D 4.79 121.7
E 4.33±0.02 110.0±0.5
F 3.89 99.0
G 3.72 94.5
H 0.83 21.14
J 0.37 6.5
K 2.44 62.0
L 2.26 57.5
M 1.97±0.02 50.0±0.5
N 1.53 39.0
P 0.24 6.0
Q 0.48 12.0
R 0.67 17.0
S 1.53 39.0
T 0.87 22.0
U 0.55 14.0
V 0.54 13.64
W 0.33 8.5
X 0.53 13.5
Y 0.81 20.71
Z 0.9 22.86
AA 0.22 Dia. 5.5 Dia.
AB M5 M5
AC 0.06 1.5
Dimensions Inches Millimeters
AD 0.51 13.0
AE 0.12 3.0
AF 0.21 5.4
AG 0.49 12.5
AH 0.81 20.5
AJ 0.30 7.75
AK 0.28 7.25
AL 0.15 3.81
AM 0.45 11.44
AN 0.14 3.5
AP 0.16 4.06
AQ 0.78 20.05
AR 0.03 0.8
AS 0.27 7.0
AT 0.16 4.2
AU 0.61 15.48
AV 0.60 15.24
AW 0.46 11.66
AX 0.04 1.15
AY 0.02 0.65
AZ 0.29 7.4
BA 0.05 6.2
BB 0.49 12.5
BC 0.17 Dia. 4.3 Dia.
BD 0.10 Dia. 2.5 Dia.
BE 0.08 Dia. 2.1Dia.
Six IGBTMOD™ + Brake
NX-Series Module
100 Amperes/600 Volts
AQ
Description:
Powerex IGBTMOD™ Modules
are designed for use in switching
applications. Each module
consists of six IGBT Transistors in
a three phase bridge configuration
and a seventh IGBT with free-
BA
wheel diode for dynamic braking.
All components and interconnects
are isolated from the heat sinking
baseplate, offering simplified
system assembly and thermal
management.
Features:
£ Low Drive Power
£ Low V
CE(sat)
£ Discrete Super-Fast Recovery
Free-Wheel Diode
£ Isolated Baseplate for Easy
Heat Sinking
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM100RX-12A is a 600V (V
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Characteristics Symbol CM100RX-12A Units
Power Device Junction Temperature Tj -40 to 150 °C
Storage Temperature T
-40 to 125 °C
stg
Mounting Torque, M5 Mounting Screws — 31 in-lb
Mounting Torque, M5 Main Terminal Screws — 31 in-lb
Module Weight (Typical) — 330 Grams
Baseplate Flatness, On Centerline X, Y (See Below) — ±0 ~ +100 µm
Isolation Voltage, AC 1 minute, 60Hz Sinusoidal V
2500 Volts
ISO
Inverter Sector
Collector-Emitter Voltage (G-E Short) V
Gate-Emitter Voltage (C-E Short) V
Collector Current (TC = 75°C)*1 IC 100 Amperes
Peak Collector Current (Pulse)*3 ICM 200 Amperes
Emitter Current (TC = 25°C)*1 I
Peak Emitter Current*3 I
Maximum Collector Dissipation (TC = 25°C)
*1*4
PC 400 Watts
600 Volts
CES
±20 Volts
GES
*2
100 Amperes
E
*2
200 Amperes
EM
Brake Sector
Collector-Emitter Voltage (G-E Short) V
Gate-Emitter Voltage (C-E Short) V
Collector Current (TC = 97°C)*1 IC 50 Amperes
Peak Collector Current (Pulse)*3 ICM 100 Amperes
Maximum Collector Dissipation (TC = 25°C)
*1*4
PC 280 Watts
Repetitive Peak Reverse Voltage (Clamp Diode Part) V
Forward Current (TC = 25°C)*1 I
Forward Current (Pulse)*3 I
*1 Case temperature (TC) and heatsink temperature (Tf) are defined on the surface of the baseplate and heatsink at just under the chip.
*2 IE, IEM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
IF, IFM, I
*3 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
*4 Junction temperature (Tj) should not increase beyond T
BASEPLATE FLATNESS
MEASUREMENT POINT
, VFM and V
RRM
+ : CONVEX
– : CONCAVE
HEATSINK SIDE
represent ratings and characteristics of the clamp diode.
Electrical and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Inverter Sector
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector Cutoff Current I
Gate-Emitter Threshold Voltage V
Gate Leakage Current I
Collector-Emitter Saturation Voltage V
IC = 100A, VGE = 15V, Tj = 125°C*5 — 1.9 — Volts
IC = 100A, VGE = 15V, Chip — 1.6 — Volts
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance C
Total Gate Charge QG VCC = 300V, IC = 100A, VGE = 15V — 270 — nC
Inductive Turn-on Delay Time t
Load Turn-on Rise Time tr VCC = 300V, IC = 100A, — — 100 ns
Switch Turn-off Delay Time t
Time Turn-off Fall Time tf RG = 6.2Ω, IE = 100A, — — 600 ns
Reverse Recovery Time t
Reverse Recovery Charge Qrr*2 — 4.8 — µC
Emitter-Collector Voltage V
IE = 100A, VGE = 0V, Tj = 125°C*5 — 1.95 — Volts
IE = 100A, VGE = 0V, Chip — 1.9 — Volts
VCE = V
CES
IC = 10mA, VCE = 10V 5 6 7 Volts
GE(th)
VGE = V
GES
IC = 100A, VGE = 15V, Tj = 25°C*5 — 1.7 2.1 Volts
CE(sat)
— — 13.3 nF
ies
VCE = 10V, VGE = 0V — — 1.4 nF
oes
— — 0.45 nF
res
— — 100 ns
d(on)
VGE = ±15V, — — 300 ns
d(off)
*2
Inductive Load Switching Operation — — 200 ns
rr
*2
IE = 100A, VGE = 0V, Tj = 25°C*5 — 2.0 2.8 Volts
EC
, VGE = 0V — — 1.0 mA
CES
, VCE = 0V — — 0.5 µA
GES
Thermal and Mechanical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Thermal Resistance, Junction to Case** R
Thermal Resistance, Junction to Case** R
Contact Thermal Resistance** R
Thermal Grease Applied
Internal Gate Resistance R
External Gate Resistance RG 6 — 62 Ω
**Thermal resistance values are per 1 element.
*1 Case temperature (TC) and heatsink temperature (Tf) are defined on the surface of the baseplate and heatsink at just under the chip.
*2 IE, IEM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
IF, IFM, I
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
, VFM and V
RRM
represent ratings and characteristics of the clamp diode.
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance R TC = 25°C*1 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R TC = 100°C, R
B Constant B
B = (InR1 – InR2) / (1/T1 – 1/T2)*6 — 3375 — K
(25/50)
Power Dissipation P25 TC = 25°C*1 — — 10 mW
**Thermal resistance values are per 1 element.
*1 Case temperature (TC) and heatsink temperature (Tf) are defined on the surface of the baseplate and heatsink at just under the chip.
*2 IE, IEM, VEC, trr and Qrr represent ratings and characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
IF, IFM, I
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
, VFM and V
RRM
represent ratings and characteristics of the clamp diode.