and halogenated solvents
(± 10,000 cps)
2 years
TDS # CLF8
CHEMTRONICS
Technical Data Sheet
Chemask Lead-Free Solder Masking Agent
PRODUCT DESCRIPTION
Chemask Lead-Free Solder Masking Agent
is a te mporary, f ast c uring, pe elable solder
masking agent formulated f or use in high
temperature l ead-free applications. It is a
temperature resistant c oating tha t pr otects
component-free areas of the P CB dur ing
wave solde ring. Chemask
Lead-Free c an
be introduced into the preheat oven within 4
minutes of application w ithout a dverse
effects. U se to pr otect pins, posts, c ontacts
and edge connections dur ing conformal
coating processes.
Stable to 550°F (288°C)
Can be used in lead-free or Tin/Lead
applications
Compatible with rosin, no clean, and
water soluble fluxes
Unaffected by cleaning solvents
Leaves no residue – non-contaminating
Ready for wave solder in 4 minutes
Dries tack free in 15 minutes
RoHS compliant
TYPICAL APPLICATIONS
Chemask
Lead-Free Solder Masking Agent
protects:
Component Free Areas for Soldering
Components and Sockets
Pin Connectors During Soldering
Temperature S ensitive C omponents
During Wave Soldering
TYPICAL PRODUCT DATA AND
PHYSICAL PROPERTIES
Base Material
Color
Solvent Stability Stable in all hydrocarbon,
(cured mask) hydrofluorocarbon, chlorinated,
Flux Compatibility
Temperature Stability
Tack-Free Drying Time
(10 mils @ 77°F)
Cure Time
(10 mils @ 77°F)
Viscosity (@ 77°F)
Viscosity Adjusted With
Solids Content
Flash Point
Weight/Gallon
Shelflife
Natural latex rubber
Pink
All types
550°F
15 min.
30 min.
190,000 cps
Deionized water
~ 80%
Nonflammable
7.2 lbs.
COMPATIBILITY
Chemask
Lead-Free Solder Masking Agent
is ge nerally c ompatible w ith m ost materials
used in printed circuit board fabrication. As
with any solder masking agent, compatibility
with substrate must be determined on a noncritical area prior to use . T est compatibility
on bare copper.
APPLICATION METHOD
Squeeze Bottle/Syringe
Yes
Spatula
Yes
Screening
No
Automatic Dispensing
Yes
Removal/Clean-up
By Hand
USAGE INSTRUCTIONS
For industrial use only.
Read MSDS carefully prior to use.
Chemask
Lead-Free Solder Masking Agent
is e ngineered f or a ll e lectronic
manufacturing applications. When applying
by hand using sque eze bottle , sy ringe or
spatula, insure that all areas of the pretinned
hole a re e venly c overed on the side to be
soldered. A utomatic dispe nsing e quipment
may also be used as appropriate.
REMOVAL: After a llowing the m ask to
become f ully c ured, pe elable solde r m ask
can be removed by hand or by the use of
tweezers. Depending on ambient conditions,
peelable mask may remain on assemblies for
extended periods of time prior to component
insertion.
AVAILABILITY
CLF8 8 oz. Squeeze Bottle
CLF1 1 Gal. / 3.7 L liquid
TECHNICAL & APPLICATION
ASSISTANCE
Chemtronics pr ovides a te chnical hotline to
answer your technical and application related
questions. T he toll f ree number is: 1-800-
TECH-401.
NOTE:
This information is believed to be accurate. It is
intended f or prof essional end users having the
skills to evaluate and use the data properly .
CHEMTRONICS does not guarantee the
accuracy of the data and assum es no liability in
connection with damages incurred while using it.
Chemtronics and Chemask are registered trademarks
of Chemtronics. All rights reserved.
DISTRIBUTED BY:
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