Chemtronics CW8 Data Sheet
Solvent Stability Dissolves in water with
or without detergent
Cure Time
(± 300 cps)
Solids Content
~ 40%
TDS # CW8
CHEMTRONICS
Technical Data Sheet
Chemask W
PRODUCT DESCRIPTION
Chemask W solder mask is water soluble
and designed to be removed with most
aqueous cleaning systems. Chemask
contains high temperature compounds that
protect component-free areas from solder
during wave soldering. This water soluble
formulation is stable to rosin, organic and
inorganic fluxes.
Protects boards from molten solder to
515°F (268°C)
Compatible with most flux types
Leaves no corrosive residue
Non-contaminating
UV Detectable
TYPICAL APPLICATIONS
During wave soldering, Chemask
protects:
Component Free Areas
Gold Connectors
Gold Fingers
Pin Connectors
W
W
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Base Material
Color
Flux Compatibility
Temperature Stability
Tack-Free Drying Time
(10 mils @ 77°F)
(10 mils @ 77°F)
Viscosity (@ 77°F)
Viscosity Adjusted With
Contains UV Indicator
Flash Point
Weight/Gallon
Synthetic Resin
Blue
Aqueous Flux
515°F (268°C)
20 min.
1 hr.
15,000 cps
DI Water
Yes
Nonflammable
8.8 lbs.
Shelflife 1 year
COMPATIBILITY
Chemask
W is generally c ompatible w ith
most materials used in pr inted circuit board
fabrication. As with any solder masking
agent, c ompatibility with su bstrate must be
determined on a no n-critical a rea prior t o
use.
APPLICATION METHOD
Squeeze Bottle/Syringe
Yes
Spatula
Yes
Screening
Yes
Stencil
Yes
Automatic Dispensing
Yes
CFC
0.0%
VOC
5.0%
HCFC
0.0%
HFC
0.0%
Cl. Solv.
0.0%
ODP
0.00
ENVIRONMENTAL IMPACT DATA
ENVIRONMENTAL IMPACT DATA
USAGE INSTRUCTIONS
For industrial use only.
Read MSDS carefully prior to use.
Chemask
W sol der masking a gent is
engineered f or a ll electronic manufacturing
applications. When applying by hand using
squeeze bottle or s patula, insure that a ll
areas o f the p re-tinned hole a re e venly
covered on the s ide to be so ldered. For
screening applications, properly clean and
prepare screen, then apply masking agent in
the same manner as solder paste. Automatic
dispensing e quipment m ay a lso be u sed as
appropriate.
REMOVAL: After a llowing t he m ask to
become f ully c ured, the m ask m ay be
washed a way w ith water. F or optimum
performance, w ater soluble m ask m ay be
removed w ith a gitation, u ltrasonic, or
industrial w ashing. S urfactants m ay be
added to increase cleaning efficiency.
AVAILABILITY
CW8 8 oz. Squeeze Bottle
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a technical hotline to answer
your t echnical and ap plication r elated q uestions.
The toll free number is: 1-800-TECH-401.
CFC, H CFC, C L. S OLV., V OC, a nd H FC num bers
shown a re the content b y w eight. O zone de pletion
potential ( ODP) is d etermined i n acco rdance w ith t he
Montreal Protocol and U.S. Clean Air Act of 1990. The
ODP of this product is 0.0. I t is the sum of the ODP of
the s ubstances t hat m ay c ontribute to t he de pletion of
stratospheric oz one, ba sed upon t he w eight o f e ach
substance in the product’s formulation.
NOTE:
This i nformation i s be lieved t o be a ccurate. It i s
intended for professional end users having the skills
to e valuate a nd u se t he d ata pr operly.
CHEMTRONICS does not g uarantee t he accuracy
of t he d ata an d assumes no l iability i n connection
with damages incurred while using it.
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