
Overview
Quick Reference Guide
IZI Probe
The IZI Probe has significant differences when compared to other RF probes. Unlike coaxial probes, the IZI Probe utilizes
long spring-like nickel contacts that act like cantilever needles. These contacts touch down independently on the wafer
surface, ensuring excellent test results on both even and uneven surfaces. Minimal overtravel is required in order to ensure
repeatable contact. The unique design guarantees unparalleled contact reliability and makes the probe exceptionally easy
to handle and align. The IZI
understand and follow the recommendations described here.
Probe, however, is handled slightly differently than a standard RF probe, and it is important to
Mounting the Probe on the Positioner
The IZI Probe can be mounted onto any industry standard positioner arm. Once mounted, position the arm parallel to the
wafer surface.
Contact and Alignment
Use the positioner z-axis to lower the probe tips. Use a high resolution microscope to view each tip as it touches down
independently on the wafer surface (parallel contacts will touch down in unison on a planar surface). Position the probe and
probe arm parallel to the wafer surface. Contact has been achieved when the tips skate slightly forward. Additional
downward z-movement after this first contact is called overtravel. It is important that the probe is poitioned at the correct
angle to the aligned substrate (see graphics below). The the probe arm fixing screws can be used to make slight
adjustments in the angle of the probe in relation to the substrate structures.
Overtravel
The IZI Probe requires very little overtravel for reliable contact. Recommended overtravel is 5 μm on gold and 30 μm on
aluminum pads. For extremely non-planar surfaces (up to 50 μm pad height differences or differing wafer topographies),
more overtravel may be required; some models can withstand an overtravel up to 200 μm. However, using the
recommended overtravel will help avoid damage to your DUT. The minimal skate requirements of the IZI
accurate positioning on very small pads. The independent spring fingers enable consistent contact on uneven surfaces or
through vibration interference, even with low overtravel values.
Probe enable
W
ARNING
Too much overtravel can damage the wafer and significantly shorten the life span of the probe.
Note that the IZI Probe contacts are typically 10 μm behind the shadow of the probe tip.
It is important that the IZI
much overtravel during alignment, and can result in the scraping away of the pad metal from the side. Too much overtravel
can destroy the calibration standards pads.
Probe contacts the wafer directly on the pad surface. Early contact is typically caused by using too
www.cascademicrotech.com IZI Probe • 1

Worst case: touch down before pad, overtravel = 100 μm
Best case: touch down on pad, low overtravel = 5 μm
Perfect case: IZI Probe viewed from the side
on the calibration standard
Corporate Headquar
Cascade Microtech, Inc.
Germany
phone: +49-811-60005-0
email: cmg_sales@ cmicro.com
Japan
phone: +81- 3-5615-5150
email: cmj_sales@ cmicro.com
China
phone: +86-21-3330-3188
email: cmc_sales@ cmicro.com
eSingapor
phone:
email: cms_sales@ cmicro.com
Tai wa n
phone: +886-3-5722810
email: cmt_sales@cmicro.com
toll free: +1-800-550-3279
phone: +1-503-601-1000
email: cmi_sales@cmicro.com
+65-6873-7482
ters
© Copyright 2010 Cascade Microtech, Inc.
All rights reserved. Cascade Microtech and
IZI Probe are registered trademarks of
Cascade Microtech, Inc. All other trademarks are the property of their respective
owners.
Data subject to change without notice.
Handling and Cleaning
Although the IZI Probe is far more robust than other probes, careful handling is required.
• Do not touch the probe tips. Dirty or damaged tips will result in compomised performance.
• Do not use liquid or unglazed ceramic, or an ultrasonic cleaner to clean the probes. A rough ceramic surface will
shorten the life of the tip.
To clean the probe tips, Probe Polish™ (P/N K25-39045) is recommended. This is a sticky pad which does not contain
liquids, fibers or solvents. Place the Probe Polish pad on the chuck (for example, on the auxiliary substrate area) and touch
the probe tips to the pad surface several times using 100 to 200 μm overtravel to safely remove any unwanted substances.
The probes can be pulled backwards over the pad like a garden rake, but never move them in a forward direction.
If you have any further questions or comments, please do not hesitate to contact a Cascade Microtech representative.
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