CHIMEI INNOLUX V500HJ1-PE8 Specification

PRODUCT SPECIFICATION
Tentative Specification
Preliminary Specification
Approval Specification
MODEL NO.: V500HJ1
SUFFIX: PE8
Revision : C1 Customer :
APPROVED BY SIGNATURE
Please return 1 copy for your confirmation with your signature and comments.
Approved By Checked By Prepared By
Chao-Chun Chung
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The copyright belongs to InnoLux. Any unauthorized use is prohibited
Carlos Lee Kevin WK Tsai
PRODUCT SPECIFICATION
CONTENTS
CONTENTS.......................................................................................................................................................................2
REVISION HISTORY.........................................................................................................................................................4
1. GENERAL DESCRIPTION ............................................................................................................................................5
1.1 OVERVIEW ..........................................................................................................................................................5
1.2 FEATURES............................................................................................................................................................5
1.3 MECHANICAL SPECIFICATIONS .....................................................................................................................6
2. ABSOLUTE MAXIMUM RATINGS ..............................................................................................................................7
2.1 ABSOLUTE RATINGS OF ENVIRONMENT.......................................................................................................7
2.2 ABSOLUTE RATINGS OF ENVIRONMENT (OPEN CELL) ...............................................................................8
2.3 ELECTRICAL ABSOLUTE RATINGS ..................................................................................................................8
2.3.1 TFT LCD MODULE ....................................................................................................................................8
3. ELECTRICAL CHARACTERISTICS..............................................................................................................................9
3.1 TFT LCD OPEN CELL ..........................................................................................................................................9
4. INPUT TERMINAL PIN ASSIGNMENT.....................................................................................................................11
4.1 TFT LCD OPEN CELL ........................................................................................................................................11
5. INPUT TERMINAL PIN ASSIGNMENT.....................................................................................................................12
5.1 TFT LCD OPEN CELL INPUT............................................................................................................................12
5.2 LVDS INTERFACE .............................................................................................................................................15
5.3 COLOR DATA INPUT ASSIGNMENT ..............................................................................................................16
5.4 FLICKER (Vcom) ADJUSTMENT.......................................................................................................................17
6. INTERFACE TIMING..................................................................................................................................................18
6.1 INPUT SIGNAL TIMING SPECIFICATIONS ....................................................................................................18
6.2 POWER ON/OFF SEQUENCE ..........................................................................................................................20
7. OPTICAL CHARACTERISTICS ..................................................................................................................................21
7.1 TEST CONDITIONS ...........................................................................................................................................21
7.2 OPTICAL SPECIFICATIONS .............................................................................................................................22
8. PRECAUTIONS ...........................................................................................................................................................25
8.1 ASSEMBLY AND HANDLING PRECAUTIONS...............................................................................................25
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PRODUCT SPECIFICATION
8.2 SAFETY PRECAUTIONS ...................................................................................................................................26
9. DEFINITION OF LABELS ...........................................................................................................................................27
9.1 OPEN CELL LABEL ...........................................................................................................................................27
10. PACKAGING.............................................................................................................................................................29
10.1 PACKAGING SPECIFICATIONS.....................................................................................................................29
10.2 PACKAGING METHOD....................................................................................................................................29
10.3 UN-PACKAGING METHOD ...........................................................................................................................30
11. MECHANICAL CHARACTERISTIC...........................................................................................................................31
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Version Date Page(New) Ver. 1.0
Ver. 1.1 Ver. 2.0
Jun.13, 2013
Jul.22, 2013 Aug.23, 2013
9~11
12~13
22~24
32~35
31.32
5 5
17 18
30 30 31
1 5
6 18 22
PRODUCT SPECIFICATION
REVISION HISTORY
Section Description
1.1
1.2
3.1
5.1
5.4
6.1
7.2
10.1
10.2
10.3 11
1.2
1.3
6.1
7.2
11
Modify OVERVIEW Modify FEATURES Modify TFT LCD OPEN CELL Modify TFT LCD OPEN CELL INPUT Modify FLICKER (Vcom) ADJUSTMENT Modify INPUT SIGNAL TIMING SPECIFICATIONS Modify OPTICAL SPECIFICATIONS Modify PACKAGING SPECIFICATIONS Modify PACKAGING METHOD Modify UN-PACKAGING METHOD Modify MECHANICAL CHARACTERISTIC Modify Model Name Modify FEATURES Modify MECHANICAL SPECIFICATIONS Modify NPUT SIGNAL TIMING SPECIFICATIONS Modify OPTICAL SPECIFICATIONS Color Chromaticity& Contrast Ratio
Modify MECHANICAL CHARACTERISTIC
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PRODUCT SPECIFICATION
X+C Board
1. GENERAL DESCRIPTION
1.1 OVERVIEW
V500HJ1-PE8 is a 50” TFT Liquid Crystal Display product with driver ICs and 2ch-LVDS interface. This product
supports 1920 x 1080 Full HDTV format and can display 16.7M colors (8-bit). The backlight unit is not built in.
1.2 FEATURES
CHARACTERISTICS ITEMS SPECIFICATIONS
Screen Diagonal [in] 50
Pixels [lines] 1920 × 1080
Active Area [mm] 1095.84(H) × 616.41(V) (50” diagonal)
Sub-Pixel Pitch [mm] 0.1903(H) × 0.5708(V)
Pixel Arrangement RGB Vertical Stripe
Weight [g] 1989 Typ. (g)
Physical Size [mm]
Display Mode Transmissive Mode / Normallly Black
Contrast Ratio Typ.5000:1
Glass thickness (Array / CF) [mm] 0.5 / 0.5
Viewing Angle (CR>20) (VA Model) Typ. +88/-88(H), +88/-88(V) (CR20)
Viewing Angle (CR>10) (TN Model) Typ. +80/-80(H), +80/-70(V) (CR10)
Color Chromaticity R = (0.659, 0.326)
Cell Transparency [%] 5.6% Typ. Please refer to “Transmittance” in 7.2
Polarizer Surface Treatment
1122.32 (W) x 676.16(H) x 1.305(D) Typ
(Typical value measure by INX’s Module)
(Typical value measured by INX’s module)
(Typical value measured by INX’s module)
G = (0.276, 0.585)
B = (0.135, 0.112)
W= (0.308, 0.356)
* Please refer to “color chromaticity” in 7.2
Anti-Glare coating (Haze 1%)
Hardness 3H
Rotation Function
Display Orientation
RoHs Compliance
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Back Side
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Unachievable
Signal input with “INX”
Front Side
INX
PRODUCT SPECIFICATION
1.3 MECHANICAL SPECIFICATIONS
Item Min. Typ. Max. Unit Note
Weight 1791 1990 2189 g -
I/F connector mounting
position
Note (1) Please refer to the attached drawings for more information of front and back outline dimensions.
Note (2) Connector mounting position
The mounting inclination of the connector makes the screen center within ± 0.5mm as the horizontal.
+/- 0.5mm
(2)
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PRODUCT SPECIFICATION
2. ABSOLUTE MAXIMUM RATINGS
2.1 ABSOLUTE RATINGS OF ENVIRONMENT
Value
Item Symbol
Min. Max.
Storage Temperature TST -20 +60 ºC
Operating Ambient Temperature TOP 0 50 ºC
Note (1) Temperature and relative humidity range is shown in the figure below.
(a) 90 %RH Max. (Ta 40 ºC).
(b) Wet-bulb temperature should be 39 ºC Max. (Ta > 40 ºC).
(c) No condensation.
Note (2) Thermal management should be considered in final product design to prevent the surface temperature of display
area from being over 65 ºC. The range of operating temperature may degrade in case of improper thermal
Unit Note
(1)
With INX
Module
(1), (2)
With INX
Module
management in final product design.
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PRODUCT SPECIFICATION
2.2 ABSOLUTE RATINGS OF ENVIRONMENT (OPEN CELL)
Recommended Storage Condition: With shipping package.
Recommended Storage temperature range: 25±5
Recommended Storage humidity range: 50±10%RH
Recommended Shelf life: a month
2.3 ELECTRICAL ABSOLUTE RATINGS
2.3.1 TFT LCD MODULE
Value
Item Symbol
Min. Max.
Power Supply Voltage VCC -0.3 13.5 V
Logic Input Voltage VIN -0.3 3.6 V
Note (1) Permanent damage to the device may occur if maximum values are exceeded. Function operation
should be restricted to the conditions described under Normal Operating Conditions.
Unit Note
(1)
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3. ELECTRICAL CHARACTERISTICS
3.1 TFT LCD OPEN CELL
(Ta = 25 ± 2 ºC)
PRODUCT SPECIFICATION
Parameter Symbol
Unit Note
Min. Typ. Max.
Power Supply Voltage VCC 10.8 12 13.2 V (1)
Value
Rush Current I
White Pattern PT
Power consumption
Black Pattern PT
Heavy Loading pattern PT
RUSH
4.27 5.14
4.27 5.15
8.29 9.97
2
A (2)
W
(3)
0.36 0.43
0.36 0.43
0.69 0.83
+300 mV
-100 mV
600 mV
A
(4)
Power Supply Current
LVDS interface
White Pattern PT
Black Pattern PT
Heavy Loading pattern PT
Differential Input High Threshold Voltage
Differential Input Low Threshold Voltage
V
V
LVTH
LVTL
+100
-300
Common Input Voltage VCM 1.0 1.2 1.4 V
Differential input voltage |VID|
200
Terminating Resistor RT
Input High Threshold
CMOS interface
Voltage Input Low Threshold
Voltage
Note (1) The module should be always operated within the above ranges.
The ripple voltage should be controlled under 10% of Vcc (Typ.).
Note (2) Measurement condition :
VIH 2.7
VIL 0
100
ohm
3.3 V
0.7 V
Vcc rising time is 470us
0.1Vcc
0.9Vcc
GND
470us
Note (3) The specified power supply current is under the cond ions at Vcc = 12 V, Ta = 25 ± 2 ºC, fv = 60 Hz, whereas a power
Vcc
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a. White Pattern
Active Area
PRODUCT SPECIFICATION
b. Black Pattern
Active Area
c. Heavy Loading pattern
Note (4) The LVDS input characteristics is shown as below :
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4. INPUT TERMINAL PIN ASSIGNMENT
X+C Board
GND
SELLVDS
SDA SCL
PRODUCT SPECIFICATION
4.1 TFT LCD OPEN CELL
TFT LCD PANEL
(1920x3x1080)
INPUT CONNECTOR, (
(187059-51221,P-TWO)
Vcc
ORX0(+/-) ORX1(+/-) ORX2(+/-) ORX3(+/-) OCLK(+/-)
WF23-402-5133,FCN) or
ERX0(+/-) ERX1(+/-) ERX2(+/-) ERX3(+/-) ECLK(+/-)
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PRODUCT SPECIFICATION
5. INPUT TERMINAL PIN ASSIGNMENT
5.1 TFT LCD OPEN CELL INPUT
CNF1 Connector Part No.: FCN (WF23-402-5133) , 187059-51221 (P-TWO)
Mating Connector: JAE (FI-RE51HL)
Pin Name Description Note
1 N.C. No Connection (1)
2 SCL I2C clock (For Vcom tunning)
3 SDA I2C data (For Vcom tunning)
4 N.C. No Connection
5 N.C. No Connection
6 N.C. No Connection
7
8
9
10 N.C. No Connection (1)
11 GND Ground
12
13
14
15
16
17
SELLVDS LVDS data format Selection
N.C. No Connection
N.C No Connection
ORX0- Odd pixel Negative LVDS differential data input. Channel 0
ORX0+ Odd pixel Positive LVDS differential data input. Channel 0
ORX1- Odd pixel Negative LVDS differential data input. Channel 1
ORX1+ Odd pixel Positive LVDS differential data input. Channel 1
ORX2- Odd pixel Negative LVDS differential data input. Channel 2
ORX2+ Odd pixel Positive LVDS differential data input. Channel 2
(1)
(2)(3)
(1)
(1)
(4)
18
19
20
21
22
23
24 N.C. No Connection
25 N.C. No Connection
26 N.C. No Connection
27 N.C. No Connection
28
29
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GND Ground
OCLK- Odd pixel Negative LVDS differential clock input.
OCLK+ Odd pixel Positive LVDS differential clock input.
GND Ground
ORX3- Odd pixel Negative LVDS differential data input. Channel 3
ORX3+ Odd pixel Positive LVDS differential data input. Channel 3
ERX0- Even pixel Negative LVDS differential data input. Channel 0
ERX0+ Even pixel Positive LVDS differential data input. Channel 0
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(4)
(4)
(1)
(4)
30
31
32
33
34
35
36
37
38
39
40
41 N.C. No Connection
42
43 N.C. No Connection
ERX1- Even pixel Negative LVDS differential data input. Channel 1
ERX1+ Even pixel Positive LVDS differential data input. Channel 1
ERX2- Even pixel Negative LVDS differential data input. Channel 2
ERX2+ Even pixel Positive LVDS differential data input. Channel 2
GND Ground
ECLK- Even pixel Negative LVDS differential clock input
ECLK+ Even pixel Positive LVDS differential clock input
GND Ground
ERX3- Even pixel Negative LVDS differential data input. Channel 3
ERX3+ Even pixel Positive LVDS differential data input. Channel 3
N.C.
N.C.
No Connection
No Connection
PRODUCT SPECIFICATION
(4)
(4)
(1)
44 GND Ground
45 GND Ground
46 GND Ground
47 N.C. No Connection
48
49
50
51
Note (1) Reserved for internal use. Please leave it open.
Note (2) Connect to Open or +3.3V: VESA Format, connect to GND: JEIDA Format.
Note (3) Interface optional pin has internal scheme as following diagram. Customer should keep the interface voltage level
VCC Power input (+12V)
VCC Power input (+12V)
VCC Power input (+12V)
VCC Power input (+12V)
SELLVDS Mode
H(default) VESA
L JEIDA
L : Connect to GND, H: Connect to +3.3V
(1)
requirement which including Panel board loading as below.
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IC
>16K ohm
1K ohm
System Board
Interface Voltage Level
PRODUCT SPECIFICATION
3.3V
Panel Board
VH > V VL < V
Note (4) Two pixel data send into the module for every clock cycle. The first pixel of the frame is odd pixel and the second
pixel is even pixel.
Note (5) LVDS connector mating dimension range request is 0.93mm~1.0mm as below.
Note (6) The screw hole which is distant from the connector is merged with Ground.
IH
IL
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5.2 LVDS INTERFACE
JEIDA Format : SELLVDS = L
VESA Format : SELLVDS = H or Open
VESA LVDS format
RXCLK±
RXCLK±
PRODUCT SPECIFICATION
Current cycle
Current cycle
ORX0±
ORX0± ORX1±
ORX1±
ORX2±
ORX2±
ORX3±
ORX3±
ERX0±
ERX0± ERX1±
ERX1±
ERX2±
ERX2±
ERX3±
ERX3±
JEDIA LVDS format
R5G0 R4 R3 R2 R1
R5G0 R4 R3 R2 R1
B0 G5B1
B0 G5B1
R5G0 R4 R3 R2 R1
R5G0 R4 R3 R2 R1
B0 G5B1
B0 G5B1
Current cycle
Current cycle
G3 G2G4
G3 G2G4
G3 G2G4
G3 G2G4
R0
R0
G1
G1
B2B4 B3B5VS HSDE
B2B4 B3B5VS HSDE
R6G6 R7G7B7 B6RSVD
R6G6 R7G7B7 B6RSVD
R0
R0
G1
G1
B2B4 B3B5VS HSDE
B2B4 B3B5VS HSDE
R6G6 R7G7B7 B6RSVD
R6G6 R7G7B7 B6RSVD
RXCLK±
RXCLK±
ORX0±
ORX0± ORX1±
ORX1±
ORX2±
ORX2±
ORX3±
ORX3±
ERX0±
ERX0± ERX1±
ERX1± ERX2±
ERX2±
ERX3±
ERX3±
R7G2 R6 R5 R4 R3
R7G2 R6 R5 R4 R3
B2 G7B3
B2 G7B3
R7G2 R6 R5 R4 R3
R7G2 R6 R5 R4 R3
B2 G7B3
B2 G7B3
G5 G4G6
G5 G4G6
G5 G4G6
G5 G4G6
R2
R2
G3
G3
B4B6 B5B7VS HSDE
B4B6 B5B7VS HSDE
R0G0 R1G1B1 B0RSVD
R0G0 R1G1B1 B0RSVD
R2
R2
G3
G3
B4B6 B5B7VS HSDE
B4B6 B5B7VS HSDE
R0G0 R1G1B1 B0RSVD
R0G0 R1G1B1 B0RSVD
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PRODUCT SPECIFICATION
R0~R7 Pixel R Data (7; MSB,
0; LSB)
G0~G7 Pixel G Data (7; MSB,
0; LSB)
B0~B7 Pixel B Data (7; MSB,
0; LSB)
Note (1) RSVD (reserved) pins on the transmitter shall be “H” or “L”.
5.3 COLOR DATA INPUT ASSIGNMENT
The brightness of each primary color (red, green and blue) is based on the 8-bit gray scale data input for the color.
The higher the binary input, the brighter the color. The table below provides the assignment of the color versus
data input.
Color
R7 R6 R5 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 B1 B0
Black Red
Green Basic Colors
Gray Scale Of Red
Gray Scale Of Green
Gray Scale Of Blue
Note (1) 0: Low Level Voltage, 1: High Level Voltage
Blue
Cyan
Magenta
Yellow
White
Red (0) / Dark
Red (1)
Red (2)
:
: Red (253) Red (254) Red (255) Green (0) / Dark Green (1) Green (2)
:
: Green (253) Green (254) Green (255) Blue (0) / Dark Blue (1) Blue (2)
:
: Blue (253) Blue (254) Blue (255)
0
0
1
1
0
0
0
0
0
0
1
1
1
1
1
1
0
0
0
0
0
0
:
:
:
:
1
1
1
1
1
1
0
0
0
0
0
0
:
:
:
:
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
0
0
0
0
0
0
Red Green Blue
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
0
0
0
0
0
0
0
0
0
0
0
0
DE Data enable signal
DCLK Data clock signal
Data Signal
0
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
1
0
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
0
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
0
1
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
1
0
0
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
0
0
1
1
1
1
1
1
0
1
0
0
0
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
:
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
1
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
:
:
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
1
1
1
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
:
:
:
:
:
:
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
0
1
0
:
:
:
:
:
:
1
0
1
1
1
0
1
1
1
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PRODUCT SPECIFICATION
5.4 FLICKER (Vcom) ADJUSTMENT
(1) Adjustment Pattern :
The adjustment pattern is shown as below. If customer needs below pattern, please directly contact with
INX account FAE.
Frame N Frame N+1
(2) Adjustment method: (Digital V-com)
Programmable memory IC is used for Digital V-com adjustment in this model. INX provide Auto Vcom tools
to adjust Digital V-com.The detail connection and setting instruction, please directly contact with Account
FAE or refer INX Auto V-com adjustment OI. Below items is suggested to be ready before Digital V-com
adjustment in customer LCM line.
a. USB Sensor Board.
b. Programmable software.
c. Document: Auto V-com adjustment suggestion OI.
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PRODUCT SPECIFICATION
DE
T
hb
Valid Display Data (
960
clocks)
T
c
6. INTERFACE TIMING
6.1 INPUT SIGNAL TIMING SPECIFICATIONS
The input signal timing specifications are shown as the following table and timing diagram.
Signal Item Symbol Min. Typ. Max. Unit Note
F
clkin
(=1/TC)
T
-
rcl
clkin_mod
F
F
SSM
T
RSKM
60 74.25 80 MHz
F
-2%
clkin
-400
200 ps (3)
F
+2%
clkin
200 KHz
400 ps (5)
LVDS
Receiver
Clock
LVDS
Receiver
Data
Frequency
Input cycle to cycle jitter Spread spectrum modulation range Spread spectrum modulation frequency
Receiver Skew Margin
MHz
(4)
Frame Rate
Fr5 47 50 53 Hz
Vertical
Active
Display
Term
Total Tv 1090 1125 1480 Th
Display Tvd 1080 1080 1080 Th
Fr6 57 60 63 Hz
Blank Tvb 10 45 400 Th
Horizontal
Active
Display
Term
Note (1) Please make sure the range of pixel clock has follow the below equation :
Fclkin(max) Fr6 Tv Th
Fr5 Tv Th Fclkin (min)
Note (2) This module is operated in DE only mode and please follow the input signal timing diagram below :
Total Th 1030 1100 1325 Tc
Display Thd 960 960 960 Tc
Blank Thb 70 140 365 Tc
T
v
T
vd
T
vb
(6)
Tv=Tvd+Tvb
Th=Thd+Thb
Version 2.0 18 Date : Aug. 21 2013
DCLK
DE
DATA
Th
T
hd
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PRODUCT SPECIFICATION
Note (3) The input clock cycle-to-cycle jitter is defined as below figures. Trcl = | T1 – T|
Note (4) The SSCG (Spread spectrum clock generator) is defined as below figures.
Note (5) The LVDS timing diagram and the receiver skew margin is defined and shown in following figure.
RXCLK+/-
RXn+/-
T
RSKM
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PRODUCT SPECIFICATION
500ms
≦T4
Option Signals
(
SELLVDS
)
0≦T8≦T3
T
9
10ms
6.2 POWER ON/OFF SEQUENCE
To prevent a latch-up or DC operation of LCD module, the power on/off sequence should be as the diagram
below.
0.9Vcc
0.9Vcc
0V
0.1VCC
0.1Vcc
0.5≦T110ms
0T2200ms
0T3
LVDS Signals
T2
0V
Power On
T3 T1
T4
Power Off
0T7T2
T7
T8
Backlight (Recommended)
500msT5
100msT6
50%
T5
50%
T6
Vcc Dip
≦≦≦≦
Vcc
Vcc(typ.) x 0.85
T9
Note (1) The supply voltage of the external system for the module input should follow the definition of Vcc.
Note (2) Apply the lamp voltage within the LCD operation range. When the backlight turns on before the LCD operation or
the LCD turns off before the backlight turns off, the display may momentarily become abnormal screen.
Note (3) In case of VCC is in off level, please keep the level of input signals on the low or high impedance.
If T2<0,that maybe cause electrical overstress failure.
Note (4) T4 should be measured after the module has been fully discharged between power off and on period.
Note (5) Interface signal shall not be kept at high impedance when the power is on.
Note (6) Vcc must decay smoothly when power-off.
0V
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7. OPTICAL CHARACTERISTICS
7.1 TEST CONDITIONS
Item Symbol Value Unit
Ambient Temperature Ta
PRODUCT SPECIFICATION
o
25 ±2
C
Ambient Humidity Ha
Vertical Frame Rate
Supply Voltage VCC
Input Signal According to typical value in "3. ELECTRICAL CHARACTERISTICS"
The LCD module should be stabilized at given temperature for 1 hour to avoid abrupt temperature change
during measuring in a windless room.
LCD Module
LCD Panel
Field of View = 1º
Fr 60 Hz
50 ±10
12.0 ±1.2
CS - 2000
%RH
V
500 mm
Light Shield Room
(Ambient Luminance < 2 lux)
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PRODUCT SPECIFICATION
7.2 OPTICAL SPECIFICATIONS
The relative measurement methods of optical characteristics are shown as below. The following items
should be measured under the test conditions described in 7.1 and stable environment shown in 7.1.
Item Symbol
Rcx 0.659 -
Red
Rcy 0.326 -
Gcx 0.276 -
Green
Color Chromaticity
Blue
White
Transmittance T% 5.1 5.6 - % (5)
Transmittance Variation
Contrast Ratio CR
Response Time
Horizontal
Viewing Angle
Vertical
Gcy 0.585 -
Bcx 0.135 -
Bcy 0.112 -
Wcx 0.308 -
Wcy
δT
Gray to
gray
θx+
θx-
θY+
θY-
Viewing Angle at Normal
Standard light source “C”
With INX Module@60Hz
With INX Module@60Hz
Condition Min. Typ. Max. Unit Note
θx=0°, θY =0°
Direction
θx=0°, θY =0°
θx=0°, θY =0°
CR20 (VA Model)
With INX Module
-0.03
0.356
1.3 (6)
3500 5000
-
88
8.5
88
88
88
+0.03
- - (1),(3)
17 ms (1),(4)
-
­Deg. (1),(2)
-
-
(0)
-
Note (0) Light source is the standard light source ”C” which is defined by CIE and driving voltage are based on
suitable gamma voltages. The calculating method is as following :
1.Measure Module’s and BLU’s spectrum at center point. W, R,G, B are with signal input. BLU (V500HJ1-P01) is
supplied by INX. (VA Model)
2.Calculate cell’s spectrum.
3.Calculate cell’s chromaticity by using the spectrum of standard light source “C”.
Note (1) Light source is the BLU which supplied by INX (V500HJ1-P01) and the cell driving voltage are based on suitable
gamma voltages.
Note (2) Definition of Viewing Angle (θx, θy) :
Viewing angles are measured by Autronic Conoscope Cono-80 (or Eldim EZ-Contrast 160R)
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PRODUCT SPECIFICATION
Time
Normal
θx = θy = 0º
θ
X-
= 90º
x-
Note (3) Definition of Contrast Ratio (CR) :
6 o’clock
θ
y-
= 90º
The contrast ratio can be calculated by the following expression.
Contrast Ratio (CR) =
L255: Luminance of gray level 255
L 0: Luminance of gray level 0
CR = CR (5), where CR (X) is corresponding to the Contrast Ratio of the point X at the figure in Note (6).
y-
θx
θy+
θx+
y+
12 o’clock direction
θ
y+
= 90º
x+
θ
X+
= 90º
L255 of Luminance Surface
L0 of Luminance Surface
Note (4) Definition of Gray-to-Gray Switching Time
100%
90%
Optical
Response
10%
0%
The driving signal means the signal of gray level 0, 31, 63, 95, 127, 159, 191, 223 and 255.
Gray to gray average time means the average switching time of gray level 0, 31, 63, 95, 127, 159, 191, 223 and 255 to
each other.
Gray to gray
switching time
Gray to gray
switching time
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Note (5) Definition of Transmittance (T%) :
[
]
Measure the transmittance at 5 points.
Light source is the BLU which contains three diffuser sheets and the cell driving voltage are based on suitable
gamma voltages.
PRODUCT SPECIFICATION
Transmittance (T%) =
The transmittance of each point can be calculated by the following expression.
T (X) =
BLU of (X) Luminance
L1023: Luminance of gray level 1023
T(X) is corresponding to the point X1~X5 at the figure in Note (6).
Note (6) Definition of Transmittance Variation (δT) :
Measure the transmittance at 5 points.
Transmittance Variation (δT )=
T(X) is calculated as Note(5).
T(5)T(4),T(3),T(2),T(1), Average
module LCD of (X) L255
×
%100
Horizontal Line
D
D/4 D/2 3D/4
] T(5) T(4), T(3), T(2), T(1), [ Maximum
] T(5) T(4), T(3), T(2), T(1), [ Minimum
W/4
1 2
X
Vertical Line
W
W/2
3W/4
5
3 4
: Test Point X=1 to 5
Active Area
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PRODUCT SPECIFICATION
8. PRECAUTIONS
8.1 ASSEMBLY AND HANDLING PRECAUTIONS
[ 1 ] Do not apply improper or unbalanced force such as bending or twisting to open cells during assembly. [ 2 ] It is recommended to assemble or to install an open cell into a customer’s product in clean working areas.
The dust and oil may cause electrical short to an open cell or worsen polarizers on an open cell.
[ 3 ] Do not apply pressure or impulse to an open cell to prevent the damage. [ 4 ] Always follow the correct power-on sequence when an open cell is assembled and turned on. This can
prevent the damage and latch-up of the CMOS LSI chips.
[ 5 ] Do not design sharp-pointed structure / parting line / tooling gate on the plastic part of a COF (Chip on
film), because the burr will scrape the COF.
[ 6 ] If COF would be bended in assemble process, do not place IC on the bending corner. [ 7 ] The gap between COF IC and any structure of BLU must be bigger than 2 mm. This can prevent the damage
of COF IC.
[ 8 ] The bezel opening must have no burr and be smooth to prevent the surface of an open cell scraped. [ 9 ] The bezel of a module or a TV set can not contact with force on the surface of an open cell. It might cause
light leakage or scrape.
[ 10 ] In the case of no FFC or FPC attached with open cells, customers can refer the FFC / FPC drawing and buy
them by self.
[ 11 ] It is important to keep enough clearance between customers’ front bezel/backlight and an open cell.
Without enough clearance, the unexpected force during module assembly procedure may damage an open
cell.
[ 12 ] Do not plug in or unplug an I/F (interface) connector while an assembled open cell is in operation. [ 13 ] Use a soft dry cloth without chemicals for cleaning, because the surface of the polarizer is very soft and
easily scratched.
[ 14 ] Moisture can easily penetrate into an open cell and may cause the damage during operation. [ 15 ] When storing open cells as spares for a long time, the following precaution is necessary.
[ 15.1 ] Do not leave open cells in high temperature and high humidity for a long time. It is highly
recommended to store open cells in the temperature range from 0 to 35 at normal humidity
without condensation.
[ 15.2 ] Open cells shall be stored in dark place. Do not store open cells in direct sunlight or fluorescent light
environment.
[ 16 ] When ambient temperature is lower than 10ºC, the display quality might be reduced. [ 17 ] Unpacking (Cartons/Tray plates) in order to prevent open cells broken:
[ 17.1 ] Moving tray plates by one operator may cause tray plates bent which may induce open cells broken.
Two operators carry one carton with their two hands. Do not throw cartons/tray plates, avoid any
impact on cartons/tray plates, and put down & pile cartons/tray plates gently.
[ 17.2 ] A tray plate handled with unbalanced force may cause an open cell damaged. Trays should be
completely put on a flat platform.
[ 17.3 ] To prevent open cells broken, tray plates should be moved one by one from a plastic bag.
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PRODUCT SPECIFICATION
[ 17.4 ] Please follow the packing design instruction, such as the maximum number of tray stacking to
prevent the deformation of tray plates which may cause open cells broken.
[ 17.5 ] To prevent an open cell broken or a COF damaged on a tray, please follow the instructions below:
[17.5.1] Do not peel a polarizer protection film of an open cell off on a tray
[17.5.2] Do not install FFC or LVDS cables of an open cell on a tray
[17.5.3] Do not press the surface of an open cell on a tray.
[17.5.4] Do not pull X-board when an open cell placed on a tray.
[ 18 ] Unpacking (Hard Box) in order to prevent open cells broken:
[ 18.1 ] Moving hard boxes by one operator may cause hard boxes fell down and open cells broken by
abnormal methods. Two operators carry one hard box with their two hands. Do handle hard boxes
carefully, such as avoiding impact, putting down, and piling up gently.
[ 18.2 ] To prevent hard boxes sliding from carts and falling down, hard boxes should be placed on a
surface with resistance.
[ 18.3 ] To prevent an open cell broken or a COF damaged in a hard box, please follow the instructions
below:
[18.3.1] Do not peel a polarizer protection film of an open cell off in a hard box.
[18.3.2] Do not install FFC or LVDS cables of an open cell in a hard box.
[18.3.3] Do not press the surface of an open cell in a hard box.
[18.3.4] Do not pull X-board when an open cell placed in a hard box.
[ 19 ] Handling – In order to prevent open cells, COFs , and components damaged:
[ 19.1 ] The forced displacement between open cells and X-board may cause a COF damaged. Use a fixture
tool for handling an open cell to avoid X-board vibrating and interfering with other components on
a PCBA & a COF.
[ 19.2 ] To prevent open cells and COFs damaged by taking out from hard boxes, using vacuum jigs to take
out open cells horizontally is recommended.
[ 19.3 ] Improper installation procedure may cause COFs of an open cell over bent which causes damages.
As installing an open cell on a backlight or a test jig, place the bottom side of the open cell first on
the backlight or the test jig and make sure no interference before fitting the open cell into the
backlight/the test jig.
[ 19.4 ] Handle open cells one by one.
[ 20 ] Avoid any metal or conductive material to contact PCB components, because it could cause electrical
damage or defect.
8.2 SAFETY PRECAUTIONS
[ 1 ] If the liquid crystal material leaks from the open cell, it should be kept away from the eyes or mouth. In case
of contact with hands, skin or clothes, it has to be washed away thoroughly with soap.
[ 2 ] After the end of life, open cells are not harmful in case of normal operation and storage.
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PRODUCT SPECIFICATION
9. DEFINITION OF LABELS
9.1 OPEN CELL LABEL
The barcode nameplate is pasted on each open cell as illustration for INX internal control.
Figure.9-1 Serial No. Label on SPWB and Cell
Model Name : V500HJ1-PE8
Revision : Rev. XX, for example: A0, A1… B1, B2… or C1, C2…etc.
Serial ID : X X X X X X X Y M D L N N N N
V500HJ1 –PE8 Rev. XX
X X X X X X X Y M D L N N N N
Serial No.
Year, Month, Date
INX Internal Use
Revision
Serial ID includes the information as below:
Manufactured Date:
Year: 2010=0, 2011=1,2012=2…etc.
Month: 1~9, A~C, for Jan. ~ Dec.
Day: 1~9, A~Y, for 1st to 31st, exclude I ,O, and U.
Revision Code: Cover all the change
Serial No.: Manufacturing sequence of product
INX Internal Use
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Figure.9-2 Panel ID Label on Cell
Panel ID Label includes the information as below :
Panel ID: T X X X X X X X X X X X
PRODUCT SPECIFICATION
TXXXXXXXXXXX
INX Internal Use
FAB Line: 1~8, for Fab1~Fab8
TFT
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PRODUCT SPECIFICATION
10. PACKAGING
10.1 PACKAGING SPECIFICATIONS
(1) 12 LCD TV Panels / 1 Box (2) Box dimensions : 1260 (L) X810 (W) X97.5 (H)mm (3) Weight : approximately 37 Kg ( 12 panels per box) (4) 120 LCD TV Panels / 1 Group
(5) Without the outer carton, Boxes stack under the package architecture
10.2 PACKAGING METHOD
Figures 10-1 and 10-2 are the packing method,
Figure.10-1 packing method
Packing method (Hard Box) is shown in following figures.
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PRODUCT SPECIFICATION
Figure.10-2 packing method
10.3 UN-PACKAGING METHOD
Figures 10-3 are the unpacking method,
Figure.10-3 unpacking method
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11. MECHANICAL CHARACTERISTIC
PRODUCT SPECIFICATION
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PRODUCT SPECIFICATION
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