California Micro Devices WLP200 Datasheet
CALIFORNIA MICRO DEVICES
Wafer Level Package Evaluation RC Filter Network
WLP200
Features
• 6 Filters per device
• Ultra small footprint, 0.5mm pitch
• Silicon substrate
• 0.30mm Eutectic Solder Bumps
Product Description
The WLP200 consists of 6 RC filters with different filter
characteristics in a wafer level package (WLP). All
I/O pins are ESD protected for contact discharges up to
8KV per the IEC1000-4-2 level 4 specification. Two
versions with different capacitor values are available.
Cellular phone application frequently demands filtering
of signals in the 800 to 2,700 MHz band. California
Micro Devices’ unique thin film Flip Chip filters provide a
minimum of –30 dB of attenuation over this frequency
SCHEMATIC DIAGRAM
C1
D1
R 50Ω
R 50Ω
Applications
• EMI filter for Mobile Equipment
(e.g. Cellular Phones)
• Evaluation Device
band. The bump size and pitch of these filters are
selected such that the device can be placed directly on
a FR4 printed circuit board using conventional assembly
techniques. Ground-bounce and cross-talk are minimized by a die design that provides eight solder bump
contacts to the common supply connection. The solder
bump contacts are a 63/37 Sn/Pb alloy and are nominally 0.30 mm in diameter.
B1
C
GND
R 50Ω
C
GND
A1
GND
D2
D3
D4
D5
R 90Ω
C
GND
R 90Ω
R 70Ω
R 70Ω
C3 B3 C2 B2 C5 B5 C4 B4
R 90Ω
C
GND
R 70Ω
C
GND
C
GND
GND
GND
GND
GND
GND
GND
A2
A3
A4
A5
© 2000 California Micro Devices Corp. All rights reserved.
11/10/2000
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
C1460800
1
CALIFORNIA MICRO DEVICES
SEULAVDRADNATS
RecnareloTetulosbA%01±
CecnareloTetulosbA%02±
srotsiseRfoRCTmpp001±
egnaRerutarepmeTgnitarepOC°58otC°04–
V6±@tnerruCegakaeLAµ1<
rotsiseR/gnitaRrewoPWm001
10-002PLWFOSCITSIRETCARAHCLACIRTCELE
retliFepyTretliFniPtupnIniPtuptuO(R ΩΩΩΩΩ))Fp(C)1etoN(cF)2etoN(cF
1#FT1C1B05531zHM6.32zHM0.63
2#T 1D1A05531zHM6.32zHM6.32
3#FT2D2A09531zHM1.31zHM8.23
4#T 3D3A09531zHM1.31zHM5.81
5#T 4D4A07531zHM8.61zHM6.12
6#FT5D5A07531zHM8.61zHM1.43
WLP200
20-002PLWFOSCITSIRETCARAHCLACIRTCELE
retliFepyTretliFniPtupnIniPtuptuO(R ΩΩΩΩΩ))Fp(C)1etoN(cF)2etoN(cF
1#FT1C1B05091zHM7.61zHM7.52
2#T 1D1A05091zHM7.61zHM0.81
3#FT2D2A09091zHM03.9zHM2.32
4#T 3D3A09091zHM03.9zHM2.31
5#T 4D4A07091zHM0.21zHM3.51
6#FT5D5A07091zHM0.21zHM4.42
* Note 1: Calculated with zero Source impedance and infinite Load impedance.
* Note 2: Calculated with 50Ω Source impedance and 50Ω Load impedance.
2.538mm
0.269
mm
D
C
B
0.5mm
0.5
mm
1.936mm
0.3mm Dia.
Bumps
©2000 California Micro Devices Corp. All rights reserved.
2
215 Topaz Street, Milpitas, California 95035 Tel: (408) 263-3214 Fax: (408) 263-7846 www.calmicro.com
A
1
2345
0.218
mm
0.635mm
0.860mm
Figure 2. WLP200 Package Diagram (View of the Bump side)
11/10/2000
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