C&H Technology VS-HFA90FA120 User Manual

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1-800-274-4284
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Please contact the C&H Technology team for the following questions -
Technical
Application
Assembly
Availability
Pricing
Phone – 1-800-274-4284
E-Mail – sales@chtechnology.com
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SOT-227
PRODUCT SUMMARY
V
R
V
(typical) 2.46 V
F
t
(typical) 35 ns
rr
per module at T
I
F(AV)
C
Vishay Semiconductors
HEXFRED®
Ultrafast Soft Recovery Diode, 90 A
FEATURES
• Fast recovery time characteristic
• Electrically isolated base plate
• Large creepage distance between terminal
• Simplified mechanical designs, rapid assembly
• Compliant to RoHS Directive 2011/65/EU
• Designed and qualified for industrial level
DESCRIPTION/APPLICATIONS
The dual diode series configuration (VS-HFA90FA120) is used for output rectification or freewheeling/clamping operation and high voltage application.
1200 V
90 A at 63 °C
The semiconductor in the SOT-227 Gen II package is isolated from the copper base plate, allowing for common heatsinks and compact assemblies to be built. These modules are intended for general applications such as HV power supplies, electronic welders, motor control and inverters.
VS-HFA90FA120
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Cathode to anode breakdown voltage V
Continuous forward current, per leg I
Single pulse forward current, per leg I
Maximum power dissipation, per leg P
RMS isolation voltage V
Operating junction and storage temperature range
T
J
FSM
ISOL
, T
R
F
D
TC = 83 °C 45
TJ = 25 °C 400
TC = 83 °C 139
T
= 100 °C 104
C
Any terminal to case, t = 1 min 2500 V
Stg
1200 V
A
W
- 55 to 150 °C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode breakdown voltage
Forward voltage V
Reverse leakage current I
Junction capacitance C
V
RM
IR = 100 μA 1200 - -
BR
IF = 25 A
I
= 40 A - 2.68 3.3
F
I
= 25 A, TJ = 125 °C - 2.22 -
FM
F
I
= 40 A, TJ = 125 °C - 2.52 -
F
= 25 A, TJ = 150 °C - 2.12 2.55
I
F
I
= 40 A, TJ = 150 °C - 2.43 2.96
F
VR = VR rated
T
= 125 °C, VR = VR rated - 0.5 2
J
T
= 150 °C, VR = VR rated - 2 5
J
VR = 1200 V See fig. 3 - 30 - pF
T
See fig. 1
See fig. 2
- 2.46 3.0
-1.57A
V
mA
Revision: 29-Feb-12
1
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 94690
VS-HFA90FA120
VR - Reverse Voltage (V)
I
R
- Reverse Current (μA)
0.01
0.1
1
10
100
1000
10 000
0 100 200 300 400 500 600
T
J
= 150 °C
T
J
= 125 °C
T
J
= 25 °C
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DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V - 35 -
Reverse recovery time t
Peak recovery current I
Reverse recovery charge Q
rr
RRM
rr
= 25 °C
J
T
= 125 °C - 130 -
J
TJ = 25 °C - 6.8 -
T
= 125 °C - 11.5 -
J
TJ = 25 °C - 270 -
T
= 125 °C - 740 -
J
I
= 40 A
F
/dt = - 200 A/μs
dI
F
= 200 V
V
R
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Junction to case, single leg conducting
Case to heatsink R
Weight -30- g
Mounting torque -1.3-Nm
R
thJC
thCS
Flat, greased and surface - 0.10 -
Vishay Semiconductors
-80-
--0.48
nsT
A
nC
°C/WJunction to case, both legs conducting - - 0.24
1000
T
= 150 °C
J
100
= 125 °C
T
J
- Instantaneous Forward Current (A)
F
I
10
1
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
T
= 25 °C
J
VF - Forward Voltage Drop (V)
Fig. 1 - Typical Forward Voltage Drop Characteristics (Per Leg) Fig. 2 - Typical Values of Reverse Current vs. Reverse Voltage
Revision: 29-Feb-12
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
2
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Document Number: 94690
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VR - Reverse Voltage (V)
C
T
-
Junction Capacitance (pF)
10
100
1000
1 10 100 1000 10 000
Z
thJC
-
Thermal Impedance (°C/W)
t1 - Rectangular Pulse Duration (s)
0.001
0.01
0.1
1
0.0001 0.001 0.01 0.1 1 10
DC
P
DM
t
2
t
1
Notes:
1. Duty factor D = t
1/t2
2. Peak TJ = PDM x Z
thJC
+ T
C
D = 0.75
D = 0.20
D = 0.25
D = 0.33
D = 0.50
Single pulse
(thermal resistance)
I
F(AV) -
Average Forward Current (A)
Allowable Case Temperature (°C)
0
25
50
75
100
125
150
175
0 102030405060708090
DC
Square wave (d = 0.5)
80 % rated V
R
applied
VS-HFA90FA120
Vishay Semiconductors
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage
Fig. 4 - Maximum Thermal Impedance Z
Fig. 5 - Maximum Allowable Case Temperature vs. Average
Revision: 29-Feb-12
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Forward Current (Per Leg)
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Characteristics (Per Leg)
thJC
300
250
200
150
100
50
Average Power Loss (W)
0
0 1020304050607080
Fig. 6 - Forward Power Loss Characteristics (Per Leg)
3
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DC
I
Average Forward Current (A)
F(AV) -
RMS limit
D = 0.20 D = 0.25 D = 0.33 D = 0.50 D = 0.75
Document Number: 94690
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Q
rr
(nC)
dIF/dt (A/μs)
0
250
500
750
1000
1250
1500
100 1000
25 °C
IF = 40 A
I
F
= 20 A
V
R
= 200 V
125 °C
dIF/dt (A/μs)
I
RR
(A)
0
10
20
30
100 1000
25 °C
IF = 40 A
V
R
= 200 V
125 °C
IF = 20 A
IRFP250
D.U.T.
L = 70 μH
V
R
= 200 V
0.01 Ω
G
D
S
dIF/dt
adjust
VS-HFA90FA120
Vishay Semiconductors
200
IF = 40 A
125 °C
150
100
(ns)
rr
t
25 °C
50
0
100 1000
I
= 20 A
F
V
= 200 V
R
dIF/dt (A/μs)
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt Fig. 8 - Typical Stored Charge vs. dIF/dt
Revision: 29-Feb-12
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Fig. 9 - Typical Reverse Recovery Current vs. dI
F
/dt
Fig. 10 - Reverse Recovery Parameter Test Circuit
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Document Number: 94690
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Q
rr
0.5 I
RRM
dI
(rec)M
/dt
0.75 I
RRM
I
RRM
t
rr
t
b
t
a
I
F
dIF/dt
0
(1)
(2)
(3)
(4)
(5)
(1) dI
F
/dt - rate of change of current
through zero crossing
(2) I
RRM
- peak reverse recovery current
(3) t
rr
- reverse recovery time measured from zero crossing point of negative going I
F
to point where a line passing
through 0.75 I
RRM
and 0.50 I
RRM
extrapolated to zero current.
(4) Q
rr
- area under curve dened by t
rr
and I
RRM
trr x I
RRM
2
Q
rr
=
(5) dI
(rec)M
/dt - peak rate of change of
current during t
b
portion of t
rr
1
43
2
Lead Assignment
1
4
2
3
VS-HFA90FA120
Vishay Semiconductors
Fig. 11 - Reverse Recovery Waveform and Definitions
ORDERING INFORMATION TABLE
CIRCUIT CONFIGURATION
CIRCUIT
2 separate diodes, parallel pin-out
Revision: 29-Feb-12
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Device code
HFVS- A 90 F A 120
51 32 4 6 7
1
- Vishay Semiconductors product
2
- HEXFRED® family
3
- Process designator (A = Electron irradiated)
4
- Average current (90 = 90 A)
5
- Circuit configuration (2 separate diodes, parallel pin-out)
- Package indicator (SOT-227 standard isolated base)
6
- Voltage rating (120 = 1200 V)
7
CONFIGURATION CODE
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CIRCUIT
F
CIRCUIT DRAWING
5
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Document Number: 94690
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Revision: 12-Mar-12
1
Document Number: 91000
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