C&H Technology VSKE91 User Manual

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VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

ADD-A-PAK

ADD-A-PAK Generation VII

Power Modules Standard Diodes, 100 A

PRODUCT SUMMARY

I

F(AV)

Type Modules - Diode, High Voltage

MECHANICAL DESCRIPTION

The ADD-A-PAK generation VII, new generation of
ADD-A-PAK module, combines the excellent thermal
performances obtained by the usage of exposed direct
bonded copper substrate, with advanced compact simple
package solution and simplified internal structure with
minimized number of interfaces.

100 A

Vishay Semiconductors

FEATURES

• High voltage

• Industrial standard package

• UL approved file E78996

• Low thermal resistance

• Compliant to RoHS Directive 2002/95/EC

• Designed and qualified for industrial level

BENEFITS

• Excellent thermal performances obtained by the usage of
exposed direct bonded copper substrate

• Up to 1600 V

• High surge capability

• Easy mounting on heatsink

ELECTRICAL DESCRIPTION

These modules are intended for general purpose high
voltage applications such as high voltage regulated power
supplies, lighting circuits, temperature and motor speed
control circuits, UPS and battery charger.

MAJOR RATINGS AND CHARACTERISTICS

SYMBOL CHARACTERISTICS VALUES UNITS

I

F(AV)

I

F(RMS)

I

FSM

2

I

t

2

I

t 204.1 kA2s

V

RRM

T

J

T

Stg

112 °C 100

157

50 Hz 2020

60 Hz 2115

50 Hz 20.41

60 Hz 18.63

Range 400 to 1600 V

- 40 to 150 °C

kA2s

A

Document Number: 94627 For technical questions, contact: [e-mail]
Revision: 09-Mar-11 1

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

This datasheet is subject to change without notice.

www.vishay.com/doc?91000

www.vishay.com

VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

Vishay Semiconductors

ADD-A-PAK Generation VII

Power Modules Standard Diodes, 100 A

ELECTRICAL SPECIFICATIONS

VOLTAGE RATINGS

V

, MAXIMUM REPETITIVE

TYPE NUMBER

VOLTAGE

CODE

RRM

PEAK REVERSE VOLTAGE

V

04 400 500

06 600 700

08 800 900

VSK.91

10 1000 1100

12 1200 1300

14 1400 1500

16 1600 1700

FORWARD CONDUCTION

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum average forward current
at case temperature

Maximum RMS forward current I

Maximum peak, one-cycle forward,
non-repetitive surge current

2

Maximum I

Maximum I

t for fusing I2t

2

t for fusing I2t t = 0.1 ms to 10 ms, no voltage reapplied 204.1 kA2s

Low level value of threshold voltage V

High level value of threshold voltage V

Low level value of forward
slope resistance

High level value of forward
slope resistance

Maximum forward voltage drop V

I

F(AV)

F(RMS)

I

FSM

F(TO)1

F(TO)2

r

f1

r

f2

FM

180° conduction, half sine wave

DC at 90 °C case temperature 157

t = 10 ms

t = 8.3 ms 2115

t = 10 ms

t = 8.3 ms 1780

t = 10 ms

t = 8.3 ms 18.63

t = 10 ms

t = 8.3 ms 13.18

(16.7 % x  x I
(I >  x I

(16.7 % x  x I

(I >  x I

IFM =  x I

No voltage
reapplied

100 % V
reapplied

No voltage
reapplied

100 % V
reapplied

< I <  x I

F(AV)

), TJ = TJ maximum 0.89

F(AV)

< I <  x I

F(AV)

), TJ = TJ maximum 2.05

F(AV)

, TJ = 25 °C, tp = 400 μs square wave 1.55 V

F(AV)

V

, MAXIMUM NON-REPETITIVE

RSM

PEAK REVERSE VOLTAGE

RRM

Sinusoidal half wave,
intitial T

RRM

), TJ = TJ maximum 0.76

F(AV)

), TJ = TJ maximum 2.4

F(AV)

V

= TJ maximum

J

I

MAXIMUM

RRM

AT T

= 150 °C

J

mA

10

100 A

112 °C

2000

1700

20.41

14.44

kA

m

A

2

s

V

BLOCKING

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum peak reverse
leakage current

Maximum RMS insulation voltage V

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I

RRM

TJ = 150 °C 10 mA

50 Hz

INS

This datasheet is subject to change without notice.

3000 (1 min)

3600 (1 s)

Document Number: 94627

www.vishay.com/doc?91000

V

VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

ADD-A-PAK Generation VII

Vishay Semiconductors

Power Modules Standard Diodes, 100 A

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Junction and storage temperature range T

Maximum internal thermal resistance,
junction to case per leg

Typical thermal resistance,
case to heatsink per module

Mounting torque ± 10 %

Approximate weight

Case style JEDEC ADD-A-PAK Gen. VII (TO-240AA)

to heatsink

busbar 3

R CONDUCTION PER JUNCTION

DEVICES

VSK.91 0.057 0.068 0.087 0.12 0.177 0.045 0.073 0.093 0.123 0.178 °C/W

Note

• Table shows the increment of thermal resistance R

SINE HALF WAVE CONDUCTION RECTANGULAR WAVE CONDUCTION

180° 120° 90° 60° 30° 180° 120° 90° 60° 30°

J

R

R

, T

thJC

thCS

Stg

DC operation 0.22

Mounting surface flat, smooth and greased 0.1

A mounting compound is recommended and the
torque should be rechecked after a period of
3 hours to allow for the spread of the compound.

when devices operate at different conduction angles than DC

thJC

- 40 to 150 °C

°C/W

4

Nm

75 g

2.7 oz.

UNITS

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Average forward current (A)

Maximum allowable case temperature (°C)

0 20406080100120

100

110

120

130

140

150

180°
120°

90°
60°
30°

RthJC (DC) = 0.22°C/W

Average forward current (A)

Maximum allowable case temperature (°C)

0 50 100 150 200

90

100

110

120

130

140

150

180°
120°

90°
60°
30°

RthJC (DC) = 0.22°C/W

DC

Average forward current (A)

Maximum average forward power loss (W)

020406080100120

0

20

40

60

80

100

120

140

160

180°
120°

90°
60°
30°

RMS limit

Per leg, Tj = 150°C

Average forward current (A)

Maximum average forward power loss (W)

0 20406080100120140160

0

20

40

60

80

100

120

140

160

180

200

180°
120°

90°
60°
30°

RMS limit

DC

Per leg, Tj = 150°C

Peak half sine wave forward current (A)

Number of equal amplitude half cycle current pulses (N)

110100

400

600

800

1000

1200

1400

1600

1800

At any rated load condition and with

rated Vrrm applied following surge

Initial T j = Tj max

@ 60 Hz 0.0083 s

@ 50 Hz 0.0100s

Per leg

VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

Vishay Semiconductors

Fig. 1 - Current Ratings Characteristics

ADD-A-PAK Generation VII

Power Modules Standard Diodes, 100 A

Fig. 4 - On-State Power Loss Characteristics

Fig. 2 - Current Ratings Characteristics

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Fig. 3 - Forward Power Loss Characteristics

Fig. 5 - Maximum Non-Repetitive Surge Current

2000

1800

Maximum Non-repetitive Surge Current

1600

1400

1200

1000

800

600

Per leg

400

Peak half sine wave forward current (A)

200

0.01 0.1 1

Fig. 6 - Maximum Non-Repetitive Surge Current

This datasheet is subject to change without notice.

Versus Pulse Train Duration

Initial T j = 150°C

No Voltage Reapplied

Rated Vrrm reapplied

Pulse train duration (s)

Document Number: 94627

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Total RMS output current (A)

Maximum total forward power loss (W)

Maximum allowable ambient temperature (°C)

0 20 40 60 80 100 120 140 160

RthSA = 0.1 °C/W

0.3 °C/W

0.5 °C/W

0.7 °C/W
1 °C/W

1.5 °C/W
3 °C/W

0 20406080100120140160

0

20

40

60

80

100

120

140

160

180

200

180°

(Sine)

VSK.91 Series

Per leg

Tj = 150°C

DC

Total output current (A)

Maximum total power loss (W)

0 20 40 60 80 100 120 140 160

RthSA = 0.2 °C/W

0.3 °C/W

0.4 °C/W

0.5 °C/W

0.7 °C/W
1 °C/W

1.5 °C/W
3 °C/W

Maximum allowable ambient temperature (°C)

0 50 100 150 200

0

100

200

300

400

500

600

700

180°

(sine)

180°
(rect)

2 x VSK.91 Series

single ph ase bridg e connect ed

Tj = 150°C

Total output current (A)

Maximum allowable ambient temperature (°C)

Maximum total power loss (W)

0 20 40 60 80 100 120 140 160

RthSA = 0.1 °C/W

0.2 °C/W

0.3 °C/W

0.5 °C/W

0.7 °C/W
1 °C/W
3 °C/W

0 50 100 150 200 250 300

0

100

200

300

400

500

600

700

800

900

120°

(rect)

3 x VSK.91 Series

three phase bridge connected

Tj = 150°C

VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

ADD-A-PAK Generation VII

Power Modules Standard Diodes, 100 A

Fig. 7 - Forward Power Loss Characteristics

Vishay Semiconductors

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Revision: 09-Mar-11 5

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Fig. 8 - Forward Power Loss Characteristics

Fig. 9 - Forward Power Loss Characteristics

This datasheet is subject to change without notice.

www.vishay.com

www.vishay.com/doc?91000

1 - Module type

2 - Circuit configuration (see Circuit Configuration table)

3

- Current code (100 A)

4 - Voltage code (see Voltage Ratings table)

Device code

4132

VSK D 91 / 16

VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

Vishay Semiconductors

1

(°C/W)

thJC

Steady state value
RthJC = 0.22 °C/W
(DC operation)

ADD-A-PAK Generation VII

Power Modules Standard Diodes, 100 A

1000

Per leg

100

10

Tj = 150°C

Instantaneous forward current (A)

1

0 0.51.01.52.02.53.0

Instantaneous forward voltage (V)

Fig. 10 - Forward Voltage Characteristics

Tj = 25°C

0.1

0.01

Transient thermal impedance Z

0.001 0.01 0.1 1 10

Fig. 11 - Thermal Impedance Z

ORDERING INFORMATION TABLE

Per leg

Square wave pulse duration (s)

Characteristics

thJC

Note

• To order the optional hardware go to www.vishay.com/doc?95172

www.vishay.com For technical questions, contact: [e-mail]
6 Revision: 09-Mar-11

THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

This datasheet is subject to change without notice.

Document Number: 94627

www.vishay.com/doc?91000

VSKD91.., VSKC91.., VSKJ91.., VSKE91.. Series

ADD-A-PAK Generation VII

Power Modules Standard Diodes, 100 A

CIRCUIT CONFIGURATION

CIRCUIT DESCRIPTION

Two diodes doubler circuit D

Two diodes common cathodes C

Two diodes common anodes J

CONFIGURATION CODE

CIRCUIT

Vishay Semiconductors

CIRCUIT DRAWING

VSKD...

~

(1) (3)(2)

2

1

VSKC...

+- -

(1)

2

1

VSKJ...

-

(1)

+

2

3

3

3

-+

(3)(2)

+

(3)(2)

1

VSKE...

Single diode E

2

1

LINKS TO RELATED DOCUMENTS

Dimensions www.vishay.com/doc?95369

3

-+
(3)(2)

Document Number: 94627 For technical questions, contact: [e-mail]
Revision: 09-Mar-11 7

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This datasheet is subject to change without notice.

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ADD-A-PAK Generation VII - Diode

DIMENSIONS in millimeters (inches)

Outline Dimensions

Vishay Semiconductors

Viti M5 x 0.8

Screws M5 x 0.8

18 (0.7) REF.

35 REF.

22.6 ± 0.2

30 ± 0.5

29 ± 0.5

(1 ± 0.020)

(1.18 ± 0.020)

(0.89 ± 0.008)

6.3 ± 0.2 (0.248 ± 0.008)

80 ± 0.3 (3.15 ± 0.012)

1

15 ± 0.5 (0.59 ± 0.020)

20 ± 0.5 (0.79 ± 0.020)

92 ± 0.75 (3.6 ± 0.030)

2

20 ± 0.5 (0.79 ± 0.020)

3

6.7 ± 0.3 (0.26 ± 0.012)

24 ± 0.5

(1 ± 0.020)

4 5 7 6

Document Number: 95369 For technical questions, contact: [e-mail]
Revision: 11-Nov-08 1

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Legal Disclaimer Notice

Vishay

Disclaimer

ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.

Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Document Number: 91000 www.vishay.com
Revision: 11-Mar-11 1

Document Number: 95043 For technical questions, contact: [e-mail]

www.chtechnology.com

Revision: 17-Dec-08 1

VISHAY HIGH POWER PRODUCTS

Modules

Application Note

Mounting Instructions for

ADD-A-PAK Generation VII

APPLICATION NOTE

Generation VII ADD-A-PAK (AAP) power modules combine
the excellent thermal performance enabled by a direct
bonded copper (Al

2O3

) substrate, superior mechanical
ruggedness, and an environmentally friendly manufacturing
process that eliminates the use of hard molds, thus reducing
direct stresses on the leads. To prevent axial pull-out, the
electrical terminals are co-molded to the module housing.

The VSK series of AAP modules uses glass passivated and
Schottky power diodes and thyristors in circuit configurations
including common anode, common cathode, half-bridge, and
single switch. The semiconductors are internally connected
through wire-bonding and electrically isolated from the
bottom baseplate, allowing the use of a common heatsink
and enabling a more compact overall assembly.

INTRODUCTION

Major AAP Generation VII module features

• High blocking voltage up to 1600 V

• Industrial standard package style, fully compatible with

TO-240AA

• High isolation capability up to V

RMS

= 3500 V

• High surge capability with I

FSM

up to 3000 A

• No toxic material: Completely lead (Pb)-free, RoHS and UL

compliant

• Elimination of copper base plate reduces weight to 75 g

• Elimination of process steps requiring usage of chemicals

and related waste treatment promotes a cleaner and more
environmentally friendly manufacturing process

These features allow AAP Generation VII modules to fit into
existing standardized assembly processes. Important factors
in the assembly process include

• Heatsink design

• PCB, busbar, and cable design

• Power leads size/area

• Distance from adjacent heat-generating parts

The implications of these items and the requirements for
assembly of AAP Generation VII modules are discussed
over the following pages.

SPECIFYING THE HEATSINK

The heat generated by the module has to be dissipated with
a heatsink. Typically natural or forced air cooling is used.

To optimize the device performance, the contact surface of
the heatsink must be flat, with a recommended flatness of
≤ 0.03 mm (≤ 1.18 mils) and a levelling depth of less than

0.02 mm (≤ 0.79 mils), according to DIN/ISO 1302. A milled
or machined surface is generally satisfactory if prepared with
tools in good working condition. The heatsink mounting
surface must be clean, with no dirt, corrosion, or surface
oxide. It is very important to keep the mounting surface free
from particles exceeding 0.05 mm (2 mils) in thickness,
provided a thermal compound is used.

MOUNTING OPERATIONS

The AAP Generation VII modules are designed with an
exposed DBC Al

2O3

substrate.

This is used to optimize the thermal behavior of the module.
To reduce the risk of damage during mounting, the ceramic
has been given additional mechanical ruggedness in the
form of two separate 15.8 mm by 21.1 mm (0.62" by 0.83")
pieces of DBC substrate, which can be seen in the photo
below.

Before mounting, inspect the module to insure that the
contact surface of the bottom substrate is clean and free of
any lumps or bulges that could damage the device or impede
heat transfer across its surface.

Mounting Instructions for

ADD-A-PAK Generation VII

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Document Number: 95043

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Application Note

Vishay High Power Products

APPLICATION NOTE

Next, make a uniform coating on the heatsink mounting
surfaces and module substrate with a good quality thermal
compound. Screen printing of the compound is
recommended, as well as direct application through a roller
or spatula. The datasheet values for thermal resistance
assume a uniform layer of thermal compound with a
maximum thickness of 0.08 mm. The thermal conductivity of
the compound should be no less than 0.5 W/mK. Apply
uniform pressure on the package to force the compound to
spread over the entire contact area, and check the device
bottom surface to verify full and uniform coverage.

Bolt the module to the heatsink using the two fixing holes.

An even amount of torque should be applied for each
individual mounting screw. An M6 screw should be used with
lock washers. A torque wrench, which is accurate in the
specified range, must be used in mounting the module to
achieve optimum results. The first mounting screw should be
tightened to one third of the recommended torque; the
second screw should then be tightened to the same torque.
Full tightening of both the screws can then be completed by
applying the recommended torque (see data in bulletins).
Over-tightening the mounting screw may lead to deformation
of the package, which would hence increase the thermal
resistance and damage the semiconductors. After a period of
three hours, check the torque with a final tightening in
opposite sequence to allow the spread of the compound.

Power terminals can be screwed to busbars and/or flexible
cables with eyelets.

We recommend the use of M5 screws with spring washers.
Users should consult published datasheets to determine the
optimal torque.

AAP Generation VII modules are designed to guarantee a
good and reliable contact even at 3 ± 10 % Nm on a busbar,
so there is no need to apply an especially high level of force
to obtain a good and reliable connection.

SOLDERING TO THE PCB

The signal terminal (gate and auxiliary cathode) pins of AAP
Gen VII modules based on thyristors can be soldered to the
PCB using hand iron or wave soldering processes.

The PCB should be designed with appropriate tolerances on
the hole diameters, and soldering must be done without
imposing any mechanical stress on the module pins (pulling
and tensioning the pins).

To prevent overheating of the device, the soldering time
should not exceed 8 to 10 seconds at a temperature of
260 °C.

Alternatively, a fast-on cable connector can be used to
contact the signal pins.