Chip Quik SMD291150G Data Sheet

SSMMDD229911115500GG

Datasheet revision 1.0 www.chipquik.com

Tack Flux No-Clean in Jar 150g

Product Highlights

Ideal for all rework, solder, de-solder and reflow applications
Non-corrosive, non-conductive, no-clean
Tack flux will not run all over PCB when applied
Has a pleasant odor
Excellent wetting
Easily cleaned with isopropyl alcohol (IPA)
Attachment of BGA spheres
Soldering flip chip components
Long stencil life
Wide process window
Clear residue
Can be used with Leaded and Lead-Free applications
RoHS II and REACH compliant

Specifications

Flux Type: Synthetic No-Clean (for Leaded and Lead-Free applications)
Flux Classification: REL0
Packaging: Jar 150g
Shelf Life: Refrigerated >24 months, Unrefrigerated >24 months

Stencil Life

>8 hours @ 20-50% RH 22-28°C (72-82°F)
>4 hours @ 50-70% RH 22-28°C (72-82°F)

Stencil Cleaning

Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling

Store refrigerated or at room temperature 3-25°C (37-77°F). Do not freeze. Allow 4 hours for flux to reach an operating
temperature of 20-25°C (68-77°F) before use.

Conforms to the following Industry Standards:

J-STD-004B, Amendment 1 (Solder Fluxes): Yes
RoHS 2 Directive 2011/65/EU: Yes

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