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SSMMDDLLTTLLFFPP5500TT33
Datasheet revision 1.0 www.chipquik.com
Solder Paste No-Clean Sn42/Bi58 in Jar 50g T3 Mesh
Product Highlights
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Print grade
Compatible with enclosed print heads
RoHS II and REACH compliant
Specifications
Alloy: Sn42/Bi58
Mesh Size: T3
Micron (µm) Range: 25-45
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Load: 90% Metal by Weight
Melting Point: 138°C (281°F)
Packaging: Jar 50g
Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months
Printer Operation
Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary
Stencil Life
>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)
Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).
Storage and Handling
Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
(68-77°F) before use.
1 © 1994-2015 Chip Quik® Inc.
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Recommended Profile
Reflow profile for Sn42/Bi58 solder assembly, designed as a starting point for process optimization.
165°C (329°F)
138°C (281°F)
130°C (266°F)
Temperature
90°C (194°F)
25°C (77°F)
Test Results
Test J-STD-004 or other
requirements as stated
Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
Corrosion IPC-TM-650: 2.6.15 L: No corrosion
Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5%
Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean)
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Tack Value IPC-TM-650: 2.4.44 48g
Viscosity – Malcom @ 10 RPM/25°C
3
(x10
mPa/s)
Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation
Conflict Minerals Compliance Electronic Industry Citizenship
REACH Compliance Articles 33 and 67 of Regulation (EC)
Conforms to the following Industry Standards:
J-STD-004B, Amendment 1 (Solder Fluxes): Yes
J-STD-005A (Solder Pastes): Yes
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 2 Directive 2011/65/EU: Yes
0sec
90sec 180sec 210sec 240sec 270sec
Time
Test Requirement Result
IPC-TM-650: 2.6.3.7 L: ≥100MΩ (No-clean)
IPC-TM-650: 2.4.34.4 Print: 125-180, Dispense: 90-130
Compliant
Coalition (EICC)
Contains no substance >0.1% w/w that
No 1907/2006
is listed as a SVHC or restricted for
use in solder materials
2 © 1994-2015 Chip Quik® Inc.
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