Chenbro RM43596, 387-43596-3300A0 User Manual

RM43596 JBOD

Rackmount Chassis User Manual

January 2019 Version 1.0

A document provides an overview of product features, functions, architecture, and support specifications

RM43596 JBOD

<Table of Contents │ 2

DISCLAIMERS

No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.

Chenbro disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness

for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or

usage in trade.

This document contains information on products, services and/or processes in development. All information provided here is subject

to change without notice. Contact your Chenbro representative to obtain the latest Configuration Guide.

The products and services described may contain defects or errors known as errata which may cause deviations from published

specifications. Current characterized errata are available on request.

Chenbro, and the Chenbro logo are trademarks of Chenbro Micom Co.,Ltd in the worldwide.

*Other names and brands may be claimed as the property of others

© 2019 Chenbro Micom Co.,Ltd.

RM43596 JBOD

<Table of Contents │ 3

Table of Contents

Table of Contents ............................................................................................................................................... 3

List of Figures ..................................................................................................................................................... 4

List of Tables ....................................................................................................................................................... 5

1. Product Overview .............................................................................................................................. 6

1-1 System Features Overview ........................................................................................................... 7

1-2 Front Panel ................................................................................................................................... 8

1-3 Back Panel .................................................................................................................................... 9

1-4 Front Control Panel .................................................................................................................... 10

1-5 Chassis Dimensions .................................................................................................................... 11

1-6 Available Rack Mounting Kit Options (Refer to “Installation”) .................................................. 12

1-7 System Level Environmental Specifications ............................................................................... 13

1-8 System Packaging ...................................................................................................................... 14

2. System Components Removal and Installation ................................................................................ 15

2-1 Top Cover Removal and Installation .......................................................................................... 16

2-2 External Hot-Swap HDD Assembly Removal and Installation .................................................... 17

2-3 System Maintenance ................................................................................................................. 19

2-4 Fan Module Removal and Installation ....................................................................................... 20

2-5 Internal/External Expander Card Removal and Installation ...................................................... 24

2-6 PSU Removal and Installation .................................................................................................... 26

2-7 Slide Rail Installation .................................................................................................................. 27

3. Backplane ......................................................................................................................................... 29

3-1 Storage Backplane Options ........................................................................................................ 30

3-2 3.5” 24-Port 12Gb/s SATA/ SAS Passive Backplane (Front-Right/Front-Left) ............................. 31

3-3 3.5” 24-Port 12Gb/s SATA/SAS Passive Backplane (Rear-Right/Rear-Left) ................................ 33

4. Maintenance and Service................................................................................................................. 35

RM43596 JBOD

List of Figures │ 4

List of Figures

Figure 1 Overview ........................................................................................................................................... 7

Figure 2 Overview ........................................................................................................................................... 7

Figure 3 Front panel ........................................................................................................................................ 8

Figure 4 Back panel overview ......................................................................................................................... 9

Figure 5 Front control panel ......................................................................................................................... 10

Figure 6 Chassis dimensions ......................................................................................................................... 11

Figure 7 Top cover installation ...................................................................................................................... 16

Figure 8 Top cover removal ........................................................................................................................... 16

Figure 9 3.5” hot-swap HDD assembly installation ....................................................................................... 17

Figure 10 3.5” hot-swap HDD assembly removal ......................................................................................... 17

Figure 11 3.5” HDD installation (tool-less type) ........................................................................................... 18

Figure 12 3.5” HDD removal (tool-less type) ................................................................................................ 18

Figure 13 Installation of whole system into the rack (tool-less type) .......................................................... 19

Figure 14 Removal of whole system from the rack (tool-less type) ............................................................. 19

Figure 15 Front fan module installation (8038) ............................................................................................ 20

Figure 16 Front fan module installation (8038) ............................................................................................ 20

Figure 17 Front fan module removal (8038) ................................................................................................. 21

Figure 18 Front fan module removal (8038) ................................................................................................. 21

Figure 19 Middle fan modules Installation (8038) ........................................................................................ 22

Figure 20 Middle fan modules removal (8038) ............................................................................................. 22

Figure 21 Rear fan modules installation (8038) ............................................................................................ 23

Figure 22 Rear fan modules removal (8038) ................................................................................................. 23

Figure 23 Internal expander card installation ............................................................................................... 24

Figure 24 Internal expander card removal .................................................................................................... 24

Figure 25 CRPS PSU installation .................................................................................................................... 26

Figure 26 CRPS PSU removal ......................................................................................................................... 26

Figure 27 Slide rail installation-1 (84H314610-003) ..................................................................................... 27

Figure 28 Slide rail installation-2 (84H314610-003) ..................................................................................... 27

Figure 29 Slide rail installation-3 (84H314610-003) ..................................................................................... 28

Figure 30 3.5” Drive tray/internal expander drive tray LED identification ................................................... 29

Figure 31 Backplane front view (front-right) ................................................................................................ 31

Figure 32 Backplane front view (front-left) .................................................................................................. 32

Figure 33 Backplane front view (rear-right) .................................................................................................. 33

Figure 34 Backplane front view (rear-left) .................................................................................................... 34

RM43596 JBOD

List of Tables │ 5

List of Tables

Table 1 Chenbro RM43596 specifications ..................................................................................................... 6

Table 2 Front control panel ......................................................................................................................... 10

Table 3 Slide rail options ............................................................................................................................. 12

Table 4 System environmental specifications summary ............................................................................. 13

Table 5 System packaging information ...................................................................................................... 14

Table 6 Product weight information ........................................................................................................... 14

Table 7 Drive power LED/activity LED behavior .......................................................................................... 29

Table 8 Backplane specifications................................................................................................................. 31

Table 9 Connector and pin header function description ............................................................................ 32

Table 10 Backplane specifications ................................................................................................................ 33

Table 11 Connector and pin header function description ............................................................................ 34

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Product Overview// │ 6

1. Product Overview

This chapter provides a high-level overview of the system features and available options. More details for each major sub-system,

feature, or option are provided in the following chapters.

Table 1 Chenbro RM43596 specifications

Feature Description

M/B Form Factor N/A (JBOD)

Dimension

(D x W x H)

1000mm x 447mm x 175mm

39.4’’ x 17.6’’ x 6.89’’

Drive Bay 96 x 3.5” Hot-swap HDD

Backplane 4 x 22-port 12Gb/s SAS3/SATA3 Passive Backplane.

4 x 2-port 12Gb/s SAS3/SATA3 Passive Backplane ( Side-docked )

8 x Internal Expander Card ( Dual Domain )

2 x External Expander Card with Console ( Debug )

Power Supply 1+1 CRPS , 80 Plus Platinum, 2000W ( Default )

185mm x 73mm x 40mm ( D x W x H )

Indicator Front : 1 x Power Status, 1 x UID, 1 x HDD Activity, 1 x Global Failure, 1 x LCM

Rear : 1 x Power Status, 1 x UID

Front Control 1 x Power On/Off Button, 1 x UID Button, 1 x LCM Display with Control keys

Rear Control 2 x RS232 Com Port, 1 x IPMI , 8 x Mini-SAS HD

System Security BMC Module Control

Slot Opening N/A

Cooling Fans (Max) Front : 4 x 8038 Hot-Swap Fan, PWM

Middle : 2 x 8038 Hot-Swap Fan, PWM

Rear : 4 x 8038 Hot-Swap Fan, PWM

Expansion Slot N/A

Front Bezel N/A

Slide Rail Full Travel with CMA

Temperature Operating: 10°C to 35°C (50°F to 95°F)

Non-operating: -40°C to 70°C (-40°F to 158°F)

Humidity Non-operating: 50% to 90%

Net Weight 77.0 Kg

Gross Weight 113.1 Kg

Container Loading 20’:48, 40’:100

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Product Overview// │ 7

1-1 System Features Overview

Figure 1 Overview

Figure 2 Over view

A. Rack Handle

B. LCM Display

C. Top Cover Latch

D. Front Control Panel

E. 3.5” Storage Drive Bay

F. Front Hot-Swap Fan Module

G. Middle Fixed Fan Module

H. Internal Expander Cards

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Product Overview// │ 8

1-2 Front Panel

Figure 3 Front panel

A. Rack Handles

B. Front Control Panel

C. LCM Display

D. Front Hot-Swap Fan Module

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Product Overview// │ 9

1-3 Back Panel

Figure 4 Back panel overview

A. External Expander Cards

B. CRPS PSU

C. Rear Hot-Swap Fan Module

D. QIG Label

E. UID Button

F. IPMI Port

G. Power Button

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Product Overview// │ 10

1-4 Front Control Panel

Figure 5 Front control panel

Table 2 Front control panel

Label ICON Indicator, button, or connector

A

UID Button/LED

B

Power LED

C

System Alarm LED

D

HDD Activity LED

E LCM Display

F

Page Up

G

Page down

H

Enter

I Return

J

Home

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Product Overview// │ 11

1-5 Chassis Dimensions

Figure 6 Chassis dimensions

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Product Overview// │ 12

1-6 Available Rack Mounting Kit Options (Refer to “Installation”)

Advisory Note – Available rack and cabinet mounting kits are not designed to support shipment of the server system while installed

in a rack. If you chose to do so, Chenbro advises you to verify your shipping configuration with appropriate shock and vibration

testing before shipment. Chenbro does not perform shipping tests which cover the complex combination of unique rack offerings

and custom packaging options.

Caution: Exceeding the specified maximum weight limit of a given rail kit or misalignment of the server in the rack may result in

failure of the rack rails, causing damage to the system or personal injury. Two persons to operate or the use of a mechanical assist

tool to install and align the server into the rack is highly recommended.

Available rack mounting kits:

Table 3 Slide rail options

Part Number

384-43503-3300A0

Rail Dimension (mm/inch) 964/37.9"

Applicable Cabinet-post to post (mm/inch) 668~936/26.3"~36.9"

3 Section/2 Section 2 Section

Traveling Distance (mm/inch) 950/37.4"

Support chassis width 438

Loading (kg) 130 kg

Max. Static Loading (kg) for UL 249 kg

Tool-less/Non tool-less Yes

Support CMA Yes

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Product Overview// │ 13

1-7 System Level Environmental Specifications

The following table defines the system level specifications under operating and non-operating environments.

Table 4 System environmental specifications summary

Parameter Specification

Temperature Operating 5º C to 35º C (41º F to 95º F)

Temperature Non-Operating -40º C to 70º C (-40º F to 158º F)

Humidity

Non-Operating

50% to 90%, non-condensing with a maximum wet bulb of 28° C (at
temperatures from 25° C to 35° C)

Shock

Unpackaged Trapezoidal, 25 g, velocity change is based on Product weight

Vibration Operating 5 Hz @ 0.0002 g2/Hz to 350 Hz @ 0.0002 g2/Hz

Input acceleration is 0.26 g RMS
10 minutes per axis for all 3 axes on all samples

Random control limit tolerance is ± 3 dB

EMI
Pre-scan

Radiated Emissions International (CISPR 22) Radiated Limits for Radiating Class A & B Devices

Frequency range(MHz)/Class A and Class B(10 meters limits):

30MHz to 300 MHz / 40 dB ( V/m) and 30 dB ( V/m)

200MHz to 1000 MHz / 47 dB ( V/m) and 37 dB ( V/m)

RVI Operating HDD class

 Class 1: Highest performance, reliability, and data integrity
 Class 2: A second tier of performance, reliability, and data integrity

HDD I/O throughput degradation SPEC
Pass/Fail Criteria

 No functional failure during test or post test diagnostics.
 Requirement to pass test is based on IOMeter data throughput (in IO’s per

second) expressed as a percent of Test HDD maximum theoretical

baseline performance

 Class1: > 90% of baseline for 4K Random Writes and > 80% of baseline for

128K Sequential Writes.

 Class2: > 85% of baseline for 4K Random Writes and > 75% of baseline for

128K Sequential Writes.

 Mix: > 80% of baseline for 4K Random Writes and > 70% of baseline for

128K Sequential Writes.

Packaged

Vibration

Non-Operating ISTA (weight over 68 kg, 1B ; weight equal or less than 68 kg, 1A)

Packaged Drop

Non-Operating Drop height change is based on product weight

Non-palletized product:

 Investigation: Test requirement is 6 face drops, 8 corner drops and 12

edge drops for a total of 26 drops.

 Validation: Test requirement is 6 face drops, 2 corner drops and 3 edge

drops for a total of 11 drops.

Palletized product: (Both investigation and validation)

 Perform two bottom drops at the specified height, 10 bottom drops at

one half of the specified height.



Perform 4 rotational edge drops (one per edge) at the specified height.

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Product Overview// │ 14

1-8 System Packaging

The original Chenbro packaging, where the server system is delivered, is designed to provide protection for L6 configuration and

tested to meet ISTA (International Safe Transit Association) Test Procedure 1A (2008). The packaging is also designed to be reused

for shipment after the system integration has been completed.

The original packaging includes the shipping box, and various protective inner packaging components, which are designed to

function together as a protective packaging system. When reused, all of the original packaging material must be used, including box

and each inner packaging component. In addition, all inner packaging components MUST be reinstalled in the proper location to

ensure adequate protection to the system for subsequent shipment.

Table 5 Syst em packaging information

Part Number Single/ Bulk Form factor (mm) Support level

387-43596-3300A0 Single 1209 x 639 x 120

L6

NOTE: The design of the inner packaging components does not prevent improper placement within the packaging

assembly. There is only one correct packaging assembly that will allow the package to meet the ISTA (International Safe

Transit Association) Test Procedure 1A (2008).

Failure to follow the specified packaging assembly instructions may result in damage to the system during shipment.

Table 6 Product weight information

Product

Unpackaged Net Weight

（kg）

Packaged Gross Weight

（kg）

Unpackaged Net Weight

(lbs)

Packaged Gross Weight

(lbs)

RM43596 77.0 113.1 169.8 249.3

NOTE: An L6 system does not include M/B, processors, memory, drives, or add-in cards. It is the system configuration as

shipped from Chenbro. Weights of integrated system (system configurations that include the items above) will vary

depending on the final system configuration.

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2. System Components Removal and Installation

RM43596 supports for a variety of different storage option:

 96 x 3.5” Hot-Swap SAS/SATA HDD

Support for different storage and peripheral options will vary depending on the system model and/or available accessory options

installed.

BEFORE YOU BEGIN

WARNING: Watch out Safety and ESD precautions instructions before installing the server.

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/ System Components Removal and Installation │ 16

2-1 Top Cover Removal and Installation

Figure 7 Top cover installation

1. Align the guide pins of this cover with the grooves on the chassis base, and install the cover vertically as shown.

(5 guide pins for both side)

NOTE: Keep the latch vertical.

2. Press the latch to lock.

3. Secure with 4 screws as shown.

Figure 8 Top cover removal

1. Loosen 4 screws on the cover as shown.

2. Pull the latch as shown to release the cover.

3. Remove it by both hands to hold each side.

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2-2 External Hot-Swap HDD Assembly Removal and Installation

Figure 9 3.5” hot-swap HDD assembly installation

1. With the open latch, insert the HDD assembly into the drive bay as shown until the bottom of chassis base.

NOTE: Watch out the direction of HDD assembly while inserting.

2. Push the latch when it is secured with a click.

Figure 10 3.5” hot-swap HDD assembly removal

1. Open the latch to release the HDD assembly as shown.

2. Pull the HDD assembly out of drive bay.

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Figure 11 3.5” HDD installation (tool-less type)

1. Slide in the HDD until align the anchor point of HDD tray.

2. Push down the HDD when it is secured with a click.

Figure 12 3.5” HDD removal (tool-less type)

1. Bottom up the HDD tray as shown.

2. Press your 2 thumbs on the HDD as shown.

NOTE: Watch out the direction of HDD assembly while inserting.
NOTE: Please operate this on a stable surface in case the HDD dropping unexpectedly.
NOTE: To avoid injury, be careful of the sharp corners and rough edges on HDD tray.

3. Lift the other side with your other fingers and release the HDD.

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2-3 System Maintenance

Figure 13 Installation of whole system into the rack (tool-less type)

1. Push the system all the way into the cabinet by 2 persons or more.

2. Secure the system with thumb screws on both sides as shown.

Figure 14 Removal of whole system from the rack (tool-less type)

1. Loosen the thumb screws on both sides as shown.

2. Pull the system out of cabinet by 2 persons or more.

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2-4 Fan Module Removal and Installation

Figure 15 Front fan module installation (8038)

Figure 16 Front fan module installation (8038)

1. Hold the finger grips of fan brackets as shown.

NOTE: Ensure that the arrow sticker on the fan is facing the back of the chassis.

2. Insert the fan module into the fan cage until it is locked with a click.

3. Place the shock-absorbing pads on the front fan modules.

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/ System Components Removal and Installation │ 21

Figure 17 Front fan module removal (8038)

Figure 18 Front fan module removal (8038)

1. Remove the shock-absorbing pads on the front fan modules.

2. Grasp and press the fan brackets by the finger grips to release the fan module vertically as shown.

3. Pull it outward and disengage from fan cage.

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/ System Components Removal and Installation │ 22

Figure 19 Middle fan modules Installation (8038)

1. Hold the finger grips of fan brackets as shown.

NOTE: Ensure that the arrow sticker on the fan is facing the back of the chassis.

2. Insert the fan module until it is secured with a click.

Figure 20 Middle fan modules removal (8038)

1. Grasp and press the fan brackets by the finger grips to release the fan module vertically as shown.

2. Pull it outward and disengage from fan cage.

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Figure 21 Rear fan modules installation (8038)

1. Hold the latches of rear fan module.

2. Insert the fan module to the rear fan cage until it is secured with a click.

Figure 22 Rear fan modules removal (8038)

1. Press and hold the latches of rear fan module.

2. Disengage the fan module from the rear fan cage.

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/ System Components Removal and Installation │ 24

2-5 Internal/External Expander Card Removal and Installation

Figure 23 Internal expander card installation

1. Align the slot of the internal expander card with the guide pin on the chassis as shown, and install the card vertically until it

reaches the Air Max connectors.

2. Press the lever to secure it.

Figure 24 Internal expander card removal

1. Open the internal expander card lever.

2. Pull it out of chassis base.

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/ System Components Removal and Installation │ 25

Figure 17 External expander card installation

1. Slide the external expander card into the chassis as shown.

2. Secure it with a thumb screw clockwise.

Figure 17 External expander card removal

1. Loosen the thumb screw anti-clockwise on external expander card.

2. Hold the bar bracket and pull it out of chassis.

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/ System Components Removal and Installation │ 26

2-6 PSU Removal and Installation

Figure 25 CRPS PSU installation

1. Grasp the finger grip with your fingers except the thumbs while pressing and holding the PSU latch with 1 thumb.

2. Slide into the chassis until it is secured with a click.

Figure 26 CRPS PSU removal

1. Press and hold the PSU latch with your thumb, and grasp the finger grip with other fingers.

2. Pull PSU out of the cage.

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/ System Components Removal and Installation │ 27

2-7 Slide Rail Installation

Figure 27 Slide rail installation-1 (84H314610-003)

1. Attach the inner rail to the chassis base while aligning T pins on the side of the system with the slots on the inner rail.

Figure 28 Slide rail installation-2 (84H314610-003)

2. Engage T pins with the slots on the inner rail as shown.

3. Secure the inner rail with 1 screw as shown.

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/ System Components Removal and Installation │ 28

Figure 29 Slide rail installation-3 (84H314610-003)

4. Install the system into the rack by 2 persons or more.

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/ Backplane │ 29

3. Backplane

Each drive tray includes separate LED indicators for drive activity and drive status. Light pipes integrated into the drive tray direct

light emitted from LEDs mounted next to each drive connector on the backplane to the drive tray faceplate, making them visible

from the front of the system.

Figure 30 3.5” Drive tray/internal expander drive tray LED identification

Table 7 Drive power LED/activity LED behavior

LED ICON LED Color Behavior Condition

A

Activity LED

Green Stay on Access

Red Solid on Failure

1Hz blink Rebuild

4Hz blink Locate

B

Activity LED Green 1Hz blink Access

C

Activity LED Red Stay on SAS signal error

NOTE: The drive activity LED is driven by signals coming from the drive itself. Drive vendors may choose to operate the activity

LED different from what is described in the table above. Should the activity LED on a given drive type behave differently than

what is described, customers should take the drive vendor specifications as a reference for the specific drive model to

determine what the expected drive activity LED operation should be.

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/ Backplane │ 30

3-1 Storage Backplane Options

RM43596 supports below backplanes :

 2 x 24-port 3.5” SAS/SATA SAS29-pin passive backplane (Front)
 2 x 24-port 3.5” SAS/SATA SAS29-pin passive backplane (Rear)
 8 x 12Gb/s SAS Expander Card (Internal)
 2 x 12Gb/s SAS Expander Card (External)
 1 x 12Gb/s BMC Module

All available SAS/SATA backplanes include the following common features:

 12Gb/s SAS and 6Gb/s SAS/SATA
 SFF-8680 12Gb/s rated drive interface connectors, providing both power and I/O signals to attached devices
 Hot swap support for SAS/SATA devices
 I2C interface from a 4-pin connector for device status communication to the BMC over SMBus
 LCM Display to indicate drive activity and status for each attached device

Functionality

The microcontroller has a master/slave I2C connection to the server board BMC. The microcontroller is not an IPMB compliant device.

The BMC will generate SEL events by monitoring registers on the HSBP microcontroller for DRIVE PRESENCE, FAULT, and RAID

REBUILD in progress.

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/ Backplane │ 31

3-2 3.5” 24-Port 12Gb/s SATA/SAS Passive Backplane (Front-Right/Front-Left)

Table 8 Backplane specifications

Specification

Host Interface Mini SAS HD

HDD Interface SAS/SATA

Hot-Swap

Yes, allows users to replace devices on line

Display

LED indicates storage device status

Error LED - Red (when HDD is error)
LED indicates Mini SAS HD Link status
Access LED – Green (When SAS signal link is busy)
Error LED - Red (when SAS signal link is error)

Environment Monitor Temperature sensor

Connectors 1. 26 x SFF-8482

2. 2 x Mini-SAS HD connectors

3. 10 x High-Speed backplane connectors

4. 1 x 8-pin Mini-Fit Power connector

5. 2 x 6-pin Micro-Fit Power connectors

Dimension 450.7(L) x 169.2(W) x 2.4(H) mm

Material FR4 8 layers

Figure 31 Backplane front view (front-right)

AFR. HDD_0 ~ HDD_3

BFR. HDD_4 ~ HDD_9

CFR. HDD_10 ~ HDD_15

DFR. HDD_16 ~ HDD_21

EFR. HDD_22

FFR. HDD_23

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/ Backplane │ 32

Figure 32 Backplane front view (front-left)

AFL. HDD_24 ~ HDD_27

BFL. HDD_28 ~ HDD_33

CFL. HDD_34 ~ HDD_39

DFL. HDD_40 ~ HDD_45

EFL. HDD_46

FFL. HDD_47

Table 9 Connector and pin header function description

Label Connecter Description

Drawing

G Power The backplane includes one 2 x 4 connector

supplying power to the backplane. Power is routed
to the backplane via a power cable harness from the
power supply modules.

H Mini-SAS HD The backplane includes two multi-port mini-SAS HD

cable connectors providing data signals for twenty
six SAS/SATA drives on the backplane.

I Fan The backplane includes two 2 x 3 connectors

supplying power and signals to the front hot-swap
fan.

J

Temperature Sensor

The backplane includes two temperature sensors

providing data signals to the BMC unit.

K High-Speed Backplane The backplane includes ten High-Speed backplane

connectors providing data signals for the internal
expander card.

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/ Backplane │ 33

3-3 3.5” 24-Port 12Gb/s SATA/SAS Passive Backplane (Rear-Right/Rear-Left)

Table 10 Backplane specifications

Specification

Host Interface Mini SAS HD

HDD Interface SAS/SATA

Hot-Swap Yes, allows users to replace storage devices on line

Display

LED indicates storage device status
Error LED - Red (when HDD is error)
LED indicates Mini SAS HD Link status
Access LED – Green (When SAS signal link is busy)

Error LED - Red (when SAS signal link is error)

Environment Monitor Temperature sensor

Connectors

1. 26 x SFF-8482

2. 2 x Mini-SAS HD

3. 10 x High-Speed backplane connectors

4. 1 x 8-pin Mini-Fit power connector

5. 2 x 16-pin power connectors

Dimension 505.0(L) x 157.5(W) x 2.4(H) mm

Material FR4 8 layers

Figure 33 Backplane front view (rear-right)

ARR. HDD_48 ~ HDD_53

BRR. HDD_54 ~ HDD_59

CRR. HDD_60 ~ HDD_65

DRR. HDD_66 ~ HDD_69

ERR. HDD_70

FRR. HDD_71

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/ Backplane │ 34

Figure 34 Backplane front view (rear-left)

ARL. HDD_72 ~ HDD_77

BRL. HDD_78 ~ HDD_83

CRL. HDD_84 ~ HDD_89

DRL. HDD_90 ~ HDD_93

ERL. HDD_94

ERL. HDD_95

Table 11 Connector and pin header function description

Label Connector Description

Drawing

G Power The backplane includes two Micro-Fit 3.0mm 2 x 16

connectors

supplying power to the backplane.

Power is routed to the backplane via a power cable
harness from the power supply modules.

J Mini-SAS HD The backplane includes 2 multi-port mini-SAS HD

cable connectors providing data signals for twenty
four SAS/SATA drives on the backplane.

K Fan The backplane includes two 2 x 3 connectors

supplying power and signals to the front hot-swap
fan.

H Temperature Sensor The backplane includes two temperature sensors

providing data signals to the BMC unit.

I High-Speed Backplane The backplane includes ten high-speed backplane

connectors providing data signals for the internal
expander card.

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/ Maintenance and Service │ 35

4. Maintenance and Service

DOA (Dead on Arrival)

If the products are found Defect On Arrival, please contact Chenbro’s regional sales or CQE and indicate the defective status via

email along with product photos and description. You may need to return the defective item by request.

The customer should ensure that the products are Defect On Arrival for up to three months from Chenbro’s shipping date and the

damage is not caused by shipping or failures resulting from accident, misuse, abuse, neglect, mishandling, misapplication,

modification, improper operation, improper repair or rework. CHENBRO is not responsible for the cost of replacement including the

delivery cost.

CHENBRO also reserves the right to examine the DOA products. If the damage of DOA products is caused by improper action as

described above, the customer will be liable for paying the related charge having occurred or paying the fee of the replacements if

the DOA products are totally scrapped.

TECHNICAL SUPPORT

Please provide following information when you apply our technical support:

 Product model name and/or part number
 Product serial number and bar code
 Buzzer beeping pattern and/or failure LED flashing pattern
 Detailed, specific questions

You may also contact Chenbro’s regional technical supports as below- Website: www.chenbro.com

CENBRO MICOM CO., LTD.

Email: [e-mail]

Tel: [phone]

Fax: [phone]

CHENBRO MICOM (USA) INC.

Email: [e-mail]

Tel: [phone]

Fax: [phone]

CHENBRO GmbH

Email: [e-mail]

Tel: + 49-2154-8142730

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number

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repair

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charge notice

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