A 4.79 121.7
B 2.44 62.0
C 0.51 13.0
D 4.49 114.05
E 4.33±0.02 110.0±0.5
F 3.89 99.0
G 3.72 94.5
H 0.16 4.06
J 0.51 13.09
K 0.15 3.81
L 0.45 11.43
M 0.9 22.86
N 0.22 Dia. 5.5 Dia.
P 2.13 54.2
Q 1.53 39.0
R 1.97±0.02 50.0±0.5
S 2.26 57.5
T 0.30 7.75
Dimensions Inches Millimeters
V 0.088 Dia. 2.25 Dia.
W 0.46 11.66
X 0.16 4.2
Y 0.59 15.0
Z 0.27 7.0
AA 0.81 20.5
AB 0.67 17.0
AC 0.12 3.0
AD 0.14 3.5
AE 0.03 0.8
AF 0.15 3.75
AG 0.05 1.15
AH 0.025 0.65
AJ 0.29 7.4
AK 0.05 1.2
AL 0.49 12.5
AM 0.12 3.0
AN 0.17 Dia. 4.3 Dia.
U 0.102 Dia. 2.6 Dia.
NX-S Series CIB Module
(3Ø Converter + 3Ø Inverter + Brake)
100 Amperes/1200 Volts
AK
U
V
Description:
CIBs are low profile and thermally
efficient. Each module consists of
a three-phase diode converter section, a three-phase inverter section
and a brake circuit. A thermistor is
included in the package for sensing the baseplate temperature. 6th
Generation CSTBT chips yield low
loss.
2
Features:
£ Low Drive Power
£ Low V
CE(sat)
£ Discrete Super-Fast Recovery
Free-Wheel Diode
£ Isolated Baseplate for Easy
Heat Sinking
Applications:
£ AC Motor Control
£ Motion/Servo Control
£ Photovoltaic/Fuel Cell
Ordering Information:
Example: Select the complete
module number you desire from
the table below -i.e.
CM100MXA-24S is a 1200V
(V
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Inverter Part IGBT/FWDi
Characteristics Symbol Rating Units
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 119°C)
*2,*3
IC 100 Amperes
Collector Current (Pulse, Repetitive)*4 I
Total Power Dissipation (TC = 25°C)
Emitter Current (TC = 25°C)
*2,*3
P
*2,*3
I
Emitter Current (Pulse, Repetitive)*4 I
Maximum Junction Temperature T
1200 Volts
CES
±20 Volts
GES
200 Amperes
CRM
750 Watts
tot
*1
100 Amperes
E
*1
200 Amperes
ERM
175 °C
j(max)
Brake Part IGBT/FWDi
Characteristics Symbol Rating Units
Collector-Emitter Voltage (VGE = 0V) V
Gate-Emitter Voltage (VCE = 0V) V
Collector Current (DC, TC = 125°C)
*2,*3
IC 50 Amperes
Collector Current (Pulse, Repetitive)*4 I
Total Power Dissipation (TC = 25°C)
*2,*3
P
Repetitive Peak Reverse Voltage (VGE = 0V) V
Forward Current (TC = 25°C)
*2,*3
I
Forward Current (Pulse, Repetitive)*4 I
Maximum Junction Temperature T
1200 Volts
CES
±20 Volts
GES
100 Amperes
CRM
425 Watts
tot
1200 Volts
RRM
*1
50 Amperes
F
*1
100 Amperes
FRM
175 °C
j(max)
Converter Part ConvDi
Characteristics Symbol Rating Units
Repetitive Peak Reverse Voltage V
Recommended AC Input Voltage Ea 440 V
DC Output Current (3-phase Full Wave Rectifying, TC = 125°C)
*2,*3
IO 100 Amperes
Surge Forward Current (Sine Half Wave 1 Cycle Peak Value, f = 60 Hz, Non-repetitive) I
Current Square Time (Value for One Cycle of Surge Current) I
Maximum Junction Temperature T
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling
diode (FWDi).
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*3 Junction temperature (Tj) should not increase beyond maximum junction
temperature (T
*4 Pulse width and repetition rate should be such that device junction temperature (Tj)
does not exceed T
j(max)
) rating.
j(max)
rating.
205/11 Rev. 2
00
15.2
18.1
31.2
32.6
47.0
48.0
Each mark points to the center position of each chip.
*1 Represent ratings and characteristics of the anti-parallel, emitter-to-collector free wheeling diode (FWDi).
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface (mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure on page 1 for chip location. The heatsink ther mal resistance should be measured just under the chips.
*3 Junction temperature (Tj) should not increase beyond maximum junction temperature (T
*4 Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed T
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Repetitive Peak Reverse Current I
VR = V
RRM
, Tj = 150°C — — 20 mA
RRM
Forward Voltage VF (Terminal) IF = 75A*5 — 1.28 1.8 Volts
NTC Thermistor Part
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance R25 TC = 25°C*2 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R TC = 100°C*2, R
B Constant B
Approximate by Equation*6 — 3375 — K
(25/50)
Power Dissipation P25 TC = 25°C*2 — — 10 mW
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface (mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure on page 1 for chip location. The heatsink ther mal resistance should be measured just under the chips.
*5 Pulse width and repetition rate should be such as to cause negligible temperature rise.
*6 B
(25/50)
R
R25; Resistance at Absolute Temperature T25 [K]; T25 = 25 [°C] + 273.15 = 298.15 [K]
R50; Resistance at Absolute Temperature T50 [K]; T50 = 50 [°C] + 273.15 = 323.15 [K]
*2 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
+ : CONVEX
– : CONCAVE
MOUNTING
X
MOUNTING SIDE
MOUNTING SIDE
Applied Across GB-Es / G*P-*/ G*N-Es 13.5 15.0 16.5 Volts
GE(on)
93.0
110.9
82.9
102.3
Tr
30
WN
29
Th
Di
28
WN
27
26
Di
25
WP
24
Tr
DiVPTrVPDiUPTr
23
WP
LABEL SIDE
81.3
90.5
99.8
109.1
Y
SIDE
– : CONCAVE
18.2033.9
00
15.2
18.1
31.2
32.6
47.0
48.0
Each mark points to the center position of each chip.