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Composition
Material Silver Filled Polymer
Silver Particle Size
10-15 microns
Color
Silver Gray
Setting Rate
<2mm/hr.
Properties
Conductivity 0.02-0.05 ohms/sq/mil
0.00005-0.000125 ohm cm
Max. Temperature 400°F (205°C)
Tack-Free Time @ 25°C 3 to 5 Minutes
Cure Time @ 25°C 20 to 30 Minutes
Solder Wetting 2 to 3 Seconds
Electrical Conductivity Excellent
Adhesion Excellent
Flexibility Good
Chemical Resistance Good
STP 1.2 mm (0.05 inches)
Shelflife 12 months
CHEMTRONICS
Technical Data Sheet
CircuitWorks Conductive Pen
PRODUCT DESCRIPTION
CircuitWorks
instant highly conductive silver traces on
circuit boards. CW2200 is used in
prototype, rework, and repair of circuit
boards by linking components, repairing
defective traces, and making smooth
jumpers. The silver traces dry in minutes
and have excellent adhesion to most
electronic materials. Engineers, repair
technicians, and manufacturers will find that
the CircuitWorks
project completion and cuts rework tim e.
Single component system
High electrical conductivity
Fast drying
Highly adherent to cir cuit boards
Conductive Pen makes
Conductive Pen speeds
TDS # CW2200
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Operating tempe rature to 400°F (205°C)
TYPICAL APPLICATIONS
CircuitWorks
Conductive Pen may be used
for electronics applications including:
Circuit Trace Repair
Solderless Linking of Components
EMI Shielding
Solderable Terminations
Quick Prototype Modifications
Tip Diameters
MTP 0.8 mm (0.03 inches)
COMPATIBILITY
CircuitWorks
Conductive Pen material has
excellent compatibility with materials used
in printed circuit board fabrication. As with
any chemical system, compatibility with the
substrate must be determined on a noncritical area prior to use.
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USAGE INSTRUCTIONS
Read MSDS carefully prior to use.
Cleaning: For best adhesion, clean board with one
of Chemtronics Electro-Wash or Pow-R-Wash
solvents in order to remove any surface
contamination wh ich may prevent adequ ate mater ial
contact.
Mixing: Although this system has been formulated
to resist hard-packing, it should be shaken
vigorously for 30 seconds to insure the proper
dispersion of the silver flakes. If pen has been
allowed to sit idle for a long period of time, the
mixing ball may seize in the barrel. To free the ball
use force to tap the barrel end of the pen until the
ball begins to move inside the pen.
Application: The conductive ink is dispensed
through the CircuitWorks
Squeezing the pen body while pressing down on the
surface will allow the material to flow, enabling the
trace to be drawn. Practice with the pen before
attempting detail work. The bulk form of this
material may be applied by brushing, banding, or
automatic dispensing equipment.
Thinning: The conductive ink has been optimized
for the CircuitWorks
Conductive Pen and thinning
is not normally necessary. However, Butyl Acetate
may be added with thorough mixing to make slight
adjustments for ease of application in the bulk form.
Clean-up/Removal: The conductive ink may be
cleaned or removed using a strong organic solvent
such as Chemtronics Electro-Wash PX.
Curing: Tack-free in 3 to 5 minutes at room
temperature. Achieves electrical conductivity
within 30 minutes. Heat cure for 5 minutes at 250
to 300°F (120 to 150°C) for maximum conductivity,
durability and chemical resistance.
Conductive Pen.
Soldering: Low temperature soldering is possible
to the heat-cured silver conductiv e traces if done at
350°F (177°C) for <5 seconds.
AVAILABILITY
CW2200STP 8.5 g (0.3 oz.), Standard 1.2 mm tip
CW2200MTP 8.5g (0.3 oz.), MicroTip 0.8 mm tip
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics provides a technical hotline to answer
your technical and application related questions.
The toll free number is: 1-800-TECH-401.
NOTE:
This information is believed to be accurate. It is
intended for professional end users having the skills
to evaluate and use the data properly.
CHEMTRONICS does not guarantee the accuracy
of the data and assumes no liability in connection
with damages incurred while using it.
CHEMTRONICS
8125 COBB CENTER DRIVE
KENNESAW, GA 30152
1-770-424-4888
REV. G (08/13)
DISTRIBUTED BY:
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