Material Part A Epoxy
Part B Hardener
Lap Shear >1200 lbs/in.
Shore Hardness >70
Conditions: Store at temperatures below 77° F
Technical Data Sheet
TDS # CW2400
CircuitWorks
PRODUCT DESCRIPTION
CircuitWorks
part, silver epoxy used in pr ototype, r epair
and ge neral c onductive bonding
applications. C W2400 f eatures strong
mechanical bonds, e xcellent e lectrical
conductivity, and quick r oom te mperature
curing. C ircuitWorks
bonds a ggressively to a w ide variety of
materials.
Two-component product
Simple mixing ratios
Excellent electrical conductivity
Fast curing
High strength bond
Bonds dissimilar surfaces
Operating temperature range from
Conductive Epoxy is a tw o
Conductive Epoxy
Conductive Epoxy
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Composition
Specific Gravity 4.0
Cured Compound
Volume Resistivity <0.001 ohm-cm
Thermal Conductivity
Cal-cm/sec-cm2 -°C 3.8 x 10-3
BTU-in/hr-ft2 -°F 11.0
Operating Temperature -131 to 212°F
Range ( -91 to 100°C)
-91°C (-131°F) to 100°C (212°F)
TYPICAL APPLICATIONS
CircuitWorks
Conductive E poxy m ay be
used for electronics applications including:
Conductive Bonds Between Heat
Sensitive Components
Solderless Surface Mount Connections
Circuit Board Trace Repair
Static Discharge and Grounding
Solder Repair
Conductive Structural Adhesions
(ASTM D-1002)
Dropping Point None @ 650°F
(ASTM D-2266) (343°C)
Adhesion Excellent
Cured Flexibility Excellent
Chemical Resistance Excellent
Moisture Resistance Good
Typical Thickness 5 mil
Shelf life 9 months
COMPATIBILITY
CircuitWorks
Conductive E poxy is
generally compatible with m ost m aterials
used in printed circuit board fabrication. As
with a ny a dhesive/sealant, c ompatibility
with substrate should be de termined on a
non-critical area prior to use.
USAGE INSTRUCTIONS
Read MSDS carefully prior to use.
Cleaning: For best results, clean the board
with one of Chemtronics
Pow-R-Wash
cleaners in or der to remove
Electro-Wash or
any sur face c ontamination w hich m ay
prevent adequate material contact.
Mixing: Mix equal amounts (1:1) by
weight or volume of Part A and Part B. Mix
thoroughly for 2 minutes and apply within 8
minutes.
Thinning: Do not attempt to thin.
Curing: Curing tim es a nd e lectrical
conductivity de pend pr imarily on
temperature. F or f astest c uring tim es,
maximum conductivity and a dhesion, c ure
the bond between 150-250°F (65-121°C) for
5-10 m inutes. C ircuitWorks
Conductive
Epoxy can be r oom te mperature cured at or
above 75°F (25°C), for 4 hours. M aximum
conductivity and bond strength are achieved
in 24 hour s. Curing at temperatures below
AVAILABILITY
CW2400 7g/ 0.25 oz. Adhesive &
7g/ 0.25 oz. Hardener
CW2400J 10g/ 0.35 oz. Adhesive &
10g/ 035 oz. Hardener
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a t echnical hotline to answer
your t echnical a nd a pplication related questions.
The toll free number is: 1-800-TECH-401.
NOTE:
This i nformation is believed to b e accu rate. I t i s
intended for professional end users having the skills
to evaluate and use t he da ta pr operly.
CHEMTRONICS does n ot g uarantee t he accu racy
of t he da ta a nd a ssumes no l iability i n connection
with damages incurred while using it.
DISTRIBUTED BY:
°
F (25°C) will re sult in a loss of
75
conductivity and adhesion.
Pot Life: 8-10 Minutes at 75°F (25°C) after
mixing.