PRODUCT SPECIFICATION
Customer:
■ Tentative Specification
□ Preliminary Specification
□ Approval Specification
MODEL NO.: V500HK2
SUFFIX: PS1
Rev. A1
APPROVED BY SIGNATURE
Name / Title
Note
Please return 1 copy for your confirmation with your signature and
comments.
Approved By Checked By Prepared By
Chao-Chun Chung
Carlos Lee HT Hung
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PRODUCT SPECIFICATION
CONTENTS
CONTENTS...................................................................................................................................................................... 2
1. GENERAL DESCRIPTION ...........................................................................................................................................5
1.1 OVERVIEW ......................................................................................................................................................... 5
1.2 FEATURES........................................................................................................................................................... 5
1.3 MECHANICAL SPECIFICATIONS..................................................................................................................... 6
2. ABSOLUTE MAXIMUM RATINGS ............................................................................................................................. 7
2.1 ABSOLUTE RATINGS OF ENVIRONMENT......................................................................................................7
2.2 ABSOLUTE RATINGS OF ENVIRONMENT (OPEN CELL) .............................................................................. 8
2.3 ELECTRICAL ABSOLUTE RATINGS ................................................................................................................. 8
2.3.1 TFT LCD MODULE ................................................................................................................................... 8
3. ELECTRICAL CHARACTERISTICS............................................................................................................................. 9
3.1 TFT LCD Module................................................................................................................................................. 9
4. BLOCK DIAGRAM OF INTERFACE ......................................................................................................................... 12
4.1 TFT LCD MODULE ...........................................................................................................................................12
5. INPUT TERMINAL PIN ASSIGNMENT....................................................................................................................13
5.1 TFT LCD OPEN CELL ....................................................................................................................................... 13
5.2 LVDS INTERFACE ............................................................................................................................................ 17
5.3 COLOR DATA INPUT ASSIGNMENT ............................................................................................................. 17
5.4 FLICKER (Vcom) ADJUSTMENT......................................................................................................................19
6. INTERFACE TIMING................................................................................................................................................. 20
6.1 INPUT SIGNAL TIMING SPECIFICATIONS ................................................................................................... 20
6.1.1 Timing spec for Frame Rate = 50Hz ....................................................................................................... 20
6.1.2 Timing spec for Frame Rate = 60Hz ....................................................................................................... 20
6.2 POWER ON/OFF SEQUENCE ......................................................................................................................... 24
7. OPTICAL CHARACTERISTICS ................................................................................................................................. 26
7.1 TEST CONDITIONS .......................................................................................................................................... 26
7.2 OPTICAL SPECIFICATIONS ............................................................................................................................ 27
8. PRECAUTIONS ..........................................................................................................................................................31
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PRODUCT SPECIFICATION
8.1 ASSEMBLY AND HANDLING PRECAUTIONS.............................................................................................. 31
8.2 SAFETY PRECAUTIONS .................................................................................................................................. 32
9. DEFINITION OF LABELS .......................................................................................................................................... 33
9.1 OPEN CELL LABEL ..........................................................................................................................................33
10. PACKAGING............................................................................................................................................................ 35
10.1 PACKING SPECIFICATIONS ......................................................................................................................... 35
10.2 PACKING METHOD....................................................................................................................................... 35
11. MECHANICAL CHARACTERISTIC ....................................................................................................................... 37
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Version Date
Ver. 0.0 11/19, 2012
Page
(New)
All
PRODUCT SPECIFICATION
REVISION HISTORY
Section Description
All Tentative Specification Ver 0.0 was first issued.
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PRODUCT SPECIFICATION
X+C Board
1. GENERAL DESCRIPTION
1.1 OVERVIEW
V500HK2-PS1 is a 50” TFT Liquid Crystal Display product with driver ICs and 2ch-LVDS interface. This product
supports 1920 x 1080 HDTV format and can display true 16.7M colors (8-bit /color). The backlight unit is not
built in.
1.2 FEATURES
CHARACTERISTICS ITEMS SPECIFICATIONS
Pixels [lines] 1920 × 1080
Active Area [mm] 1095.84(H) x (V) 616.41
Sub-Pixel Pitch [mm] 0.21(H) x 0.63(V)
Pixel Arrangement RGB vertical stripe
Weight [g] 2080
Physical Size [mm] 1105.84 (W) x 663.66(H) x(1.305/2.8) Typ.
(Panel /PCBA+Connector)
Display Mode Transmissive mode / Normally black
Contrast Ratio 5000:1 Typ.
(Typical value measured at CMI’s module)
Glass thickness (Array / CF) [mm] 0.5 / 0.5
Viewing Angle (CR>20)
(VA Model)
Color Chromaticity
Cell Transparency [%] 6.7%Typ.
Polarizer Surface Treatment
Rotation Function
Display Orientation
Back Side
+88/-88(H),+88/-88(V) Typ.
(Typical value measured by CMI’s module)
R=(0.661, 0.324)
G=(0.274, 0.594)
B=(0.133, 0.166)
W=(0.304, 0.357)
* Please refer to “color chromaticity” in in 7.2
* Please refer to “Center Transmittance” in 7.2
Anti-Glare coating (Haze 1%)
Unachievable
Signal input with “CMI”
Front Side
CMI
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PRODUCT SPECIFICATION
1.3 MECHANICAL SPECIFICATIONS
Item Min. Typ. Max. Unit Note
Weight - 2080 - g -
I/F connector mounting
position
Note (1) Please refer to the attached drawings for more information of front and back outline dimensions.
Note (2) Connector mounting position
The mounting inclination of the connector makes the
screen center within ± 0.5mm as the horizontal.
+/- 0.5mm
(2)
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PRODUCT SPECIFICATION
2. ABSOLUTE MAXIMUM RATINGS
2.1 ABSOLUTE RATINGS OF ENVIRONMENT
Item Symbol
Storage Temperature TST -20 +60 ºC (1), (3)
Operating Ambient Temperature TOP 0 50 ºC (1), (2), (3)
Note (1) Temperature and relative humidity range is shown in the figure below.
(a) 90 %RH Max. (Ta ≦ 40 ºC).
(b) Wet-bulb temperature should be 39 ºC Max. (Ta > 40 ºC).
(c) No condensation.
Note (2) Thermal management should be considered in final product design to prevent the surface temperature of display
area from being over 65 ºC. The range of operating temperature may degrade in case of improper thermal
management in final product design.
Note (3) The rating of environment is base on LCD module. Leave LCD cell alone, this environment condition can’t be
guaranteed. Except LCD cell, the customer has to consider the ability of other parts of LCD module and LCD
Min. Max.
Value
Unit Note
module process.
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PRODUCT SPECIFICATION
2.2 ABSOLUTE RATINGS OF ENVIRONMENT (OPEN CELL)
Recommended Storage Condition: With shipping package.
Recommended Storage temperature range: 25±5 ℃
Recommended Storage humidity range: 50±10%RH
Recommended Shelf life: a month
2.3 ELECTRICAL ABSOLUTE RATINGS
2.3.1 TFT LCD MODULE
Value
Item Symbol
Min. Max.
Power Supply Voltage VCC -0.3 13.5 V
Logic Input Voltage VIN -0.3 3.6 V
Note (1) Permanent damage to the device may occur if maximum values are exceeded. Function operation
Unit Note
(1)
should be restricted to the conditions described under Normal Operating Conditions.
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PRODUCT SPECIFICATION
Threshold Voltage
Threshold Voltage
(single
-
end)
3. ELECTRICAL CHARACTERISTICS
3.1 TFT LCD Module
(Ta = 25 ± 2 ºC)
Parameter Symbol
Unit Note
Min. Typ. Max.
Power Supply Voltage VCC 10.8 12 13.2 V (1)
Value
Rush Current I
White Pattern PT
Black Pattern PT
Power
consumption
Heavy Loading pattern
Ex: Horizontal Strip
RUSH
－ －
－
－
－
13.68 16.2
13.56 16.08
26.4 32.4
3
A (2)
W
(by cell and platform)
(3)
White Pattern PT
Black Pattern PT
－
－
1.14 1.35
1.13 1.34
Power Supply
Current
Heavy Loading pattern
Ex: Horizontal Strip
PT
－
2.2 2.7
A
(by cell and platform)
Differential Input High
Differential Input Low
V
V
LVTH
LVTL
+100
-300
－
－
+300 mV
-100 mV
LVDS interface
CMOS
interface
Common Input Voltage VCM 1.0 1.2 1.4 V
Differential input voltage
|VID|
Terminating Resistor RT
Input High Threshold Voltage
Input Low Threshold Voltage
VIH 2.7
VIL 0
200
－
－
100
－
－
600 mV
－
ohm
3.3 V
0.7 V
(4)
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PRODUCT SPECIFICATION
Note (1) The module should be always operated within the above ranges. The ripple voltage should be controlled under 10%
of Vcc (Typ.).
Note (2) Measurement condition :
Vcc rising time is 470us
Note (3) The specified power consumption and power supply current is under the conditions at Vcc = 12 V, Ta = 25 ± 2 ºC, fv =
120 Hz, whereas a power dissipation check pattern below is displayed.
a. White Pattern
GND
0.1Vcc
b. Black Pattern
0.9Vcc
470us
Vcc
c. Heavy Loading pattern: Ex Horizontal Strip
Active Area
Active Area
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Note (4) The LVDS input characteristics are as follows:
PRODUCT SPECIFICATION
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4. BLOCK DIAGRAM OF INTERFACE
CN
:
1st:FI-
RE51S
-HF-CM-
R1500
,
JAE
ORX0(+/
-)
ERX0(+/
-)
SELLVDS
VCC
GND
4.1 TFT LCD MODULE
PRODUCT SPECIFICATION
TFT LCD PANEL
(1920x3x1080)
INPUT CONNECTOR
ORX 1(+/-)
ORX 2(+/-)
ORX 3(+/-)
OCLK(+/-)
ERX 1(+/-)
ERX 2(+/-)
ERX 3(+/-)
ECLK(+/-)
X(R) Board X(L) Board
C Board
400
PWM_DIMMING_OUT1
TCON_SCL_IN
PWM_DIMMING_OUT2
TCON_SDA_IN
PWM_DIMMING_OUT3
TCON_I2C_EN
PWM_DIMMING_OUT4
AGING_EN
REF_SYNC_IN
BT_SYNC_OUT
FRC_SCL
FRC_SDA
MAIN_CHECK
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5. INPUT TERMINAL PIN ASSIGNMENT
5.1 TFT LCD OPEN CELL
CN400 Connector Pin Assignment(FI-RE51S-HF-CM-R1500(JAE)
Pin Name Description Note
1 VCC +12V power supply
2 VCC +12V power supply
3 VCC +12V power supply
4 VCC +12V power supply
VCC +12V power supply
5
PWM_DIMMING_
6
OUT4
7 GND Ground
8 GND Ground
PWM4 output for scanning control
PRODUCT SPECIFICATION
9 GND Ground
10 LO[0]- Odd pixel Negative LVDS differential data input. Channel 0
11 LO[0]+ Odd pixel Positive LVDS differential data input. Channel 0
12 LO[1]- Odd pixel Negative LVDS differential data input. Channel 1
(4)
13 LO[1]+ Odd pixel Positive LVDS differential data input. Channel 1
14 LO[2]- Odd pixel Negative LVDS differential data input. Channel 2
15 LO[2]+ Odd pixel Positive LVDS differential data input. Channel 2
16 GND Ground
17 LOCLK- Odd pixel Negative LVDS differential clock input.
(4)
18 LOCLK+ Odd pixel Positive LVDS differential clock input.
19 GND Ground
20 LO[3]- Odd pixel Negative LVDS differential data input. Channel 3
21 LO[3]+ Odd pixel Positive LVDS differential data input. Channel 3
(4)
22 LO[4]- Odd pixel Negative LVDS differential data input. Channel 4
23 LO[4]+ Odd pixel Positive LVDS differential data input. Channel 4
24 GND Ground
25 LE[0]- Even pixel Negative LVDS differential data input. Channel 0
26 LE[0]+ Even pixel Positive LVDS differential data input. Channel 0
27 LE[1]- Even pixel Negative LVDS differential data input. Channel 1
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(4)
PRODUCT SPECIFICATION
28 LE[1]+ Even pixel Positive LVDS differential data input. Channel 1
29 LE[2]- Even pixel Negative LVDS differential data input. Channel 2
(4)
30 LE[2]+ Even pixel Positive LVDS differential data input. Channel 2
31 GND Ground
32 LECLK- Even pixel Negative LVDS differential clock input.
(4)
33 LECLK+ Even pixel Positive LVDS differential clock input.
34 GND Ground
35 LE[3]- Even pixel Negative LVDS differential data input. Channel 3
36 LE[3]+ Even pixel Positive LVDS differential data input. Channel 3
(4)
37 LE[4]- Even pixel Negative LVDS differential data input. Channel 4
38 LE[4]+ Even pixel Positive LVDS differential data input. Channel 4
39 GND Ground
40 TCON_SCL__IN I2C Bus of TCON
41 REF_SYNC_IN Shop Mode Sync
42 BT_SYNC_OUT BT Sync
43 TCON_I2C_EN Bus Switch Enable
44 TCON_SDA_IN I2C Bus of TCON
PWM_DIMMING_
45
OUT2
PWM_DIMMING_
46
OUT3
47 FRC_SCL I2C Bus of FRC
PWM_DIMMING_
48
OUT1
49 FRC_SDA I2C Bus of FRC
50 MAIN_CHECK TCON Board Stand Alone Mode
51 AGING_EN. TCON Aging Enable
PWM2 output for scanning control
PWM3 output for scanning control
PWM1 output for scanning control
Note (1) Reserved for internal use. Please leave it open.
Note (2) Interface optional pin has internal scheme as following diagram. Customer should keep the interface voltage
level requirement which including Panel board loading as below.
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IC
>16K ohm
1K ohm
System Board
Interface Voltage Level
PRODUCT SPECIFICATION
3.3V
Panel Board
VH > V
VL < V
Note (3) Interface optional pin has internal scheme as following diagram.
Customer should keep the interface voltage level requirement which including Panel board loading as below.
Interface Voltage Level
VH > V
VL < V
IH
IL
Panel Board System Board
1K ohm
IH
IL
IC
>16K ohm
Version 0.0 15 Date : Nov. 19. 2012
Note (4) Two pixel data send into the module for every clock cycle. The first pixel of the frame is odd pixel and the second
pixel is even pixel.
Note (5) LVDS connector pin order defined as below
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PRODUCT SPECIFICATION
Note (7) LVDS connector mating dimension range request is 0.93mm~1.0mm as below.
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5.2 LVDS INTERFACE
JEDIA LVDS format
RXCLK±
RXCLK±
PRODUCT SPECIFICATION
Current cycle
Current cycle
ORX0±
ORX0±
ORX1±
ORX1±
ORX2±
ORX2±
ORX3±
ORX3±
ERX0±
ERX0±
ERX1±
ERX1±
ERX2±
ERX2±
ERX3±
ERX3±
R7G2 R6 R5 R4 R3
R7G2 R6 R5 R4 R3
B2 G7B3
B2 G7B3
R7G2 R6 R5 R4 R3
R7G2 R6 R5 R4 R3
B2 G7B3
B2 G7B3
G5 G4G6
G5 G4G6
G5 G4G6
G5 G4G6
R2
R2
G3
G3
B4B6 B5B7VS HSDE
B4B6 B5B7VS HSDE
R0G0 R1G1B1 B0RSVD
R0G0 R1G1B1 B0RSVD
R2
R2
G3
G3
B4B6 B5B7VS HSDE
B4B6 B5B7VS HSDE
R0G0 R1G1B1 B0RSVD
R0G0 R1G1B1 B0RSVD
5.3 COLOR DATA INPUT ASSIGNMENT
The brightness of each primary color (red, green and blue) is based on the 8-bit gray scale data input for the
color. The higher the binary input, the brighter the color. The table below provides the assignment of the color
versus data input.
Data Signal
Color
R7 R6 R5 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 B1 B0
Black
Red
Green
Basic
Colors
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Blue
Cyan
Magenta
Yellow
White
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0
0
1
1
0
0
0
0
0
0
1
1
1
1
1
1
Red Green Blue
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
1
1
1
1
1
1
Red (0) / Dark
PRODUCT SPECIFICATION
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Gray
Scale
Of
Red
Gray
Scale
Of
Green
Gray
Scale
Of
Blue
Red (1)
Red (2)
:
:
Red (253)
Red (254)
Red (255)
Green (0) / Dark
Green (1)
Green (2)
:
:
Green (253)
Green (254)
Green (255)
Blue (0) / Dark
Blue (1)
Blue (2)
:
:
Blue (253)
Blue (254)
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
:
:
:
:
:
:
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1
1
1
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
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0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
:
:
:
:
:
:
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0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
0
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
Blue (255)
Note (1) 0: Low Level Voltage, 1: High Level Voltage
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0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
PRODUCT SPECIFICATION
5.4 FLICKER (Vcom) ADJUSTMENT
(1) Adjustment Pattern:
Column-inversion pattern was shown as below. If customer need below pattern, please directly contact with
Account FAE.
Frame N Frame N+1
(2) Adjustment method: (Digital V-com / Gamma)
Programmable memory IC is used for Digital V-com(Gamma) adjustment in this model. CMI provide Auto
Vcom(Auto Gamma) tools to adjust Digital V-com(Gamma).The detail connection and setting instruction,
please directly contact with Account FAE or refer CMI Auto V-com(Auto Gamma) adjustment OI. Below
items is suggested to be ready before Digital V-com(Gamma) adjustment in customer LCM line.
a. USB Sensor Board.
b. Programmable software
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PRODUCT SPECIFICATION
6. INTERFACE TIMING
6.1 INPUT SIGNAL TIMING SPECIFICATIONS
(Ta = 25 ± 2 ºC)
The input signal timing specifications are shown as the following table and timing diagram.
Signal Item Symbol
F
clkin
Frequency
(=1/TC)
Min. Typ. Max. Unit Note
60 74.25 77 MHz
Input cycle to
T
LVDS
- - 200 ps (2)
rcl
cycle jitter
Receiver
Spread spectrum
Clock
clkin_mod
F
F
-2% - F
clkin
clkin
+2%
MHz
modulation range
Spread spectrum
F
- - 200 KHz
SSM
modulation frequency
LVDS
Receiver
Receiver Skew Margin T
RSKM
-400 - 400 ps (4)
Data
6.1.1 Timing spec for Frame Rate = 50Hz
Signal Item Symbol Min. Typ. Max. Unit Note
Frame rate 2D mode Fr5 47 50 53 Hz (8),(9)
(3)
Vertical
Total Tv 1115 1125 1380 Th
Active
Display
2D Mode
Term
Horizontal
Display Tvd 1080 1080 1080 Th
Blank Tvb 35 45 300 Th
Total Th 1050 1100 1150 Tc
Active
Display
2D Mode
Term
Display Thd 960 960 960 Tc
Blank Thb 90 140 190 Tc
6.1.2 Timing spec for Frame Rate = 60Hz
Signal Item Symbol
2D mode Fr6 57 60 62.5 Hz (8),(9)
Frame rate
3D mode Fr6 60 60 60 Hz (6),(8),(9)
Vertical
Active
2D Mode
Total Tv 1115 1125 1380 Th Tv=Tvd+Tvb
Display Tvd 1080 1080 1080 Th
Tv=Tvd+T
vb
－
－
Th=Thd+T
hb
－
－
Min. Typ. Max. Unit Note
－
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Display
Term
PRODUCT SPECIFICATION
Blank Tvb 35 45 300 Th
Total Tv 1125 Th
－
3D Mdoe
Horizontal
Active
Display
Term
Note (1) Please make sure the range of pixel clock has follow the below equation:
2D Mode
3D Mdoe
Fclkin(max) ≧ Fr6 ╳ Tv ╳ Th
Fr5 ╳ Tv ╳ Th ≧ Fclkin(min)
Display Tvd 1080 Th
Blank Tvb 45 Th
Total Th 1050 1100 1150 Tc Th=Thd+Thb
Display Thd 960 960 960 Tc
Blank Thb 90 140 190 Tc
Total Th 1050 1100 1150 Tc Th=Thd+Thb
Display Thd 960 960 960 Tc
Blank Thb 90 140 190 Tc
(5), (7)
－
－
－
－
VBP max : 150 line
Suggest VBP=VFP=1/2*(Vtotal-Vsidplay)
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PRODUCT SPECIFICATION
DE
T
hb
Valid Display Data (
960
clocks)
T
c
Tv
Tvd
Th
DCLK
Thd
DE
DATA
Note (2) The input clock cycle-to-cycle jitter is defined as below figures. Trcl =｜T1 – T︱
Tvb
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PRODUCT SPECIFICATION
Note (3) The SSCG (Spread spectrum clock generator) is defined as below figures.
Note (4) The LVDS timing diagram and the receiver skew margin is defined and shown in following figure.
RXCLK+/-
RXn+/-
T
Note (5) Please fix the Vertical timing (Vertical Total =1125 / Display =1080 / Blank = 45) in 60Hz 3D mode
Note (6) In 3D mode, the set up Fr6 in Typ. ±3 Hz .In order to ensure that the electric function performance to avoid no display
symptom.(Except picture quality symptom.)
Note (7) In 3D mode, the set up Tv and Tvb in Typ. ±30.In order to ensure that the electric function performance to
avoid no display symptom.(Except picture quality symptom.)
Note (8) The frame-to-frame jitter of the input frame rate is defined as the above figures. FRn = FRn-1 ± 1.8%.
RSKM
Tc
Note (9) The setup of the frame rate jitter > 1.8% may result in the cosmetic LED backlight symptom but the electric function is
not affected.
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PRODUCT SPECIFICATION
500ms
≦T4
0≦T8≦T3
T
13≦10ms
6.2 POWER ON/OFF SEQUENCE
To prevent a latch-up or DC operation of LCD module, the power on/off sequence should be as the diagram
below.
0.9Vcc
0.9Vcc
0V
0.5≦T1≦10ms
0≦T2≦200 ms
0≦T3
0.1VCC
T3 T1
T2
LVDS Signals
0≦T7≦T2
0V
Power On
T7
0.1Vcc
T4
Power Off
T8
Option Signals (SELLVDS
)
Backlight (Recommended)
500ms≦T5
100ms≦T6
T5
50%
50%
T6
Vcc Dip
Vcc
Vcc(typ.) x 0.85
T13
0V
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PRODUCT SPECIFICATION
Note (1) The supply voltage of the external system for the module input should follow the definition of Vcc.
Note (2) Apply the LED voltage within the LCD operation range. When the backlight turns on before the LCD operation or
the LCD turns off before the backlight turns off, the display may momentarily become abnormal screen.
Note (3) In case of Vcc is in off level, please keep the level of input signals on the low or high impedance. If T2<0,that maybe
cause electrical overstress failure.
Note (4) T4 should be measured after the module has been fully discharged between power off and on period.
Note (5) Interface signal shall not be kept at high impedance when the power is on.
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PRODUCT SPECIFICATION
7. OPTICAL CHARACTERISTICS
7.1 TEST CONDITIONS
Item Symbol Value Unit
Ambient Temperature Ta
Ambient Humidity Ha
Supply Voltage VCC
Input Signal According to typical value in "3. ELECTRICAL CHARACTERISTICS"
Lamp Current IL 115 mA
The LCD module should be stabilized at given temperature for 1 hour to avoid abrupt temperature change
during measuring in a windless room.
25±2
50±10
12V±1.2
o
%RH
V
C
LCD Module
LCD Panel
Field of View = 1º
500 mm
CS - 2000
Light Shield Room
(Ambient Luminance < 2 lux)
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PRODUCT SPECIFICATION
7.2 OPTICAL SPECIFICATIONS
The relative measurement methods of optical characteristics are shown as below. The following items should
be measured under the test conditions described in 7.1 and stable environment shown in 7.1.
Item Symbol
Rcx 0.661 -
Red
Rcy 0.324 -
Gcx 0.274 -
Green
Condition Min. Typ. Max. Unit Note
θx=0°, θY =0°
Gcy 0.594 -
Color
Chromaticity
Blue
Viewing Angle at
Bcx 0.133 -
Bcy 0.116 -
Wcx 0.304 -
Normal Direction
Standard light source
“C”
Typ.
-0.03
Typ.
+0.03
(0)
White
Wcy
0.357
-
Transmittance T% - 6.7 % (1),(5)
θx=0°, θY =0°
Transmittance Variation
δT
1.3 (1),(6)
with CMI module
Contrast Ratio CR
Gray to
Response Time
gray
5000
θx=0°, θY =0°
- 6 12 ms (1),(4)
with CMI Module
- - (1),(3)
θx+
-
88
-
Horizontal
Viewing
θx-
CR≥20
-
88
Deg. (1),(2)
Angle
θY+
With CMI module
-
88
-
Vertical
θY-
-
88
-
Transmission direction
Φ
of the up polarizer
Note (0) Light source is the standard light source ”C” which is defined by CIE and driving voltage are based on
suitable gamma voltages. The calculating method is as following :
1. Measure Module’s and BLU’s spectrum at center point. White and R,G,B are with signal input. BLU (for
V500HK2-LS5) is supplied by CMI.
2. Calculate cell’s spectrum.
3. Calculate cell’s chromaticity by using the spectrum of standard light source “C”.
Note (1) Light source is the BLU which supplied by CMI and driving voltage are based on suitable gamma voltages.
up-P
-
-
90
-
Deg. (7)
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Note (2) Definition of Viewing Angle (θx, θy) :
Time
Viewing angles are measured by Autronic Conoscope Cono-80 (or Eldim EZ-Contrast 160R)
PRODUCT SPECIFICATION
θX- = 90º
6 o’clock
θy- = 90º
Note (3) Definition of Contrast Ratio (CR):
The contrast ratio can be calculated by the following expression.
y-
x-
Normal
θx = θy = 0º
θy- θy+
θx−
θx+
y+
12 o’clock direction
θy+ = 90º
x+
θX+ = 90º
Contrast Ratio (CR) =
L1023 : Luminance of gray level 1023
L0 : Luminance of gray level 0
CR = CR (5), where CR (X) is corresponding to the Contrast Ratio of the point X at the figure in Note (5).
Note (4) Definition of Gray-to-Gray Switching Time:
100%
90%
Optical
Response
10%
0%
Gray to gray
switching time
L1023 of Luminance Surface
L0 of Luminance Surface
Gray to gray
switching time
The driving signal means the signal of gray level 0, 124, 252, 380, 508, 636, 764, 892 and 1023.
Gray to gray average time means the average switching time of gray level 0, 124, 252, 380, 508, 636, 764, 892 and
1023 to each other.
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Note (5) Definition of Transmittance (T%) :
6 o’clock
Measure the luminance of gray level 255 at 5 points of LCD module.
PRODUCT SPECIFICATION
Transmittance (T%) =
The 5 point is corresponding of the point X at the figure in Note (6).
Note (6) Definition of Transmittance Variation (δT) : (VA Model)
Measure the transmittance at 5 points.
The transmittance of each point can be calculated by the following expression.
T (X) = L255 (X) of LCD module / Luminance (X) of BLU.
L255: Luminance of gray level 255
Transmittance Variation (δT )=
Horizontal Line
D
D
4
D
2
1 2
W
4
5
W
2
3 4
3W
4
(5)] L (4), L (3), L (2), L (1), [L
3D
4
module LCD of average
(5)] L (4), L (3), L (2), L (1), [L
BLU of average
(5)] T (4), T (3), T (2), T (1), [T Maximume
(5)] T (4), T (3), T (2), T (1), [T Minimum
×
100%
X
Test point :
X = 1 ~ 5
Note (7) This is a reference for designing the shutter glasses of 3D application. (VA Case)
Definition of the transmission direction of the up polarizer (Φ
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x-
y-
Up Polarizer
12 o’clock direction
y+
Φ
up-P
) on LCD Module:
up-P
x
+
Φ=0o
PRODUCT SPECIFICATION
The transmission axis of the front polarizer of the shutter glasses should be parallel to this panel transmission direction to
get a maximum 3D mode luminance.
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PRODUCT SPECIFICATION
8. PRECAUTIONS
8.1 ASSEMBLY AND HANDLING PRECAUTIONS
[ 1 ] Do not apply improper or unbalanced force such as bending or twisting to open cells during assembly.
[ 2 ] It is recommended to assemble or to install an open cell into a customer’s product in clean working areas.
The dust and oil may cause electrical short to an open cell or worsen polarizers on an open cell.
[ 3 ] Do not apply pressure or impulse to an open cell to prevent the damage.
[ 4 ] Always follow the correct power-on sequence when an open cell is assembled and turned on. This can
prevent the damage and latch-up of the CMOS LSI chips.
[ 5 ] Do not design sharp-pointed structure / parting line / tooling gate on the plastic part of a COF (Chip on
film), because the burr will scrape the COF.
[ 6 ] If COF would be bended in assemble process, do not place IC on the bending corner.
[ 7 ] The gap between COF IC and any structure of BLU must be bigger than 2 mm. This can prevent the damage
of COF IC.
[ 8 ] The bezel opening must have no burr and be smooth to prevent the surface of an open cell scraped.
[ 9 ] The bezel of a module or a TV set can not contact with force on the surface of an open cell. It might cause
light leakage or scrape.
[ 10 ] In the case of no FFC or FPC attached with open cells, customers can refer the FFC / FPC drawing and buy
them by self.
[ 11 ] It is important to keep enough clearance between customers’ front bezel/backlight and an open cell.
Without enough clearance, the unexpected force during module assembly procedure may damage an open
cell.
[ 12 ] Do not plug in or unplug an I/F (interface) connector while an assembled open cell is in operation.
[ 13 ] Use a soft dry cloth without chemicals for cleaning, because the surface of the polarizer is very soft and
easily scratched.
[ 14 ] Moisture can easily penetrate into an open cell and may cause the damage during operation.
[ 15 ] When storing open cells as spares for a long time, the following precaution is necessary.
[ 15.1 ] Do not leave open cells in high temperature and high humidity for a long time. It is highly
recommended to store open cells in the temperature range from 0 to 35℃ at normal humidity
without condensation.
[ 15.2 ] Open cells shall be stored in dark place. Do not store open cells in direct sunlight or fluorescent light
environment.
[ 16 ] When ambient temperature is lower than 10ºC, the display quality might be reduced.
[ 17 ] Unpacking (Cartons/Tray plates) in order to prevent open cells broken:
[ 17.1 ] Moving tray plates by one operator may cause tray plates bent which may induce open cells broken.
Two operators carry one carton with their two hands. Do not throw cartons/tray plates, avoid any
impact on cartons/tray plates, and put down & pile cartons/tray plates gently.
[ 17.2 ] A tray plate handled with unbalanced force may cause an open cell damaged. Trays should be
completely put on a flat platform.
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PRODUCT SPECIFICATION
[ 17.3 ] To prevent open cells broken, tray plates should be moved one by one from a plastic bag.
[ 17.4 ] Please follow the packing design instruction, such as the maximum number of tray stacking to
prevent the deformation of tray plates which may cause open cells broken.
[ 17.5 ] To prevent an open cell broken or a COF damaged on a tray, please follow the instructions below:
[17.5.1] Do not peel a polarizer protection film of an open cell off on a tray
[17.5.2] Do not install FFC or LVDS cables of an open cell on a tray
[17.5.3] Do not press the surface of an open cell on a tray.
[17.5.4] Do not pull X-board when an open cell placed on a tray.
[ 18 ] Unpacking (Hard Box) in order to prevent open cells broken:
[ 18.1 ] Moving hard boxes by one operator may cause hard boxes fell down and open cells broken by
abnormal methods. Two operators carry one hard box with their two hands. Do handle hard boxes
carefully, such as avoiding impact, putting down, and piling up gently.
[ 18.2 ] To prevent hard boxes sliding from carts and falling down, hard boxes should be placed on a
surface with resistance.
[ 18.3 ] To prevent an open cell broken or a COF damaged in a hard box, please follow the instructions
below:
[18.3.1] Do not peel a polarizer protection film of an open cell off in a hard box.
[18.3.2] Do not install FFC or LVDS cables of an open cell in a hard box.
[18.3.3] Do not press the surface of an open cell in a hard box.
[18.3.4] Do not pull X-board when an open cell placed in a hard box.
[ 19 ] Handling – In order to prevent open cells, COFs , and components damaged:
[ 19.1 ] The forced displacement between open cells and X-board may cause a COF damaged. Use a fixture
tool for handling an open cell to avoid X-board vibrating and interfering with other components on
a PCBA & a COF.
[ 19.2 ] To prevent open cells and COFs damaged by taking out from hard boxes, using vacuum jigs to take
out open cells horizontally is recommended.
[ 19.3 ] Improper installation procedure may cause COFs of an open cell over bent which causes damages.
As installing an open cell on a backlight or a test jig, place the bottom side of the open cell first on
the backlight or the test jig and make sure no interference before fitting the open cell into the
backlight/the test jig.
[ 19.4 ] Handle open cells one by one.
[ 20 ] Avoid any metal or conductive material to contact PCB components, because it could cause electrical
damage or defect.
8.2 SAFETY PRECAUTIONS
[ 1 ] If the liquid crystal material leaks from the open cell, it should be kept away from the eyes or mouth. In case
of contact with hands, skin or clothes, it has to be washed away thoroughly with soap.
[ 2 ] After the end of life, open cells are not harmful in case of normal operation and storage.
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PRODUCT SPECIFICATION
9. DEFINITION OF LABELS
9.1 OPEN CELL LABEL
The barcode nameplate is pasted on each open cell as illustration for CMI internal contro
Figure.9-1 Serial No. Label on SPWB
Model Name : V500HK2-PS1
Revision : Rev. XX, for example: A0, A1… B1, B2… or C1, C2…etc.
Serial ID : X X X X X X X Y M D L N N N N
V500HK2 –PS1 Rev. XX
X X X X X X X Y M D L N N N N
Serial No.
Year, Month, Date
CMI Internal Use
Revision
Serial ID includes the information as below:
Manufactured Date :
Year: 2010=0, 2011=1,2012=2…etc.
Month: 1~9, A~C, for Jan. ~ Dec.
Day: 1~9, A~Y, for 1st to 31st, exclude I ,O, and U.
Revision Code : Cover all the change
Serial No.: Manufacturing sequence of product
CMI Internal Use
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PRODUCT SPECIFICATION
Figure.9-2 Panel ID Label on Cell
Panel ID Label includes the information as below:
Panel ID: T X X X X X X X X X X X
TXXXXXXXXXXX
CMI Internal Use
FAB Line: 1~8, for Fab1~Fab8
TFT
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10. PACKAGING
10.1 PACKING SPECIFICATIONS
(1) 13 LCD TV Panels / 1 Box
(2) Box dimensions : 1260 (L) X 810(W) X 97.5 (H)
(3) Weight : approximately 38Kg ( 13 panels per box)
(4) 130 LCD TV Panels / 1 Group
10.2 PACKING METHOD
Figures 10-1 and 10-2 are the packing method
PRODUCT SPECIFICATION
Figure.10-1 packing method
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PRODUCT SPECIFICATION
Figure.10-2 packing method
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11. MECHANICAL CHARACTERISTIC
PRODUCT SPECIFICATION
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PRODUCT SPECIFICATION
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PRODUCT SPECIFICATION
Appendix A
Local Dimming demo function
A.1 I2C address and write command
Device address: 0xe0
Register address: 0x65
Command data: 0x16 0x00 0x00 0x00 0x00 0x00: Local Dimming demo mode OFF (Note 1)
0x16 0x00 0x00 0x00 0x00 0x01 : Local Dimming demo mode ON (Demo in right half
screen) (Note 2)
Preamble data: 0x26 0x38
I2C data:
START
Device Address Preamble data
11100000
(0xE0)
Register Address Command Data Command Data
01100101
(0x65)
Command Data Command Data Command Data
00000000
(0x00)
Command Data
ACK
ACK
ACK
00100110
(0x26)
00010110
(0x16)
00000000
(0x00)
ACK
ACK
ACK
Preamble data
00111000
(0x38)
00000000
(0x00)
00000000
(0x00)
ACK
ACK
ACK
00000001
STOP
(0x01)
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Note 1: Local Dimming demo OFF
Note 2: Local Dimming demo ON
PRODUCT SPECIFICATION
A.2 I2C timing
Symbol Parameter Min. Max. Unit
t
Start setup time 250 - ns
SU-STA
t
Start hold time 250 - ns
HD-STA
t
Data setup time 80 - ns
SU-DAT
t
Data hold time 0 - ns
HD-DAT
t
Stop setup time 250 - ns
SU-STO
Time between Stop condition and next
t
BUF
500 - ns
Start condition
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