CELER CMM3030-BD-0192, CMM3030-BD-0048 Datasheet

3236 Scott Boulevard Santa Clara, California 95054 Phone: [phone] Fax: [phone]

CMM3030-BD

Features

❏ Small Size
❏ High Gain: 10 dB Typical
❏ Output Voltage up to 7.5 V Peak-to-Peak
❏ 30 kHz to 30 GHz Bandwidth
❏ Low Gain Ripple: 1.0 dB pp Typical
❏ Sub 0.25 Micron PHEMT

Applications
❏ Driver Amplifier for LiNb03Modulator @

OC192 bit rate SONET/SHD Transmission
Systems

❏ Medium Power Linear Gain Block for

Broadband Systems

Description

The CMM3030-BD is a precision GaAs MMIC,
medium power amplifier and is part of Celeritek’s family of
WideFiber™ products.

The CMM3030-BD optical driver amplifier gives
fiber optic system designers a unique combination of wide­band frequency coverage, along with a flat response and very
low internal jitter. It is a precision PHEMT GaAs MMIC
medium power amplifier with +23 dBm @ P1dB. It operates
from 30 kHz to 30 GHz with a 10 dB linear gain. Low inter-

nal jitter makes it especially well suited for high speed digital
data applications. Maximum output voltage is 7.5 V peak-to­peak.

It is an excellent choice as a driver amplifier for
Lithium Niobate external optical modulators, to acheive high
extinction ratio. Targeted for OC-192 and other high speed
applications, the bit rate can be as high as 15 Gb/s. The bias
voltage can be adjusted to reduce the output voltage as needed.

CMM3030-BD amplifiers are shipped in Gel Pack
from Celeritek’s foundry.

30 kHz to 30 GHz GaAs MMIC

Optical Modulator DriverAmplifier

Advanced Product Information
November 2000 (1 of 2)

Chip Diagram

Specifications (TA= 25°C, V

DD

= 8V)

Parameters Units Min Typ Max

Frequency Range — 30 kHz 30.0 GHz
Small Signal Gain dB 9.0 10.0
Gain Flatness ±dB 0.5 0.75
Input/Output VSWR — 1.8:1 2.0:1
Power Output (@1 dB Gain Compression) dBm 22.0 23.0
Second Order Intercept Point dBm 40.0
Third Order Intercept Point dBm 30.0
Current mA 225 275

Units in Microns

3236 Scott Boulevard, Santa Clara, California 95054
Phone: [phone] Fax: [phone]

CMM3030-BD

Advanced Product Information - November 2000

(2 of 2)

Celeritek reserves the right to make changes without further notice to any products herein. Celeritek makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Celeritek assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating
parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Celeritek does not convey any license under its patent
rights nor the rights of others. Celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Celeritek product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Celeritek products for any such unintended or unauthorized application, Buyer shall indemnify and hold Celeritek and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Celeritek was negligent
regarding the design or manufacture of the part. Celeritek is a registered trademark of Celeritek, Inc. Celeritek, Inc. is an Equal Opportunity/Affirmative Action Employer.

Ordering Information

Part Number for Ordering

System Application/Description

CMM3030-BD-0048 OC-48/STM-16
CMM3030-BD-0192 OC-192/STM-64

Absolute Maximum Ratings

Parameter Rating

Drain Voltage 12 V
Gate Voltage -5 V
Drain Current 350 mA
Continuous Power Dissipation 3.0 W
Channel Temperature +175°C
Storage Temperature -65°C to +175°C
Mounting Temperature +320°C
Input Power +23 dBm

Die Attach and Bonding Procedures

Die Attach: Eutectic die attach is recommended. For eutec­tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.

Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre­stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.

Schematic Diagram