Page 1
20,000 cps to
28,000 cps
TDS # CWF8
CHEMTRONICS
Technical Data Sheet
Chemask WF Solder Masking Agent
PRODUCT DESCRIPTION
Chemask WF Solder Masking Agent is a
high temperature te mporary spot mask that
protects component-free are as from molten
solder during wave soldering. It is w ater
soluble, designed to be removed with open
and closed loop aqueous cleaning sy stems.
Chemask
WF is low foaming and has no
effect on deionized wate r (DI) system resin
beds. This water soluble formulation is
stable to rosin, organic and inorganic fluxes.
Protects boards from molten solder to
515°F (268°C)
Waste stream filterable with micron bags
Prolongs deionized water system life
Low foaming
Compatible with most flux types
Leaves no corrosive residue
Does not contain Methanol
Non-contaminating
Patent No. 6,207,265
TYPICAL APPLICATIONS
During wave soldering, Chemask
WF
Solder Masking Agent protects:
Component Free Areas
Gold Connectors
Gold Fingers
Pin Connectors
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Base Material
Color
Flux Compatibility
Temperature Stability
Tack-Free Drying Time
(10 mils @ 77°F)
Cure Time
(10 mils @ 77°F)
Viscosity (@ 77°F)
Viscosity Adjusted With
Solids Content
Flash Point
Weight/Gallon
Shelflife
Synthetic Resin
White
All types
515°F (268°C)
30 min.
1 hour
Dionized water
~ 40%
None
8.8 lbs.
1 year
COMPATIBILITY
Chemask
WF Solder Masking Agent is
generally compatible with most materials
used in printed circuit board fabrication. As
with any solder masking agent,
compatibility with substrate must be
determined on a non-critical area prior to
use.
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APPLICATION METHOD
Squeeze Bottle/Syringe
Yes
Spatula
Yes
Screening
Yes
Stencil
Yes
Automatic Dispensing
Yes
CFC
0.0%
VOC
5.0%
HCFC
0.0%
HFC
0.0%
Cl. Solv.
0.0%
ODP
0.0%
USAGE INSTRUCTIONS
For industrial use only.
Mix well before each use.
When applying by hand using squeeze
bottle, syringe or spatula, insure that all
areas of the pre-tinned hole are evenly
covered on the side to be soldered. For
screening applications, properly clean and
prepare screen, then apply masking agent in
the same manner as solder paste. Automatic
dispensing equipment may also be used as
appropriate. Allow an hour to fully cure a
10 mil thick application. Thicker
applications will require additional cure
time. Rapid cure can be achieved in a 120
o
F oven.
REMOVAL: After allowing the mask to
become fully cured, the mask may be
washed away in a open or closed loop
aqueous cleaning system with water
o
temperature a t a minimum 120
F under
agitation. If using a recirculating system,
install a minimum 10 micron bag filter
before the resin beds.
Detergents may be used to increase cleaning
efficiency.
AVAILABILITY
CWF8 8 oz. Liquid Squeeze Bottle
CWF1 1 Gal. Liquid
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a technical hotline to
answer your technical and application
related questions. The toll free number is:
1-800-TECH-401.
ENVIRONMENTAL IMPACT DATA
ENVIRONMENTAL IMPACT DATA
CFC, HCFC, CL. SOLV., VOC, and HFC numbers
shown are the content by weight. Ozone depletion
potential (ODP) is determined in accordance with the
Montreal Protocol and U.S. Clean Air Act of 1990. T he
ODP of this product is zero.
NOTE:
This information is believed to be accurate. It is
intended for professional end users having the skills
to evaluate and use the data properly.
CHEMTRONICS does not guarantee the accuracy
of the data and assumes no liability in connection
with damages incurred while using it.
CHEMTRONICS
8125 COBB CENTER DRIVE
KENNESAW, GA 30152
1-770-424-4888
DISTRIBUTED BY:
REV. G (08/13)
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