Chip Quik SMD291AX50T3 Data Sheet

SSMMDD229911AAXX5500TT33

Datasheet revision 1.0 www.chipquik.com

Solder Paste No-Clean Sn63/Pb37 in Jar 50g T3 Mesh

Product Highlights

Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Print grade
Compatible with enclosed print heads
Passes BONO test

Specifications

Alloy: Sn63/Pb37
Mesh Size: T3
Micron (µm) Range: 25-45
Flux Type: Synthetic No-Clean
Flux Classification: REL0
Metal Load: 90.25% Metal by Weight
Melting Point: 183°C (361°F)
Packaging: Jar 50g
Shelf Life: Refrigerated >12 months, Unrefrigerated >6 months

Printer Operation

Print Speed: 25-100mm/sec
Squeegee Pressure: 70-250g/cm of blade
Under Stencil Wipe: Once every 10-25 prints, or as necessary

Stencil Life

>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)

Stencil Cleaning

Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling

Refrigerate at 3-8°C (37-46°F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25°C
(68-77°F) before use.

1 © 1994-2015 Chip Quik® Inc.

Recommended Profile

Reflow profile for Sn63/Pb37 solder assembly, designed as a starting point for process optimization.

235°C (455°F)

183°C (361°F)

150°C (300°F)

Temperature

100°C (200°F)

25°C (77°F)

Test Results

Test J-STD-004 or other
requirements as stated

Copper Mirror IPC-TM-650: 2.3.32 L: No breakthrough
Corrosion IPC-TM-650: 2.6.15 L: No corrosion
Quantitative Halides IPC-TM-650: 2.3.28.1 L: <0.5%
Electrochemical Migration IPC-TM-650: 2.6.14.1 L: <1 decade drop (No-clean)
Surface Insulation Resistance 85°C,
85% RH @ 168 Hours
Tack Value IPC-TM-650: 2.4.44 44g
Viscosity – Malcom @ 10 RPM/25°C

3

mPa/s)

(x10
Visual IPC-TM-650: 3.4.2.5 Clear and free from precipitation
Conflict Minerals Compliance Electronic Industry Citizenship

REACH Compliance Articles 33 and 67 of Regulation (EC)

Conforms to the following Industry Standards:

J-STD-004B, Amendment 1 (Solder Fluxes): Yes
J-STD-005A (Solder Pastes): Yes
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 2 Directive 2011/65/EU: No

0sec

30sec 120sec 150sec 210sec 240sec

Time

Test Requirement Result

IPC-TM-650: 2.6.3.7 L: ≥100MΩ (No-clean)

IPC-TM-650: 2.4.34.4 Print: 210-300, Dispense: 100-140

Compliant

Coalition (EICC)

Contains no substance >0.1% w/w that

No 1907/2006

is listed as a SVHC or restricted for
use in solder materials

2 © 1994-2015 Chip Quik® Inc.