C&H Technology HFA320NJ40CPbF User Manual

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HFA320NJ40CPbF

Vishay High Power Products

Ultrafast Soft Recovery Diode, 320 A

TO-2 44

PRODUCT SUMMARY

I

F(AV)

V

R

at T

I

F(DC)

C

Lug
terminal
anode 1

Base common

cathode

320 A

400 V

255 A at 85 °C

HEXFRED

Lug
terminal
anode 2

®

FEATURES

• Very low Qrr and t

• Lead (Pb)-free

• Designed and qualified for industrial level

BENEFITS

• Reduced RFI and EMI

• Reduced snubbing

DESCRIPTION

HEXFRED® diodes are optimized to reduce losses and
EMI/RFI in high frequency power conditioning systems. An
extensive characterization of the recovery behavior for
different values of current, temperature and dI/dt simplifies
the calculations of losses in the operating conditions. The
softness of the recovery eliminates the need for a snubber in
most applications. These devices are ideally suited for
power converters, motors drives and other applications
where switching losses are significant portion of the total
losses.

rr

RoHS

COMPLIANT

ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS

Cathode to anode voltage V

Continuous forward current I

Single pulse forward current I

Non-repetitive avalanche energy E

Maximum power dissipation P

Operating junction and storage
temperature range

T

J

F

FSM

AS

, T

R

TC = 25 °C 420

= 85 °C 255

T

C

T

= 115 °C 160

C

Limited by junction temperature 1200

L = 100 µH, duty cycle limited by maximum T

D

TC = 25 °C 625

T

= 100 °C 250

C

Stg

J

400 V

A

1.4 mJ

W

- 55 to 150 °C

ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Cathode to anode
breakdown voltage

Maximum forward voltage V

Maximum reverse
leakage current

Junction capacitance C

Series inductance L

V

BR

FM

I

RM

T

S

IR = 100 µA 400 - -

IF = 160 A

I

= 320 A - 1.30 1.54

F

I

= 160 A, TJ = 125 °C - 1.00 1.20

F

TJ = 125 °C, VR = 400 V See fig. 2 - 0.9 3 mA

VR = 200 V See fig. 3 - 370 500 pF

From top of terminal hole to mounting plane - 5.0 - nH

See fig. 1

- 1.10 1.35

V

Document Number: 94072 For technical questions, contact: [e-mail]
Revision: 01-Aug-08 1

www.vishay.com

HFA320NJ40CPbF

Vishay High Power Products

HEXFRED

®

Ultrafast Soft Recovery

Diode, 320 A

DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)

PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS

Reverse recovery time
See fig. 5

Peak recovery current
See fig. 6

Reverse recovery charge
See fig. 7

Peak rate of recovery current
See fig. 8

dI

t

rr

I

RRM

Q

(rec)M

THERMAL - MECHANICAL SPECIFICATIONS

PARAMETER SYMBOL MIN. TYP. MAX. UNITS

Maximum junction and storage temperature range T

Thermal resistance, junction to case

Typical thermal resistance, case to heatsink R

Weight

Mounting torque

Terminal torque 30 (3.4) - 40 (4.6)

Vertical pull --80

2" lever pull --35

Note

(1)

Mounting surface must be smooth, flat, free of burrs or other protrusions. Apply a thin even film or thermal grease to mounting surface.
Gradually tighten each mounting bolt in 5 to 10 lbf ⋅ in steps until desired or maximum torque limits are reached.

IF = 1.0 A, dIF/dt = 200 A/µs, VR = 30 V - 45 -

= 25 °C

J

T

= 125 °C - 290 440

J

- 90 140

TJ = 25 °C - 8.7 20

= 160 A

I

T

= 125 °C - 18 30

J

TJ = 25 °C - 420 1100

rr

T

= 125 °C - 2600 7000

J

= 25 °C - 300 -

T

J

/dt

T

= 125 °C - 280 -

J

per leg

per module - - 0.095

F

dI

/dt = 200 A/µs

F

V

= 200 V

R

, T

J

Stg

R

thJC

thCS

- 55 - 150 °C

- - 0.19

-0.10-

-68- g

-2.4-oz.

(1)

30 (3.4) - 40 (4.6)

center hole 12 (1.4) - 18 (2.1)

°C/W

K/W

N ⋅ m

(lbf ⋅ in)

lbf ⋅ in

nsT

A

nC

A/µs

www.vishay.com For technical questions, contact: [e-mail]

Document Number: 94072

2 Revision: 01-Aug-08