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HFA80FA120P
Vishay High Power Products
SOT-227
PRODUCT SUMMARY
VR 1200 V
V
(typical) 2.6 V
F
t
(typical) 25 ns
rr
at T
I
F(DC)
C
HEXFRED
®
Ultrafast Soft Recovery Diode, 80 A
FEATURES
1
2
40 A at 60 °C
4
3
• Fast recovery time characteristic
• Electrically isolated base plate
• Large creepage distance between terminal
• Simplified mechanical designs, rapid assembly
• UL pending
• Totally lead (Pb)-free
• Designed and qualified for industrial level
DESCRIPTION/APPLICATIONS
The dual diode series configuration (HFA80FA120P) is used
for output rectification or freewheeling/clamping operation
and high voltage application.
The semiconductor in the SOT-227 package is isolated from
the copper base plate, allowing for common heatsinks and
compact assemblies to be built.
These modules are intended for general applications such as
HV power supplies, electronic welders, motor control and
inverters.
RoHS
COMPLIANT
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Cathode to anode voltage V
Continuous forward current I
Maximum repetitive forward current I
Maximum power dissipation P
RMS isolation voltage V
Operating junction and storage
temperature range
T
J
F
FSM
FRM
ISOL
, T
R
TC = 60 °C 40
TJ = 25 °C 400
Rated V
D
TC = 25 °C 178
T
C
Any terminal to case, t = 1 min 2500 V
Stg
square wave, 20 kHz, TC = 60 °C 72
R,
= 100 °C 71
1200 V
ASingle pulse forward current I
W
- 55 to + 150 °C
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Cathode to anode
breakdown voltage
Forward voltage V
Reverse leakage current I
Junction capacitance C
V
BR
FM
RM
IR = 100 µA 1200 - -
IF = 25 A
I
= 40 A - 2.9 3.3
F
I
= 80 A, TJ = 125 °C - 3.4 -
F
VR = VR rated
T
= 125 °C, VR = 0.8 x VR rated - 0.5 2 mA
J
VR = 200 V See fig. 3 - 43 - pF
T
See fig. 1
See fig. 2
-2.63.0
-2.0-µA
V
Document Number: 94075 For technical questions, contact: ind-modules@vishay.com
Revision: 04-Aug-08 1
www.vishay.com
HFA80FA120P
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery
Diode, 80 A
DYNAMIC RECOVERY CHARACTERISTICS (TC = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 25 -
Reverse recovery time t
Peak recovery current I
Reverse recovery charge Q
rr
RRM
= 25 °C
J
T
= 125 °C - 110 -
J
TJ = 25 °C - 5.9 -
T
= 125 °C - 10.8 -
J
TJ = 25 °C - 160 -
rr
T
= 125 °C - 630 -
J
= 40 A
I
F
/dt = - 200 A/µs
dI
F
= 200 V
V
R
-52-
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Junction to case, single leg conducting
Case to heatsink R
Weight -30- g
Mounting torque -1.3-Nm
R
thJC
thCS
Flat, greased and surface - 0.05 -
--0.7
nsT
A
nC
°C/WJunction to case, both legs conducting - - 0.35
www.vishay.com For technical questions, contact: ind-modules@vishay.com
2 Revision: 04-Aug-08
Document Number: 94075