CHIMEI INNOLUX V236BJ1-P02 Specification

PRODUCT SPECIFICATION

Customer:

□ Tentative Specification

□ Preliminary Specification

■ Approval Specification

MODEL NO.: V236BJ1

SUFFIX: P02

APPROVED BY SIGNATURE

Name / Title Note

Please return 1 copy for your confirmation with your signature and comments.

Approved By Checked By Prepared By

Chao-Chun Chung

YP Lee Wesun Yen

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PRODUCT SPECIFICATION

CONTENTS

CONTENTS....................................................................................................................................................................................... 2

REVISION HISTORY ....................................................................................................................................................................... 3

1. GENERAL DESCRIPTION ......................................................................................................................................................... 4

1.1 OVERVIEW ......................................................................................................................................................................... 4

1.2 FEATURES .......................................................................................................................................................................... 4

1.3 MECHANICAL SPECIFICATIONS................................................................................................................................. 5

2. ABSOLUTE MAXIMUM RATINGS ..........................................................................................................................................6

2.1 ABSOLUTE RATINGS OF ENVIRONMENT................................................................................................................. 6

2.2 ABSOLUTE RATINGS OF ENVIRONMENT (OPEN CELL)....................................................................................... 7

2.3 ELECTRICAL ABSOLUTE RATINGS............................................................................................................................. 7

2.3.1 TFT LCD MODULE................................................................................................................................................. 7

3. ELECTRICAL CHARACTERISTICS.......................................................................................................................................... 8

3.1 TFT LCD OPEN CELL ....................................................................................................................................................... 8

4. INPUT TERMINAL PIN ASSIGNMENT................................................................................................................................ 10

4.1 TFT LCD OPEN CELL ..................................................................................................................................................... 10

5. INPUT TERMINAL PIN ASSIGNMENT................................................................................................................................ 11

5.1 TFT LCD OPEN CELL INPUT...................................................................................................................................... 112

5.2 COLOR DATA INPUT ASSIGNMENT....................................................................................................................... 133

5.3 FLICKER (Vcom) ADJUSTMENT ................................................................................................................................ 144

6. INTERFACE TIMING................................................................................................................................................................ 15

6.1 INPUT SIGNAL TIMING SPECIFICATIONS .............................................................................................................. 15

6.2 POWER ON/OFF SEQUENCE ......................................................................................................................................17

7. OPTICAL CHARACTERISTICS............................................................................................................................................... 18

7.1 TEST CONDITIONS......................................................................................................................................................... 18

7.2 OPTICAL SPECIFICATIONS ......................................................................................................................................... 19

8. PRECAUTIONS .......................................................................................................................................................................... 22

8.1 ASSEMBLY AND HANDLING PRECAUTIONS........................................................................................................ 22

8.2 SAFETY PRECAUTIONS ................................................................................................................................................ 23

9. DEFINITION OF LABELS......................................................................................................................................................... 24

9.1 OPEN CELL LABEL......................................................................................................................................................... 24

10. PACKAGING............................................................................................................................................................................ 25

10.1 PACKAGING SPECIFICATIONS ................................................................................................................................ 25

10.2 PACKAGING METHOD...................................................................................................................................................

11. MECHANICAL CHARACTERISTIC ........................................................................................................................................

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Version Date Page(New)

Ver. 2.0

Ver 2.1

Jan.16, 2013

Jan.31.2013

All

4

27

PRODUCT SPECIFICATION

REVISION HISTORY

Section Description

All

1.2

11

The Approval Specification was first issued. Physical Size [mm]

MECHANICAL CHARACTERISTIC (Panel thicknes)

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PRODUCT SPECIFICATION

X+C Board

1. GENERAL DESCRIPTION

1.1 OVERVIEW

V236BJ1-P02 is a 23.6” TFT Liquid Crystal Display product with driver ICs and 1ch-LVDS interface. This product supports 1366*768 HDTV format and can display 16.7M colors (8-bit / color)..

1.2 FEATURES

CHARACTERISTICS ITEMS SPECIFICATIONS

Screen Diagonal [in] 23.6

Pixels [lines] 1366 × 768

Active Area [mm] 521.4705(H) × 293.184(V) (23.6” diagonal)

Sub-Pixel Pitch [mm] 0.12725(H) × 0.38175(V)

Pixel Arrangement RGB Vertical Stripe

Weight [g] 490 Typ. (g)

Physical Size [mm] 535.06(W) × 306.34(H) × 1.32(D) Typ.

Display Mode Transmissive Mode / Normallly Black

Contrast Ratio Typ.3000:1

(Typical value measure by INX’s Module)

Glass thickness (Array / CF) [mm] 0.5 / 0.5

Viewing Angle (CR>20) Typ. +88/-88(H), +88/-88(V) (CR≧20)

(Typical value measured by INX’s module)

Color Chromaticity R = (0.648, 0.329)

G = (0.270, 0.589)

B = (0.133, 0.105)

W= (0.309, 0.354)

* Please refer to “color chromaticity” in 7.2

Cell Transparency [%] 5.4%

* Please refer to “Transmittance” in 7.2

Polarizer Surface Treatment

Rotation Function

Display Orientation

Anti-Glare coating (Haze 1%)

Unachievable

Signal input with “INX”

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Back Side

Front Side

INX

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PRODUCT SPECIFICATION

1.3 MECHANICAL SPECIFICATIONS

Item Min. Typ. Max. Unit Note

Weight 475 490 505 g -

I/F connector mounting

position

Note (1) Please refer to the attached drawings for more information of front and back outline dimensions.

Note (2) Connector mounting position

The mounting inclination of the connector makes the screen center within ± 0.5mm as the horizontal.

+/- 0.5mm

(2)

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PRODUCT SPECIFICATION

2. ABSOLUTE MAXIMUM RATINGS

2.1 ABSOLUTE RATINGS OF ENVIRONMENT

Value

Item Symbol

Min. Max.

Storage Temperature TST -20 +60 ºC

Operating Ambient Temperature TOP 0 50 ºC

Note (1) Temperature and relative humidity range is shown in the figure below.

(a) 90 %RH Max. (Ta ≦ 40 ºC).

(b) Wet-bulb temperature should be 39 ºC Max. (Ta > 40 ºC).

(c) No condensation.

Note (2) Thermal management should be considered in final product design to prevent the surface temperature of display

area from being over 65 ºC. The range of operating temperature may degrade in case of improper thermal

Unit Note

(1)

With INX

Module

(1), (2)

With INX

Module

management in final product design.

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PRODUCT SPECIFICATION

2.2 ABSOLUTE RATINGS OF ENVIRONMENT (OPEN CELL)

Recommended Storage Condition: With shipping package.

Recommended Storage temperature range: 25±5 ℃

Recommended Storage humidity range: 50±10%RH

Recommended Shelf life: a month

2.3 ELECTRICAL ABSOLUTE RATINGS

2.3.1 TFT LCD MODULE

Value

Item Symbol

Min. Max.

Power Supply Voltage VCC -0.3 13.5 V

Logic Input Voltage VIN -0.3 3.6 V

Note (1) Permanent damage to the device may occur if maximum values are exceeded. Function operation

should be restricted to the conditions described under Normal Operating Conditions.

Unit Note

(1)

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3. ELECTRICAL CHARACTERISTICS

3.1 TFT LCD OPEN CELL

(Ta = 25 ± 2 ºC)

PRODUCT SPECIFICATION

Parameter Symbol

Min. Typ. Max.

Power Supply Voltage VCC 10.8 12 13.2 V (1)

Rush Current I

White Pattern PT

Power consumption

Power Supply Current

LVDS interface

Black Pattern PT

Heavy Loading pattern Ex: Horizontal Stripe (by cell and platform)

White Pattern PT

Black Pattern PT

Heavy Loading pattern Ex: Horizontal Stripe (by cell and platform)

Differential Input High Threshold Voltage

Differential Input Low Threshold Voltage

Common Input Voltage VCM 1.0 1.2 1.4 V

V

RUSH

PT

LVTH

LVTL

－

+100

-300

Value

－

5.256 6.24

3.269

5.0976 6.053

0.44 0.52

0.272 0.3185

0.425

－

3.172 A (2)

3.822

0.5044

+300 mV

-100 mV

Unit Note

W

(3)

A

(4)

Differential input voltage |VID|

Terminating Resistor RT

Input High Threshold

CMOS interface

Note (1) The module should be always operated within the above ranges.

The ripple voltage should be controlled under 10% of Vcc (Typ.).

Note (2) Measurement condition :

Voltage Input Low Threshold

Voltage

VIH 2.7

VIL 0

200

－

GND

－

100

－

600 mV

－

3.3 V

0.7 V

Vcc rising time is 470us

0.1Vcc

ohm

Vcc

0.9Vcc

470us

Note (3) The specified power supply current is under the conditions at Vcc = 12 V, Ta = 25 ± 2 ºC, fv = 60 Hz, whereas a power

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PRODUCT SPECIFICATION

dissipation check pattern below is displayed.

a. White Pattern

Active Area

b. Black Pattern

Active Area

c. Heavy Loading pattern Ex: Horizontal Stripe

Note (4) The LVDS input characteristics is shown as below :

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4. INPUT TERMINAL PIN ASSIGNMENT

X+C Board

Foxconn GS23301

-

1321S

-7H

GND

SELLVDS

SDA SCL

4.1 TFT LCD OPEN CELL

PRODUCT SPECIFICATION

TFT LCD PANEL

(1366x3x768)

INPUT CONNECTOR, P-TWO 187114-30091 or

Vcc

RX0(+/-) RX1(+/-) RX2(+/-) RX3(+/-) CLK(+/-)

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PRODUCT SPECIFICATION

5. INPUT TERMINAL PIN ASSIGNMENT

5.1 TFT LCD OPEN CELL INPUT

CNF1 Connector Pin Assignment P-TWO=187053-30091 or FOXCONN=GS23302-1321S-7H

Pin Name Description Remark 1 VCC +12.0V power supply 2 VCC +12.0V power supply 3 VCC +12.0V power supply 4 VCC +12.0V power supply 5 GND Ground 6 GND Ground 7 GND Ground

8 NC 9 SELLVDS Select LVDS Format (3)(4)

10 NC NC (2) 11 GND Ground 12 RX0- Negative LVDS differential data input. Channel 0 13 RX0+ Positive LVDS differential data input. Channel 0 14 GND Ground 15 RX1- Negative LVDS differential data input. Channel 1 16 RX1+ Positive LVDS differential data input. Channel 1 17 GND Ground 18 RX2- Negative LVDS differential data input. Channel 2 19 RX2+ Positive LVDS differential data input. Channel 2 20 GND Ground 21 RXLCK- Negative LVDS differential clock input. 22 RXCLK+ Positive LVDS differential clock input. 23 GND Ground 24 RX3- Negative LVDS differential data input. Channel 3 25 RX3+ Positive LVDS differential data input. Channel 3 26 GND Ground 27 NC No connection (2)

28 SCL I2C clock (For Vcom tunning) 29 SDA I2C data (For Vcom tunning) 30 GND Ground

Note (1) LVDS connector pin orderdefined as below

No connection

(2)

Note (2) Reserved for internal use. Please leave it open.

Note (3) Connect to Open or +3.3V: VESA Format, connect to GND: JEIDA Format.

SELLVDS Mode

H(default) VESA

L JEIDA

L : Connect to GND, H: Connect to +3.3V

Note (4) Interface optional pin has internal scheme as following diagram. Customer should keep the interface voltage level

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PRODUCT SPECIFICATION

IC

>16K ohm

1K ohm

requirement which including Panel board loading as below.

System Board

Interface Voltage Level

Panel Board

3.3V

VH > V VL < V

Note (5) LVDS connector mating dimension range request is 0.93mm~1.0mm as below.

Note (6) The screw hole which is distant from the connector is merged with Ground.

IH

IL

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PRODUCT SPECIFICATION

5.2 COLOR DATA INPUT ASSIGNMENT

The brightness of each primary color (red, green and blue) is based on the 8-bit gray scale data input for the color.

The higher the binary input, the brighter the color. The table below provides the assignment of the color versus

data input.

Data Signal

Color

R7 R6 R5 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 B1 B0

Black Red

Green Basic Colors

Gray Scale Of Red

Gray Scale Of Green

Gray Scale Of Blue

Note (1) 0: Low Level Voltage, 1: High Level Voltage

Blue

Cyan

Magenta

Yellow

White

Red (0) / Dark

Red (1)

Red (2)

:

: Red (253) Red (254) Red (255) Green (0) / Dark Green (1) Green (2)

:

: Green (253) Green (254) Green (255) Blue (0) / Dark Blue (1) Blue (2)

:

: Blue (253) Blue (254) Blue (255)

0

1

0

1

0

:

1

0

:

0

:

0

Red Green Blue

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

1

0

:

1

0

1

0

1

0

1

0

1

0

1

0

:

0

1

0

1

0

1

0

1

0

:

0

1

0

1

0

1

0

1

0

1

0

:

0

:

0

:

1

0

1

0

1

0

:

0

:

0

1

0

1

0

:

1

0

1

0

1

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PRODUCT SPECIFICATION

5.3 FLICKER (Vcom) ADJUSTMENT

(1) Adjustment Pattern :

The adjustment pattern is shown as below. If customer needs below pattern, please directly contact with

INX account FAE.

(2) Adjustment method: (Digital V-com)

Programmable memory IC is used for Digital V-com adjustment in this model. INX provide Auto Vcom tools

to adjust Digital V-com.The detail connection and setting instruction, please directly contact with Account

FAE or refer INX Auto V-com adjustment OI. Below items is suggested to be ready before Digital V-com

adjustment in customer LCM line.

a. USB Sensor Board.

b. Programmable software.

c. Document: Auto V-com adjustment suggestion OI.

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PRODUCT SPECIFICATION

DE

T

hb

Valid Display Data (

960

clocks)

T

c

6. INTERFACE TIMING

6.1 INPUT SIGNAL TIMING SPECIFICATIONS

The input signal timing specifications are shown as the following table and timing diagram.

Signal Item Symbol Min. Typ. Max. Unit Note

F

clkin

(=1/TC)

T

-

rcl

clkin_mod

F

SSM

T

RSKM

60 76 82 MHz

－

F

-2%

clkin

－－

-400

－

300 ps (3)

F

+2%

clkin

200 KHz

400 ps (5)

LVDS

Receiver

Clock

LVDS

Receiver

Data

Frequency

Input cycle to cycle jitter Spread spectrum modulation range Spread spectrum modulation frequency

Receiver Skew Margin

MHz

(4)

Frame Rate

Fr5 47 50 53 Hz

Vertical

Active

Display

Term

Total Tv 778 806 986 Th

Display Tvd 768 768 768 Th

Fr6 57 60 63 Hz

Blank Tvb 10 38 218 Th

Horizontal

Active

Display

Term

Note (1) Please make sure the range of pixel clock has follow the below equation :

Fclkin(max) ≧ Fr6 ╳ Tv ╳ Th

Fr5 ╳ Tv ╳ Th ≧ Fclkin (min)

Note (2) This module is operated in DE only mode and please follow the input signal timing diagram below :

Total Th 1446 1560 1936 Tc

Display Thd 1366 1366 1366 Tc

Blank Thb 80 194 570 Tc

Tv

Tvd

Tvb

(6)

Tv=Tvd+Tvb

－

Th=Thd+Thb

－

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Th

DCLK

Thd

DE

DATA

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PRODUCT SPECIFICATION

Note (3) The input clock cycle-to-cycle jitter is defined as below figures. Trcl = | T1 – T|

Note (4) The SSCG (Spread spectrum clock generator) is defined as below figures.

Note (5) The LVDS timing diagram and the receiver skew margin is defined and shown in following figure.

RXCLK+/-

RXn+/-

T

RSKM

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PRODUCT SPECIFICATION

500ms

≦T4

Option Signals

(

SELLVDS

)

0≦T8≦T3

T

9

10ms

6.2 POWER ON/OFF SEQUENCE

To prevent a latch-up or DC operation of LCD module, the power on/off sequence should be as the diagram

below.

0.9Vcc

0V

0.1VCC

0.1Vcc

0.5≦T1≦10ms

0≦T2≦200ms

0≦T3

LVDS Signals

T2

0V

Power On

T3 T1

T4

Power Off

0≦T7≦T2

T7

T8

Backlight (Recommended)

500ms≦T5

100ms≦T6

50%

T5

50%

T6

Vcc Dip

≦≦≦≦

Vcc

Vcc(typ.) x 0.85

T9

Note (1) The supply voltage of the external system for the module input should follow the definition of Vcc.

Note (2) Apply the lamp voltage within the LCD operation range. When the backlight turns on before the LCD operation or

the LCD turns off before the backlight turns off, the display may momentarily become abnormal screen.

Note (3) In case of VCC is in off level, please keep the level of input signals on the low or high impedance.

If T2<0,that maybe cause electrical overstress failure.

Note (4) T4 should be measured after the module has been fully discharged between power off and on period.

Note (5) Interface signal shall not be kept at high impedance when the power is on.

Note (6) Vcc must decay smoothly when power-off.

0V

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7. OPTICAL CHARACTERISTICS

7.1 TEST CONDITIONS

Item Symbol Value Unit

Ambient Temperature Ta

PRODUCT SPECIFICATION

o

25 ±2

C

Ambient Humidity Ha

Vertical Frame Rate

Supply Voltage VCC

Input Signal According to typical value in "3. ELECTRICAL CHARACTERISTICS"

The LCD module should be stabilized at given temperature for 1 hour to avoid abrupt temperature change

during measuring in a windless room.

LCD Module

LCD Panel

Field of View = 1º

Fr 60 Hz

50 ±10

12.0 ±1.2

CS - 2000

%RH

V

500 mm

Light Shield Room

(Ambient Luminance < 2 lux)

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PRODUCT SPECIFICATION

7.2 OPTICAL SPECIFICATIONS

The relative measurement methods of optical characteristics are shown as below. The following items

should be measured under the test conditions described in 7.1 and stable environment shown in 7.1.

Item Symbol

Rcx

Red

Rcy

Gcx

Green

Color Chromaticity

Blue

White

Transmittance T% 5.4 - %

Transmittance Variation

Contrast Ratio CR

Response Time (VA Model)

Horizontal

Viewing Angle

Vertical

Gcy

Bcx

Bcy

Wcx

Wcy

δT

Gray to

gray

θx+

θx-

θY+

θY-

Viewing Angle at Normal

Standard light source “C”

θx=0°, θY =0° With INX Module@60Hz

CR≥20

With INX Module

Condition Min. Typ. Max. Unit Note

0.648

0.329

θx=0°, θY =0°

Direction

-0.03

0.9 1.42 (6)

2100 3000

-

80 80 80 80

0.270

0.598

0.133

0.103

0.309

0.354

8.5

88 88 88 88

+0.03

- - (1),(3)

20 ms (1),(4)

-

Deg. (1),(2)

-

(0)

-

(5)

Note (0) Light source is the standard light source ”C” which is defined by CIE and driving voltage are based on

suitable gamma voltages. The calculating method is as following :

1. Measure Module’s and BLU’s spectrum at center point. W, R, G, B are with signal input. BLU (V236BJ1-L01) is supplied by CMI.

2. Calculate cell’s spectrum.

3. Calculate cell’s chromaticity by using the spectrum of standard light source “C”.

Note (1) Light source is the BLU which supplied by CMI and driving voltage are based on suitable gamma

voltages.

Note (2) Definition of Viewing Angle (θx, θy):

Viewing angles are measured by Autronic Conoscope Cono-80

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PRODUCT SPECIFICATION

Time

Normal

θx = θy = 0º

θX- = 90º

x-

6 o’clock

θy- = 90º

y-

Note (3) Definition of Contrast Ratio (CR) :

The contrast ratio can be calculated by the following expression.

Contrast Ratio (CR) =

L255: Luminance of gray level 255

L 0: Luminance of gray level 0

θx−

θy+

θx+

y+

12 o’clock direction

θy+ = 90º

x+

θX+ = 90º

L255 of Luminance Surface

L0 of Luminance Surface

CR = CR (5), where CR (X) is corresponding to the Contrast Ratio of the point X at the figure in Note (6).

Note (4) Definition of Gray-to-Gray Switching Time

100%

90%

Optical

Response

10%

0%

The driving signal means the signal of gray level 0, 31, 63, 95, 127, 159, 191, 223 and 255.

Gray to gray average time means the average switching time of gray level 0, 31, 63, 95, 127, 159, 191, 223 and 255 to

each other.

Note (4) Definition of Response Time (Tr, Tf)

Gray to gray

switching time

Gray to gray

switching time

Note (5) Definition of Transmittance (T%)

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PRODUCT SPECIFICATION

[

]

Measure the transmittance at 5 points.

Light source is the BLU which contains three diffuser sheets and the cell driving voltage are based on suitable

gamma voltages.

Transmittance (T%) =

The transmittance of each point can be calculated by the following expression.

T (X) =

L1023: Luminance of gray level 1023

T(X) is corresponding to the point X1~X5 at the figure in Note (6).

.

Note (6) Definition of Transmittance Variation (δT) :

Measure the transmittance at 5 points.

Transmittance Variation (δT )=

T(X) is calculated as Note(5).

BLU of (X) Luminance

T(5)T(4),T(3),T(2),T(1), Average

module LCD of (X) L1023

%100

×

] T(5) T(4), T(3), T(2), T(1), [ Maximum

] T(5) T(4), T(3), T(2), T(1), [ Minimum

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PRODUCT SPECIFICATION

8. PRECAUTIONS

8.1 ASSEMBLY AND HANDLING PRECAUTIONS

[ 1 ] Do not apply improper or unbalanced force such as bending or twisting to open cells during assembly. [ 2 ] It is recommended to assemble or to install an open cell into a customer’s product in clean working areas.

The dust and oil may cause electrical short to an open cell or worsen polarizers on an open cell.

[ 3 ] Do not apply pressure or impulse to an open cell to prevent the damage. [ 4 ] Always follow the correct power-on sequence when an open cell is assembled and turned on. This can

prevent the damage and latch-up of the CMOS LSI chips.

[ 5 ] Do not design sharp-pointed structure / parting line / tooling gate on the plastic part of a COF (Chip on

film), because the burr will scrape the COF.

[ 6 ] If COF would be bended in assemble process, do not place IC on the bending corner. [ 7 ] The gap between COF IC and any structure of BLU must be bigger than 2 mm. This can prevent the damage

of COF IC.

[ 8 ] The bezel opening must have no burr and be smooth to prevent the surface of an open cell scraped. [ 9 ] The bezel of a module or a TV set can not contact with force on the surface of an open cell. It might cause

light leakage or scrape.

[ 10 ] In the case of no FFC or FPC attached with open cells, customers can refer the FFC / FPC drawing and buy

them by self.

[ 11 ] It is important to keep enough clearance between customers’ front bezel/backlight and an open cell.

Without enough clearance, the unexpected force during module assembly procedure may damage an open

cell.

[ 12 ] Do not plug in or unplug an I/F (interface) connector while an assembled open cell is in operation. [ 13 ] Use a soft dry cloth without chemicals for cleaning, because the surface of the polarizer is very soft and

easily scratched.

[ 14 ] Moisture can easily penetrate into an open cell and may cause the damage during operation. [ 15 ] When storing open cells as spares for a long time, the following precaution is necessary.

[ 15.1 ] Do not leave open cells in high temperature and high humidity for a long time. It is highly

recommended to store open cells in the temperature range from 0 to 35℃ at normal humidity

without condensation.

[ 15.2 ] Open cells shall be stored in dark place. Do not store open cells in direct sunlight or fluorescent light

environment.

[ 16 ] When ambient temperature is lower than 10ºC, the display quality might be reduced. [ 17 ] Unpacking (Cartons/Tray plates) in order to prevent open cells broken:

[ 17.1 ] Moving tray plates by one operator may cause tray plates bent which may induce open cells broken.

Two operators carry one carton with their two hands. Do not throw cartons/tray plates, avoid any

impact on cartons/tray plates, and put down & pile cartons/tray plates gently.

[ 17.2 ] A tray plate handled with unbalanced force may cause an open cell damaged. Trays should be

completely put on a flat platform.

[ 17.3 ] To prevent open cells broken, tray plates should be moved one by one from a plastic bag.

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PRODUCT SPECIFICATION

[ 17.4 ] sPlease follow the packing design instruction, such as the maximum number of tray stacking to

prevent the deformation of tray plates which may cause open cells broken.

[ 17.5 ] To prevent an open cell broken or a COF damaged on a tray, please follow the instructions below:

[17.5.1] Do not peel a polarizer protection film of an open cell off on a tray

[17.5.2] Do not install FFC or LVDS cables of an open cell on a tray

[17.5.3] Do not press the surface of an open cell on a tray.

[17.5.4] Do not pull X-board when an open cell placed on a tray.

[ 18 ] Unpacking (Hard Box) in order to prevent open cells broken:

[ 18.1 ] Moving hard boxes by one operator may cause hard boxes fell down and open cells broken by

abnormal methods. Two operators carry one hard box with their two hands. Do handle hard boxes

carefully, such as avoiding impact, putting down, and piling up gently.

[ 18.2 ] To prevent hard boxes sliding from carts and falling down, hard boxes should be placed on a

surface with resistance.

[ 18.3 ] To prevent an open cell broken or a COF damaged in a hard box, please follow the instructions

below:

[18.3.1] Do not peel a polarizer protection film of an open cell off in a hard box.

[18.3.2] Do not install FFC or LVDS cables of an open cell in a hard box.

[18.3.3] Do not press the surface of an open cell in a hard box.

[18.3.4] Do not pull X-board when an open cell placed in a hard box.

[ 19 ] Handling – In order to prevent open cells, COFs , and components damaged:

[ 19.1 ] The forced displacement between open cells and X-board may cause a COF damaged. Use a fixture

tool for handling an open cell to avoid X-board vibrating and interfering with other components on

a PCBA & a COF.

[ 19.2 ] To prevent open cells and COFs damaged by taking out from hard boxes, using vacuum jigs to take

out open cells horizontally is recommended.

[ 19.3 ] Improper installation procedure may cause COFs of an open cell over bent which causes damages.

As installing an open cell on a backlight or a test jig, place the bottom side of the open cell first on

the backlight or the test jig and make sure no interference before fitting the open cell into the

backlight/the test jig.

[ 19.4 ] Handle open cells one by one.

[ 20 ] Avoid any metal or conductive material to contact PCB components, because it could cause electrical

damage or defect.

8.2 SAFETY PRECAUTIONS

[ 1 ] If the liquid crystal material leaks from the open cell, it should be kept away from the eyes or mouth. In case

of contact with hands, skin or clothes, it has to be washed away thoroughly with soap.

[ 2 ] After the end of life, open cells are not harmful in case of normal operation andtorage.

Version 2.1 23 Date：：：：Jan.31.2013

The copyright belongs to InnoLux. Any unauthorized use is prohibited

PRODUCT SPECIFICATION

V

236BJ1

-P0

2 Rev.

V

236BJ1

-P0

2 Rev.

9. DEFINITION OF LABELS

9.1 OPEN CELL LABEL

The barcode nameplate is pasted on each open cell as illustration for INX internal control.

XXXXXXXXXXXXXX

9.2 CARTON LABEL

The barcode nameplate is pasted on each box as illustration, and its definitions are as following explanation

P.O. NO. Made in Taiwan

XXXXXXXXXXXXXX

Parts ID. Quantities 15

Model Name V236BJ1-P02 Rev.

Carton ID. RoHS

XXXXXXXXXXXXXX

P.O. NO. Made in China

Parts ID. Quantities 15

Model Name V236BJ1-P02 Rev.

Carton ID. RoHS

(a) Model Name: V236BJ1– P02 (b) Carton ID: CMI internal control (c) Quantities: 15

Version 2.1 24 Date：：：：Jan.31.2013

The copyright belongs to InnoLux. Any unauthorized use is prohibited

XXXXXXXXXXXXXX

10. PACKAGING

10.1 PACKAGING SPECIFICATIONS

(1) 15 PCS LCD TV Panels / 1 Box (2) BOX DIMENSIONS : 630 (L) X 480 (W) X93 (H)MM (3) WEIGHT : APPROXIMATELY 10.3KG (4) 540 PCS LCD TV PANELS / 1 GROUP

10.2 PACKING METHOD

Packing method (Hard Box) is shown in following figures.

PRODUCT SPECIFICATION

Figure.9-1 packing method

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The copyright belongs to InnoLux. Any unauthorized use is prohibited

PRODUCT SPECIFICATION

Figure.9-2 packing method

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The copyright belongs to InnoLux. Any unauthorized use is prohibited

11. MECHANICAL CHARACTERISTIC

PRODUCT SPECIFICATION

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The copyright belongs to InnoLux. Any unauthorized use is prohibited

CHIMEI INNOLUX V236BJ1-P02 Specification

Specifications and Main Features

Frequently Asked Questions

User Manual