Chemtronics CW8 User Manual

Solvent Stability Dissolves in water with

or without detergent

Cure Time
(± 300 cps)

Solids Content

~ 40%

TDS # CW8

CHEMTRONICS

Technical Data Sheet

Chemask W

PRODUCT DESCRIPTION

Chemask W solder mask is water soluble
and designed to be removed with most
aqueous cle aning systems. Chemask
contains high temperature compounds that
protect component-free areas from solder
during wave soldering. This water sol uble
formulation is stable to r osin, organic and
inorganic f luxes.

 Protects boards from molten solder to

515°F (268°C)

 Compatible with most flux types
 Leaves no corrosive residue
 Non-contaminating
 UV Detectable

TYPICAL APPLICATIONS

During wave soldering, C hemask



protects:

 Component F ree Areas
 Gold Connectors
 Gold Fingers
 Pin Connectors



W

W

TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES

Base Material
Color

Flux Compatibility
Temperature Stability
Tack-Free Drying Time

(10 mils @ 77°F)

(10 mils @ 77°F)
Viscosity (@ 77°F)

Viscosity Adjusted With
Contains UV Indicator

Flash Po i nt
Weight/Gallon

Synthetic Resin
Blue

Aqueous Flux
515°F (268°C)

20 min.

1 hr.

15,000 cps

DI Water
Yes

Nonflammable

8.8 lbs.

Shelflife 1 yea r

COMPATIBILITY



Chemask

W is generally compatible with
most materials used in printed circuit board
fabrication. As with any solder masking
agent, compatibility with substrate must be
determined on a non-critical area prior to
use.

APPLICATION METHOD

Squeeze Bottle/Syringe

Yes

Spatula

Yes

Screening

Yes

Stencil

Yes

Automatic Dispensing

Yes

CFC

0.0%

VOC

5.0%

HCFC

0.0%

HFC

0.0%

Cl. Solv.

0.0%

ODP

0.00

ENVIRONMENTAL IMPACT DATA

ENVIRONMENTAL IMPACT DATA

USAGE INSTRUCTIONS

For industria l use only.
Read MSDS carefully prior to use.
Chemask



W solder masking agent is
engineered for all electronic manufacturing
applications. When applying by hand using
squeeze bottle or spatula, insure that all
areas of the pre-tinned hole are evenly
covered on the side to be soldered. For
screening applications, properly clean and
prepare screen, then apply masking agent in
the same manner as solder paste. Automatic
dispensing equipment may also be used as
appropriate.

REMOVAL: After allowing the mask to
become fully cured, the mask may be
washed away with water. For optimum
performance, water soluble mask may be
removed with agitation, ultrasonic, or
industrial washing. Surfactants may be
added to increa se cle a nin g eff ic ie nc y .

AVAILABILITY

CW8 8 oz. Squeeze Bottle

TECHNICAL & APPLICATION
ASSISTANCE

Chemtronics provides a technical hotline to answer
your technical and application related questions.
The toll free number is: 1-800-TECH-401.

CFC, HCFC, CL. SOLV., VOC, and HFC numbers
shown are the content by weight. Ozone depletion
potential (ODP) is determined in accordance with the
Montreal Protocol and U.S. Clean Air Act of 1990. The
ODP of this product is 0.0. It is the sum of the ODP of
the substances that may contribute to the depletion of
stratospheric ozone, based upon the weight of each
substance in the product’s formulation.

NOTE:

This information is believed to be accurate. It is
intended for professional end users having the skills
to evaluate and use the data properly.
CHEMTRONICS does not guarantee the accuracy
of the data and assumes no liability in connection
with damages incurred while using it.

CHEMTRONICS
8125 COBB CENTER DRIVE
KENNESAW, GA 30152
1-770-424-4888

DISTRIBUTED BY:

REV. G (08/13)