPTION
The semiconductor in the SOT-227 package is isolated from
the copper base plate, allowing for common heatsinks and
compact assemblies to be built.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOLCHARACTERISTICSVALUESUNITS
I
O
I
FSM
2
I
V
T
t
RRM
J
T
C
50 Hz300
60 Hz310
50 Hz442
60 Hz402
61A
57°C
A
A2s
600V
- 55 to 150°C
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
V
, MAXIMUM
TYPE NUMBER
SA61BA606060070010
VOLTAGE
CODE
RRM
REPETITIVE PEAK
REVERSE VOLTAGE
V
V
, MAXIMUM
RSM
NON-REPETITIVE PEAK
REVERSE VOLTAGE
V
I
RRM
AT T
MAXIMUM
MAXIMUM
J
mA
Revision: 29-Feb-12
1
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 94688
Page 3
VS-SA61BA60
I
FM
t
rr
dI
R
dt
I
RM(REC)
Q
rr
t
www.vishay.com
FORWARD CONDUCTION
PARAMETERSYMBOLTEST CONDITIONS VALUESUNITS
Maximum DC output current
at case temperature
Maximum peak, one-cycle
non-repetitive forward current
Maximum I
Maximum I
2
t for fusingI2t
2
t for fusingI2tI2t for time tx = I2t x tx0.1 tx 10 ms, V
Value of threshold voltageV
Forward slope resistancer
Maximum forward voltage dropV
RMS isolation voltage base plateV
I
I
FSM
F(TO)
O
FM
INS
Resistive or inductive load61A
t = 10 ms
t = 8.3 ms310
t = 10 ms
t = 8.3 ms260
t = 10 ms
t = 8.3 ms402
t = 10 ms
t = 8.3 ms284
No voltage
reapplied
100 % V
RRM
reapplied
No voltage
reapplied
100 % V
RRM
reapplied
Initial T
T
maximum
J
TJ maximum
t
TJ = 25 °C, IFM = 30 A
= TJ maximum, IFM = 30 A
J
pk
tp = 400 μs
pk
f = 50 Hz, t = 1 s3000
Vishay Semiconductors
57°C
300
250
=
J
442
313
= 0 V4.4kA2s
RRM
0.914V
10.5m
1.33
1.23
A
A2s
VT
RECOVERY CHARACTERISTICS
PARAMETER
Reverse recovery time, typicalt
Reverse recovery current,
typical
Reverse recovery charge,
typical
Snap factor, typicalST
Junction capacitance, typicalC
SYMB
OL
rr
I
rr
Q
rr
T
TEST CONDITIONS VALUESUNITS
TJ = 25 °C, IF = 20 A, VR = 30 V,
/dt = 100 A/μs
dI
F
= 125 °C, IF = 20 A, VR = 30 V,
T
J
dI
/dt = 100 A/μs
F
TJ = 25 °C, IF = 20 A, VR = 30 V,
dI
/dt = 100 A/μs
F
= 125 °C, IF = 20 A, VR = 30 V,
T
J
/dt = 100 A/μs
dI
F
TJ = 25 °C, IF = 20 A, VR = 30 V,
dI
/dt = 100 A/μs
F
= 125 °C, IF = 20 A, VR = 30 V,
T
J
dI
/dt = 100 A/μs
F
= 25 °C0.6-
J
170
ns
250
10.5
16
900
nC
1970
VR = 600 V67pF
A
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETERSYMBOLTEST CONDITIONS VALUESUNITS
Junction and storage
temperature range
Maximum thermal resistance
junction to case per bridge
Typical thermal resistance,
case to heatsink per module
Approximate weight30g
Mounting torque ± 10 %Bridge to heatsink1.3Nm
Case styleSOT-227
Revision: 29-Feb-12
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T
J
R
, T
thJC
Stg
- 55 to 150°C
0.30
°C/W
R
thCS
Mounting surface, smooth, flat and greased0.05
2
Document Number: 94688
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Page 4
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I
F(AV) -
Average Forward Current (A)
Allowable Case Temperature (°C)
40
50
60
70
80
90
100
110
120
130
140
150
0 10 20 30 40 50 60 70
180˚
(Rect)
180˚
(Sine)
VS-SA61BA60
Vishay Semiconductors
1000
100
- Instantaneous Forward Current (A)
F
I
10
TJ = 150 °C
1
00.511.522.533.5
V
Forward Voltage Drop (V)
FM -
T
= 25 °C
T
J
= 125 °C
J
Fig. 1 - Typical Forward Voltage Drop Characteristics
10 000
TJ = 150 °C
1000
100
10
TJ = 125 °C
T
= 25 °C
J
220
200
180
160
140
120
100
80
60
40
Average Power Loss (W)
20
0
0 10 20 30 40 50 60
I
F(AV) -
Fig. 4 - Current Rating Characteristics
180˚
(Sine)
180˚
(Rect)
Average Forward Current (A)
1
- Reverse Current (μA)
R
I
0.1
0100200300400500600
VR - Reverse Voltage (V)
Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
1000
100
Junction Capacitance (pF)
-
T
C
10
101001000
VR - Reverse Voltage (V)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Revision: 29-Feb-12
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 5 - Forward Power Loss Characteristics
3
Document Number: 94688
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Page 5
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t
rr
(ns)
dIF/dt (A/μs)
50
100
150
200
250
300
1001000
IF = 30 A
I
F
= 20 A
I
F
= 10 A
VR = 30 V
125 °C
25 °C
10
1
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
0.1
Thermal Impedance (°C/W)
-
thJC
Z
0 .01
D = 0.01
Single Pulse
(Thermal Resistance)
0.00001 0.0001 0.001 0.01 0.1 1
Notes:
1. Duty factor D = t
2. Peak T
tp - Square Wave Pulse Duration (μs)
Fig. 6 - Typical Forward Voltage Drop Characteristics
V
R
35
= 30 V
P
DM
= Pdm x Z
J
VS-SA61BA60
Vishay Semiconductors
t
1
t
2
/ t2
1
+ Tc
thJC
IF = 30 A
I
= 20 A
F
Fig. 7 - Typical Reverse Recovery Time vs. dI
4000
V
= 30 V
R
3500
3000
2500
(nC)
2000
rr
Q
125 °C
1500
1000
500
1001000
= 10 A
I
F
I
= 20 A
F
dIF/dt (A/μs)
Fig. 8 - Typical Stored Charge vs. dI
I
= 30 A
F
25 °C
/dt
F
25
(A)
RR
I
125 °C
15
= 10 A
I
25 °C
5
1001000
F
dIF/dt (A/μs)
/dt
F
Fig. 9 - Typical Reverse Recovery Current vs. dI
F
/dt
Revision: 29-Feb-12
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4
Document Number: 94688
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Page 6
www.vishay.com
IRFP250
D.U.T.
L = 70 μH
V
R
= 200 V
0.01 Ω
G
D
S
dIF/dt
adjust
Q
rr
0.5 I
RRM
dI
(rec)M
/dt
0.75 I
RRM
I
RRM
t
rr
t
b
t
a
I
F
dIF/dt
0
(1)
(2)
(3)
(4)
(5)
(1) dI
F
/dt - rate of change of current
through zero crossing
(2) I
RRM
- peak reverse recovery current
(3) t
rr
- reverse recovery time measured
from zero crossing point of negative
going I
F
to point where a line passing
through 0.75 I
RRM
and 0.50 I
RRM
extrapolated to zero current.
(4) Q
rr
- area under curve dened by t
rr
and I
RRM
trr x I
RRM
2
Q
rr
=
(5) dI
(rec)M
/dt - peak rate of change of
current during t
b
portion of t
rr
VS-SA61BA60
Vishay Semiconductors
Fig. 10 - Reverse Recovery Parameter Test Circuit
Revision: 29-Feb-12
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Fig. 11 - Reverse Recovery Waveform and Definitions
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
5
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Document Number: 94688
Page 7
www.vishay.com
ORDERING INFORMATION TABLE
VS-SA61BA60
Vishay Semiconductors
Device code
SVS-A61BA60
5132467
-Vishay Semiconductors product
1
-S = Fast recovery diode
2
-A = Present Silicon Generation
3
-Current rating (61 = 61 A)
4
-Circuit configuration:
5
B = Single phase bridge
-Package indicator:
6
A = SOT-227, standard insulated base
-Voltage rating (60 = 600 V)
7
CIRCUIT CONFIGURATION
CIRCUITCIRCUIT CONFIGURATION CODECIRCUIT DRAWING
2
Single phase bridgeB
~
4
1
+
Revision: 29-Feb-12
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
6
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 94688
-
3
Page 8
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Revision: 12-Mar-12
1
Document Number: 91000
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