C&H Technology VS-GT100DA120U User Manual

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C & H TECHNOLOGY, INC. 6121 BAKER RD. SUITE 108 MINNETONKA, MINNESOTA 55345
800-274-4284 952-933-6190 FAX: 952-933-6223 WWW.CHTECHNOLOGY.COM
www.vishay.com
SOT-227
Insulated Gate Bipolar Transistor
PRODUCT SUMMARY
V
CES
I
DC 100 A at 119 °C
C
typical at 100 A, 25 °C 1.73 V
V
CE(on)
Package SOT-227
Circuit Single Switch Diode
(Trench IGBT), 100 A
FEATURES
• Trench IGBT technology with positive temperature coefficient
• Square RBSOA
• 10 μs short circuit capability
•HEXFRED recovery
•TJ maximum = 150 °C
• Fully isolated package
• Very low internal inductance ( 5 nH typical)
• Industry standard outline
• UL approved file E78996
• Material categorization: For definitions of compliance
1200 V
please see www.vishay.com/doc?99912
BENEFITS
• Designed for increased operating efficiency in power conversion: UPS, SMPS, welding, induction heating
• Easy to assemble and parallel
• Direct mounting to heatsink
• Plug-in compatible with other SOT-227 packages
• Speed 4 kHz to 30 kHz
• Very low V
• Low EMI, requires less snubbing
VS-GT100DA120U
Vishay Semiconductors
®
antiparallel diodes with ultrasoft reverse
CE(on)
Note
(1)
Revision: 13-Sep-13
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
Continuous collector current I
Pulsed collector current I
Clamped inductive load current I
Diode continuous forward current I
Peak diode forward current I
Gate to emitter voltage V
Power dissipation, IGBT P
Power dissipation, diode P
Isolation voltage V
Maximum continuous collector current must be limited to 100 A to do not exceed the maximum temperature of terminals
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CES
C
CM
LM
FSM
GE
ISOL
TC = 25 °C 258
(1)
T
= 80 °C 174
C
TC = 25 °C 50
F
T
= 80 °C 34
C
TC = 25 °C 893
D
D
= 119 °C 221
T
C
TC = 25 °C 176
= 119 °C 44
T
C
Any terminal to case, t = 1 min 2500 V
1
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1200 V
450
450
180
± 20 V
Document Number: 93196
A
W
VS-GT100DA120U
www.vishay.com
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
BR(CES)
VGE = 0 V, IC = 250 μA 1200 - -
VGE = 15 V, IC = 100 A - 1.73 2.1
Gate threshold voltage V
Temperature coefficient of threshold voltage
V
GE(th)
Collector to emitter leakage current I
Forward voltage drop V
Gate to emitter leakage current I
CE(on)
GE(th)
/TJVCE = VGE, IC = 1 mA (25 °C to 125 °C) - -17.6 - mV/°C
CES
FM
GES
= 15 V, IC = 100 A, TJ = 125 °C - 1.98 2.2
V
GE
VCE = VGE, IC = 7.5 mA 4.9 5.9 7.9
VGE = 0 V, VCE = 1200 V - 0.6 100 μA
= 0 V, VCE = 1200 V, TJ = 125 °C - 0.6 10 mA
V
GE
IF = 40 A, VGE = 0 V - 2.81 3.3
= 40 A, VGE = 0 V, TJ = 125 °C - 3.07 3.4
I
F
VGE = ± 20 V - - ± 200 nA
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Reverse bias safe operating area RBSOA
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
Short circuit safe operating area SCSOA
on
off
tot
on
off
tot
d(on)
d(off)
rr
rr
rr
rr
IC = 100 A, VCC = 720 V, V
= 15 V, Rg = 5 
GE
L = 500 μH, T
= 25 °C
J
Energy losses include tail and
IC = 100 A, VCC = 720 V, V
= 15 V, Rg = 5 
GE
r
f
L = 500 μH, T
= 150 °C, IC = 450 A, Rg = 22 
T
J
V
= 15 V to 0 V, VCC = 900 V,
GE
= 1200 V, L = 500 μH
V
P
= 125 °C
J
diode recovery (see fig. 20)
IF = 50 A, dIF/dt = 200 A/μs, Vrr = 400 V
rr
IF = 50 A, dIF/dt = 200 A/μs,
= 400 V, TJ = 125 °C
V
rr
rr
= 150 °C, Rg = 22 ,
T
J
V
= 15 V to 0 V, VCC = 900 V,
GE
= 1200 V
V
p
Vishay Semiconductors
VCollector to emitter voltage V
V
-5.2-
-7.1-
-12.3-
-6.1-
-9.8-
-15.9-
- 350 -
-75-
- 374 -
- 493 -
Fullsquare
- 164 194 ns
-1215A
- 994 1455 nC
- 230 273 ns
-16.520 A
- 1864 2730 nC
10 μs
mJ
ns
Revision: 13-Sep-13
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Document Number: 93196
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VS-GT100DA120U
Allowable Case Temperature (°C)
IC - Continuous Collector Current (A)
0
93196_01
40 80 120 200160 240 280
0
160
100
120
140
20
40
60
80
IGBT DC
I
C
(A)
VCE (V)
1 10 100 1000 10 000
0.01
0.1
1
93196_02
1000
10
100
Allowable Case Temperature (°C)
IF - Continuous Forward Current (A)
402010 30 50
60
0
100
160
180
0
40
60
140
80
120
20
93196_04
Diode DC
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THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Junction and storage temperature range T
Junction to case
IGBT
Case to heatsink R
Weight -30-g
Mounting torque --1.3Nm
Case style SOT-227
Fig. 1 - Maximum DC IGBT Collector Current vs.
Case Temperature
J
R
, T
thJC
thCS
Stg
Flat, greased surface - 0.1 -
300
275
250
225
200
175
150
(A)
C
I
125
100
75
50
25
0
04.00.5 1.0 1.5 2.0 2.5 3.0 3.5
93196_03
Fig. 3 - Typical IGBT Collector Current Characteristics
Vishay Semiconductors
-40 - 150 °C
- - 0.14
TJ = 125 °C
TJ = 25 °C
VCE (V)
V
GE
= 15 V
TJ = 150 °C
°C/WDiode - - 0.71
Revision: 13-Sep-13
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Fig. 2 - IGBT Reverse Bias SOA
T
= 150 °C, VGE = 15 V
J
Fig. 4 - Maximum DC Forward Current vs.
3
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Case Temperature
Document Number: 93196
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I
F
(A)
VFM (V)
07123456
0
93196_05
200
100
75
175
50
150
25
125
TJ = 25 °C
TJ = 125 °C
TJ = 150 °C
I
CES
(mA)
V
CES
(V)
100 1300300 500 700 900 1100
0.00001
93196_06
10
0.1
0.01
0.001
0.0001
1
TJ = 25 °C
TJ = 125 °C
TJ = 150 °C
V
geth
(V)
IC (mA)
081246357
3.0
3.5
4.0
4.5
5.0
5.5
93196_07
6.0
TJ = 25 °C
TJ = 125 °C
V
CE
(V)
TJ (°C)
20 16040 80 12060 100 140
1.00
1.50
2.00
93196_08
2.75
1.25
1.75
2.25
2.50
100 A
150 A
50 A
27 A
Energy (mJ)
IC (A)
20 30 50 907040 60 10080 110
1
93196_09
11
5
9
7
3
6
10
8
4
2
E
on
E
off
VS-GT100DA120U
Vishay Semiconductors
Fig. 5 - Typical Diode Forward Characteristics
Fig. 6 - Typical IGBT Zero Gate Voltage Collector Current
Fig. 8 - Typical IGBT Collector to Emitter Voltage vs.
Junction Temperature, V
Fig. 9 - Typical IGBT Energy Loss vs. I
TJ = 125 °C, L = 500 μH, VCC = 720 V,
R
= 5 , VGE = 15 V
g
1000
t
d(off)
t
d(on)
t
= 15 V
GE
C
f
Revision: 13-Sep-13
Fig. 7 - Typical IGBT Threshold Voltage
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Switching Time (ns)
93196_10
4
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100
t
r
10
20 30 50 70 9060 80 10040 110
IC (A)
Fig. 10 - Typical IGBT Switching Time vs. I
TJ = 125 °C, L = 500 μH, VCC = 720 V,
R
= 5 , VGE = 15 V
g
Document Number: 93196
C
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Q
rr
(nC)
dIF/dt (A/μs)
100 1000
0
93196_15
3000
1000
1500
2500
2000
500
TJ = 125 °C
TJ = 25 °C
VS-GT100DA120U
Vishay Semiconductors
40
35
30
25
20
Energy (mJ)
15
10
5
01020 4030 50
93196_11
Fig. 11 - Typical IGBT Energy Loss vs. R
10 000
1000
100
Switching Time (ns)
10
010 304020 50
93196_12
Fig. 12 - Typical IGBT Switching Time vs. R
TJ = 125 °C, L = 500 μH, VCC = 720 V,
E
on
E
off
Rg (Ω)
TJ = 125 °C, IC = 100 A, L = 500 μH,
V
= 720 V, VGE = 15 V
CC
t
d(on)
t
f
t
r
Rg (Ω)
I
= 100 A, VGE = 15 V
C
t
d(off)
310
290
270
250
230
210
(ns)
190
rr
t
170
150
130
110
90
93196_13
g
45
40
35
30
25
(A)
rr
I
20
15
10
5
0
93196_14
g
TJ = 25 °C
100
Fig. 13 - Typical t
100
Fig. 14 - Typical I
V
= 400 V, IF = 50 A
rr
TJ = 125 °C
V
= 400 V, IF = 50 A
rr
TJ = 125 °C
dIF/dt (A/μs)
Diode vs. dIF/dt
rr
TJ = 25 °C
dIF/dt (A/μs)
Diode vs. dIF/dt
rr
1000
1000
Revision: 13-Sep-13
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 15 - Typical Q
V
= 400 V, IF = 50 A
rr
Diode vs. dIF/dt
rr
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Document Number: 93196
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0.001
0.01
0.1
1
0.00001
93196_16
0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
Z
thJC
- Thermal Impedance
Junction to Case (°C/W)
10
D = 0.50 D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01 DC
0.001
0.01
0.1
10
1
0.00001
93196_17
0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
Z
thJC
- Thermal Impedance
Junction to Case (°C/W)
10
D = 0.50 D = 0.20 D = 0.10 D = 0.05 D = 0.02 D = 0.01 DC
VS-GT100DA120U
Vishay Semiconductors
Fig. 16 - Maximum Thermal Impedance Z
Fig. 17 - Maximum Thermal Impedance Z
Characteristics (IGBT)
thJC
Characteristics (Diode)
thJC
Revision: 13-Sep-13
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Document Number: 93196
VS-GT100DA120U
L
Diode clamp/
D.U.T.
D.U.T./
driver
- 5 V
+
-
R
g
V
CC
+
-
t = 5 µs
t
d(on)
t
f
t
r
90 %
t
d(off)
10 %
90 %
10 %
5 %
V
C
I
C
E
on
E
off
Ets = (Eon + E
off
)
1
2
3
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L
V
*
50 V
C
1000 V
1
* Driver same type as D.U.T.; VC = 80 % of V * Note: Due to the 50 V power supply, pulse width and inductor will increase to obtain Id
Fig. 18a - Clamped Inductive Load Test Circuit Fig. 18b - Pulsed Collector Current Test Circuit
D.U.T.
2
ce(max)
Vishay Semiconductors
V
CC
R =
I
CM
D.U.T.
R
g
+
-
V
CC
Fig. 19a - Switching Loss Test Circuit
Fig. 19b - Switching Loss Waveforms Test Circuit
Revision: 13-Sep-13
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Document Number: 93196
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ORDERING INFORMATION TABLE
VS-GT100DA120U
Vishay Semiconductors
Device code
CIRCUIT CONFIGURATION
VS-
G T 100 D A 120 U
51 32 4 6 7 8
- Vishay Semiconductors product
1
2
- Insulated Gate Bipolar Transistor (IGBT)
3
- T = Trench IGBT technology
4
- Current rating (100 = 100 A)
5
- Circuit configuration (D = Single switch with antiparallel diode)
6
- Package indicator (A = SOT-227)
- Voltage rating (120 = 1200 V)
7
- Speed/type (U = Ultrafast)
8
3 (C)
2 (G)
1, 4 (E)
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95036
Packaging information www.vishay.com/doc?95037
Revision: 13-Sep-13
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Document Number: 93196
DIMENSIONS in millimeters (inches)
38.30 (1.508)
37.80 (1.488)
-A-
4
12
3
12.50 (0.492)
7.50 (0.295)
Ø 4.40 (0.173) Ø 4.20 (0.165)
30.20 (1.189)
29.80 (1.173)
15.00 (0.590)
6.25 (0.246)
25.70 (1.012)
25.20 (0.992)
-B-
R full
Chamfer
2.00 (0.079) x 45°
2.10 (0.082)
1.90 (0.075)
8.10 (0.319)
7.70 (0.303)
4 x
2.10 (0.082)
1.90 (0.075)
-C-
0.12 (0.005)
12.30 (0.484)
11.80 (0.464)
MMM
0.25 (0.010)
CA B
4 x M4 nuts
Outline Dimensions
Vishay Semiconductors
SOT-227
Notes
• Dimensioning and tolerancing per ANSI Y14.5M-1982
• Controlling dimension: millimeter
Document Number: 95036 For technical questions, contact: indmodules@vishay.com Revision: 28-Aug-07 1
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Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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