Caratec KXG60ZNV256G User Manual

XG6 Series

Client SSD

The XG6 series utilizes KIOXIA's latest 96-layer, 3D TLC (3-bit-per-cell) ash memory. With 4th
generation BiCS FLASHTM and SLC cache features, XG6 SSDs reach up to sequential read/
write speeds of 3180 MB/s and 2960 MB/s respectively and deliver up to 355,000 random
read and 365,000 random write IOPS. In addition to high performance, XG6 carries on the low
power design of the XG family, consuming 4.7 W or less in active mode and less than 3 mW
in stand-by mode.

The new XG6 series is optimized for power-sensitive mobile PCs, performance-oriented gam­ing PCs, as well as data center environments for server-boot, caching and logging.

Available in a compact M.2 2280 single-sided form factor, the XG6 series comes in three ca­pacity models of 256 GB, 512 GB and 1,024 GB, each with the option of a Self-Encrypting Drive
(SED) model supporting TCG Opal Version 2.01.

Product image may dier from the actual product.

Key Features

• KIOXIA 96-Layer BiCS FLASH

• PCIe® Gen3 x4, NVMe

• Capacities up to 1,024 GB

• M.2 2280 Single-sided

• TCG OPAL 2.01 Optional for SED*

* Availability of the SED model line-up may vary by region.

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Key Applications

• Thin performance notebook PCs

• High-performance desktop PCs

• Gaming PCs

• Server-boot, caching & logging use in
data center

Specications

Model Number KXG60ZNV1T02 KXG60ZNV512G KXG60ZNV256G

SED Model Number KXG6AZNV1T02 KXG6AZNV512G KXG6AZNV256G

Physical

[1]

Capacity

Form Factor M.2 2280-S2 Single-sided

Interface PCIe® Base Specication Revision 3.1a

1,024 GB 512 GB 256 GB

Interface Speed 32 GT/s (PCIe® Gen3 ×4 Lane)

TM

Command NVMe

Memory Type BiCS FLASH™

Connector Type M.2 M

Revision 1.3a

Copyright © 2019 KIOXIA Corporation. All rights reserved.

XG6 | Client SSD | Product Brief

Rev.1.0

Specications (Continued)

Model Number KXG60ZNV1T02 KXG60ZNV512G KXG60ZNV256G

SED Model Number KXG6AZNV1T02 KXG6AZNV512G KXG6AZNV256G

[1]

Capacity

Form Factor M.2 2280-S2 Single-sided

Performance

[2]

(Up to)

Sequential Read 3,180 MB/s 3,100 MB/s 3,050 MB/s

Sequential Write 2,960 MB/s 2,800 MB/s 1,550 MB/s

Power Requirements

Supply Voltage 3.3 V ±5 %

1,024 GB 512 GB 256 GB

Power

Active 4.7 W typ. 4.1 W typ. 4.0 W typ.

Consump­tion

Reliability

L1.2 mode 3 mW typ.

[3]

MTTF 1,500,000 hours

Mechanical

Dimension (LxWxH) 22.0mm x 80.0 mm x 2.23 mm

Weight (Typ.) 7.3 g typ. 7.0 g typ.

Environmental

Operating : 0 to 95 °C (Controller Temperature)

Temperature

Shock (Operating) 14.7 km/s2 {1.500 G} (0.5ms)

• Sanitize is supported.

Additional Features

• Namespace Management and Namespace Attachment commands are supported.

• Non-Operational Power State Conguration is supported.

• TCG Storage Interface Interactions Specication (SIIS) Version 1.07 is supported.

[1] Denition of capacity: KIOXIA Corporation denes a megabyte (MB) as 1,000,000 bytes, a gigabyte (GB) as 1,000,000,000 bytes and a terabyte (TB) as 1,000,000,000,000 bytes. A computer
operating system, however, reports storage capacity using powers of 2 for the denition of 1GB = 2^30 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity
(including examples of various media les) will vary based on le size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software appli­cations, or media content. Actual formatted capacity may vary.

[2] Read and write speed, tested on the state of "SLC cache=ON", may vary depending on the host device, read and write conditions, and le size.

[3] MTTF (Mean Time to Failure) is not a guarantee or estimate of product life; it is a statistical value related to mean. failure rates for a large number of products which may not accurately reect
actual operation. Actual operating life of the product may be dierent from the MTTF.

Products and specications discussed herein are subject to change without notice. All information discussed herein is provided on an “as is” basis, without warranties of any kind. Before creating
and producing designs and using, customers must refer to and comply with the latest versions of the product specications.

*PCIe® is a registered trademark of PCI-SIG.
*NVMe™ is a trademark of NVM Express, Inc.
*All other company names, product names, and service names mentioned herein may be trademarks of their respective companies.
*Availability of the SED model line-up may vary by region.

0 to 85 °C (Other Components Temperature)

Non-Operating: -40 °C to 85 °C

Copyright © 2019 KIOXIA Corporation. All rights reserved.

XG6 | Client SSD | Product Brief

Rev.1.0