6121 Baker Road,
Suite 108
Minnetonka, MN 55345
www.chtechnology.com
Phone (952) 933-6190
Fax (952) 933-6223
1-800-274-4284
Thank you for downloading this document from C&H Technology, Inc.
Please contact the C&H Technology team for the following questions -
Technical
Application
Assembly
Availability
Pricing
Phone – 1-800-274-4284
E-Mail – sales@chtechnology.com
www.chtechnology.com - SPECIALISTS IN POWER ELECTRONIC COMPONENTS AND ASSEMBLIES - www.chtechnology.com
INT-A-PAK
Vishay High Power Products
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT), 209 A
FEATURES
• Generation 5 Non Punch Through (NPT)
technology
• Ultrafast: Optimized for hard switching operating
frequencies 8 to 60 kHz
•Low V
• 10 µs short circuit capability
• Square RBSOA
•Positive V
• HEXFRED
• Industry standard package
•Al2O3 DBC
• UL pending
• Designed for industrial level and lead (Pb)-free
CE(on)
temperature coefficient
CE(on)
®
antiparallel diode with ultrasoft reverse
recovery characteristics
GB200TS60NPbF
RoHS
COMPLIANT
PRODUCT SUMMARY
V
CES
DC 209 A
I
C
at 100 A, 25 °C 2.6 V
V
CE(on)
600 V
BENEFITS
• Benchmark efficiency for UPS and welding application
• Rugged transient performance
• Direct mounting on heatsink
• Very low junction to case thermal resistance
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
Continuous collector current I
Pulsed collector current I
Clamped inductive load current I
Diode continuous forward current I
Gate to emitter voltage V
Maximum power dissipation P
Isolation voltage V
CES
C
CM
LM
F
GE
D
ISOL
TC = 25 °C 209
= 80 °C 142
T
C
TC = 25 °C 178
= 80 °C 121
T
C
TC = 25 °C 781
T
= 80 °C 438
C
Any terminal to case, t = 1 min 2500 V
600 V
400
400
± 20 V
A
W
Document Number: 94503 For technical questions, contact: ind-modules@vishay.com
Revision: 07-May-08 1
www.vishay.com
GB200TS60NPbF
Vishay High Power Products
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT),
209 A
ELECTRICAL CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
Gate threshold voltage V
Collector to emitter leakage current I
Diode forward voltage drop V
Gate to emitter leakage current I
BR(CES)VGE
CE(on)
GE(th)
CES
FM
GES
= 0 V, IC = 500 µA 600 - -
VGE = 15 V, IC = 100 A - 1.95 2.1
= 15 V, IC = 200 A - 2.6 2.84
V
GE
= 15 V, IC = 100 A, TJ = 125 °C - 2.28 2.5
V
GE
= 15 V, IC = 200 A, TJ = 125 °C - 3.14 3.48
V
GE
VCE = VGE, IC = 500 µA 3 4.2 6
VGE = 0 V, VCE = 600 V - 0.005 0.2
V
= 0 V, VCE = 600 V, TJ = 150 °C - 0.01 15
GE
IC = 100 A - 1.39 1.78
= 200 A - 1.64 2.2
I
C
= 100 A, TJ = 125 °C - 1.32 1.69
I
C
= 200 A, TJ = 125 °C - 1.67 2.30
I
C
VGE = ± 20 V - - ± 200 nA
V Collector to emitter voltage V
mA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
on
off
tot
on
off
tot
d(on)
r
d(off)
f
Reverse bias safe operating area RBSOA
Short circuit safe operating area SCSOA
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
rr
rr
rr
rr
rr
rr
IC = 200 A, VCC = 360 V, VGE = 15 V,
R
= 10 Ω, L = 200 µH
G
IC = 200 A, VCC = 360 V, VGE = 15 V,
= 10 Ω, L = 200 µH, TJ = 125 °C
R
G
= 150 °C, IC = 400 A,
T
J
= 27 Ω, V GE = 15 V to 0
R
G
T
= 150 °C, VCC = 400 V, VP = 600 V,
J
R
= 27 Ω, V GE = 15 V to 0
G
IF = 50 A, dIF/dt = 200 A/µs,
V
= 400 V, TJ = 25 °C
CC
IF = 50 A, dIF/dt = 200 A/µs,
V
= 400 V, TJ = 125 °C
CC
-3 . 6 5-
-6 . 9-
- 10.55 -
-3 . 8-
mJ
-7 . 8-
- 11.6 -
- 507 -
- 133 -
- 538 -
ns
-9 2-
Fullsquare
10 - -
- 226 260 ns
-1 72 0A
- 1900 2600 nC
- 290 330 ns
-2 53 0A
- 3600 5000 nC
www.vishay.com For technical questions, contact: ind-modules@vishay.com
Document Number: 94503
2 Revision: 07-May-08
GB200TS60NPbF
INT-A-PAK "Half-Bridge"
Vishay High Power Products
(Ultrafast Speed IGBT), 209 A
THERMAL - MECHANICAL CHARACTERISTICS
PARAMETER SYMBOL MIN. TYP. MAX. UNITS
Operating junction and storage temperature range T
Junction to case per leg
IGBT
Case to sink per module R
Mounting torque
case to heatsink - - 4
case to terminal 1, 2, 3 - - 3
, T
J
Stg
R
thJC
thCS
Weight - 185 - g
300
Vge = 18V
Vge = 15V
250
Vge = 12V
200
- 40 - 150 °C
-0 . 1 30 . 1 6
°C/W Diode - 0.19 0.32
-0 . 1-
Nm
300
250
200
150
(A)
cE
I
100
50
0
01234
Vge = 9V
VCE(V)
Fig. 1 - Typical IGBT Output Characteristics
T
= 25 °C, tp = 500 µs
J
300
Vge = 18V
Vge = 15V
250
Vge = 12V
200
150
(A)
cE
I
100
50
0
012345
Vge = 9V
VCE(V)
Fig. 2 - Typical IGBT Output Characteristics
T
= 125 °C, tp = 500 µs
J
150
(A)
cE
I
100
50
Tj = 125°C
Tj = 25°C
0
0123456789
VGE(V)
Fig. 3 - Typical Transfer Characteristics
V
= 20 V, tp = 500 µs
CE
3.5
3
2.5
2
1.5
, Collector -to-Emitter Voltage (V)
CE
V
1
04 08 01 2 01 6 0
TJ, Junction Temperature (°C)
Ic = 200A
Ic = 100A
Ic = 50A
Fig. 4 - Typical Collector to Emitter Voltage vs.
Junction Temperature
Document Number: 94503 For technical questions, contact: ind-modules@vishay.com
www.vishay.com
Revision: 07-May-08 3
GB200TS60NPbF
Vishay High Power Products
200
150
100
(A)
F
I
50
0
160
140
120
100
80
60
, Case Temperature (°C)
40
C
T
20
0
Tj = 125°C
Tj = 25°C
0 . 00 . 51 . 01 . 52 . 0
VF(V)
Fig. 5 - Diode Forward Characteristics,
t
= 500 µs
p
DC
0 50 100 150 200 250
Maximum DC Collector Current (A)
Fig. 6 - Maximum Collector Current vs.
Case Temperature
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT),
209 A
Switching Time (ns)
1000
td(off)
td(on)
tf
100
tr
10
40 60 80 100 120 140 160 180 200 220
IC (A)
Fig. 8 - Typical Switching Time vs. I
TJ = 125 °C, L = 200 µH, VCC = 360 V,
R
= 10 Ω, V GE = 15 V
G
13000
12000
11000
10000
9000
8000
7000
Energy (mJ)
6000
5000
4000
3000
5 101520253035404550
Eoff
Eon
RG ( Ω)
Fig. 9 - Typical Energy Loss vs. R
TJ = 125 °C, L = 200 µH, VCC = 360 V,
I
= 200 A, VGE = 15 V
CE
C
G
8000
7000
6000
5000
4000
3000
Energy (mJ)
2000
1000
0
50 100 150 200
Eoff
IC (A)
Fig. 7 - Typical Energy Loss vs. I
TJ = 125 °C, L = 200 µH, VCC = 360 V,
R
= 10 Ω, V GE = 15 V
G
Eon
C
10000
1000
td(off)
td(on)
tr
100
Energy Time (ns)
tf
10
0 1 02 03 04 05 0
RG ( Ω)
Fig. 10 - Typical Switching Time vs. R
TJ = 125 °C, L = 200 µH, VCC = 360 V,
I
= 200 A, VGE = 15 V
CE
G
www.vishay.com For technical questions, contact: ind-modules@vishay.com
Document Number: 94503
4 Revision: 07-May-08
GB200TS60NPbF
100
90
80
70
60
(A)
RR
I
50
40
30
20
40 80 120 160 200
10 ohm
IF(A)
Fig. 11 - Typical Diode IRR vs. I
TJ = 125 °C
100
90
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT), 209 A
27 ohm
47 ohm
Total Switching Losses (mJ)
F
Fig. 14 - Typical Switching Losses vs. Gate Resistance
Vishay High Power Products
26
25
24
23
22
21
20
19
18
17
16
15
14
13
12
11
5 101520253035404550
RG ( Ω)
T
= 125 °C, L = 200 µH, RG = 10 Ω,
J
V
= 360 V, VGE = 15 V
CC
100
80
70
(A)
RR
I
60
50
40
30
0 1 02 03 04 05 0
RG ( Ω)
Fig. 12 - Typical Diode I
TJ = 125 °C, IF = 200 A
100
90
80
(A)
RR
I
70
60
50
600 700 800 900 1000 1100 1200 1300
RR
vs. R
dIF/ dt (A/μs)
Fig. 13 - Typical Diode I
T
= 125 °C, VCC = 360 V, IF = 200 A, VGE = 15 V
J
vs. dIF/dt
RR
Ic = 200A
10
Ic = 100A
Ic = 50A
Total Switching Losses (mJ)
1
02 55 07 51 0 01 2 5
TJ - Junction Temperature (°C)
G
Fig. 15 - Typical Switching Losses vs.
Junction Temperature;
L = 200 µH, R
12
11
10
9
8
7
6
5
4
Total Switching Losses (mJ)
3
2
40 60 80 100 120 140 160 180 200 220
= 10 Ω, V CC = 360 V, VGE = 15 V
G
IC(A)
Fig. 16 - Typical Switching Losses vs.
Collector to Emitter Current;
T
= 125 °C,RG1 = 10 Ω, R G2 = 0 Ω, V CC = 360 V, VGE = 15 V
J
Document Number: 94503 For technical questions, contact: ind-modules@vishay.com
www.vishay.com
Revision: 07-May-08 5
GB200TS60NPbF
Vishay High Power Products
1
)
thJC
D = 0.5
0.1
D = 0.2
D = 0.1
D = 0.05
0.01
D = 0.02
Thermal response (Z
)
thJC
Thermal response (Z
D = 0.01
0.001
1E-05 1E-04 1E-03 1E-02 1E-01 1E+00 1E+01
Fig. 17 - Maximum Transient Thermal Impedance, Junction to Case (IGBT)
1
D = 0.5
0.1
D = 0.2
D = 0.1
D = 0.05
D = 0.02
0.01
D = 0.01
0.001
1E-05 1E-04 1E-03 1E-02 1E-01 1E+00
Fig. 18 - Maximum Transient Thermal Impedance, Junction to Case (HEXFRED
INT-A-PAK "Half-Bridge"
(Ultrafast Speed IGBT),
209 A
Notes:
Single Pulse
(Thermal Response)
t1, Rectangular Pulse Duration (sec)
Single Pulse
(Thermal Response)
t1, Rectangular Pulse Duration (sec)
1. Duty Factor D = t1/t2
2. Peak Tj = Pdm x ZthJC + Tc
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = Pdm x ZthJC + Tc
®
)
www.vishay.com For technical questions, contact: ind-modules@vishay.com
Document Number: 94503
6 Revision: 07-May-08
GB200TS60NPbF
(Ultrafast Speed IGBT), 209 A
ORDERING INFORMATION TABLE
Device code
G B 200 T S 60 N PbF
1 - Insulated Gate Bipolar Transistor (IGBT)
2 - B = IGBT Generation 5 NPT
3 - Current rating (200 = 200 A)
4 - Circuit configuration (T = Half-bridge)
5 - Package indicator (S = INT-A-PAK)
6 - Voltage rating (60 = 600 V)
7 - Speed/type (N = Ultrafast IGBT)
8 - Lead (Pb)-free
INT-A-PAK "Half-Bridge"
5 13 24678
Vishay High Power Products
CIRCUIT CONFIGURATION
3
6
7
1
4
5
2
LINKS TO RELATED DOCUMENTS
Dimensions http://www.vishay.com/doc?95173
Document Number: 94503 For technical questions, contact: ind-modules@vishay.com
Revision: 07-May-08 7
www.vishay.com
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000 www.vishay.com
Revision: 18-Jul-08 1