Chip Quik SMDSWLF.020-4OZ Data Sheet

Test J-STD-004 or other
requirements as stated

Test Requirement

Result

Copper Mirror

IPC-TM-650: 2.3.32

L: No breakthrough

Corrosion

IPC-TM-650: 2.6.15

L: No corrosion

Quantitative Halides

IPC-TM-650: 2.3.28.1

L: <0.5%

Electrochemical Migration

IPC-TM-650: 2.6.14.1

L: <1 decade drop (No-clean)

Surface Insulation Resistance 85°C,
85% RH @ 168 Hours

IPC-TM-650: 2.6.3.7

L: ≥100MΩ (No-clean)
Visual

IPC-TM-650: 3.4.2.5

Clear and free from precipitation

Conflict Minerals Compliance

Electronic Industry Citizenship
Coalition (EICC)

Compliant

REACH Compliance

Articles 33 and 67 of Regulation (EC)
No 1907/2006

Contains no substance >0.1% w/w that
is listed as a SVHC or restricted for
use in solder materials

SSMMDDSSW

WLLFF..002200 44OOZZ

Datasheet revision 1.0 www.chipquik.com

Solder Wire SAC305 No-Clean with 2.2% Flux Core 4oz Spool

Product Highlights

2.2% flux core
Made from grade-A virgin metals
Smaller Size
RoHS II and REACH compliant

Specifications

Alloy: Sn96.5/Ag3.0/Cu0.5
Wire Diameter: 0.020”
Flux Type: No-Clean
Flux Classification: ROL0
Melting Point: 217-220°C (423-428°F)
Packaging: 4 oz spool

Test Results

Conforms to the following Industry Standards:

J-STD-004B, Amendment 1 (Solder Fluxes): Yes
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 2 Directive 2011/65/EU: Yes

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