C&H Technology VSK71 User Manual

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ADD-A-PAK Generation VII Power Modules

ADD-A-PAK

PRODUCT SUMMARY

I

F(AV)

Vishay High Power Products

Standard Diodes, 80 A

FEATURES

• High voltage

• Industrial standard package

• UL pending

isolating voltage

RMS

80 A

• 3500 V

• Low thermal resistance

• Totally lead (Pb)-free

• Designed and qualified for industrial level

BENEFITS

• Excellent thermal performances obtained by the usage of
exposed direct bonded copper substrate

• Up to 1600 V

VSK.71.. Series

• High surge capability

MECHANICAL DESCRIPTION

• Easy mounting on heatsink

The ADD-A-PAK generation VII, new generation of
ADD-A-PAK module, combines the excellent thermal
performances obtained by the usage of exposed direct
bonded copper substrate, with advanced compact simple
package solution and simplified internal structure with
minimized number of interfaces.

ELECTRICAL DESCRIPTION

These modules are intended for general purpose high
voltage applications such as high voltage regulated power
supplies, lighting circuits, temperature and motor speed
control circuits, UPS and battery charger.

MAJOR RATINGS AND CHARACTERISTICS

SYMBOL CHARACTERISTICS VALUES UNITS

I

F(AV)

I

F(RMS)

I

FSM

2

I

t

2

I

√t 112.5 kA2√s

V

RRM

T

J

T

Stg

110 °C 80

126

50 Hz 1500

60 Hz 1570

50 Hz 11.25

60 Hz 10.26

Range 400 to 1600 V

- 40 to 150 °C

A

kA2s

Document Number: 94626 For technical questions, contact: [e-mail]
Revision: 17-Dec-08 1

www.vishay.com

VSK.71.. Series

Vishay High Power Products

ADD-A-PAK Generation VII Power Modules

Standard Diodes, 80 A

ELECTRICAL SPECIFICATIONS

VOLTAGE RATINGS

V

, MAXIMUM NON-REPETITIVE

RSM

PEAK REVERSE VOLTAGE

V

TYPE NUMBER

VOLTAGE

CODE

V

, MAXIMUM REPETITIVE

RRM

PEAK REVERSE VOLTAGE

V

04 400 500

06 600 700

08 800 900

VSK.71

10 1000 1100

12 1200 1300

14 1400 1500

16 1600 1700

FORWARD CONDUCTION

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum average forward current
at case temperature

Maximum RMS forward current I

Maximum peak, one-cycle forward,
non-repetitive surge current

2

Maximum I

Maximum I

t for fusing I2t

2

√t for fusing I2√t t = 0.1 ms to 10 ms, no voltage reapplied 112.5 kA2√s

Low level value of threshold voltage V

High level value of threshold voltage V

Low level value of forward
slope resistance

High level value of forward
slope resistance

Maximum forward voltage drop V

I

F(AV)

F(RMS)

I

FSM

F(TO)1

F(TO)2

r

f1

r

f2

FM

180° conduction, half sine wave

DC at 90 °C case temperature 126

t = 10 ms

t = 8.3 ms 1570

t = 10 ms

t = 8.3 ms 1320

t = 10 ms

t = 8.3 ms 10.26

t = 10 ms

t = 8.3 ms 7.23

(16.7 % x π x I
(I > π x I

(16.7 % x π x I

(I > π x I

IFM = π x I

No voltage
reapplied

100 % V

RRM

reapplied

No voltage

Sinusoidal half wave,

= TJ maximum

intitial T

J

reapplied

100 % V

RRM

reapplied

< I < π x I

F(AV)

), TJ = TJ maximum 0.83

F(AV)

< I < π x I

F(AV)

), TJ = TJ maximum 2.89

F(AV)

, TJ = 25 °C, tp = 400 µs square wave 1.6 V

F(AV)

), TJ = TJ maximum 0.73

F(AV)

), TJ = TJ maximum 3.22

F(AV)

80 A

110 °C

1500

1260

11.25

7.95

I

MAXIMUM

RRM

AT T

J

= 150 °C
mA

10

kA

mΩ

A

2

s

V

BLOCKING

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum peak reverse
leakage current

RMS insulation voltage V

www.vishay.com For technical questions, contact: [e-mail]
2 Revision: 17-Dec-08

I

RRM

TJ = 150 °C 10 mA

50 Hz, 1 s 3500 V

INS

Document Number: 94626

VSK.71.. Series

ADD-A-PAK Generation VII Power Modules

Vishay High Power Products

Standard Diodes, 80 A

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Junction and storage temperature range T

Maximum internal thermal resistance,
junction to case per leg

Typical thermal resistance,
case to heatsink per module

to heatsink

Mounting torque ± 10 %

busbar 3

Approximate weight

Case style JEDEC TO-240AA compatible

, T

J

Stg

R

thJC

R

thCS

DC operation 0.28

Mounting surface flat, smooth and greased 0.1

A mounting compound is recommended and the
torque should be rechecked after a period of
3 hours to allow for the spread of the compound.

ΔR CONDUCTION PER JUNCTION

DEVICES

VSK.71 0.075 0.088 0.113 0.155 0.228 0.06 0.094 0.12 0.158 0.23 °C/W

Note

• Table shows the increment of thermal resistance R

SINE HALF WAVE CONDUCTION RECTANGULAR WAVE CONDUCTION

180° 120° 90° 60° 30° 180° 120° 90° 60° 30°

when devices operate at different conduction angles than DC

thJC

- 40 to 150 °C

°C/W

4

Nm

75 g

2.7 oz.

UNITS

Document Number: 94626 For technical questions, contact: [e-mail]
Revision: 17-Dec-08 3

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VSK.71.. Series

Vishay High Power Products

150

140

130

120

110

180°
120°

100

Maximum allowable case temperature (°C)

90

020406080100

Fig. 1 - Current Ratings Characteristics

150

140

130

120

DC

110

180°
120°

100

Maximum allowable case temperature (°C)

90

0 20406080100120140

Fig. 2 - Current Ratings Characteristics

RthJC (DC) = 0.28°C/W

90°
60°
30°

Average forward current (A)

RthJC (DC) = 0.28°C/W

90°
60°
30°

Average forward current (A)

ADD-A-PAK Generation VII Power Modules

Standard Diodes, 80 A

160

140

120

100

80

60

40

20

Maximum average forward power loss (W)

1400

1200

1000

800

600

Peak half sine wave forward current (A)

400

Fig. 5 - Maximum Non-Repetitive Surge Current

180°
120°

90°
60°
30°

RMS limit

Per leg, Tj = 150°C

0

0 20406080100120140

Average forward current (A)

Fig. 4 - Foward Power Loss Characteristics

At any rated load condition and with

rated Vrrm applied following surge

@ 60 Hz 0.0083 s

Per leg

110100

Number of equal amplitude half cycle current pulses (N)

DC

Initial T j = Tj max

@ 50 Hz 0.0100s

120

100

80

180°
120°

90°
60°
30°

RMS limit

1600

1400

1200

1000

Maximum Non-repetitive Surge Current

Versus Pulse Train Duration

Initial T j = 15 0°C

No Voltage Reapplied

Rated Vrrm reapplied

60

800

40

20

Per leg, Tj = 150°C

Maximum average forward power loss (W)

0

0 102030405060708090

Average forward current (A)

Fig. 3 - Forward Power Loss Characteristics

600

400

Peak half sine wave forward current (A)

200

Per leg

0.01 0.1 1

Pulse train duration (s)

Fig. 6 - Maximum Non-Repetitive Surge Current

www.vishay.com For technical questions, contact: [e-mail]

Document Number: 94626

4 Revision: 17-Dec-08

0

VSK.71.. Series

ADD-A-PAK Generation VII Power Modules

Standard Diodes, 80 A

160

140

120

100

80

60

40

20

Maximum total forward power loss (W)

0

0 20406080100120140

600

500

400

180°

(Sine)

Total RMS output current (A)

DC

VSK.71 Series

Per leg

Tj = 150°C

Fig. 7 - Forward Power Loss Characteristics

180°

(sine)

180°
(rect)

0 20 40 60 80 100 120 140 16

Maximum allowable ambient temperature (°C)

Vishay High Power Products

RthSA = 0.5 °C/W

0.7 °C/W
1 °C/W

1.5 °C/W
2 °C/W
3 °C/W
7 °C/W

RthSA = 0.1 °C/W

0.2 °C/W

0.3 °C/W

0.5 °C/W
1 °C/W
2 °C/W

300

200

100

Maximum total power loss (W)

single ph ase bridg e connect ed

0

0 50 100 150 200

Total output current (A)

600

500

400

300

200

100

Maximum total power loss (W)

three phase bridge connected

0

0 50 100 150 200

Total output current (A)

2 x VSK.71 Series

Tj = 150°C

0 20 40 60 80 100 120 140 16

Maximum allowable ambient temperature (°C)

Fig. 8 - Forward Power Loss Characteristics

120°
(rect)

3 x VSK.71 Series

Tj = 150°C

0 20 40 60 80 100 120 140 160

Maximum allowable ambient temperature (°C)

Fig. 9 - Forward Power Loss Characteristics

RthSA = 0.1 °C/W

0.2 °C/W

0.3 °C/W

0.4 °C/W

0.7 °C/W

1.5 °C/W

Document Number: 94626 For technical questions, contact: [e-mail]

www.vishay.com

Revision: 17-Dec-08 5

VSK.71.. Series

Vishay High Power Products

1000

100

10

Instantaneous forward current (A)

1

(°C/W)

thJC

Steady state value
RthJC = 0.28 °C/W
(DC operation)

ADD-A-PAK Generation VII Power Modules

Standard Diodes, 80 A

Per leg

Tj = 150°C

Tj = 25°C

1

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0

Instantaneous forward voltage (V)

Fig. 10 - Forward Voltage Characteristics

0.1

0.01

Transient thermal impedance Z

0.001 0.01 0.1 1 10

Fig. 11 - Thermal Impedance Z

ORDERING INFORMATION TABLE

Device code

Per leg

Square wave pulse duration (s)

Characteristics

thJC

VSK D 71 / 16

4132

1 - Module type

2 - Circuit configuration (see end of datasheet)

- Current code (80 A)

3

4 - Voltage code (see Voltage Ratings table)

Note

• To order the optional hardware go to www.vishay.com/doc?95172

www.vishay.com For technical questions, contact: [e-mail]
6 Revision: 17-Dec-08

Document Number: 94626

VSK.71.. Series

ADD-A-PAK Generation VII Power Modules

Vishay High Power Products

Standard Diodes, 80 A

CIRCUIT CONFIGURATION

VSKD...

(1)

~

1

2

+

(2)

3

-

(3)

Dimensions http://www.vishay.com/doc?95369

VSKE...

(1)

(2)

+

-

(3)

LINKS TO RELATED DOCUMENTS

VSKJ...

(1)

-

+

(2)

+

(3)

VSKC...

(1)

+

-

(2)

-

(3)

D = 2 diodes in series

E = Single diode

J = 2 diodes/common anode

C = 2 diodes/common cathode

Document Number: 94626 For technical questions, contact: [e-mail]
Revision: 17-Dec-08 7

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ADD-A-PAK Generation VII - Diode

DIMENSIONS in millimeters (inches)

Outline Dimensions

Vishay High Power Products

Viti M5 x 0.8

Screws M5 x 0.8

18 (0.7) REF.

35 REF.

22.6 ± 0.2

30 ± 0.5

(1.18 ± 0.020)

(0.89 ± 0.008)

29 ± 0.5

(1 ± 0.020)

15 ± 0.5 (0.59 ± 0.020)

6.3 ± 0.2 (0.248 ± 0.008)

80 ± 0.3 (3.15 ± 0.012)

2

1

20 ± 0.5 (0.79 ± 0.020)

20 ± 0.5 (0.79 ± 0.020)

92 ± 0.75 (3.6 ± 0.030)

6.7 ± 0.3 (0.26 ± 0.012)

24 ± 0.5

(1 ± 0.020)

3

4 5 7 6

Document Number: 95369 For technical questions concerning discrete products, contact: [e-mail]
Revision: 11-Nov-08 For technical questions concerning module products, contact: [e-mail]

www.vishay.com

1

VISHAY HIGH POWER PRODUCTS

Modules

Mounting Instructions for

ADD-A-PAK Generation VII

Generation VII ADD-A-PAK (AAP) power modules combine
the excellent thermal performance enabled by a direct
bonded copper (Al2O3) substrate, superior mechanical
ruggedness, and an environmentally friendly manufacturing
process that eliminates the use of hard molds, thus reducing
direct stresses on the leads. To prevent axial pull-out, the
electrical terminals are co-molded to the module housing.

The VSK series of AAP modules uses glass passivated and
Schottky power diodes and thyristors in circuit configurations
including common anode, common cathode, half-bridge, and
single switch. The semiconductors are internally connected
through wire-bonding and electrically isolated from the
bottom baseplate, allowing the use of a common heatsink
and enabling a more compact overall assembly.

INTRODUCTION

Major AAP Generation VII module features

• High blocking voltage up to 1600 V

• Industrial standard package style, fully compatible with
TO-240AA

• High isolation capability up to V

• High surge capability with I

• No toxic material: Completely lead (Pb)-free, RoHS and UL
compliant

• Elimination of copper base plate reduces weight to 75 g

• Elimination of process steps requiring usage of chemicals
and related waste treatment promotes a cleaner and more
environmentally friendly manufacturing process

These features allow AAP Generation VII modules to fit into
existing standardized assembly processes. Important factors
in the assembly process include

• Heatsink design

• PCB, busbar, and cable design

• Power leads size/area

• Distance from adjacent heat-generating parts

The implications of these items and the requirements for
assembly of AAP Generation VII modules are discussed
over the following pages.

FSM

= 3500 V

RMS

up to 3000 A

Application Note

SPECIFYING THE HEATSINK

The heat generated by the module has to be dissipated with
a heatsink. Typically natural or forced air cooling is used.

To optimize the device performance, the contact surface of
the heatsink must be flat, with a recommended flatness of
≤ 0.03 mm (≤ 1.18 mils) and a levelling depth of less than

0.02 mm (≤ 0.79 mils), according to DIN/ISO 1302. A milled
or machined surface is generally satisfactory if prepared with
tools in good working condition. The heatsink mounting
surface must be clean, with no dirt, corrosion, or surface
oxide. It is very important to keep the mounting surface free
from particles exceeding 0.05 mm (2 mils) in thickness,
provided a thermal compound is used.

MOUNTING OPERATIONS

The AAP Generation VII modules are designed with an
exposed DBC Al2O3 substrate.

This is used to optimize the thermal behavior of the module.
To reduce the risk of damage during mounting, the ceramic
has been given additional mechanical ruggedness in the
form of two separate 15.8 mm by 21.1 mm (0.62" by 0.83")
pieces of DBC substrate, which can be seen in the photo
below.

APPLICATION NOTE

Before mounting, inspect the module to insure that the
contact surface of the bottom substrate is clean and free of
any lumps or bulges that could damage the device or impede
heat transfer across its surface.

Document Number: 95043 For technical questions, contact: [e-mail]
Revision: 17-Dec-08 1

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Mounting Instructions for

ADD-A-PAK Generation VII

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Document Number: 95043

2 Revision: 17-Dec-08

Application Note

Vishay High Power Products

APPLICATION NOTE

Next, make a uniform coating on the heatsink mounting
surfaces and module substrate with a good quality thermal
compound. Screen printing of the compound is
recommended, as well as direct application through a roller
or spatula. The datasheet values for thermal resistance
assume a uniform layer of thermal compound with a
maximum thickness of 0.08 mm. The thermal conductivity of
the compound should be no less than 0.5 W/mK. Apply
uniform pressure on the package to force the compound to
spread over the entire contact area, and check the device
bottom surface to verify full and uniform coverage.

Bolt the module to the heatsink using the two fixing holes.

An even amount of torque should be applied for each
individual mounting screw. An M6 screw should be used with
lock washers. A torque wrench, which is accurate in the
specified range, must be used in mounting the module to
achieve optimum results. The first mounting screw should be
tightened to one third of the recommended torque; the
second screw should then be tightened to the same torque.
Full tightening of both the screws can then be completed by
applying the recommended torque (see data in bulletins).
Over-tightening the mounting screw may lead to deformation
of the package, which would hence increase the thermal
resistance and damage the semiconductors. After a period of
three hours, check the torque with a final tightening in
opposite sequence to allow the spread of the compound.

Power terminals can be screwed to busbars and/or flexible
cables with eyelets.

We recommend the use of M5 screws with spring washers.
Users should consult published datasheets to determine the
optimal torque.

AAP Generation VII modules are designed to guarantee a
good and reliable contact even at 3 ± 10 % Nm on a busbar,
so there is no need to apply an especially high level of force
to obtain a good and reliable connection.

SOLDERING TO THE PCB

The signal terminal (gate and auxiliary cathode) pins of AAP
Gen VII modules based on thyristors can be soldered to the
PCB using hand iron or wave soldering processes.

The PCB should be designed with appropriate tolerances on
the hole diameters, and soldering must be done without
imposing any mechanical stress on the module pins (pulling
and tensioning the pins).

To prevent overheating of the device, the soldering time
should not exceed 8 to 10 seconds at a temperature of
260 °C.

Alternatively, a fast-on cable connector can be used to
contact the signal pins.