C&H Technology HFA320NJ40CPbF User Manual

6121 Baker Road,
Suite 108
Minnetonka, MN 55345

www.chtechnology.com

Phone [phone]

Fax [phone]

1-800-274-4284

Thank you for downloading this document from C&H Technology, Inc.

Please contact the C&H Technology team for the following questions -

Technical

Application

Assembly

Availability

Pricing

Phone – 1-800-274-4284

E-Mail – [e-mail]

www.chtechnology.com - SPECIALISTS IN POWER ELECTRONIC COMPONENTS AND ASSEMBLIES - www.chtechnology.com

HFA320NJ40CPbF

Vishay High Power Products

Ultrafast Soft Recovery Diode, 320 A

TO-2 44

PRODUCT SUMMARY

I

F(AV)

V

R

at T

I

F(DC)

C

Lug
terminal
anode 1

Base common

cathode

320 A

400 V

255 A at 85 °C

HEXFRED

Lug
terminal
anode 2

®

FEATURES

• Very low Qrr and t

• Lead (Pb)-free

• Designed and qualified for industrial level

BENEFITS

• Reduced RFI and EMI

• Reduced snubbing

DESCRIPTION

HEXFRED® diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems. An
extensive characterization of the recovery behavior for
different values of current, temperature and dI/dt simplifies
the calculations of losses in the operating conditions. The
softness of the recovery eliminates the need for a snubber in
most applications. These devices are ideally suited for
power converters, motors drives and other applications
where switching losses are significant portion of the total
losses.

rr

RoHS

COMPLIANT

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS

Cathode to anode voltage V

Continuous forward current I

Single pulse forward current I

Non-repetitive avalanche energy E

Maximum power dissipation P

Operating junction and storage
temperature range

T

J

F

FSM

AS

, T

R

TC = 25 °C 420

= 85 °C 255

T

C

T

= 115 °C 160

C

Limited by junction temperature 1200

L = 100 µH, duty cycle limited by maximum T

D

TC = 25 °C 625

T

= 100 °C 250

C

Stg

J

400 V

A

1.4 mJ

W

- 55 to 150 °C

ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Cathode to anode
breakdown voltage

Maximum forward voltage V

Maximum reverse
leakage current

Junction capacitance C

Series inductance L

V

BR

FM

I

RM

T

S

IR = 100 µA 400 - -

IF = 160 A

I

= 320 A - 1.30 1.54

F

I

= 160 A, TJ = 125 °C - 1.00 1.20

F

TJ = 125 °C, VR = 400 V See fig. 2 - 0.9 3 mA

VR = 200 V See fig. 3 - 370 500 pF

From top of terminal hole to mounting plane - 5.0 - nH

See fig. 1

- 1.10 1.35

V

Document Number: 94072 For technical questions, contact: [e-mail]
Revision: 01-Aug-08 1

www.vishay.com

HFA320NJ40CPbF

Vishay High Power Products

HEXFRED

®

Ultrafast Soft Recovery

Diode, 320 A

DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Reverse recovery time
See fig. 5

Peak recovery current
See fig. 6

Reverse recovery charge
See fig. 7

Peak rate of recovery current
See fig. 8

dI

t

rr

I

RRM

Q

(rec)M

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL MIN. TYP. MAX. UNITS

Maximum junction and storage temperature range T

Thermal resistance, junction to case

Typical thermal resistance, case to heatsink R

Weight

Mounting torque

Terminal torque 30 (3.4) - 40 (4.6)

Vertical pull --80

2" lever pull --35

Note

(1)

Mounting surface must be smooth, flat, free of burrs or other protrusions. Apply a thin even film or thermal grease to mounting surface.
Gradually tighten each mounting bolt in 5 to 10 lbf ⋅ in steps until desired or maximum torque limits are reached.

IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 45 -

= 25 °C

J

T

= 125 °C - 290 440

J

- 90 140

TJ = 25 °C - 8.7 20

= 160 A

I

T

= 125 °C - 18 30

J

TJ = 25 °C - 420 1100

rr

T

= 125 °C - 2600 7000

J

= 25 °C - 300 -

T

J

/dt

T

= 125 °C - 280 -

J

per leg

per module - - 0.095

F

dI

/dt = 200 A/µs

F

V

= 200 V

R

, T

J

Stg

R

thJC

thCS

- 55 - 150 °C

- - 0.19

-0.10-

-68- g

-2.4-oz.

(1)

30 (3.4) - 40 (4.6)

center hole 12 (1.4) - 18 (2.1)

°C/W

K/W

N ⋅ m

(lbf ⋅ in)

lbf ⋅ in

nsT

A

nC

A/µs

www.vishay.com For technical questions, contact: [e-mail]

Document Number: 94072

2 Revision: 01-Aug-08

HFA320NJ40CPbF

1000

100

10

1

- Instantaneous Forward Current (A)

F

I

0.2 1.80.8

0.4 1.4

Fig. 1 - Maximum Forward Voltage Drop vs.

Instantaneous Forward Current (Per Leg)

10 000

1000

100

10

- Reverse Current (µA)

1

R

I

0.1

100

Fig. 2 - Typical Reverse Current vs.

Ultrafast Soft Recovery

TJ = 150 °C

= 125 °C

T

J

= 25 °C

T

J

0.6 1.0 1.61.2

VFM - Forward Voltage Drop (V)

TJ = 150 °C

TJ = 125 °C

TJ = 25 °C

200

VR - Reverse Voltage (V)

Reverse Voltage (Per Leg)

300

HEXFRED

®

Diode, 320 A

400

Vishay High Power Products

160

140

120

100

80

60

Case Temperature (°C)

40

20

0

0 100 300 500

I

F(AV)

200 400

- DC Forward Current (A)

Maximum Allowable

Fig. 4 - Maximum Allowable Case Temperature vs. DC

Forward Current (Per Leg)

400

350

300

250

200

(ns)

rr

t

150

100

50

0

100

dIF/dt (A/µs)

Fig. 5 - Typical Reverse Recovery Time vs. dI

DC

TJ = 125 °C
TJ = 25 °C

IF = 200 A

= 160 A

I

F

= 70 A

I

F

/dt (Per Leg)

F

1000

10 000

1000

- Junction Capacitance (pF)

T

C

100

1 10 100 1000

TJ = 25 °C

VR - Reverse Voltage (V)

Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage

80

TJ = 125 °C

70

TJ = 25 °C

60

IF = 200 A

50

= 160 A

I

(A)

RRM

I

F

= 70 A

I

F

40

30

20

10

0

100

dIF/dt (A/µs)

Fig. 6 - Typical Recovery Current vs. dI

1000

/dt (Per Leg)

F

(Per Leg)

Document Number: 94072 For technical questions, contact: [e-mail]

www.vishay.com

Revision: 01-Aug-08 3

HFA320NJ40CPbF

Vishay High Power Products

7000

TJ = 125 °C
TJ = 25 °C

6000

(nC)

rr

Q

5000

4000

3000

2000

1000

IF = 200 A

= 160 A

I

F

= 70 A

I

F

0

100

dIF/dt (A/µs)

Fig. 7 - Typical Stored Charge vs. dIF/dt (Per Leg) Fig. 8 - Typical dI

1

HEXFRED

®

Ultrafast Soft Recovery

Diode, 320 A

10 000

1000

/dt (A/µs)

(rec)M

dI

1000

100

100

200 A
160 A
70 A

TJ = 125 °C
TJ = 25 °C

dIF/dt (A/µs)

/dt vs. dIF/dt (Per Leg)

(rec)M

1000

0.1

D = 0.50

0.01

- Thermal Response

thJC

Z

0.001

0.00001 0.0001 0.001 0.01 0.1

Single pulse

(thermal response)

D = 0.33
D = 0.25
D = 0.17
D = 0.08

t1 - Rectangular Pulse Duration (s)

Fig. 9 - Maximum Thermal Impedance Z

Characteristics (Per Leg)

thJC

1

10

www.vishay.com For technical questions, contact: [e-mail]

Document Number: 94072

4 Revision: 01-Aug-08

HFA320NJ40CPbF

HEXFRED

Ultrafast Soft Recovery

Diode, 320 A

L = 70 µH

dIF/dt

adjust

Fig. 10 - Reverse Recovery Parameter Test Circuit

I

F

0

(1)

/dt - rate of change of current

(1) dI

F

through zero crossing

- peak reverse recovery current

(2) I

RRM

- reverse recovery time measured

(3) t

rr

from zero crossing point of negative
going I
through 0.75 I
extrapolated to zero current.

to point where a line passing

F

and 0.50 I

RRM

Fig. 11 - Reverse Recovery Waveform and Definitions

dIF/dt

RRM

G

V

= 200 V

R

®

Vishay High Power Products

0.01 Ω

D.U.T.

D

IRFP250

S

(3)

t

rr

t

a

(2)

I

RRM

t

b

(4)

Q

rr

0.5 I

RRM

dI

/dt

(rec)M

0.75 I

RRM

(4) Q

- area under curve defined by t

rr

and I

RRM

trr x I

(5) dI
current during t

=

Q

rr

/dt - peak rate of change of

(rec)M

portion of t

b

(5)

rr

RRM

2

rr

L = 100 µH

I

L(PK)

High-speed

D.U.T.

Current
monitor

R

g

= 25 Ω

switch

Freewheel

diode

V

d

= 50 V

+

Decay

time

V

(AVAL)

V

R(RATED)

Fig. 12 - Avalanche Test Circuit and Waveforms

Document Number: 94072 For technical questions, contact: [e-mail]

www.vishay.com

Revision: 01-Aug-08 5

HFA320NJ40CPbF

Vishay High Power Products

HEXFRED

®

Ultrafast Soft Recovery

Diode, 320 A

ORDERING INFORMATION TABLE

Device code

Dimensions http://www.vishay.com/doc?95021

HFA 320 NJ 40 C PbF

51324

6

- HEXFRED® family, electron irradiated

1

2 - Average current rating

3 - NJ = TO-244

4

- Voltage rating (400 V)

5

- C = Common cathode

6

- Lead (Pb)-free

LINKS TO RELATED DOCUMENTS

www.vishay.com For technical questions, contact: [e-mail]
6 Revision: 01-Aug-08

Document Number: 94072

Legal Disclaimer Notice

Vishay

Notice

The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.

Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.

Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.

International Rectifier
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product
names noted herein may be trademarks of their respective owners.

®

, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN

®

Document Number: 99901 www.vishay.com
Revision: 12-Mar-07 1