Chip Quik SMDLTLFP10 Data Sheet

SSMMDDLLTTLLFFPP1100

Datasheet revision 1.0 www.chipquik.com

Solder Paste No-Clean Sn42/Bi58 in 10cc Syringe 35g T3 Mesh

Product Highlights

Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Dispense grade
Compatible with enclosed print heads
RoHS II and REACH compliant

Specifications

Alloy: Sn42/Bi58
Mesh Size: T3
Micron (µm) Range: 25-45
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Load: 87% Metal by Weight
Melting Point: 138°C (281°F)
Packaging: 10cc/35g Syringe
Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months

Printer Operation

Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary

Stencil Life

>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)

Stencil Cleaning

Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling

Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
(68-77°F) before use.

1 © 1994-2015 Chip Quik® Inc.

Recommended Profile

Reflow profile for Sn42/Bi58 solder assembly, designed as a starting point for process optimization.

165°C (329°F)

138°C (281°F)

130°C (266°F)

Temperature

90°C (194°F)

25°C (77°F)

Test Results

Test J-STD-004 or other
requirements as stated

Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
Corrosion IPC-TM-650: 2.6.15 L: No corrosion
Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5%
Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean)
Surface Insulation Resistance 85°C,

85% RH @ 168 Hours
Tack Value IPC-TM-650: 2.4.44 48g
Viscosity – Malcom @ 10 RPM/25°C

3

(x10

mPa/s)
Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation
Conflict Minerals Compliance Electronic Industry Citizenship

REACH Compliance Articles 33 and 67 of Regulation (EC)

Conforms to the following Industry Standards:

J-STD-004B, Amendment 1 (Solder Fluxes): Yes
J-STD-005A (Solder Pastes): Yes
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 2 Directive 2011/65/EU: Yes

0sec

90sec 180sec 210sec 240sec 270sec

Time

Test Requirement Result

IPC-TM-650: 2.6.3.7 L: ≥100MΩ (No-clean)

IPC-TM-650: 2.4.34.4 Print: 125-180, Dispense: 90-130

Compliant

Coalition (EICC)

Contains no substance >0.1% w/w that

No 1907/2006

is listed as a SVHC or restricted for
use in solder materials

2 © 1994-2015 Chip Quik® Inc.