C&H Technology VS340LM-CS05CB User Manual

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VS340LM..CS05CB Series

Fast Recovery Diodes

Vishay High Power Products

PRODUCT SUMMARY

Junction size Rectangular 350 x 230 mils

Wafer size 4"

class 1000/1200 V

V

RRM

Passivation process Glassivated MOAT

Reference Vishay HPP

packaged part

60EPF Series

FEATURES

• 100 % tested at probe

• Bondable top metal

• Wafer in box, and die in chip carrier

RoHS

COMPLIANT

MAJOR RATINGS AND CHARACTERISTICS

PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS

Maximum forward voltage V

Maximum repetitive reverse voltage V

Note

(1)

Nitrogen flow on die edge

RRM

FM

(1)

TJ = 25 °C, IF = 60 A 1300 mV

TJ = 25 °C, I

= 100 µA 1000/1200 V

RRM

MECHANICAL DATA

Nominal back metal composition (thickness) Cr-Ni-Ag (1 kÅ - 4 kÅ - 6 kÅ)

Nominal front metal composition (thickness) 100 % Al (20 µm)

Chip dimensions 350 x 230 mils (8.89 x 5.84 mm) - see dimensions (link at the end of datasheet)

Wafer diameter 100 mm, with standard < 110 > flat

Wafer thickness 260 µm

Maximum width of sawing line 45 µm

Reject ink dot size Ø 0.25 mm minimum

Ink dot location See dimensions (link at the end of datasheet)

Recommended storage environment Storage in original container, in desiccated nitrogen, with no contamination

Document Number: 93899 For technical questions, contact: [e-mail]
Revision: 28-Mar-08 1

www.vishay.com

VS340LM..CS05CB Series

Vishay High Power Products

ORDERING INFORMATION TABLE

Device code

VS 340 L M 12 C S05 CB

1 - Vishay HPP device

2 - Chip dimension in mils

3 - Type of device: L = Wire bondable fast recovery diode

4 - Passivation process: M = Glassivated MOAT

- Voltage code x 100 = V

5

6

- Metallization: C = Aluminum (anode) - silver (cathode)

7 -t

8 - CB = Probed uncut die (wafer in box)

Fast Recovery Diodes

51324678

RRM

code: S05 = 500 ns

rr

None = Probed die in chip carrier

Available class

10 = 1000 V
12 = 1200 V

LINKS TO RELATED DOCUMENTS

Dimensions http://www.vishay.com/doc?95128

www.vishay.com For technical questions, contact: [e-mail]
2 Revision: 28-Mar-08

Document Number: 93899