Powerex IGBTMOD™ Modules are
designed for use in switching two
IGBT applications. Each
module consists of a half-bridge
configuration, with each transistor
having a reverse-connected
super-fast recovery free-wheel
diode. All components and interconnects are isolated from the
heat sinking baseplate, offering
simplified system assembly and
thermal management.
Features:
£ Low Drive Power
£ Low V
£
£ Isolated Baseplate for Easy
Applications:
£ High Power UPS
£ Large Motor Drives
£ Utility Interface Inverters
Ordering Information:
Example: Select the complete
module number you desire from
the table - i.e. CM1400DU-24NF
is a 1200V (V
Dual IGBTMOD Power Module.
(Without Lead Resistance) (Chip) IC = 1400A, VGE = 15V, Tj = 125°C*4 – 2.0 – Volts
Module Lead Resistance R
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
IC = 1400A, Terminal-Chip – 0.286 – mΩ
(lead)
– – 220 nF
ies
VCE = 10V, VGE = 0V – – 25 nF
oes
– – 4.7 nF
res
Total Gate Charge QG VCC = 600V, IC = 1400A, VGE = 15V – 7200 – nC
Turn-on Delay Time t
– – 800 ns
d(on)
Turn-on Rise Time tr VCC = 600V, IC = 1400A, – – 300 ns
Turn-off Delay Time t
VGE = ±15V, – – 1000 ns
d(off)
Turn-off Fall Time tf RG = 0.22Ω, Inductive Load, – – 300 ns
Reverse Recovery Time t
Reverse Recovery Charge Q
Emitter-Collector Voltage V
(Without Lead Resistance) (Chip)
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*2 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
*3 Junction temperature (Tj) should not increase beyond maximum junction temperature (T
*4 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*5 Case temperature (TC') measured point is just under the chips. If you use this value, Rth(f-a) should be measured just under the chips.
*8 The operation temperature is restrained by the permission temperature of female connector.
Thermal and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case*7 R
Thermal Resistance, Junction to Case*7 R
Contact Thermal Resistance*6 R
Thermal Grease Applied (1/2 Module)
Thermal Resistance, Junction to Case*5 R
TC Reference Point Under the Chips
Thermal Resistance, Junction to Case*5 R
TC Reference Point Under the Chips
External Gate Resistance RG 0.22 – 2.2 Ω
*5 Case temperature (TC') measured point is just under the chips. If you use this value, Rth(f-a) should be measured just under the chips.
*6 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*7 Case temperature (TC) measured point is shown in the device dtawing.