"Full Bridge" IGBT MTP (Ultrafast NPT IGBT), 20 A
PRODUCT SUMMARY
V
CES
I
C(DC)
(typical)
V
CE(on)
= 20 A, 25 °C
at I
C
MTP
600 V
20 A at TC = 97 °C
1.9 V
20MT060KF
Vishay High Power Products
FEATURES
• Generation 5 Non Punch Through (NPT)
technology
•Positive V
• 10 μs short circuit capability
•FRED Pt® hyperfast rectifier
•Low V
CE(on)
• Square RBSOA
• Very low conduction and switching losses
• Very low stray inductance design for high speed operation
• UL approved file E78996
• Speed 8 kHz to 60 kHz
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
BENEFITS
• Optimized for welding, UPS and SMPS applications
• Low EMI, requires less snubbing
• Excellent current sharing in parallel operation
• Direct mounting to heatsink
• PCB solderable terminals
• Very low junction to case thermal resistance
temperature coefficient
CE(on)
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
Continuous collector current I
Pulsed collector current I
Clamped inductive load current I
Diode continuous forward current I
Peak diode forward current I
Gate to emitter voltage V
RMS isolation voltage V
Maximum power dissipation
per single IGBT
Document Number: 93223 For technical questions, contact: indmodules@vishay.com
Revision: 29-Apr-10 1
CES
C
CM
LM
F
FSM
GE
ISOL
P
TC = 25 °C 35
= 80 °C 24
T
C
TC = 95 °C 20
Any terminal to case, t = 1 minute 2500
D
TC = 25 °C 114
T
= 80 °C 64
C
600 V
70
70
70
± 20
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A
V
W
20MT060KF
Vishay High Power Products
"Full Bridge" IGBT MTP
(Ultrafast NPT IGBT), 20 A
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
Temperature coefficient of breakdown voltage ΔV
(BR)CES
Collector to emitter saturation voltage V
Gate threshold voltage V
Temperature coefficient of threshold voltage V
GE(th)
Collector to emitter leaking current I
Diode forward voltage drop V
Gate to emitter leakage current I
(BR)CES
CE(on)
GE(th)
/ΔT
CES
FM
GES
VGE = 0 V, IC = 500 μA 600 - - V
/ΔTJVGE = 0 V, IC = 1 mA (25 to 125 °C) - + 0.6 - V/°C
VGE = 15 V, IC = 20 A - 1.9 2.2
= 15 V, IC = 40 A - 2.57 3.0
V
GE
= 15 V, IC = 20 A, TJ = 125 °C - 2.22 2.5
V
GE
= 15 V, IC = 40 A, TJ = 125 °C - 3.15 3.5
V
GE
VCE = VGE, IC = 250 μA 3.5 4.4 5.5
VCE = VGE, IC = 1 mA (25 to 125 °C) - - 10 - mV/°C
J
VGE = 0 V, V
= 0 V, V
V
GE
= 600 V - 4 100
CE
= 600 V, TJ = 125 °C - 80 200
CE
VGE = 0 V, IF = 20 A - 1.63 1.9
= 0 V, IF = 40 A - 1.88 2.2
V
GE
= 0 V, IF = 20 A, TJ = 125 °C - 1.32 1.6
V
GE
= 0 V, IF = 40 A, TJ = 125 °C - 1.62 1.85
V
GE
VGE = ± 20 V - - ± 200 nA
V
μA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Total gate charge (turn-on) Q
Gate to collector charge (turn-on) Q
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Input capacitance C
Reverse transfer capacitance C
Reverse bias safe operating area RBSOA
Short circuit safe operating area SCSOA
ge
gc
on
off
tot
on
off
tot
d(on)
r
d(off)
f
ies
oes
res
g
IC = 20 A
= 300 V
V
CC
V
= 15 V
GE
VCC = 360 V, IC = 20 A, VGE = 15 V,
= 5 Ω, L = 500 μH,
R
g
energy losses include tail and
diode reverse recovery
VCC = 360 V, IC = 20 A, VGE = 15 V,
R
= 5 Ω, L = 500 μH, TJ = 125 °C,
g
energy losses include tail and
diode reverse recovery
VGE = 0 V
= 30 V
V
CC
f = 1.0 MHz
= 150 °C, IC = 70 A
T
J
V
= 400 V, Vp = 600 V
CC
R
= 22 Ω, VGE = + 15 V to 0 V
g
= 150 °C
T
J
V
= 400 V, Vp = 600 V
CC
R
= 22 Ω, VGE = + 15 V to 0 V
g
www.vishay.com For technical questions, contact: indmodules@vishay.com
2 Revision: 29-Apr-10
-72-
-16-
nCGate to emitter charge (turn-on) Q
-24-
-0.18-
-0.27-
-0.45-
-0.25-
mJ
-0.36-
-0.61-
-67-
-23-
- 101 -
ns
- 127 -
- 1316 -
- 335 -
pFOutput capacitance C
-40-
Fullsquare
10 - - μs
Document Number: 93223
20MT060KF
"Full Bridge" IGBT MTP
Vishay High Power Products
(Ultrafast NPT IGBT), 20 A
RECOVERY SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
rr
IF = 20 A
dI/dt = 200 A/μs
rr
V
rr
rr
IF = 20 A
dI/dt = 200 A/μs, V
rr
T
rr
= 400 V
R
= 125 °C
J
= 400 V
R
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Operating junction temperature range T
Storage temperature range T
Junction to case
IGBT
Case to sink per module R
Clearance External shortest distance in air between 2 terminals 5.5 - -
Creepage
Mounting torque
Weight 66 g
J
Stg
R
thJC
thCS
Shortest distance along external surface of the
insulating material between 2 terminals
A mounting compound is recommended and the
torque should be checked after 3 hours to allow for
the spread of the compound. Lubricated threads.
- 85 106 ns
-4.56 A
- 188 318 nC
- 132 156 ns
-9.511A
- 626 842 nC
- 40 - 150
- 40 - 125
°C
--1.1
°C/WDiode - - 2.1
-0.06-
8--
mm
3 ± 10 % Nm
160
140
120
100
80
60
40
20
Allowable Case Temperature (°C)
0
0
93223_01
IC - Continuous Collector Current (A)
DC
20151053025 35
40
(A)
C
I
93223_02
100
10
1
0.1
0.01
1 10 100 1000
VCE (V)
Fig. 1 - Maximum DC IGBT Collector Current vs. Case Temperature Fig. 2 - IGBT Reverse BIAS SOA
T
= 150 °C; VGE = 15 V
J
Document Number: 93223 For technical questions, contact: indmodules@vishay.com
www.vishay.com
Revision: 29-Apr-10 3