Chemtronics CM8 User Manual

Stable in all Hydrocarbons,
and chlorinated solvents
(10 mils @ 77°F)
(± 300 cps)
TDS # CM8
CHEMTRONICS
Technical Data Sheet
Chemask
PRODUCT DESCRIPTION
Chemask is a fast curing peelable solder masking agent. It contains a high temperature r esistant compound that protects component-free a reas during wave soldering.
Chemask
may be used to protect pins, posts, contacts and edge connections during conformal coating pr ocesses.
Stable to 515°F (268°C) Compatible with rosin, water soluble
fluxes and cleaning solvents
Leaves no residueDries tack free in 30 minutes Non-contaminating
TYPICAL APPLICATIONS
Chemask
protects:
Component Free Areas for Soldering ComponentsPin Connectors During SolderingTemperature Sensitive Components
During Wave Solder ing
SocketsBoard Areas From Conforma l Coating
TYPICAL PRODUCT DATA AND PHYSICAL PROPERTIES
Base Material Color
Solvent Stability
Flux Compatibility Temperature Stability Tack-Free Drying Time
(10 mils @ 77°F) Cure Time
Viscosity (@ 77°F)
Viscosity Adjusted With Solids Content
Flash Point Weight/Gallon
Shelflife 2 year
Natural latex rubber Pink
Hydrofluorocarbons, water
All Types 515°F
15 min.
30 min.
20,000-28,000 cps
DI Water ~ 60%
Nonflammable
7.2 lbs.
COMPATIBILITY
Chemask
is generally compatible with most materials used in printed circuit board fabrication. As with any solder masking agent, compatibility with substrate must be determined on a non-critical area prior to use.
APPLICATION METHOD
Squeeze Bottle/Syringe
Yes
Spatula
Yes
Screening
No
Automatic Dispensing
Yes
Removal/Clean-up
By Hand
CFC
0.0%
VOC
3.1%
HCFC
0.0%
HFC
0.0%
Cl. Solv.
0.0%
ODP
0.00
USAGE INSTRUCTIONS For industrial use only. Read MSDS carefully prior to use.
Chemask
solder masking agent is engineered for all electronic manufacturing applications. When applying by hand using squeeze bottle or spatula, insure that all areas of the pretinned hole are evenly covered on the side to be soldered. Automatic dispensing equipment may also be used as appropriate.
REMOVAL: After allowing the mask to become fully cured, peelable solder mask can be removed by hand or by the use of tweezers. Depending on ambient conditions, peelable mask may remain on assemblies for extended periods of time prior to component insertion.
AVAILABILITY
CM8 8 oz. Squeeze Bottle CM1 1 Gal. Liquid
TECHNICAL & APPLICATION ASSISTANCE
Chemtronics provides a technical hotline to answer your tec hnical and application related questions. The toll free number is: 1-800-
TECH-401.
ENVIRONMENTAL IMPACT DATA
ENVIRONMENTAL IMPACT DATA
CFC, HCFC, CL. SOLV., VOC, and HFC numbers shown are the content by weight. Ozone depletion potential (ODP) is determined in accordance with the Montreal Protocol and U.S. Clean Air Act of 1990. The ODP of this product is 0.0. It is the sum of the ODP of the substances that may contribute to the depletion of stratospheric ozone, based upon the weight of each substance in the product’s formulation.
NOTE:
This information is believed to be accurate. It is intended for professional end users having the skills to evaluate and use the data properly. CHEMTRONICS does not guarantee the accuracy of the data and assumes no liability in connection with damages incurred while using it.
CHEMTRONICS 8125 COBB CENTER DRIVE KENNESAW, GA 30152 1-770-424-4888
Chemtronics and Chemask are registered trademarks of Chemtronics. All rights reserved.
DISTRIBUTED BY:
REV. F (08/13)
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