A 4.79 121.7
B 2.44 62.0
C 0.51 13.0
D 4.49 114.05
E 4.33±0.02 110.0±0.5
F 3.89 99.0
G 3.72 94.5
H 0.16 4.06
J 0.51 13.09
K 0.15 3.81
L 0.45 11.43
M 0.6 15.24
N 0.22 Dia. 5.5 Dia.
P 2.13 54.2
Q 1.53 39.0
R 1.97±0.02 50.0±0.5
S 2.26 57.5
T 0.30 7.75
U 0.59 15.0
Dimensions Inches Millimeters
V 0.3 7.62
W 0.46 11.66
X 0.16 4.2
Y 0.08 Dia. 2.1 Dia.
Z 0.27 7.0
AA 0.81 20.5
AB 0.67 17.0
AC 0.12 3.0
AD 0.14 3.5
AE 0.03 0.8
AF 0.15 3.75
AG 0.05 1.15
AH 0.025 0.65
AJ 0.29 7.4
AK 0.047 1.2
AL 0.49 12.5
AM 0.06 1.5
AN 0.17 Dia. 4.3 Dia.
AP 0.10 Dia. 2.5 Dia.
NX-Series CIB Module
(3Ø Converter + 3Ø Inverter + Brake)
75 Amperes/600 Volts
AK
AP
1
Description:
CIBs are low profile and thermally
efficient. Each module consists of
a three-phase diode converter section, a three-phase inverter section
and a brake circuit. A thermistor is
included in the package for sensing the baseplate temperature. 5th
Generation CSTBT chips yield low
loss.
Features:
£ Low Drive Power
£ Low V
CE(sat)
£ Discrete Super-Fast Recovery
Free-Wheel Diode
£ Isolated Baseplate for Easy
Heat Sinking
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM75MX-12A is a 600V (V
75 Ampere CIB Power Module.
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Characteristics Symbol CM75MX-12A Units
Inverter Part IGBT/FWDi
Collector-Emitter Voltage (G-E Short) V
Gate-Emitter Voltage (C-E Short) V
Collector Current (DC, TC = 70°C)
*2,*4
IC 75 Amperes
Collector Current (Pulse)*3 I
Total Power Dissipation (TC = 25°C)
*2,*4
P
Emitter Current*2 I
Emitter Current (Pulse)*3 I
600 Volts
CES
±20 Volts
GES
150 Amperes
CRM
280 Watts
tot
*1
75 Amperes
E
*1
150 Amperes
ERM
Brake Part IGBT/ClampDi
Collector-Emitter Voltage (G-E Short) V
Gate-Emitter Voltage (C-E Short) V
Collector Current (DC, TC = 97°C)
*2,*4
IC 50 Amperes
Collector Current (Pulse)*3 I
Total Power Dissipation (TC = 25°C)
*2,*4
P
Repetitive Peak Reverse Voltage V
Forward Current (TC = 25°C)*2 IF 50 Amperes
Forward Current (Pulse)*3 I
600 Volts
CES
±20 Volts
GES
100 Amperes
CRM
280 Watts
tot
600 Volts
RRM
100 Amperes
FRM
Converter Part ConvDi
Repetitive Peak Reverse Voltage V
Recommended AC Input Voltage Ea 220 Volts
DC Output Current (3-Phase Full Wave Rectifying, f = 60Hz,TC = 125°C)
Surge Forward Current (Sine Half-wave 1 Cycle Peak Value, f = 60Hz, Non-repetitive) I
Current Square Time (Value for One Cycle of Surge Current) I2t 2340 A2s
Module
Isolation Voltage (Charged Part to Baseplate, RMS, f = 60Hz, AC 1 min.) V
Junction Temperature Tj -40 ~ +150 °C
Storage Temperature T
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*2 Junction temperature (Tj) should not increase beyond maximum junction temperature (T
*3 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface (mounting side) of the baseplate
and the heatsink side just under the chips. Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Brake Part IGBT/ClampDi
Collector Cutoff Current I
Gate Leakage Current I
Gate-Emitter Threshold Voltage V
Collector-Emitter Saturation Voltage V
Tj = 125°C, IC = 50A, VGE = 15V*5 — 1.9 — Volts
IC = 50A, VGE = 15V, Chip — 1.6 — Volts
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge QG VCC = 300V, IC = 50A, VGE = 15V — 200 — nC
Internal Gate Resistance rg TC = 25°C — 0 — Ω
Repetitive Reverse Current I
Forward Voltage Drop VF Tj = 25°C, IF = 50A*5 — 2.0 2.8 Volts
Tj = 125°C, IF = 50A*5 — 1.95 — Volts
IF = 50A, Chip — 1.9 — Volts
External Gate Resistance RG 13 — 125 Ω
VCE = V
CES
VGE = V
GES
IC = 5mA, VCE = 0V 5 6 7 Volts
GE(th)
Tj = 25°C, IC = 50A, VGE = 15V*5 — 1.7 2.1 Volts
CE(sat)
— — 9.3 nF
ies
VCE = 10V, VGE = 0V — — 1.0 nF
oes
— — 0.3 nF
res
VR = V
RRM
, VGE = 0V — — 1.0 mA
CES
, VCE = 0V — — 0.5 µA
GES
— — 1.0 mA
RRM
Converter Part
Repetitive Peak Reverse Current I
Forward Voltage Drop VF IF = 75A*5 — 1.2 1.6 Volts
NTC Thermistor Part
Zero Power Resistance R25 TC = 25°C*4 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R R
B Constant B
Power Dissipation P25 TC = 25°C*4 — — 10 mW
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*6 B
R
R25; Resistance at Absolute Temperature T25 [K]; T25 = 25 [°C] + 273.15 = 298.15 [K]
R50; Resistance at Absolute Temperature T50 [K]; T50 = 50 [°C] + 273.15 = 323.15 [K]
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case R
Thermal Resistance, Junction to Case R
Thermal Resistance, Junction to Case R
Thermal Resistance, Junction to Case R
Thermal Resistance, Junction to Case R
Contact Thermal Resistance R
Thermal Grease Applied
Q Per Inverter IGBT*4 — — 0.44 °C/W
th(j-c)
D Per Inverter FWDi*4 — — 0.85 °C/W
th(j-c)
Q Brake IGBT*4 — — 0.44 °C/W
th(j-c)
D Brake ClampDi*4 — — 0.85 °C/W
th(j-c)
D Per ConvDi*4 — — 0.24 °C/W
th(j-c)
Case to Heatsink, Per 1 Module — 0.015 — °C/W
th(c-s)
*4,*7
Mechanical Characteristics
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Mounting Torque, M5 Mounting Screws — 31 in-lb
Module Weight (Typical) — 270 Grams
Isolation Voltage, (Charged Part to Baseplate, RMS, f = 60Hz, AC 1 min.) V
Flatness of Baseplate*8 ec ±0 to +100 µm
*4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.