Page 1
Bellcore TR-NWT-000078 : PASS
After 96 Hours (megohms) 2 x 104 Limit
Group A Group B Group C
ANSI/IPC J SF-818
: PASS
After 168 Hours (ohms) 1.8 x 108 Limit
1-2
2-3
3-4 4-5
Electromigration : PASS
Average Insulation Resistance
(megohms)-One Decade Limit
Initial Final
Group E 3.93 x 103 1.24 x 104
Group F 3.87 x 103 2.84 x 104
At 10x magnification no evidence of
TDS # SWNoClean
CHEMTRONICS
Technical Data Sheet
Soder-Wick No Clean
Desoldering Braid
PRODUCT DESCRIPTION
Soder-Wick No Clean is designed to
provide fast and safe desoldering without
leaving behind harmful flux residues.
Soder-Wick
No Clean uses pure, oxygen
free copper braid and a patented flux
technology to make an efficient and
effective desoldering braid. Soder-Wick
No Clean SD is available on ESD safe
bobbins for protection against damage due
to static electricity.
Requires little or no post solder clea ning
No corrosive residues
Halide free
ESD Safe bobbins meet specs:
MIL-STD-1686C
MIL-HDBK-263B
Static decay pr ovision of
MIL-B-81705C
Minimal risk of heat and static
component damage
TYPICAL APPLICATIONS
Soder-Wick
No Clean safely removes
solder from:
Lugs and Posts
Micro Circuits
Surface Mount Device Pads
Ball Grid Array Pads
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Surface Insulation Resistance
4.8 x 106 3.8 x 106 4.1 x 106
2.3 x 1010 2.6 x 1010 2.8 x 1010
electromigration or heavy corrosion.
Silver Chromate Test Paper PASS
Copper Mirror Test PASS
Shelflife 2 years
SODER-WICK NO CLEAN MEETS OR
EXCEEDS:
MIL-F-14256F, Type R
DOD-STD-883E, Method 2022
Bellcore TR-NWT-000078
ANSI/IPC J SF-818
2.8 x 1010
Page 2
Part #
Size Inches
Color
Size Metric
1
.030”
White
.76mm
2
.060”
Yellow
1.52mm
3
.080”
Green
2.03mm
4
.110”
Blue
2.79mm
5
.145”
Brown
3.68mm
6
.210”
Red
5.33mm
BGA
-
Purple
-
Part #
Size
Length
Part #
Size
Length
60-1-5 1 5
60-1-10
1
10
60-2-5 2 5
60-2-10
2
10
60-3-5 3 5
60-3-10
3
10
60-4-5 4 5
60-4-10
4
10
60-5-5 5 5
60-5-10
5
10
60-6-5 6 5
VacuPak Packaging
Part #
Size
storage.
SW16015
1
SW16025
2
SW16035
3
SW16045
4
SW16055
5
SW160BGA
BGA
AVAILABILITY
USAGE INSTRUCTIONS
For industrial use only.
Read MSDS carefully prior to use.
1) Choose a Soder-Wick No Clean width equal to
or slightly larger than the pad or connection.
2) Choose a solder iron tip equal to or slightly
larger than the pad or connection.
3) Set temperature of iron between 600-750°F.
4) Place wick on solder joint and place tip of hot
iron on top of wick.
5) As solder becomes molten, the color of the wick
will change from copper to silver.
6) Remove wick and iron from joint
simultaneously once color change has stopped.
7) The component lead / pad is now clean and free
from solder.
8) Clip and discard used portion of the wick.
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a technical hotline to
answer your tec hnical and application
related questions. The toll free number is:
1-800-TECH-401.
Chemtronics, Soder-Wick and CircuitWorks are
registered trademarks of Chemtronics. All rights reserved.
VacuPak is a trademark of Chemtronics. All rights reserved.
The VacuPak
Can contains
ten five-foot bobbins in a
vacuum sealed can. This
package provides the highest
level of cleanliness and
freshness. Great for tool kit
NOTE:
This information is believed to be accurate. It is
intended for professional end users having the skills
to evaluate and use the data properly. Chemtronics
does not guarantee the accuracy of the data and
assumes no liability in connection with damages
incurred while using it.
CHEMTRONICS
8125 COBB CENTER DRIVE
KENNESAW, GA 30152
1-770-424-4888
REV. F (08/13)
DISTRIBUTED BY:
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