C&H Technology VSK56 User Manual

6121 Baker Road, Suite 108 Minnetonka, MN 55345
www.chtechnology.com
Fax (952) 933-6223
1-800-274-4284
Thank you for downloading this document from C&H Technology, Inc.
Please contact the C&H Technology team for the following questions -
Technical
Application
Assembly
Availability
Pricing
Phone – 1-800-274-4284
E-Mail – sales@chtechnology.com
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ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
ADD-A-PAK
PRODUCT SUMMARY
I
or I
T(AV)
F(AV)
45 A/60 A
VSK.41.., VSK.56.. Series
Vishay High Power Products
FEATURES
• High voltage
• Industrial standard package
• UL pending
• Low thermal resistance
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
BENEFITS
• Excellent thermal performances obtained by the usage of exposed direct bonded copper substrate
• Up to 1600 V
• High surge capability
MECHANICAL DESCRIPTION
• Easy mounting on heatsink
The ADD-A-PAK generation VII, new generation of ADD-A-PAK module, combines the excellent thermal performances obtained by the usage of exposed direct bonded copper substrate, with advanced compact simple package solution and simplified internal structure with minimized number of interfaces.
ELECTRICAL DESCRIPTION
These modules are intended for general purpose high voltage applications such as high voltage regulated power supplies, lighting circuits, temperature and motor speed control circuits, UPS and battery charger.
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VSK.41 VSK.56 UNITS
I
or I
T(AV)
F(AV)
I
O(RMS)
I
TSM,
I
FSM
2
t
I
2
t 36.1 72 kA2√s
I
V
RRM
T
Stg
T
J
85 °C 45 60
As AC switch 100 135
50 Hz 850 1200
60 Hz 890 1256
50 Hz 3.61 7.20
60 Hz 3.30 6.57
Range 400 to 1600 V
- 40 to 125 °C
A
kA2s
Document Number: 94630 For technical questions, contact: indmodules@vishay.com Revision: 05-Aug-09 1
www.vishay.com
VSK.41.., VSK.56.. Series
Vishay High Power Products
ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
ELECTRICAL SPECIFICATIONS
VOLTAGE RATINGS
V
, MAXIMUM
RRM
REPETITIVE PEAK
REVERSE VOLTAGE
TYPE NUMBER
VOLTAGE
CODE
V
04 400 500 400
06 600 700 600
VSK.41 VSK.56
08 800 900 800
10 1000 1100 1000
12 1200 1300 1200
14 1400 1500 1400
16 1600 1700 1600
ON-STATE CONDUCTION
PARAMETER SYMBOL TEST CONDITIONS VSK.41 VSK.56 UNITS
Maximum average on-state current (thyristors) I
Maximum average forward current (diodes) I
Maximum continuous RMS on-state current, as AC switch
Maximum peak, one-cycle non-repetitive on-state or forward current
2
Maximum I
Maximum I
t for fusing I2t
2
t for fusing I2√t
Maximum value or threshold voltage V
Maximum value of on-state slope resistance
Maximum peak on-state or forward voltage
Maximum non-repetitive rate of rise of turned on current
Maximum holding current I
Maximum latching current I
Notes
(1)I2
t for time tx = I2√t x √t
(2)
Average power = V
(3)
16.7 % x π x IAV < I < π x I
(4)
I > π x I
AV
T(TO)
x
x I
+ rt x (I
T(AV)
AV
T(RMS)
T(AV)
F(AV)
I
O(RMS)
I
TSM
or
I
FSM
(1)
(2)
T(TO)
(2)
r
t
V
TM
V
FM
dI/dt
H
L
2
)
V
, MAXIMUM
RSM
NON-REPETITIVE PEAK
REVERSE VOLTAGE
V
180° conduction, half sine wave, T
= 85 °C
C
or
I
(RMS)
t = 10 ms
t = 8.3 ms 890 1256
t = 10 ms
t = 8.3 ms 750 1056
t = 10 ms
t = 8.3 ms 3.30 6.57
t = 10 ms
t = 8.3 ms 2.33 4.56
No voltage reapplied
100 % V reapplied
No voltage reapplied
100 % V reapplied
t = 0.1 ms to 10 ms, no voltage reapplied
= TJ maximum
T
J
Low level
High level
Low level
High level
ITM = π x I
IFM = π x I
T
J
I
TM
(3)
TJ = TJ maximum
(4)
(3)
TJ = TJ maximum
(4)
T(AV)
TJ = 25 °C 1.81 1.7 V
F(AV)
= 25 °C, from 0.67 V
= π x I
, Ig = 500 mA, tr < 0.5 µs, tp > 6 µs
T(AV)
DRM
TJ = 25 °C, anode supply = 6 V, resistive load, gate open circuit
V
, MAXIMUM REPETITIVE
DRM
PEAK OFF-STATE VOLTAGE,
GATE OPEN CIRCUIT
V
I
(RMS)
Sinusoidal half wave, initial T
=
RRM
RRM
maximum
T
J
Initial T T
maximum
J
J
=
J
,
45 60
100 135
850 1200
715 1000
3.61 7.20
2.56 5.10
36.1 72 kA
1.08 0.91
1.12 1.02
4.7 4.27
4.5 3.77
150 A/µs
200
TJ = 25 °C, anode supply = 6 V, resistive load 400 400
I
RRM,
I
DRM
AT 125 °C
mA
15
kA
mΩ
mA
A
2
s
2
s
V
www.vishay.com For technical questions, contact: indmodules@vishay.com
Document Number: 94630
2 Revision: 05-Aug-09
VSK.41.., VSK.56.. Series
ADD-A-PAK Generation VII Power Modules
Vishay High Power Products
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
TRIGGERING
PARAMETER SYMBOL TEST CONDITIONS VSK.41 VSK.56 UNITS
Maximum peak gate power P
Maximum average gate power P
Maximum peak gate current I
Maximum peak negative gate voltage - V
GM
G(AV)
GM
GM
TJ = - 40 °C
Maximum gate voltage required to trigger V
GT
T
= 25 °C 2.5
J
T
= 125 °C 1.7
J
Anode supply = 6 V resistive load
TJ = - 40 °C
Maximum gate current required to trigger I
Maximum gate voltage that will not trigger V
Maximum gate current that will not trigger I
GT
GD
GD
= 25 °C 150
J
= 125 °C 80
T
J
TJ = 125 °C, rated V
TJ = 125 °C, rated V
Anode supply = 6 V resistive load
applied 0.25 V
DRM
applied 6 mA
DRM
BLOCKING
PARAMETER SYMBOL TEST CONDITIONS VSK.41 VSK.56 UNITS
Maximum peak reverse and off-state leakage current at V
RRM
, V
DRM
Maximum RMS insulation voltage V
Maximum critical rate of rise of off-state voltage dV/dt T
I
RRM,
I
DRM
TJ = 125 °C, gate open circuit 15 mA
50 Hz
INS
= 125 °C, linear to 0.67 V
J
DRM
10
2.5
2.5 A
10
4.0
270
3000 (1 min)
3600 (1 s)
1000 V/µs
W
V
mAT
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VSK.41 VSK.56 UNITS
Junction operating and storage temperature range
Maximum internal thermal resistance, junction to case per leg
Typical thermal resistance, case to heatsink per module
to heatsink
Mounting torque ± 10 %
busbar 3
Approximate weight
T
, T
J
Stg
R
thJC
DC operation 0.44 0.35
- 40 to 125 °C
°C/W
R
thCS
Mounting surface flat, smooth and greased 0.1
A mounting compound is recommended and the torque should be rechecked after a period of
4
Nm
3 h to allow for the spread of the compound.
75 g
2.7 oz.
Case style JEDEC TO-240AA compatible
ΔR CONDUCTION PER JUNCTION
DEVICES
VSK.41.. 0.110 0.131 0.17 0.23 0.342 0.085 0.138 0.177 0.235 0.345
VSK.56.. 0.088 0.104 0.134 0.184 0.273 0.07 0.111 0.143 0.189 0.275
Note
• Table shows the increment of thermal resistance R
Document Number: 94630 For technical questions, contact: indmodules@vishay.com Revision: 05-Aug-09 3
SINE HALF WAVE CONDUCTION RECTANGULAR WAVE CONDUCTION
180° 120° 90° 60° 30° 180° 120° 90° 60° 30°
when devices operate at different conduction angles than DC
thJC
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UNITS
°C/W
VSK.41.., VSK.56.. Series
Vishay High Power Products
130
120
110
100
Maximum allowable case temperature (°C)
130
120
110
100
90
80
Maximum allowable case temperature (°C)
70
VSK.41 Series RthJC (DC) = 0.44°C/W
180° 120°
90°
90
60° 30°
80
0 1020304050
Average on-state current (A)
Fig. 1 - Current Ratings Characteristics
VSK.41 Series RthJC (DC) = 0.44 °C/W
DC 180°
120°
90° 60° 30°
0 1020304050607080
Average on-state current (A)
Fig. 2 - Current Ratings Characteristics
ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
120
100
80
60
40
20
0
Maximum average on-state power loss (W)
Fig. 4 - On-State Power Loss Characteristics
800
700
600
500
400
Peak half sine wave on-state current (A)
300
Number of equal amplitude half cycle current pulses (N)
Fig. 5 - Maximum Non-Repetitive Surge Current
180° 120°
90° 60° 30°
RMS limit
VSK.41 Series Per leg, Tj = 125°C
0 1020304050607080
Average on-state current (A)
At any rated load condition and with
rated Vrrm applied following surge
Per leg
Initial T j = Tj max
@ 60 Hz 0.0083 s
@ 50 Hz 0.0100s
110100
DC
80
70
60
50
40
30
180° 120°
90° 60° 30°
RMS limit
900
Maximum Non-repetitive Surge Current
800
700
Versus Pulse Train Duration. Control of conduction may not be maintaned.
No Voltage Reapplied
Rated Vrrm reapplied
600
500
Initial T j = 125°C
20
10
Maximum average on-state power loss (W)
0
VSK.41 Series Per leg, Tj = 125°C
0 5 10 15 20 25 30 35 40 45 50
Average on-state current (A)
Fig. 3 - On-State Power Loss Characteristics
400
Peak half sine wave on-state current (A)
300
Per leg
0.01 0.1 1
Pulse train duration (s)
Fig. 6 - Maximum Non-Repetitive Surge Current
www.vishay.com For technical questions, contact: indmodules@vishay.com
Document Number: 94630
4 Revision: 05-Aug-09
VSK.41.., VSK.56.. Series
ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
160
140
120
100
80
60
40
20
Maximum total on-state power loss (W)
0
0 20406080100
Total RMS output current (A)
350
300
250
200
150
180° 120°
90° 60° 30°
VSK.41 Series
Per module
Tj = 125°C
0 20 40 60 80 100 120 140
Maximum allowable ambient temperature (°C)
Fig. 7 - On-State Power Loss Characteristics
180°
(sine)
180°
(rect)
Vishay High Power Products
RthSA = 0.1 °C/W
0.3 °C/W
0.5 °C/W
0.7 °C/W 1 °C/W
1.5 °C/W 2 °C/W 3 °C/W 5 °C/W
RthSA = 0.1 °C/W
0.2 °C/W
0.3 °C/W
0.5 °C/W
0.7 °C/W 1 °C/W
1.5 °C/W
100
Maximum total power loss (W)
50
single ph ase bridg e connect ed
0
020406080100
Total output current (A)
500
400
120°
300
(rect)
200
100
Maximum total power loss (W)
three phase brid ge connec ted
0
0 20406080100120140
Total output current (A)
2 x VSK.41 Series
Tj = 125°C
0 20 40 60 80 100 120 140
Maximum allowable ambient temperature (°C)
Fig. 8 - On-State Power Loss Characteristics
RthSA = 0.1 °C/W
0.2 °C/W
0.3 °C/W
0.5 °C/W
0.7 °C/W 1 °C/W
3 x VSK.41 Series
Tj = 125°C
0 20 40 60 80 100 120 140
Maximum allowable ambient temperature (°C)
Fig. 9 - On-State Power Loss Characteristics
Document Number: 94630 For technical questions, contact: indmodules@vishay.com
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Revision: 05-Aug-09 5
VSK.41.., VSK.56.. Series
Vishay High Power Products
130
120
110
100
90
Maximum allowable case temperature (°C)
80
130
120
110
100
90
80
Maximum allowable case temperature (°C)
70
VSK.56 Series RthJC (DC) = 0.35°C/W
180° 120°
90° 60° 30°
0 10203040506070
Average on-state current (A)
Fig. 10 - Current Ratings Characteristics
VSK.56 Series RthJC (DC) = 0.35 °C/W
DC 180°
120°
90° 60° 30°
0 20406080100
Average on-state current (A)
Fig. 11 - Current Ratings Characteristics
ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
140
120
100
80
60
40
20
0
Maximum average on-state power loss (W)
Fig. 13 - On-State Power Loss Characteristics
1100
1000
900
800
700
600
500
Peak half sine wave on-state current (A)
400
Number of equal amplitude half cycle current pulses (N)
Fig. 14 - Maximum Non-Repetitive Surge Current
180° 120°
90° 60° 30°
RMS limit
VSK.56 Series Per leg, Tj = 125°C
0 20 40 60 80 100
Average on-state current (A)
At any rated load condition and with
rated Vrrm applied following surge
Per leg
Initial T j = Tj max
@ 60 Hz 0.0083 s
@ 50 Hz 0.0100s
110100
DC
100
80
60
40
180° 120°
90° 60° 30°
RMS limit
1300
1200
1100
1000
900
800
Maximum Non-repetitive Surge Current
Versus Pulse Train Duration. Control
of conduction may not be maintained.
Initial T j = 125°C
No Voltage Reapplied
Rated Vrrm reapplied
700
20
VSK.56 Series
Maximum average on-state power loss (W)
0
Per leg, Tj = 125°C
0 10203040506070
Average on-state current (A)
Fig. 12 - On-State Power Loss Characteristics
600
500
Peak half sine wave on-state current (A)
400
Per leg
0.01 0.1 1
Pulse train duration (s)
Fig. 15 - Maximum Non-Repetitive Surge Current
www.vishay.com For technical questions, contact: indmodules@vishay.com
Document Number: 94630
6 Revision: 05-Aug-09
VSK.41.., VSK.56.. Series
ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
250
200
150
100
50
Maximum total on-state power loss (W)
0
020406080100120140
Total RMS output current (A)
600
500
400
300
180° 120°
90° 60° 30°
VSK.56 Series
Per module
Tj = 125°C
0 20 40 60 80 100 120 140
Maximum allowable ambient temperature (°C)
Fig. 16 - On-State Power Loss Characteristics
180°
(sine)
180° (rect)
Vishay High Power Products
RthSA = 0.1 °C/W
0.2 °C/W
0.3 °C/W
0.4 °C/W
0.5 °C/W
0.7 °C/W 1 °C/W
1.5 °C/W 2 °C/W 4 °C/W
RthSA = 0.1 °C/W
0.2 °C/W
0.3 °C/W
0.5 °C/W
0.7 °C/W 1 °C/W 2 °C/W
200
100
Maximum total power loss (W)
single phase bridge connected
0
0 20406080100120140
Total output current (A)
Fig. 17 - On-State Power Loss Characteristics
700
600
500
400
300
200
Maximum total power loss (W)
100
three phase bridge connec ted
0
0 20406080100120140160180
Total output current (A)
Fig. 18 - On-State Power Loss Characteristics
2 x VSK.56 Series
Tj = 125°C
120° (rect)
3 x VSK.56 Series
Tj = 125°C
0 20 40 60 80 100 120 140
Maximum allowable ambient temperature (°C)
RthSA = 0.1 °C/W
0.2 °C/W
0.3 °C/W
0.5 °C/W
0.7 °C/W 1 °C/W
0 20 40 60 80 100 120 140
Maximum allowable ambient temperature (°C)
Document Number: 94630 For technical questions, contact: indmodules@vishay.com
www.vishay.com
Revision: 05-Aug-09 7
VSK.41.., VSK.56.. Series
Vishay High Power Products
1000
Instantaneous on-state current (A)
VSK. 41 Series Per leg
100
10
Tj = 125°C
Tj = 25°C
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Instantaneous on-state voltage (V)
Fig. 19 - On-State Voltage Drop Characteristics Fig. 20 - On-State Voltage Drop Characteristics
1
Steady state value
(°C/W)
thJC
RthJC = 0.44 °C/W RthJC = 0.35 °C/W (DC operation)
ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
1000
Instantaneous on-state current (A)
VSK. 56 Series Per leg
100
10
Tj = 125°C
Tj = 25°C
1
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Instantaneous on-state voltage (V)
0.1
0.01
Transient thermal impedance Z
VSK.41 Series VSK.56 Series
Per leg
0.001 0.01 0.1 1 10
Square wave pulse duration (s)
Fig. 21 - Thermal Impedance Z
100
Rectangular gate pulse a)Recommended load line for
rated di/ dt: 20 V, 30 ohms t r = 0.5 µs, t p >= 6 µs
b)Rec omm end ed load line fo r
<= 30% rat ed di/ d t: 20 V , 65 ohm s
10
tr = 1 µs, tp >= 6 µs
1
Instantaneous gate voltage (V)
VGD
IGD
0.1
0.001 0.01 0.1 1 10 100 10 00
(a)
(b)
TJ = - 4 0 ° C
TJ = 2 5 °C
T J = 125 °C
VSK.
IRK.41../ .56.. Se ries
Instantaneous gate current (A)
Characteristics
thJC
(1) PGM = 100 W, t p = 500 µs (2) PGM = 50 W, tp = 1 ms (3) PGM = 20 W, tp = 25 ms (4) PGM = 10 W, tp = 5 ms
(4)
Fr e q u e n c y Li m it e d b y PG (A V)
(3)
(2) (1)
Fig. 22 - Gate Characteristics
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Document Number: 94630
8 Revision: 05-Aug-09
VSK.41.., VSK.56.. Series
ADD-A-PAK Generation VII Power Modules
Thyristor/Diode and Thyristor/Thyristor, 45 A/60 A
ORDERING INFORMATION TABLE
Device code
Note
• To order the optional hardware go to www.vishay.com/doc?95172
CIRCUIT CONFIGURATION
VSKT
(1)
~
VSK T 56 / 16
1324
1 - Module type
2 - Circuit configuration (see end of datasheet)
3
- Current code
4 - Voltage code (see Voltage Ratings table)
VSKH
(1)
Vishay High Power Products
41 = 45 A 56 = 60 A
VSKL
~
(1)
~
VSKN
(1)
-
1
4 5 7 6
1
G1 (4)
K1 (5)
(2)
(3)
+
-
K2 (7)G2(6)
2
3
4 5
2
3
G1
(4)
K1 (5)
(2)
(3)
+
-
1
2
3
7 6
(2)
(3)
+
-
K2 (7)G2(6)
1
2
3
4 5
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95368
G1 (4)
K1 (5)
(2)
(3)
+
+
Document Number: 94630 For technical questions, contact: indmodules@vishay.com
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Revision: 05-Aug-09 9
ADD-A-PAK Generation VII - Thyristor
DIMENSIONS in millimeters (inches)
Outline Dimensions
Vishay High Power Products
Fast-on tab 2.8 x 0.8 (0.110 x 0.03)
35 REF.
22.6 ± 0.2
30 ± 0.5
(1.18 ± 0.020)
(0.89 ± 0.008)
Viti M5 x 0.8
Screws M5 x 0.8
29 ± 0.5
(1 ± 0.020)
15 ± 0.5 (0.59 ± 0.020)
6.3 ± 0.2 (0.248 ± 0.008)
18 (0.7) REF.
80 ± 0.3 (3.15 ± 0.012)
2
1
20 ± 0.5 (0.79 ± 0.020)
20 ± 0.5 (0.79 ± 0.020)
92 ± 0.75 (3.6 ± 0.030)
15.5 ± 0.5
(0.6 ± 0.020)
3
4 5 7 6
6.7 ± 0.3 (0.26 ± 0.012)
24 ± 0.5
(1 ± 0.020)
30 ± 1 (1.18 ± 0.039)
4 ± 0.2 (0.157 ± 0.008)
5.8 ± 0.25 (0.228 ± 0.010)
Document Number: 95368 For technical questions concerning discrete products, contact: diodes-tech@vishay.com Revision: 11-Nov-08 For technical questions concerning module products, contact: ind-modules@vishay.com
www.vishay.com
1
Document Number: 95043 For technical questions, contact: sales@chtechnology.com
www.chtechnology.com
Revision: 17-Dec-08 1
VISHAY HIGH POWER PRODUCTS
Modules
Application Note
Mounting Instructions for
ADD-A-PAK Generation VII
APPLICATION NOTE
Generation VII ADD-A-PAK (AAP) power modules combine the excellent thermal performance enabled by a direct bonded copper (Al
2O3
) substrate, superior mechanical ruggedness, and an environmentally friendly manufacturing process that eliminates the use of hard molds, thus reducing direct stresses on the leads. To prevent axial pull-out, the electrical terminals are co-molded to the module housing.
The VSK series of AAP modules uses glass passivated and Schottky power diodes and thyristors in circuit configurations including common anode, common cathode, half-bridge, and single switch. The semiconductors are internally connected through wire-bonding and electrically isolated from the bottom baseplate, allowing the use of a common heatsink and enabling a more compact overall assembly.
INTRODUCTION
Major AAP Generation VII module features
• High blocking voltage up to 1600 V
• Industrial standard package style, fully compatible with
TO-240AA
• High isolation capability up to V
RMS
= 3500 V
• High surge capability with I
FSM
up to 3000 A
• No toxic material: Completely lead (Pb)-free, RoHS and UL
compliant
• Elimination of copper base plate reduces weight to 75 g
• Elimination of process steps requiring usage of chemicals
and related waste treatment promotes a cleaner and more environmentally friendly manufacturing process
These features allow AAP Generation VII modules to fit into existing standardized assembly processes. Important factors in the assembly process include
• Heatsink design
• PCB, busbar, and cable design
• Power leads size/area
• Distance from adjacent heat-generating parts
The implications of these items and the requirements for assembly of AAP Generation VII modules are discussed over the following pages.
SPECIFYING THE HEATSINK
The heat generated by the module has to be dissipated with a heatsink. Typically natural or forced air cooling is used.
To optimize the device performance, the contact surface of the heatsink must be flat, with a recommended flatness of 0.03 mm ( 1.18 mils) and a levelling depth of less than
0.02 mm ( 0.79 mils), according to DIN/ISO 1302. A milled or machined surface is generally satisfactory if prepared with tools in good working condition. The heatsink mounting surface must be clean, with no dirt, corrosion, or surface oxide. It is very important to keep the mounting surface free from particles exceeding 0.05 mm (2 mils) in thickness, provided a thermal compound is used.
MOUNTING OPERATIONS
The AAP Generation VII modules are designed with an exposed DBC Al
2O3
substrate.
This is used to optimize the thermal behavior of the module. To reduce the risk of damage during mounting, the ceramic has been given additional mechanical ruggedness in the form of two separate 15.8 mm by 21.1 mm (0.62" by 0.83") pieces of DBC substrate, which can be seen in the photo below.
Before mounting, inspect the module to insure that the contact surface of the bottom substrate is clean and free of any lumps or bulges that could damage the device or impede heat transfer across its surface.
Mounting Instructions for
ADD-A-PAK Generation VII
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Document Number: 95043
2 Revision: 17-Dec-08
Application Note
Vishay High Power Products
APPLICATION NOTE
Next, make a uniform coating on the heatsink mounting surfaces and module substrate with a good quality thermal compound. Screen printing of the compound is recommended, as well as direct application through a roller or spatula. The datasheet values for thermal resistance assume a uniform layer of thermal compound with a maximum thickness of 0.08 mm. The thermal conductivity of the compound should be no less than 0.5 W/mK. Apply uniform pressure on the package to force the compound to spread over the entire contact area, and check the device bottom surface to verify full and uniform coverage.
Bolt the module to the heatsink using the two fixing holes.
An even amount of torque should be applied for each individual mounting screw. An M6 screw should be used with lock washers. A torque wrench, which is accurate in the specified range, must be used in mounting the module to achieve optimum results. The first mounting screw should be tightened to one third of the recommended torque; the second screw should then be tightened to the same torque. Full tightening of both the screws can then be completed by applying the recommended torque (see data in bulletins). Over-tightening the mounting screw may lead to deformation of the package, which would hence increase the thermal resistance and damage the semiconductors. After a period of three hours, check the torque with a final tightening in opposite sequence to allow the spread of the compound.
Power terminals can be screwed to busbars and/or flexible cables with eyelets.
We recommend the use of M5 screws with spring washers. Users should consult published datasheets to determine the optimal torque.
AAP Generation VII modules are designed to guarantee a good and reliable contact even at 3 ± 10 % Nm on a busbar, so there is no need to apply an especially high level of force to obtain a good and reliable connection.
SOLDERING TO THE PCB
The signal terminal (gate and auxiliary cathode) pins of AAP Gen VII modules based on thyristors can be soldered to the PCB using hand iron or wave soldering processes.
The PCB should be designed with appropriate tolerances on the hole diameters, and soldering must be done without imposing any mechanical stress on the module pins (pulling and tensioning the pins).
To prevent overheating of the device, the soldering time should not exceed 8 to 10 seconds at a temperature of 260 °C.
Alternatively, a fast-on cable connector can be used to contact the signal pins.
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