CELER CMM0014-BD Datasheet

3236 Scott Boulevard Santa Clara, California 95054 Phone: [phone] Fax: [phone]

2.0 to 22.0 GHz
GaAs MMIC
Power Amplifier

Advanced Product Information
October 2003 (1 of 2)

Features

❏ Small Size: 45 x 92 mils
❏ High Gain: 11.5 dB
❏ Medium Power: +25 dBm, Typ P1dB
❏ Directly Cascadable – Fully Matched
❏ Unconditionally Stable
❏ Single Supply
❏ Bias Control
❏ pHEMT Technology
❏ Silicon Nitride Passivation

Specifications (TA= 25°C, Vdd= 8V)

Parameters Units Min Typ Max

Frequency Range GHz 2.0 22.0
Small Signal Gain dB 10.0 13.5
Gain Flatness ±dB 1.6
Return Loss dB -10
P1dB Variation (over operating frequency) dBm 4.5
Power Output (@1 dB Gain Compression)

1

dBm 22.5 27.5
Saturated Output Power dBm 24.0 29.0
Second Order Intercept Point dBm 40.0
Third Order Intercept Point dBm 30.0
Current mA 250 300 350
Stability

2

Unconditionally Stable

Absolute Maximum Ratings

Parameter Rating

Drain Voltage 12V

Drain Current 375 mA

Continuous Power Dissipation 3.0 W

Channel Temperature +175°C

Storage Temperature -65°C to +175°C

Mounting Temperature +320°C

Input Power +23 dBm

Die Attach and Bonding Procedures

Die Attach: Eutectic die attach is recommended. For eutec­tic die attach: Preform: AuSn (80% Au, 20% Sn); Stage
Temperature: 290°C, ±5°C; Handling Tool: Tweezers; Time: 1
min or less.

Wire Bonding: Wire Size: 0.7 to 1.0 mil in diameter (pre­stressed); Thermocompression bonding is preferred over
thermosonic bonding. For thermocompression bonding:
Stage Temperature: 250°C; Bond Tip Temperature: 150°C;
Bonding Tip Pressure: 18 to 40 gms depending on size of
wire.

CMM0014-BD

Chip Diagram

Notes: 1. Power may be increased by 1 dB if Bias of 7V and 350 mA is used (all source resistors bonded to ground).

2. Stability factor measured on-wafer.

3236 Scott Boulevard, Santa Clara, California 95054
Phone: [phone] Fax: [phone]

CMM0014-BD

Advanced Product Information - October 2003

(2 of 2)

Celeritek reserves the right to make changes without further notice to any products herein. Celeritek makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Celeritek assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different applications. All operating
parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Celeritek does not convey any license under its patent
rights nor the rights of others. Celeritek products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or
other applications intended to support or sustain life, or for any other application in which the failure of the Celeritek product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Celeritek products for any such unintended or unauthorized application, Buyer shall indemnify and hold Celeritek and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Celeritek was negligent
regarding the design or manufacture of the part. Celeritek is a registered trademark of Celeritek, Inc. Celeritek, Inc. is an Equal Opportunity/Affirmative Action Employer.

Ordering Information

The CMM-0014-BD is available in bare die and is shipped in Gel Pak.

Part Number for Ordering

Package

CMM0014-BD Bare Die

Typical Performance (Vdd = 8V, 300 mA)